DLW5BTHyyyTQ2y Spec Datasheet by Murata Electronics

Sgec. No. JEFL243C79120701 [Fesmng Commons] Tesmng Commons]
Spec. No. JEFL243C-9120-01 P 1/10
MURATA MFG CO., LTD.
Reference Only
Wire Wound Chip Common Mode Choke Coil
DLW5BTH□□□TQ2□
Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to Wire Wound Chip Common Mode Choke Coil DLW5BTH_TQ Series for
Automotive Electronics based on AEC-Q200.
2. Part Numbering
(ex.) DL W 5B T H 102 T Q 2 L
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
(1) Chip Common Mode Choke Coil
(2) Structure (W : Winding Type)
(3) Dimension (L×W)
(4) Type
(5) Category
3.Rating
Customer
Part Number
MURATA
Part Number
Impedance
at 10MHz,
Under Standard
Tesiting Conditions
(Ω min.)
Impedance
at 100MHz,
Under Standard
Tesiting Conditions
(Ω Typ.)
Rated
Voltage
V(DC)
Withstanding
Voltage
V(DC)
Rated
Current(*)
(A)
DC
Resistance
(Rdc)
(Ωmax.)
Insulation
Resistance
(MΩ min.)
ESD
Rank
2.2kV
at
105℃
at
125℃
DLW5BTH101TQ2L
10 100
50 125
4.0 2.5 0.013
10 2
DLW5BTH101TQ2K
DLW5BTH101TQ2B
DLW5BTH251TQ2L
20 250 3.0 2.0 0.020
DLW5BTH251TQ2K
DLW5BTH251TQ2B
DLW5BTH501TQ2L
30 500 2.5 1.5 0.027 DLW5BTH501TQ2K
DLW5BTH501TQ2B
DLW5BTH102TQ2L
60 1000 2.0 1.2 0.034
DLW5BTH102TQ2K
DLW5BTH102TQ2B
DLW5BTH142TQ2L
100 1400 1.5 1.0 0.056 DLW5BTH142TQ2K
DLW5BTH142TQ2B
(*)As for DLW5BTH_TQ type Rated Current is derated as following figure depending on the operating temperature.
· Operating Temperature : - 40 °C to + 125 °C · Storage Temperature : - 40 °C to + 125 °C
(6) Impedance (Typ. at 100MHz)
(7) Circuit
(8) Features
(9) Number of Line
(10) Packaging Code L : Taping (φ180mm/reel)
K : Taping (φ330mm/reel)
B : Bulk
Rated Current
at 105℃
Rated Current
at 125℃
105 125
Operating Temperature
(
Ambient temperature
)[℃]
Rated Current [A]
Sgec. No. JEFL243079120701 3g: Reference Onl
Spec. No. JEFL243C-9120-01 P 2/10
MURATA MFG CO., LTD.
Reference Only
4. Standard Testing Conditions
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. 15 ºC to 35 °C Temperature : 20 °C ± 2 °C
Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH) Humidity : 60 %(RH) to 70 %(RH)
Atmospheric pressure : 86 kPa to 106 kPa
5. Style and Dimensions
■ Unit Mass (Typical value)
0.21g
（in: mm）
No polarity
6. Marking
7. Electrical Performance
No. Item Specifications Test Method
7.1 Impedance
(|Z|) (at 10MHz)
Meet item 3. Measuring Equipment : KEYSIGHT 4191A or the
equivalents.
Measuring Frequency : 10MHz (ref. Item 9.)
7.2 Insulation
Resistance
(I.R.)
Measuring Equipment : R8340A or the equivalents.
Measuring voltage : Rated Voltage
Time : within 60 s (ref. Item 9.)
7.3 DC Resistance
(Rdc)
Measuring Current : 100 mA max. (ref. Item 9.)
(In case of doubt in the above mentioned standard
condition,measure by 4 terminal method.)
・
Top of the tape Tape
DLW5BT
Sprocket Hole
marking
(L)5.0±0.3
(W)5.0±0.3
3.6±0.3
±0.3
1.3
±0.3
0.9
±0.3
1.3
①②
1.7
±0.3
1.7
±0.3
1.3
±0.3
:
Electrode
④③
0.5
min.
0.45min.
2.35±0.15
3.0±0.5
0.5±0.3
:
M
arking
(TOP)
①
④
②
③
■
Equivalent Circuites
Sgec. No. JEFL243079120701 Tame A Impedance Wilhslandmg
Spec. No. JEFL243C-9120-01 P 3/10
MURATA MFG CO., LTD.
Reference Only
No. Item Specifications Test Method
7.4 Withstanding
Voltage
Products shall not be damaged. Test Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 seconds
Charge Current : 1 mA max. (ref. Item 9.)
8. Q200 Requirement
7-1. Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200 Murata Specification / Deviation
No. Stress Test Method
3 High
Temperature
Exposure
1000hours at 125 deg C
Set for 24hours at room temperature,
then measured.
Meet Table A after testing.
Table A
4 Temperature Cycling 1000cycles
-40 deg C to +125 deg C
Set for 24hours at room temperature,
then measured.
Meet Table A after testing.
5 Destructive
Physical Analysis
Per EIA469
No electrical tests
Not Applicable
7 Biased Humidity 1000hours at 85 deg C, 85%RH
Apply max rated voltage and current.
Meet Table A after testing.
Apply rated voltage.
(ref.item 9)
8 Operational Life Apply 125 deg C
1000hours
Set for 24hours at room temperature,
then measured
Meet Table A after testing.
Apply derating of rated current.
(ref.item 9)
9 External Visual Visual inspection No abnormalities
10 Physical Dimension Meet ITEM 5
（Style and Dimensions）
No defects
12 Resistance to
Solvents
Per MIL-STD-202 Method 215 Not Applicable
13 Mechanical Shock
Per MIL-STD-202 Method 213
Conditon F:
1500g’s(14.7N)/0.5ms/
Half sine
Meet Table A after testing.
14 Vibration 5g's(0.049N) for 20 minutes, 12cycles
each of 3 oritentations
Test from 10-2000Hz.
12cycles each of 3 orientations
Meet Table A after testing.
15 Resistance
to Soldering Heat
No-heating
Solder temperature
260C+/-5 deg C
Immersion time 10s
Pre-heating：150 to 180C / 90±30s
Meet Table A after testing.
17 ESD
Per AEC-Q200-002 Meet Table A after testing.
ESD Rank: Refer to Item 3. Rating.
Appearance No damaged.
Impedance
change
(at 10MHz)
within ± 20%
I.R. 10MΩ min.
Withstanding
Voltage No damaged.
Sgec. No. JEFL243C79120701 T P A E P T c 9.6 Opera‘ional Life (Supp‘y Terminal) 10. Impedance Frequency Characterislics (Typical) DLWSBTH 7T0 series 10000 Common Made DLWSBTHMZTQZ DLWSBTH1OZTQZ 1000 DstaTHsmTQz DLWSBTHZSHQZ E DLWSBTH101TQZ : E, a g 100 m 1: 3. E 10 1 - — ' - — Z : — ’ . ‘ Frequency (MHz) MURATAMFG CO.. LTD. 1 10 100
Spec. No. JEFL243C-9120-01 P 4/10
MURATA MFG CO., LTD.
Reference Only
AEC-Q200 Murata Specification / Deviation
No. Stress Test Method
18 Solderbility
Per J-STD-002 Method b : Not Applicable
90% of the terminations is to be soldered.
(except partly-exposed wire)
Flux:Ethanol solution of rosin,25(wt)% includes activator
equivalent to 0.06 to 0.10(wt)% chlorine
19 Electrical
Characterization
Measured : Impedance No defects
22
T
erminal Strength Per AEC-Q200-006
A
force of 17.7N
f
or 60sec
No defects
30 Electrical
T
ransient
Conduction
Per ISO-7637-2 Not Applicable
9. Terminal to be Tested When measuring and
supplying the voltage, the following terminal is applied.
No. Item Terminal to be Tested
9.1 Impedance (|Z|)
(Measurement Terminal)
9.2 DC Resistance (Rdc)
(Measurement Terminal)
9.3 Insulation Resistance (I.R.)
(Measurement Terminal)
9.4 Withstanding Voltage
(Measurement Terminal)
9.5 Biased Humidity (Supply Terminal)
9.6 Operational Life (Supply Terminal)
10. Impedance Frequency Characteristics (Typical)
1
10
100
1000
10000
1 10 100 1000
Impedance (ohm)
Frequency (MHz)
DLW5BTH _TQ series
Common Mode
Diffrential mode
DLW5BTH142TQ2
DLW5BTH102TQ2
DLW5BTH501TQ2
DLW5BTH251TQ2
DLW5BTH101TQ2
DLW5BTH142TQ2
DLW5BTH102TQ2
DLW5BTH501TQ2
DLW5BTH251TQ2
DLW5BTH101TQ2
Terminal
Terminal
Terminal Terminal
Terminal
Terminal
Terminal
Terminal
Sgec. No. JEFL243079120701 2.710. m% Pla =9 Dneclion of feed (in mm) mm ree‘) »
Spec. No. JEFL243C-9120-01 P 5/10
MURATA MFG CO., LTD.
Reference Only
11. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are
specified in item 14 except the case of being specified special condition.
12. Specification of Packaging
12.1. Appearance and Dimensions
*Dimension of the Cavity is measured
at the bottom side.
(in mm)
12.2. Specification of Taping
(1) Packing quantity (Standard quantity) φ180 mm reel : 700 pcs. / reel φ330 mm reel :2500 pcs. / reel
(2) Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous.The specified quantity per reel is kept.
12.3. Pull Strength of Plastic Tape
Plastic Tape 5 N min.
Cover Tape 10 N min.
12.4. Peeling off force of Cover Tape
0.2N to 0.7N (minimum value is typical.)
Speed of Peeling off : 300 mm / min
12.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
« Packaging Code : L (φ180mm reel) »
« Packaging Code : K (φ330mm reel) »
165 to 180 degree FCover tape
Plastic tape
160 min. 210 min.
190 min.
φ
13.0±0.2
φ
21.0±0.8
φ
180±
φ
60±
13±
17±1.4
1
0
0
3
Direction of feed
Trailer
1
0
Leader
Empty Tape Cover tape
(in mm)
Label
2.0±0.5
2.0±0.5
φ
13.0±0.5
φ
21.0±0.8
φ
330±2.0
φ
50 min.
14±1.5
2.0±0.5 (in mm)
210 min.
190 min.
Leader
Empty Tape Cover tape
Direction of feed
Trailer
160 min.
Label
2.7±0.1
0.4±0.05
8.0±0.1
4.0±0.1
φ
1.5
5.5±0.1
5.5
12.0±0.2
2.0±0.05
＋
0.1
－
0
5.5±0.1
1.75±0.1
Direction of feed
±0.05
Sgec. No. JEFL243079120701 erw ). 0000 & Outer Case Dimensions W D Smndard Reel 186 93 I a
Spec. No. JEFL243C-9120-01 P 6/10
MURATA MFG CO., LTD.
Reference Only
12.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity, etc
∗1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking » ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
12.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking (∗2), Quantity, etc
12.8 Specification of Outer Case
Reel
Outer Case Dimensions
(mm)
Standard Reel
Quantity in
Outer Case
(Reel)
W D H
φ180mm 186 186 93 4
φ330mm 340 340 85 4
∗ Above Outer Case size is typical. It depends on a quantity of an order.
13. △
! Caution
13.1. Mounting Direction
Mount products in right direction.
Wrong direction which is 90 ° rotated from right direction cause not open or short circuit but also flames
or other serious trouble.
13.2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and / or reliability requirements
to the applications listed in the above.
13.3 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
13.4 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be
caused by the abnormal function or the failure of our product.
right direction wrong direction
ZZ
W
D
Label
H
Sgec. No. JEFL2430»9120»01 Nouee Products can on This product is d Please oonsult u 14.1. Flux and Sold Flux Use rosinsbased flux.(with convening chlorine content 0.06 to 0.1(wl)%. ). Solder 14.2. Assembling < exclusive="" use="" of="" flow="" soldering="" soreflow="" sold="">< thermal="" shock=""> Presheating sh ceramic surfac should be ln 5 Not enough pr 14.3. Cleaning Con Do not clean a 14.4. Flesin coating The impedanc open circult is condition etc, some operatin attention when please make s 14.5. Anention regs The following (1) P.C.B. shall be [Products direction (2) Components loc lt l5 effectlve to imp lt is best to implant to reduce stress Contents of Me 1 Turn the m 2 Add sllts lrl 3 Keep the m l D )oooo : MURATAMFG (20., LTD.
Spec. No. JEFL243C-9120-01 P 7/10
MURATA MFG CO., LTD.
Reference Only
14.Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
14.1. Flux and Solder
Flux Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ),
but not highly acidic flux
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
14.2. Assembling
< Exclusive use of Reflow soldering >
Flow soldering may cause deterioration in insulation resistance.
So,reflow soldering shall be applied for this product.
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C max. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
Not enough preheating may cause deterioration in insulation resistance and / or crank or ceramic body.
14.3. Cleaning Conditions
Do not clean after soldering. If cleaning, please contact us.
14.4. Resin coating
The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under
some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful
attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating resin,
please make sure no reliability issue is observed by evaluating products mounted on your board.
14.5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
Products shall be location the sideways
direction (Length:a<b) to the mechanical
stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
〈
Poor example
〉〈
Good example
〉
b
a
Perforation
Slit
B
C
D
Sgec. No. JEFL2430»9120»01 CODE" Screw Hole Rec 14.6. Anenlion Regardin < the="" arrangemem="" of="" pr="" 'p.c.b.="" shall="" be="" desig="" far="" from="" the="" pomon="" o="" 'the="" portion="" of="" perfora="" as="" narrow="" as="" possible="" so="" as="" none="" be="" applie="" ofp="" c="" b="" separalion="" 'producls="" shall="" nol="" be="" line="" of="" a="" series="" of="" hole="" are="" big="" holes="" in="" p.c.b="" (because="" lhe="" slress="" c="" line="" of="" holes.)="">< products="" placing=""> 'Suppon pins shall be lo prevenr causing a during placing lhe pro side of P.C.B. < p.c.b.="" separation=""> . shall nol be se P.C.B. shall be separ 14.7. Slandard Land Dime \‘ {D ® l_ if I 5.5 EDD
Spec. No. JEFL243C-9120-01 P 8/10
MURATA MFG CO., LTD.
Reference Only
Pick- up nozzle
Support pin
P.C.B.
Product
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
14.6. Attention Regarding P.C.B. Design
< The Arrangement of Products >
•P.C.B. shall be designed so that products are
far from the portion of perforation.
•The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the case
of P.C.B. separation.
•Products shall not be arranged on the
line of a series of holes when there
are big holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
< Products Placing >
•Support pins shall be set under P.C.B.
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B..
< P.C.B. Separation >
•P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
14.7. Standard Land Dimensions
○
×
×
○
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Product
P.C.B.
Hole
○
×
0.9
2.9
5.5
1.3
3.3
4.7
*
①②③④
indicates terminal number
.
①②
④③
Resist
Copper foil pattern
No pattern
(in mm)
Screw Hole Recommended
Reference Onli Sgec. No. JEFL243079120701 a H77 l— |
Spec. No. JEFL243C-9120-01 P 9/10
MURATA MFG CO., LTD.
Reference Only
14.8. Reflow Soldering
(1) Standard printing pattern of solder paste
・Standard thickness of solder paste
should be 150 to 200µm.
Solderability is subject to reflow condition
and thermal conductivity.
Please make sure that your product has been evaluated
in view of your specifications with our product being
mounted to your product.
・Use the solder paste printing pattern of the
right pattern.
・For the resist and copper foil pattern,
use standard land dimensions.
・Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
(2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150～180°C 、90s±30s
Heating above 220°C、30s～60s above 230°C、60s max.
Peak temperature 250±3°C 260°C, 10s
Cycle of reflow 2 times 2 times
14.9. Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being mounted
by reflow soldering.
· Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.
· Tip temperature: 350°C max. · Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. · Times : 2times max.
Notes: Do not touch the products directly with the soldering iron.
0.9
2.9
5.5
1.3
3.3
4.7
(in mm)
150
90s±30s Time（ｓ）
250±3℃
Tem
p
.
(℃)
220℃
30～60s
180
260℃
230℃
60s max.
Limit Profile
Standard Profile
Reference Onl Sgec. No. JEFL2430»9120»01
Spec. No. JEFL243C-9120-01 P 10/10
MURATA MFG CO., LTD.
Reference Only
14.10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
14.11. Brushing of neighborhood of products
When you clean the neighborhood of products such as connector pins, bristles of cleaning brush
shall not be touched to the winding portion to prevent the breaking of wire.
14.12. Operating Environment
Do not use this product under the following environmental conditions,on deterioration of the performance,
such as inslation resistance may result from the use.
(1) in corrosive gases (acidic gases,alkaline gases,chlorine,sulfur gases,organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent,may splash on the products.
14.13. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
· Products should be stored in the warehouse on the following conditions.
Temperature : -10 °C to +40 °C
Humidity : 15 % to 85% relative humidity No rapid change on temperature and humidity.
·Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration.
Poor solderabirity due to the oxidized electrode.
·Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
·Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
·Products should not be stored under the air tights packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
15. △
!Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.