4902P Datasheet by MG Chemicals

Chemicals as 4902P C IANCE Frank (DRC conflict free (compliant compliant) Physical Properties Value Color Silvery-white metal Density 8.6 g/cm3 Electrical Properties Value Volume Resistivity 34.5 p9 cm Electrical Conductivity a) 4.5% IACS Thermal Properties Value Melting Point, Solidus Melting Point, Liquidus Tip Temperature Upper Limit 138 °c [280 °F] 138 °c [280 °F] Do not exceed 425 DC [800 DF]
4902P Technical Data Sheet
Sn42Bi57Ag1 Low Temperature Solder Paste
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA SAI Global File: 004008 4902P
Page 1 of 6
Date: 24 August 2020 / Ver. 1.03
Description
The 4902P Sn42Bi57Ag1 Low Temperature Solder Paste is made for low temperature applications. It
spreads and adheres well to a variety of materials and provides excellent soldering results and
appearance. This uniform paste dispenses evenly and resists solder beading and bright spots.
Applications & Usages
The solder paste is designed to is used for LEDs and telecommunication assemblies.
Benefits and Features
• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
• Flux meets J-STD-004B for ROM1
• Particle size Type 3 (with 80% min. between 25-45 µm)
• No-clean
• Excellent 12 mil (0.30 mm) fine pitch printing capability
• Long operational life—non-slumping
• Good wettability
• Halogen free
Sn42Bi57Ag1 Alloy Typical Literature Properties
Physical Properties
Value
Color
Silvery-white metal
Density
8.6 g/cm3
Electrical Properties
Value
Volume Resistivity
34.5 µΩcm
Electrical Conductivity a)
4.5% IACS
a) International Annealed Copper Standard: 100% give 5.8 × 107 S/m.
Thermal Properties
Value
Melting Point, Solidus
138 °C [280 °F]
Melting Point, Liquidus
138 °C [280 °F]
Tip Temperature Upper Limit
Do not exceed 425 °C [800 °F]
C
OMPLIANCE
Dobb-Frank (DRC conflict free)
REACH (compliant)
RoHS (compliant)
Chenucals as 4902P Properties Value Properties J-STD-OOGC MAIN INGREDIENTS IMPURITIES 3’ Sn 41.5 to 42.5% Sb 50 20% Max Bi 57.5 to 58.5% In 50 10% Max Ag 0.9% to 1.1% Cu 50 08% Max Pb 50 07% Max Au 50.03% Max 0’ As 50.05% Max B HS Fe 50 02% Max ‘ 0 Ni 50.01% Max % COMPLIANT Al 50.0050/0 Max Zn 50.003% Max Cd 50.002% Max
4902P Technical Data Sheet
Sn42Bi57Ag1 Low Temperature Solder Paste
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA SAI Global File: 004008 4902P
Page 2 of 6
Date: 24 August 2020 / Ver. 1.03
Solder Alloy Composition
Properties
Value
Properties
J-STD-006C
MAIN INGREDIENTS
IMPURITIES a)
Sn
41.5 to 42.5%
Sb
≤0.20% Max
Bi
57.5 to 58.5%
In
≤0.10% Max
Ag
0.9% to 1.1%
Cu
≤0.08% Max
Pb
≤0.07% Max
Au
≤0.03% Max
As
≤0.05% Max
Fe
≤0.02% Max
Ni
≤0.01% Max
Al
≤0.005% Max
Zn
≤0.003% Max
Cd
≤0.002% Max
a) Exceeds the requirements of J-STD-006C and meets ASTM B 32.
Particle Size
The powder distribution complies with the J-STD-005 Type 3 (with 80% min. between 25-45 µm) particle
sizes.
Storage and Shelf Life
The shelf life for an unopened container is 12 months at room temperature (20–25 °C [68–77 °F]) and 24
months refrigerated (2–10 °C [35–50 °F]), from the date of manufacture. Store syringes in an upright
position with tip down to prevent flux separation and air entrapment.
Bring the paste to room temperature prior to use. To warm the refrigerated paste, let the unopened
container stand for 4 hours at ambient temperature before use. For faster warm up, place the sealed
container in a water bath at ambient temperature for 30 minutes.
Reusing Solder Paste
Reusing solder paste is not normally recommended because it typically generates more complications than
it is worth. If you do decide to reuse solder paste, keep the following pointers in mind:
• Keep the paste tightly sealed and refrigerated when not in use.
• Store syringes upright position with tip down to prevent flux separation and air entrapment.
• Before reuse, check that the paste hasn’t separated or thickened relative to its usual state.
Chemicals as 4902P Flux Properties Method Value Flux Classification J—STD-004B ROMl Flux Type Rosin Flux Activity Moderate Halides %(wt) IPC-TM-6SO 2.3.28.1 50.15% Acid Value (mgKOH/g sample) IPC-TM-6SO 2.3.13 142 Copper Mirror IPC-TM-6SO 2.3.32 No penetration Electromigration @96 h IPC-TM-6SO 2.6.14.1 4 x 109 S) @596 h 4 X 109 S) JIS Z 3284 Pass Corrosion Test IPC-TM-6SO 2.6 Minor corrosion Surface Insulation Resistance (SIR) @96 h IPC-TM-6SO 2.6 22 X 109 S7 Surface Insulation Resistance (SIR) @168 h JIS Z 3284 Pass Paste Properties Method Value FILIX Content IPC-TM-6SO 2.4.2.3 11% Viscosity @10 rpm/min IPC-TM-6SO 2.4.34. 153 000 CP Adhesive Force @8 h IPC-TM-6SO 2.4.34.4 139 gf JIS Z 3284 131 gf Collapsibility IPC-TM-6SO 2.4.34.4 Pass
4902P Technical Data Sheet
Sn42Bi57Ag1 Low Temperature Solder Paste
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA SAI Global File: 004008 4902P
Page 3 of 6
Date: 24 August 2020 / Ver. 1.03
Properties of Flux
Flux Properties
Method
Value
Flux Classification
J-STD-004B
ROM1
Flux Type
Rosin
Flux Activity
Moderate
Halides %(wt)
IPC-TM-650 2.3.28.1
≤0.15%
Acid Value (mgKOH/g sample)
IPC-TM-650 2.3.13
142
Copper Mirror
IPC-TM-650 2.3.32
No penetration
Electromigration @96 h
IPC-TM-650 2.6.14.1
4 x 109 Ω
@596 h
4 x 109 Ω
JIS Z 3284
Pass
Corrosion Test
IPC-TM-650 2.6.15
Minor corrosion
Surface Insulation Resistance (SIR) @96 h
IPC-TM-650 2.6.3.7
≥2 x 109 Ω
Surface Insulation Resistance (SIR) @168 h
JIS Z 3284
Pass
Paste Properties
Method
Value
Flux Content
IPC-TM-650 2.4.2.3
11%
Viscosity @10 rpm/min
IPC-TM-650 2.4.34.2
153 000 cP
Adhesive Force @8 h
IPC-TM-650 2.4.34.4
139 gf
JIS Z 3284
131 gf
Collapsibility
IPC-TM-650 2.4.34.4
Pass
Note: The force in grams is denoted with the unit gf.
Pressure
The pressure applied in the syringe should be kept at a minimum, with a dispensing pressure of
0.05–0.06 MPa (7 to 9 lb/in2) and a dispensing frequency of 6 to a 120 times/min.
Solder Paste Application
Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the
paste enough time to reach thermal equilibrium with the environment. The flow rate of paste in a
dispensing application depends on viscosity, which can be altered by temperature change. If solder paste
is purchased in syringes, pre-mixing is not necessary due to the shear action produced from the
dispensing.
‘% Chemicals m2 4902P
4902P Technical Data Sheet
Sn42Bi57Ag1 Low Temperature Solder Paste
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA SAI Global File: 004008 4902P
Page 4 of 6
Date: 24 August 2020 / Ver. 1.03
Reflow
The following is a recommended profile for a forced air convection reflow process. The melting
temperature of the solder, the heat resistance of the components, and the characteristics of the PCB
(i.e. density, thickness, etc.) determine the actual reflow profile.
The Preheat Zone, which is also referred to as the ramp zone, is used to elevate the temperature of the
PCB to the desired soak temperature. In the preheat zone, the rate of temperature rise should not exceed
2.5 °C/s to avoid thermal chock stresses. The oven preheat zone normally occupies 25–33% of the heated
tunnel length.
The Soak Zone normally occupies 33–50% of the heated tunnel length. It exposes the PCB to a relatively
stable temperature that allows the components of different mass to reach a uniform temperature. The
soak zone also allows the flux to concentrate and the volatiles to escape from the paste.
The Reflow Zone, or spike zone, elevates the temperature of the PCB assembly from the activation
temperature to the recommended peak temperature. The activation temperature is always slightly below
the alloy melting point, while the peak temperature is always above its melting point.
Cleaning
The 4902P is a no clean formulation; therefore, the residues do not need to be removed for typical
applications. For spot residue removal, you may use MG 8241-T or 8241-W Isopropyl Alcohol Wipes.
0
20
40
60
80
100
120
140
160
180
200
050 100 150 200 250
Temperature (˚C)
time (s)
Reflow time
60–90 s
Peak Temperature 160–180 ˚C
Soak Temp.
110–139 ˚C
Preheat
≤1˚C/s
as 4902P £®§3fl§ HMIS® RATING NFPA® 704 CODES HEALTH: FLAMMABILITY: PERSONAL PROTECTION:
4902P Technical Data Sheet
Sn42Bi57Ag1 Low Temperature Solder Paste
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA SAI Global File: 004008 4902P
Page 5 of 6
Date: 24 August 2020 / Ver. 1.03
Working Environment
Solder paste performs best when used in a controlled environment. Maintaining ambient temperature of
between 22–28 °C [72-82 °F] at a relative humidity of 40–60% will ensure consistent performance and
maximum life of paste. Do not let the print temperature exceed 32 °C [89 °F].
Cleaning Misprint Boards
In case of a misprinted board, the paste may be cleaned by hand using the MG 8241 Alcohol Wipes.
Stencil Cleaning
Periodic cleaning of the stencil during production is recommended to prevent unwanted deposits outside
the print areas. Insufficient stencil cleaning increases solder balling. After printing 5 to 10 boards, we
therefore recommend a dry wipe. And after every 15 to 25 boards, we recommend a wet wipe with MG
8241-T or 8241-W Alcohol Wipe. For fine pitch boards, the cleaning frequency generally needs to be
increased.
Disposal
The 4902P should be stored in a sealed container and disposed of in accordance with state & local
authority requirements.
Health and Safety
Please see the 4902P Sn42Bi57Ag1 Low Temperature Solder Paste Safety Data Sheet (SDS) for more
details on transportation, storage, handling and other security guidelines.
Environmental Impact: Very toxic to aquatic life with long lasting effects.
This product meets the European Directive
2011/65/EU Annex II (ROHS);
recasting 2002/95/EC.
Health and Safety: This product may cause serious eye irritation. It is widely used in the packing and
food industry.
HMIS® RATING
NFPA® 704 CODES
HEALTH:
*
1
FLAMMABILITY:
0
PHYSICAL HAZARD:
0
PERSONAL PROTECTION:
Approximate HMIS and NFPA Risk Ratings Legend:
0 (Low or none); 1 (Slight); 2 (Moderate); 3 (Serious); 4 (Severe)
0
1
0
1
Chemicals as 4902P Cat. No. Packaging Net Weight 4902P-1SG Syringe 15 g 0.52 oz 4902P-256 Syringe 25 g 0.88 oz suggert©mgchemicals.com Mailing address: Manufacturing 8: Support vement suggestions, or p www.mgchemicals.com 1 2 10 Corporate Drive Burlington, Ontario, Canada L7L 5R6 Head Office 9347— 1 93rd Street Surrey, British Columbia, Canada V4N 4E7
4902P Technical Data Sheet
Sn42Bi57Ag1 Low Temperature Solder Paste
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA SAI Global File: 004008 4902P
Page 6 of 6
Date: 24 August 2020 / Ver. 1.03
Packaging and Supporting Products
Cat. No.
Packaging
Net Weight
4902P-15G
Syringe
15 g
0.52 oz
4902P-25G
Syringe
25 g
0.88 oz
Technical Support
Contact us regarding any questions, improvement suggestions, or problems with this product. Application
notes, instructions, and FAQs are located at www.mgchemicals.com.
Email: support@mgchemicals.com
Phone: +(1) 800-340-0772 (Canada, Mexico & USA)
+(1) 905-331-1396 (International)
+(44) 1663 362888 (UK & Europe)
Fax: +(1) 905-331-2862 or +(1) 800-340-0773
Mailing address:
Manufacturing & Support
Head Office
1210 Corporate Drive
9347–193rd Street
Burlington, Ontario, Canada
Surrey, British Columbia, Canada
L7L 5R6
V4N 4E7
Warranty
M.G. Chemicals Ltd. warranties this product for 12 months from the date of purchase by the end user.
M.G. Chemicals Ltd. makes no claims as to shelf life of this product for the warranty. The liability of M.G.
Chemicals Ltd. whether based on its warranty, contracts, or otherwise shall in no case include incidental or
consequential damage.
Disclaimer
This information is believed to be accurate. It is intended for professional end users having the skills to
evaluate and use the data properly. M.G. Chemicals Ltd. does not guarantee the accuracy of the data and
assumes no liability in connection with damages incurred while using it.