LM317L Datasheet by Texas Instruments

I TEXAS INSTRUMENTS LM317L
C1 = 0.1 µF
VI
470 W
R1
R2
C2 = 1 µF
VO
Adjustment
OutputInput
LM317L
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LM317L
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LM317L 3-Terminal Adjustable Regulator
1 Features 3 Description
The LM317L device is an adjustable, 3-terminal,
1 Output Voltage Range Adjustable 1.25 V to 32 V positive-voltage regulator capable of supplying
When Used With External Resistor Divider 100 mA over an output-voltage range of 1.25 V to
Output Current Capability of 100 mA 32 V. It is exceptionally easy to use and requires only
Input Regulation Typically 0.01% Per Input- two external resistors to set the output voltage.
Voltage Change Device Information
Output Regulation Typically 0.5% PART NUMBER PACKAGE BODY SIZE (NOM)
Ripple Rejection Typically 80 dB SOIC (8) 4.90 mm × 3.91 mm
For Higher Output Current Requirements, TO-92 (3) 4.30 mm × 4.30 mm
See LM317M (500 mA) and LM317 (1.5 A) LM317L SOT-89 (3) 4.50 mm × 2.50 mm
TSSOP (8) 3.00 mm × 4.40 mm
2 Applications
Electronic Points of Sale
Medical, Health, and Fitness Applications
• Printers
Appliances and White Goods
TV Set-Top Boxes
4 Simplified Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
8.3 Feature Description................................................... 7
1 Features.................................................................. 18.4 Device Functional Modes.......................................... 7
2 Applications ........................................................... 19 Application and Implementation .......................... 8
3 Description ............................................................. 19.1 Application Information.............................................. 8
4 Simplified Schematic............................................. 19.2 Typical Application ................................................... 8
5 Revision History..................................................... 29.3 General Configurations ........................................... 10
6 Pin Configuration and Functions......................... 310 Power Supply Recommendations ..................... 14
7 Specifications......................................................... 411 Layout................................................................... 14
7.1 Absolute Maximum Ratings ..................................... 411.1 Layout Guidelines ................................................. 14
7.2 Handling Ratings....................................................... 411.2 Layout Example .................................................... 14
7.3 Recommended Operating Conditions....................... 412 Device and Documentation Support ................. 15
7.4 Thermal Information.................................................. 412.1 Trademarks........................................................... 15
7.5 Electrical Characteristics........................................... 512.2 Electrostatic Discharge Caution............................ 15
7.6 Typical Characteristics.............................................. 512.3 Glossary................................................................ 15
8 Detailed Description.............................................. 613 Mechanical, Packaging, and Orderable
8.1 Overview ................................................................... 6Information ........................................................... 15
8.2 Functional Block Diagram......................................... 6
5 Revision History
Changes from Revision D (October 2011) to Revision E Page
Added Device Information table, Pin Functions table, Handling Ratings table, Thermal Information table, Typical
Characteristics,Detailed Description,Application and Implementation,Power Supply Recommendations, Layout,
Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections.............................. 1
Deleted Ordering Information table. ....................................................................................................................................... 1
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l TEXAS INSTRUMENTS D PACKAGE r—‘r—H—Hfi U PWPACKAGE [ U 1 [ J [ J [ J :I O :l :I
INPUT
OUTPUT
ADJUSTMENT
LP PACKAGE
(TOP VIEW)
INPUT
OUTPUT
ADJUSTMENT
PK PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
INPUT
OUTPUT
OUTPUT
ADJUSTMENT
NC
OUTPUT
OUTPUT
NC
D PACKAGE
(TOP VIEW)
NC – No internal connection
OUTPUT terminals are all internally connected.
1
2
3
4
8
7
6
5
INPUT
NC
NC
ADJUSTMENT
NC
NC
OUTPUT
NC
PW PACKAGE
(TOP VIEW)
NC – No internal connection
LM317L
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6 Pin Configuration and Functions
Pin Functions
NAME D, PW LP, PK TYPE DESCRIPTION
ADJUSTMENT 4 I Output feedback voltage
INPUT 1 I Input supply voltage
5
NC No connect
8
2
3
OUTPUT O Regulated output voltage
6
7
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7 Specifications
7.1 Absolute Maximum Ratings(1)
over operating temperature range (unless otherwise noted)
MIN MAX UNIT
Vl– VOInput-to-output differential voltage 35 V
TJOperating virtual-junction temperature 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 0 3000
pins(1)
V(ESD) Electrostatic discharge V
Charged device model (CDM), per JEDEC specification 0 2000
JESD22-C101, all pins(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN MAX UNIT
VOOutput voltage 1.25 32 V
VI– VOInput-to-output voltage differential 2.5 32 V
IOOutput current 2.5 100 mA
LM317LC 0 125
TJOperating virtual-junction temperature °C
LM317LI –40 125
7.4 Thermal Information
LM317L
THERMAL METRIC(1) UNIT
D LP PK PW
8 PINS 3 PINS 3 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 97.1 139.5 51.5 149.4 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
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0
1
2
±40 ±15 10 35 60 85 110
Change in adjustment current (A)
Operating temperature (C)
C001
LM317L
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7.5 Electrical Characteristics
over recommended operating virtual-junction temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
TJ= 25°C 0.01 0.02
Input voltage regulation(2) VI– VO= 5 V to 35 V %V
IO= 2.5 mA to 100 mA 0.02 0.05
VO= 10 V, f = 120 Hz 65
Ripple regulation dB
VO= 10 V, 66 80
10-μF capacitor between ADJUSTMENT and ground
VO5 V 25 mV
VI= 5 V to 35 V, TJ= 25°C,
IO= 2.5 mA to 100 mA, VO5 V 5 mV/V
Output voltage regulation VO5 V 50 mV
VI= 5 V to 35 V,
IO= 2.5 mA to 100 mA VO5 V 10 mV/V
Output voltage change with temperature TJ= 0°C to 125°C 10 mV/V
Output voltage long-term drift After 1000 hours at TJ= 125°C and VI– VO= 35 V 3 10 mV/V
Output noise voltage f = 10 Hz to 10 kHz, TJ= 25°C 30 μV/V
Minimum output current to maintain regulation VI– VO= 35 V 1.5 2.5 mA
Peak output current VI– VO35 V 100 200 mA
ADJUSTMENT current 50 100 μA
Change in ADJUSTMENT current VI– VO= 2.5 V to 35 V, IO= 2.5 mA to 100 mA 0.2 5 μA
VI– VO= 5 V to 35 V,
Reference voltage (output to ADJUSTMENT) IO= 2.5 mA to 100 mA, 1.2 1.25 1.3 V
Prated dissipation
(1) Unless otherwise noted, these specifications apply for the following test conditions: VI– VO= 5 V and IO= 40 mA. Pulse-testing
techniques must be used that maintain the junction temperature as close to the ambient temperature as possible. All characteristics are
measured with a 0.1-μF capacitor across the input and a 1-μF capacitor across the output.
(2) Input voltage regulation is expressed here as the percentage change in output voltage per 1-V change at the input.
7.6 Typical Characteristics
Figure 1. Change in Adjustment Current Over Temperature
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l TEXAS INSTRUMENTS Input Output
+
Over Temp &
Over Current
Protection
Input
Adj.
Output
1.25V
Iadj
LM317L
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8 Detailed Description
8.1 Overview
The LM317L device is a 100-mA linear regulator with high voltage tolerance up to 35 V. The device has a
feedback voltage that is relative to the output instead of ground. This ungrounded design allows the LM317L
device to have superior line and load regulation. This design also allows the LM317L device to be used as a
current source or current sink using a single resistor. Any output voltage from 1.25 to 32 V can be obtained by
using two resistors. The bias current of the device, up to 2.5 mA, flows to the output; this current must be used
by the load or the feedback resistors. The power dissipation is the product of pass-element voltage and current,
which is calculated as shown in Equation 1.
PD= (VIN – VOUT)×IOUT (1)
The application heat sink must be able to absorb the power calculated in Equation 1.
In addition to higher performance than fixed regulators, this regulator offers full overload protection, available
only in integrated circuits. Included on the chip are current-limiting and thermal-overload protection. All overload-
protection circuitry remains fully functional even when ADJUSTMENT is disconnected. Normally, no capacitors
are needed unless the device is situated far from the input filter capacitors, in which case an input bypass is
needed. An optional output capacitor can be added to improve transient response. ADJUSTMENT can be
bypassed to achieve very high ripple rejection, which is difficult to achieve with standard three-terminal
regulators.
In addition to replacing fixed regulators, the LM317L regulator is useful in a wide variety of other applications.
Since the regulator is floating and sees only the input-to-output differential voltage, supplies of several hundred
volts can be regulated as long as the maximum input-to-output differential is not exceeded. Its primary
application is that of a programmable output regulator, but by connecting a fixed resistor between ADJUSTMENT
and OUTPUT, this device can be used as a precision current regulator. Supplies with electronic shutdown can be
achieved by clamping ADJUSTMENT to ground, programming the output to 1.25 V, where most loads draw little
current.
The LM317LC device is characterized for operation over the virtual junction temperature range of 0°C to 125°C.
The LM317LI device is characterized for operation over the virtual junction temperature range of –40°C to 125°C.
8.2 Functional Block Diagram
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8.3 Feature Description
8.3.1 NPN Darlington Output Drive
NPN Darlington output topology provides naturally low output impedance and an output capacitor is optional. To
support maximum current and lowest temperature, 2.5-V headroom is recommended (VI– VO).
8.3.2 Overload Block
Over-current and over-temperature shutdown protects the device against overload or damage from operating in
excessive heat.
8.3.3 Programmable Feedback
Op amp with 1.25-V offset input at the ADJUST pin provides easy output voltage or current (not both)
programming. For current regulation applications, a single resistor whose resistance value is 1.25 V / IOUT and
power rating is greater than (1.25 V)2/ R should be used. For voltage regulation applications, two resistors set
the output voltage. See Typical Application for a schematic and the resistor formula.
8.4 Device Functional Modes
8.4.1 Normal operation
The device OUTPUT pin will source current necessary to make OUTPUT pin 1.25 V greater than ADJUST
terminal to provide output regulation.
8.4.2 Operation With Low Input Voltage
The device requires up to 2.5-V headroom (VI– VO) to operate in regulation. With less headroom, the device
may drop out and OUTPUT voltage will be INPUT voltage minus drop out voltage.
8.4.3 Operation at Light Loads
The device passes its bias current to the OUTPUT pin. The load or feedback must consume this minimum
current for regulation or the output may be too high.
8.4.4 Operation In Self Protection
When an overload occurs the device will shut down Darlington NPN output stage or reduce the output current to
prevent device damage. The device will automatically reset from the overload. The output may be reduced or
alternate between on and off until the overload is removed.
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l TEXAS INSTRUMENTS LM317L
C1 = 0.1 µF
VI
470 W
R1
R2
C2 = 1 µF
VO
Adjustment
OutputInput
LM317L
LM317L
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The two output resistors are the only components required to adjust VOUT.
9.2 Typical Application
9.2.1 Design Requirements
1. Use of an input bypass capacitor is recommended if regulator is far from the filter capacitors.
2. For this design example, use the parameters listed in Table 1.
3. Use of an output capacitor improves transient response, but is optional.
Table 1. Design Parameters
DESIGN PARAMETER EXAMPLE VALUE
Input voltage range (Output Voltage + 2.5 V) to 32 V
Output voltage VREF × (1 + R2/ R1)+IADJ × R2
9.2.2 Detailed Design Procedure
9.2.2.1 Input Capacitor
An input capacitor is not required, but it is recommended, particularly if the regulator is not in close proximity to
the power-supply filter capacitors. A 0.1-µF ceramic or 1-µF tantalum provides sufficient bypassing for most
applications, especially when adjustment and output capacitors are used.
9.2.2.2 Output Capacitor
An output capacitor improves transient response, but it not needed for stability.
9.2.2.3 Feedback Resistors
The feedback resistor set the output voltage using Equation 2.
VREF × (1 + R2/ R1)+IADJ × R2(2)
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VI VO (V)
VADJUSTMENT (V)
0 6.25 12.5 18.75 25 31.25 37.5 42.5
1.2
1.22
1.24
1.26
1.28
1.3
D001
40qC
0qC
25qC
125qC
2
OUT REF ADJ 2
1
R
V V 1 (I R )
R
æ ö
= ´ + + ´
ç ÷
è ø
LM317L
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9.2.2.4 Adjustment Terminal Capacitor
The optional adjustment pin capacitor will improve ripple rejection by preventing the amplification of the ripple.
When capacitor is used and VOUT > 6 V, a protection diode from adjust to output is recommended.
9.2.2.5 Design Options and Parameters
Common Linear Regulator designs are concerned with the following parameters:
Input voltage range
Input capacitor range
Output voltage
Output current rating
Output capacitor range
Input short protection
• Stability
Ripple rejection
9.2.2.6 Output Voltage
VOis calculated as shown in Equation 3.
(3)
Because IADJ typically is 50 µA, it is negligible in most applications.
9.2.2.7 Ripple Rejection
CADJ is used to improve ripple rejection; it prevents amplification of the ripple as the output voltage is adjusted
higher. If CADJ is used, it is best to include protection diodes.
9.2.2.8 Input Short Protection
If the input is shorted to ground during a fault condition, protection diodes provide measures to prevent the
possibility of external capacitors discharging through low-impedance paths in the IC. By providing low-impedance
discharge paths for COand CADJ, respectively, D1 and D2 prevent the capacitors from discharging into the output
of the regulator.
9.2.3 Application Curves
Figure 2. Adjustment Voltage Relative to Output Over Temperature
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l TEXAS INSTRUMENTS LM317L LM317L LM317L
VI
R1
Adjustment
OutputInput
LM317L
Ilimit
1.25
R1
=
VO
R2 = 3 kW
1N4002
R3 =
820 W
−10 V
C1 = 0.1 µF
35 V
Adjustment
OutputInput
LM317L
R1 = 120 W
2 3
OUT REF
1
R R
V V 1 10 V
R
æ ö
+
= + -
ç ÷
è ø
R1 =
470 W
D1
1N4002
C3 = 1 µF
C2 = 10 µF
R2 =
10 kW
VI
+
+
Adjustment
OutputInput
LM317L
VO
C1 =
0.1 µF
LM317L
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9.3 General Configurations
9.3.1 Regulator Circuit With Improved Ripple Rejection
C2 helps to stabilize the voltage at the adjustment pin, which will help reject noise. Diode D1 exists to discharge
C2 in case the output is shorted to ground.
Figure 3. Regulator Circuit With Improved Ripple Rejection
9.3.2 0-V to 30-V Regulator Circuit
In the 0-V to 30-V regulator circuit application, the output voltage is determined by Equation 4.
(4)
Figure 4. 0-V to 30-V Regulator Circuit
9.3.3 Precision Current-Limiter Circuit
This application will limit the output current to the ILIMIT shown in Figure 5.
Figure 5. Precision Current-Limiter Circuit
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l TEXAS INSTRUMENTS kQ LM317L uF
R1 =
470
R2 = 5.1 k
C1 = 25 µF
2N2905
R3 = 50 k
1N4002
VO= 15 V
VI
LM317L
Adjustment
OutputInput
R3 = 240
VI
C1 = 0.1 µF
C2 = 1 µF
Output
Adjust
VO
R2 = 1.5 k
R1 = 470
LM317L
R4 = 2 k
Adjustment
OutputInput LM317L
Adjustment
OutputInput
LM317L
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General Configurations (continued)
9.3.4 Tracking Preregulator Circuit
The tracking preregulator circuit application keeps a constant voltage across the second LM317L in the circuit.
Figure 6. Tracking Preregulator Circuit
9.3.5 Slow-Turn On 15-V Regulator Circuit
The capacitor C1, in combination with the PNP transistor, helps the circuit to slowly start supplying voltage. In the
beginning, the capacitor is not charged. Therefore, output voltage will start at 1.9 V, as determined by
Equation 5. As the capacitor voltage rises, VOUT will rise at the same rate. When the output voltage reaches the
value determined by R1 and R2, the PNP will be turned off.
VC1 + VBE + 1.25 V = 0 V + 0.65 V + 1.25 V = 1.9 V (5)
Figure 7. Slow-Turn On 15-V Regulator Circuit
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l TEXAS INSTRUMENTS LM317L LM317L as
1.1 k
240
V−
VI
LM317L
Adjustment
OutputInput
ICHG
RVBE
ICHG
VBE =
VI
24
LM317L
Adjustment
OutputInput
LM317L
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General Configurations (continued)
9.3.6 50-mA Constant-Current Battery-Charger Circuit
The current-limit operation mode can be used to trickle charge a battery at a fixed current as determined by
Equation 6. VIshould be greater than VBAT + 3.75 V.
ICHG = 1.25 V ÷ 24 Ω(6)
(1.25 V [VREF] + 2.5 V [headroom]) (7)
Figure 8. 50-mA Constant-Current Battery-Charger Circuit
9.3.7 Current-Limited 6-V Charger
As the charge current increases, the voltage at the bottom resistor increases until the NPN starts sinking current
from the adjustment pin. The voltage at the adjustment pin will drop, and consequently the output voltage will
decrease until the NPN stops conducting.
Figure 9. Current-Limited 6-V Charger
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l TEXAS INSTRUMENTS TIP73
500 W
VO
47 µF
1N4002
120 W
10 µF
10 µF
5 kW
22 W
5 kW
2N2905
TIP73
VI
RL
LM317L
Adjustment
OutputInput
LM317L
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General Configurations (continued)
9.3.8 High-Current Adjustable Regulator
This application allows higher currents at VOUT than the LM317L device can provide, while still keeping the output
voltage at levels determined by the adjustment-pin resistor divider of the LM317L.
Figure 10. High-Current Adjustable Regulator
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R1
OUTPUT
INPUT
OUTPUT
ADJ/GND
R2
Cadj
COUT
0.1 Fμ 10 Fμ
Ground
Ground
High
Frequency
Bypass
Capacitor
High Input
Bypass
Capacitor
Power
LM317L
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10 Power Supply Recommendations
The LM317L device is designed to operate from an input voltage supply range between 2.5 V to 32 V greater
than the output voltage. If the device is more than six inches from the input filter capacitors, an input bypass
capacitor, 0.1 µF or greater, of any type is needed for stability.
11 Layout
11.1 Layout Guidelines
It is recommended that the input pin be bypassed to ground with a bypass-capacitor.
The optimum placement is closest to the VIN of the device and GND of the system. Care must be taken to
minimize the loop area formed by the bypass-capacitor connection, the VIN pin, and the GND pin of the
system.
For operation at full-rated load, it is recommended to use wide trace lengths to eliminate IR drop and heat
dissipation.
11.2 Layout Example
Figure 11. Layout Diagram
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12 Device and Documentation Support
12.1 Trademarks
All trademarks are the property of their respective owners.
12.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.3 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Samples Samples Samples Samples Sample: Sample: Samples Samples Samples Samples Samples Samples Samples Samples Samples
PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM317LCD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 125 L317LC
LM317LCDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 125 L317LC
LM317LCDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 125 L317LC
LM317LCLP ACTIVE TO-92 LP 3 1000 RoHS & Green SN N / A for Pkg Type 0 to 125 L317LC
LM317LCLPR ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 0 to 125 L317LC
LM317LCLPRE3 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 0 to 125 L317LC
LM317LCPK ACTIVE SOT-89 PK 3 1000 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LA
LM317LCPKG3 ACTIVE SOT-89 PK 3 1000 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LA
LM317LCPW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 125 L317LC
LM317LCPWE4 ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 125 L317LC
LM317LCPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 125 L317LC
LM317LCPWRE4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 125 L317LC
LM317LCPWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 125 L317LC
LM317LID ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L317LI
LM317LIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 L317LI
LM317LIDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L317LI
LM317LILP ACTIVE TO-92 LP 3 1000 RoHS & Green SN N / A for Pkg Type -40 to 125 L317LI
LM317LILPR ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type -40 to 125 L317LI
LM317LIPK ACTIVE SOT-89 PK 3 1000 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LB
LM317LIPKG3 ACTIVE SOT-89 PK 3 1000 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LB
I TEXAS INSTRUMENTS Samples Samples
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM317LIPW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L317LI
LM317LIPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L317LI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM317LCDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM317LCDR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM317LCDRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM317LCPK SOT-89 PK 3 1000 180.0 12.4 4.91 4.52 1.9 8.0 12.0 Q3
LM317LCPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM317LIDR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM317LIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM317LIDRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM317LIPK SOT-89 PK 3 1000 180.0 12.4 4.91 4.52 1.9 8.0 12.0 Q3
LM317LIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2021
Pack Materials-Page 1
l TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM317LCDR SOIC D 8 2500 340.5 336.1 25.0
LM317LCDR SOIC D 8 2500 364.0 364.0 27.0
LM317LCDRG4 SOIC D 8 2500 340.5 336.1 25.0
LM317LCPK SOT-89 PK 3 1000 340.0 340.0 38.0
LM317LCPWR TSSOP PW 8 2000 367.0 367.0 35.0
LM317LIDR SOIC D 8 2500 364.0 364.0 27.0
LM317LIDR SOIC D 8 2500 340.5 336.1 25.0
LM317LIDRG4 SOIC D 8 2500 340.5 336.1 25.0
LM317LIPK SOT-89 PK 3 1000 340.0 340.0 38.0
LM317LIPWR TSSOP PW 8 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2021
Pack Materials-Page 2
MECHANICAL DATA PK (R—PSSO—FS) PLASTIC SlNGLE-IN—LINE PACKAGE w MED W AA a 5‘ b .6 lo » 0354 L ”NH/MD 02/2006 NOTS, A B C D AH Hnec' dimensmrs c'e m m'Hme‘ers Tm drawan ‘5 sumac: :0 change mm: name, We center Md ‘3 w c‘cdnca‘ comm w the mb Body dimensmns do nut mm mm flcsh ar aroms‘m Q ’ncrvuuw pud cuntum opuonm warm hose d'wmvsmns Dwmensamnq cnd tu‘erc'vc'mg per ASM: v14 SM 199:, Mod flush and protrusim nut (a exceed 015 per sice & :OHS wwihm JEDEC T137243 vc'chon AA, except m'm'murv \Cad \cnqth‘ pw 2 mwnm \cad wwdth, mwmm tab wwdth *3 TEXAS INSrRUMENTs www.1i.c0m
LAND PATTERN PK (R—PDSO-G3) anrvpte "ward tayth {\ cw #~V,DD ‘ No'v Sutdev Mm DeHed Pud Sotder Musk Cpemrq (Nate E) ~ Pod Geometry (Nate 5) 0,07 \ AH Around/ Exampe Stenc' Destgn (Nate D‘/ 4205221 /A 09/06 \OTS' A M wec' ctmsns m‘s C'e 'v mtthmeier: a Tm drawing guinea: to change thhOJt notice a D rubhcutton ”757735 ‘5 recom'nen d fur utterrute designs Luser Cuttmq cpe’tures wtth t’upezmdc watts am! utso rouncthq comers th (Her better caste re ease Customers shouts Contact twtr board assembty Stte to! Stenctt Cestgn Vecommefldahows Reter to VIP/321) t Custowcrs Shoutd Contact thew boavd fibflcattow Ste tor some“ mask iotcranccs actwcm and nromd Stqnat pacsv
‘J
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
Yl“‘+
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
PW0008A '
www.ti.com
PACKAGE OUTLINE
C
TYP
6.6
6.2
1.2 MAX
6X 0.65
8X 0.30
0.19
2X
1.95
0.15
0.05
(0.15) TYP
0 - 8
0.25
GAGE PLANE
0.75
0.50
A
NOTE 3
3.1
2.9
B
NOTE 4
4.5
4.3
4221848/A 02/2015
TSSOP - 1.2 mm max heightPW0008A
SMALL OUTLINE PACKAGE
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
18
0.1 C A B
5
4
PIN 1 ID
AREA
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
PW0008A
www.ti.com
EXAMPLE BOARD LAYOUT
(5.8)
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
8X (1.5)
8X (0.45)
6X (0.65)
(R )
TYP
0.05
4221848/A 02/2015
TSSOP - 1.2 mm max heightPW0008A
SMALL OUTLINE PACKAGE
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:10X
1
45
8
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
PW0008A
www.ti.com
EXAMPLE STENCIL DESIGN
(5.8)
6X (0.65)
8X (0.45)
8X (1.5)
(R ) TYP0.05
4221848/A 02/2015
TSSOP - 1.2 mm max heightPW0008A
SMALL OUTLINE PACKAGE
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SYMM
SYMM
1
45
8
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
GENERIC PACKAGE VIEW LP 3 TO-92 - 5.34 mm max heigm TRANSISTOR OUTLINE Images above are jusl a represenlalion of the package family, aclual package may vary Refel lo the product dala sheel for package details. 404000172/F I TEXAS INSTRI IMFNTS
www.ti.com
PACKAGE OUTLINE
3X 2.67
2.03
5.21
4.44
5.34
4.32
3X
12.7 MIN
2X 1.27 0.13
3X 0.55
0.38
4.19
3.17
3.43 MIN
3X 0.43
0.35
(2.54)
NOTE 3
2X
2.6 0.2
2X
4 MAX
SEATING
PLANE
6X
0.076 MAX
(0.51) TYP
(1.5) TYP
TO-92 - 5.34 mm max heightLP0003A
TO-92
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
EJECTOR PIN
OPTIONAL
PLANE
SEATING
STRAIGHT LEAD OPTION
321
SCALE 1.200
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL
TO STRAIGHT LEAD OPTION
SCALE 1.200
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND
TYP
(1.07)
(1.5) 2X (1.5)
2X (1.07)
(1.27)
(2.54)
FULL R
TYP
( 1.4)0.05 MAX
ALL AROUND
TYP
(2.6)
(5.2)
(R0.05) TYP
3X ( 0.9) HOLE
2X ( 1.4)
METAL
3X ( 0.85) HOLE
(R0.05) TYP
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
LAND PATTERN EXAMPLE
FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
SOLDER MASK
OPENING
METAL
2X
SOLDER MASK
OPENING
123
LAND PATTERN EXAMPLE
STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
METAL
TYP
SOLDER MASK
OPENING
2X
SOLDER MASK
OPENING
2X
METAL
12 3
““““““ \\\\\ ““ ““““ ““““““‘\\¢““““““\x‘ ““:\+““““‘w“xw‘
www.ti.com
TAPE SPECIFICATIONS
19.0
17.5
13.7
11.7
11.0
8.5
0.5 MIN
TYP-4.33.7
9.75
8.50
TYP
2.9
2.4 6.75
5.95
13.0
12.4
(2.5) TYP
16.5
15.5
32
23
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
FOR FORMED LEAD OPTION PACKAGE
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