Contents
1 Dimensions and Connections 3
2 Optical Characteristics 4
3 Absolute Maximum Ratings 5
4 Device Characteristics 5
5 I2C Interface Characteristics 8
5.1 START and STOP conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.2 Clocklowextension.......................................... 9
5.3 SlaveAddress............................................. 9
5.4 Protocol diagram description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.5 GeneralCall.............................................. 9
5.6 Reading Data from the Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.7 Writing Data to Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.8 ReadingEEPROM ........................................... 11
6 Data processing characteristics 12
6.1 Control and Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.2 Control Register Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7 Internal processing overview 17
7.1 Object and Ambient Temperatures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.2 Presence detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.3 Motiondetection ........................................... 18
7.4 Ambient temperature shock detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.5 Object temperature over or under limit detection . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.6 Hysteresis............................................... 20
8 Temperature Measurement 21
8.1 Calibration Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8.2 EEPROMcontent ........................................... 21
8.3 EEPROMDetails............................................ 21
8.4 Calculation of the Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
8.5 Calculation of the Object Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
9 Integration instructions and recommendations 24
9.1 PCB layout and Wiring Patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
9.2 Position................................................ 24
10 Packaging Specification 26
11 Statements 27
11.1Patents ................................................ 27
11.2Quality ................................................ 27
11.3RoHS ................................................. 27
11.4LiabilityPolicy............................................. 27
11.5Copyright............................................... 27