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Lead Forming Codes Datasheet by Rubycon
Fig.3
QSPECIFICATION TABLE
(mm?
Taning nude
T1
TA
T8
'.A®I\c$bl ’r—‘is. Na. '
. Fig.2
Fig.1
'Fséz
Bra at read
fleigm'ol b; y
Dwsranoe 1mm cemev to came! of next body 30.0
mm Ivofiyqfitgkrfihékm ‘ , L : 15.6103
Dismnce bsmesn Denial of driv-ng hole and lean P. 5.1 3.75
I w...” halesni}! mid} " ,
PM of [sad F 2.5
Wm cg gum}; cape W , I ,,
Wm of adheslve tape Wo 5.0 MIN
msvance bemmm Jam “7“,, was egg: ' Wa : 9.6- , ,,
Max. aHowabls dmams bemeen mmm and adheswe tape Edges W2 1.5 MAX
’msiahoe ifiiwéé’n 99an 91 man; 1121b and bé a} mm} H ‘ __ 1‘85 ‘ f 26.0 1 85%;? $0.75
Dwstsnca between new of drMns hole and clinch Den of bad He — I 6.0 7 ~ 10.5
mg. [535 ' 1 ' H L} , , ' 0.5:; MAX
Dia. 0! dflvins hale ¢Do 4.0 $0.2
0:1 sumpuém qt body‘mp '~ . "Ah , 1.6 MAX L
O" alignment of body mu AD 1.0 MAX
Sym yi mm «9; mama; and wash; ape m. lead a: ’ 1 0-5, 5:03
Quaniily (Des) 2000 1 000 500 250
away:
QTAPING SPECIFICATIONS
ODIMENSIONS
Fig.1
Max. BHIrnafle 651mg hawem mwmmam amaswa taps eagfi w2
1.5 1.5 MAX
‘08 new {a waguingnoléauyogurfi éfbodv‘ i, ”17.5 V ’ ’ ' , - 17’5‘ ' ‘
Dwstame between came! UVfiMng holes-1d chnch DGHDI Iead 160 -— 15.0 $0.5
.Bfiofileéfi”; 7' 7 , , ,f 05 V 'as _ ’: MAXI
Dia, m unwns We ¢>Da 4.0 4.0 1:02
wa|imfér7tomoywcg j 7 V ‘ » Ah 1(0‘ 7 , - 1-.0 MAXE
OH alimment 0' body 109 AD 1.0 La MAX
Sum oemmexhlmmwmafismps mafiml‘aau'd‘s y Q5 0,6 . 7:03
Gummy (pas)
2000 (4)81 000)
‘LEAD CUTI'ING FORMING SPECIFICATIONS
Hubycon provides Ieed-Iormed and lead-cut pvoducts to faciiitate mounting on primed circuit boards, as well as products
with ieads sneciaily processed (kink formed) for self suwoning insertions In printed civcuit boards.
- Lead forming (mm)
(¢5~¢8i n :6 Emma. 73'
Lead farming code : FA ‘ 3‘ 1
# 2 EMAX 510.5
(mm)
v Lead cutting ‘
5‘0 , , (CA)
(¢5~¢15) a
Lead cutting code ‘ CA ‘ i _E 4-D ' , (CC)
cc hum] 3.5 ., '(CE)
CE ms 05 015
2D 2.5 3,5
5‘0
- Kinked Iead forming
(¢5~0>3J
Kinked lead forming code :
v Kinked lead cunins
($1 O~¢1 8)
Kinked iead muting code : KC
KC’
—— Ezn z
p mx
£02
(mm)
2320.5
wu
Time A
-(¢10~¢1B)/Low profile with hmilomai mounnng
TYPE B
H105
-w ms
Q Q
Ft05
ha 5
R1 FIK RX 85 RI
0.8
5.0
4.0
A B A
(mm)
RK RX 86
0.8
7.5
4.0 3.5
E A B A B
35
frm; in!
wav-
CODE : GA
( Positive leading)
LEAD TYPE ( DIA. ¢12,5X20)
Ap ‘AP
\ ‘ l _
l i
l i l
i l . 4
\ i i
l
‘ l
‘ l
ind ‘
ii I
W
+ r
A 21
; oedeheoe 7‘77
. .
3 if
we
@%
Case Dia 4; mm
Symm' ¢12.5 Remarks
ltd 0.6 10.05 Dia of lead
L 22.0 MAX Height at body
P 25.4 :1.0 Distance tram center to center of body
F'u 12 7 102 Distance from center to center of driving hale
P1 3.85 10.5 Distance between center of driving hole and lead
P2 6.35 11.0 Distance between center of driving hole and body
F 5.0 10.8 Lead spacing
W 18.0 :0.3 Vifidth of mounting tape
Wu 5.0 MIN Width of adhesive tape
W1 9 0 :0 5 Distance between center of driving hole and edge of mounting tape
W2 15 MAX Max. allowable distance between mount and adhesive tape side
H 135 i075 Distance between center of driving hole and bottom of body
L1 0.5 MAX Protmsion of lead
tiDo 4.0 :02 Die. of driving hole
Ah 1.0 MAX Off alignment of body
Ap 1.0 MAX Off alignment at body
t 0.6 10.3 Sum 01 thickness for mounting and adhesive tape without lead dia.
PAGE 1/2
CODE : GC (Positive leading)
w
1 1 w»
X,
A
w
at:
LEAD TYPE ( DIA. $18)
P1
Case Dia 0 mm
Symbol Ma Remarks
ltd 0.8 1005 Die of lead
L 22.0 MAX Hight of body
P 30.0 110 Distance from center to center of body
P0 15.0 1-0.3 Distance from center to center of driving hale
P1 3.75 10.5 Distance between center of driving hale and lead
P2 7.5 11.0 Distance between center of driving hole and body
F 7.5 i023 Lead spacing
W 18.0 10.3 VWdth of mounting tape
Wu 5.0 MW VWdth of adhesive tape
W1 90 10.5 Distance between center of driving hole and edge of mounting tape
W2 15 MAX Max. allowable distance between mount and adhesive tape side
H 18.5 5325 Distance between center of driving hole and bottom of body
L1 0.5 MAX Protrusicn of lead
an 4.0 i0.2 Dia. of driving hole
Ah 1.0 MAX 0ft alignment of body
Ap 1 0 MAX of! alignment of body
1 0.6 $0.53 Sum of thickness for mounting and adhesive tape without lead dla.
BXA SERIES W“
RUBYCON CORPORATION
PAGE 2/2
CODE : 63 (Positiveleading)
LEAD TYPE ( DIA. $18)
$16% ApiAp
i IGLBA i
l l . i .
l l J i. i i 4
‘ ‘ 1 i i
ii i i i:
i i 1.
P1 ‘F. W \i/ 1
e . . _ i .
J g .
8?). We-.g--c-.-e.¢g.l~ .
i 1 LI U7
l Pa l Do
@%
Case Dia mm
Symbol $1: Remarks
¢d 0.8 10.05 Dia of lead
L 22.0 MAX Hight 01 body
P 25.4 11.0 Distance from center to center of body
P0 12.7 120.3 Distance from center to center of driving hole
P1 8.95 10.5 Distance between center ofdriving hole and lead
P2 12.7 11.0 Distance between center of driving hole and body
F 7.5 10.3 Lead spacing
W 18.0 10.3 Width of mounting tape
W5 50 MIN Width of adhesive tape
W1 9.0 10.5 Distance between center of driving hole and edge of mounting tape
W2 1.5 MAX Max. allowable distance between mount and adhesive laps sids
H 19.0 :0 15 Distance between center at driving hole and boflom of body
L1 0.5 MAX Protrusion of lead
¢Da 4.0 :0 2 Dia. of driving hole
Ah 1.0 MAX Off alignment of body
Ap 1.0 MAX Off alignment of body
t 0.5 10.3 Sum ofthickness for mounting and adhesive tape without lead dia.
BXA SERIES Rub—9°”
RUBYCON CORPORATION
Pi n “if? has? €20 ,
. $9.35 531 thu 5&5
pangs... m Emma man nun.» M+P>>gv ,.,w is?
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