USD

LQW2BANyyyy00L Series Spec Datasheet by Murata Electronics

View All Related Products | Download PDF Datasheet
Sgec N0.JELF243A701153701 LQWZBANSNZGOOL LQW2BAN8N2JOOL LQWZBAN1 1 NGOOL LQWZBAN11NJO0L LQWZBAN12NGO0L LQW2BAN12NJOOL LQWZBAN13NGO0L LQW2BAN13NJOOL LQWZBAN15NGO0L LQW2BAN15NJOOL LQWZBAN18NGO0L LQW2BAN18NJOOL LQWZBANZONGOOL LQW2BAN20NJOOL LQWZBANZZNGOOL LQW2BAN22NJOOL LQWZBANZANGOOL LQW2BAN24NJOOL LQWZBAN27NGO0L LQW2BAN27NJOOL LQWZBANSONGOOL LQW2BANSONJOOL LQWZBANSBNGOOL LQW2BAN33NJOOL LQWZBANSSNGOOL LQW2BAN36NJOOL LQWZBANSQNGOOL LQW2BAN39NJOOL LQWZBANABNGOOL LQW2BAN43NJOOL LQWZBAN47NGO0L LQW2BAN47NJOOL
Spec No.JELF243A-0115B-01 P.1/11
MURATA MFG.CO., LTD
Reference Only
CHIP COIL (CHIP INDUCTORS) LQW2BAN□□□□00L REFERENCE SPECIFICATION
1.Scope
This reference specification applies to LQW2BAN_00 Series Chip coil(Chip Inductors).
2.Part Numbering
(ex) LQ W 2B A N 47N G 0 0 L
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W) and
L:Taping
Characteristics
*B:Bulk
*Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3.Rating
Operating Temperature Range. –55°C ~ +125°C (includes self-heating)
Storage Temperature Range. –55°C ~ +125°C
Customer
Part Number
MURATA Part
Number
Inductance Q
(min.)
DC
Resistance
( max.)
Self
Resonant
Frequency
(MHz min.)
*1,*2
Rated
Current
(mA)
(nH) Tolerance
LQW2BAN3N2J00L 3.2
J±5%
95 0.02 13800 3800
LQW2BAN3N6J00L 3.6 75 0.05 11800 2000
LQW2BAN6N8J00L 6.8 90 0.03 6200 3000
LQW2BAN7N5J00L 7.5 85 0.04 3900 2400
LQW2BAN8N2G00L
8.2
G±2%
J±5%
80
0.09 3200 1500
LQW2BAN8N2J00L
LQW2BAN11NG00L
11
0.04
4700
2400
LQW2BAN11NJ00L
LQW2BAN12NG00L
12 4300
LQW2BAN12NJ00L
LQW2BAN13NG00L
13 3500
LQW2BAN13NJ00L
LQW2BAN15NG00L
15 70 0.12 1940 1500
LQW2BAN15NJ00L
LQW2BAN18NG00L
18
85
0.05
3620
2200
LQW2BAN18NJ00L
LQW2BAN20NG00L
20 2960
LQW2BAN20NJ00L
LQW2BAN22NG00L
22 0.07 1850 1900
LQW2BAN22NJ00L
LQW2BAN24NG00L
24 75 0.15 1970 1400
LQW2BAN24NJ00L
LQW2BAN27NG00L
27 85 0.07 2750
2000
LQW2BAN27NJ00L
LQW2BAN30NG00L
30 80 0.08 2000
LQW2BAN30NJ00L
LQW2BAN33NG00L
33
75
0.12
1900
1500
LQW2BAN33NJ00L
LQW2BAN36NG00L
36
0.08 1900
LQW2BAN36NJ00L
LQW2BAN39NG00L
39
LQW2BAN39NJ00L
LQW2BAN43NG00L
43 75 0.12 1720 1550
LQW2BAN43NJ00L
LQW2BAN47NG00L
47 70 0.20 1500 1250
LQW2BAN47NJ00L
Reference On Q Sgec N0.JELF243A»0115B»01 LQWZBAN51NGOOL LQWZBAN51NJO0L LQWZBANSGNGOOL LQWZBANSGNJOOL LQWZBANSZNGOOL LQWZBANGZNJOOL LQWZBANSSNGOOL LQWZBANGZ‘SNJOOL LQWZBAN75NGOOL LQWZBAN75NJO0L LQWZBANSZNGOOL LQWZBAN82NJO0L LQWZBAN91NGOOL LQWZBANSMNJOOL LQWZBANR10GOOL LQWZBANR10JO0L LQWZBANR1 1 GOOL LQWZBANR1 1 JOOL LQWZBANR12GOOL LQWZBANR12JO0L LQWZBANR13GOOL LQWZBANR13JO0L LQWZBANR15GOOL LQWZBANR15JO0L LQWZBANR16GOOL LQWZBANR16JO0L LQWZBANR18GOOL LQWZBANR18JO0L LQWZBANRZOGOOL LQWZBANRZOJOOL pera_|
Spec No.JELF243A-0115B-01 P.2/11
MURATA MFG.CO., LTD
Reference Only
Customer
Part Number
MURATA Part
Number
Inductance Q
(min.)
DC
Resistance
( max.)
Self
Resonant
Frequency
(MHz min.)
*1,*2
Rated
Current
(mA)
(nH) Tolerance
LQW2BAN51NG00L
51
G±2%
J±5%
75 0.11 1100 1800
LQW2BAN51NJ00L
LQW2BAN56NG00L
56
70
0.18 1600 1250
LQW2BAN56NJ00L
LQW2BAN62NG00L
62 0.12
1470
1650
LQW2BAN62NJ00L
LQW2BAN68NG00L
68 0.20 1250
LQW2BAN68NJ00L
LQW2BAN75NG00L
75 68 0.28 1450 1100
LQW2BAN75NJ00L
LQW2BAN82NG00L
82
70
0.24 1330 1200
LQW2BAN82NJ00L
LQW2BAN91NG00L
91 0.21 1140 1300
LQW2BAN91NJ00L
LQW2BANR10G00L
100 66 0.35
1200
1050
LQW2BANR10J00L
LQW2BANR11G00L
110
57 0.38 970
LQW2BANR11J00L
LQW2BANR12G00L
120
LQW2BANR12J00L
LQW2BANR13G00L
130 56 0.42 1000 950
LQW2BANR13J00L
LQW2BANR15G00L
150 58
0.46
920
930
LQW2BANR15J00L
LQW2BANR16G00L
160
53
LQW2BANR16J00L
LQW2BANR18G00L
180 0.58 800
LQW2BANR18J00L
LQW2BANR20G00L
200 0.63 750
LQW2BANR20J00L
*1 Derating of rated current shown by Figure 1 should be applied.
*2: When applied Rated current to the Products, self temperature rise shall be limited to 40 max..
4. Testing Conditions
Unless otherwise specified In case of doubt
Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C±2°C
Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH)
Atmospheric Pressure : 86kPa to 106 kPa
125
85
100
50
Current derating (%)
0
0
Temperature ()
.
Figure 1. Derating curve
Sgec No.JELF243A»O11SB»O1 % .—> 1.5:02 Measuring M
Spec No.JELF243A-0115B-01 P.3/11
MURATA MFG.CO., LTD
Reference Only
5. Appearance and Dimensions
6.Electrical Performance
No. Item Specification Test Method
6.1 Inductance
Inductance shall meet item 3. Measuring Equipment:
KEYSIGHT 4287A or equivalent
Measuring Frequency:
<Inductance> 250MHz/3.2nH39nH
200MHz/43nH75nH
150MHz/82nH130nH
100MHz/150nH200nH
<Q> 1500MHz/3.2nH,3.6nH
1000MHz/6.8nH8.2nH
500MHz/11nH100nH
250MHz/110nH200nH
Measuring Condition:
Test signal level / about 0dBm
Electrode spaces / 1.5 mm
Electrical length / 10.0mm
Measuring Fixture: KEYSIGHT 16197A
Position coil under test as shown in below and
contact coil with each terminal by adding weight.
Measuring Method:See the endnote.
<Electrical Performance:Measuring
Method of Inductance/Q>
6.2 Q Q shall meet item 3.
6.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter
6.4 Self Resonant
Frequency(SRF)
S.R.F shall meet item 3. Measuring Equipment: KEYSIGHT 8753C
or equivalent
Unit Mass (Typical value)
0.014g
1.42±0.1
0.25±0.15
1.5±0.2
0.5±0.1
(in mm)
2.09±0.2 1.53±0.2
1.5mm
Spec No.JELF243A»0115B»01 7.2 Bending Test 7.3 Vibration 23 amp Coll Sold /Subs Ins I I I l-—-I _ we (in mm) Applied Direction Force:10N Hold Durationz5s11s Substrate:Glass»epoxy substrate (100mmX40mmX1.0mm) Speed oprplying Forcezlmm / s Deflectionzamm Hold Durationz5s Oscillation Frequency 10HZ~2000HZ~10HZIOF15 mm Total amplitude 3 mm or Acceleration amplitude 196m/s‘ whichever IS smaller. Time : A period ol2 hours In each of 3 mutually perpendicular directions. (Total Ghours) 7.4 Solderability The wetting area of the electrode shall be at leasl 90% covered With new solder coating. Fluszthanol solution of rosin,25(wt)% Includes activator equivalent to 0.06(wl)% chlorine.(immersed for 5510 105) Solder:Sn»3,0Ag»0.SCu Pre»Heating:150°Ct10°C I 605 to 905 Solder Temperature:240°CtS°C Immersion Timezastls 7.5 Resistance to Soldering Heat AppearancezNo damage Inductance Change: within 5% Fluszthanol solution of rosin,25(wt)% Includes activator equivalent to 0.06(wl)% Chlorine,(immersed for 5510 105) Solder:Sn»3,0Ag»0.SCu Pre»Heating:150°Ct10°C I 605 to 905 Solder Temperature:270°CtS°C Immersion Time210stls Then measured after exposure In lhe room condition for 24h12h, MURATA MFG.CO . LTD
Spec No.JELF243A-0115B-01 P.4/11
MURATA MFG.CO., LTD
Reference Only
7.Mechanical Performance
No. Item Specification Test Method
7.1 Shear Test Chip coil shall not be damaged
after tested as test method.
Substrate:Glass-epoxy substrate
(in mm)
Applied Direction:
Force:10N
Hold Duration:5s±1s
7.2 Bending Test Substrate:Glass-epoxy substrate
(100mm×40mm×1.0mm)
Speed of Applying Force:1mm / s
Deflection:3mm
Hold Duration:5s
7.3 Vibration Oscillation Frequency:
10Hz~2000Hz~10Hz for 15 min
Total amplitude 3 mm or Acceleration
amplitude 196m/s2 whichever is smaller.
Time : A period of 2 hours in each of
3 mutually perpendicular directions.
(Total 6hours)
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux:Ethanol solution of rosin,25(wt)%
Includes activator equivalent to 0.06(wt)%
chlorine.(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
7.5 Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±5%
Flux:Ethanol solution of rosin,25(wt)%
Includes activator equivalent to 0.06(wt)%
Chlorine.(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:270°C±5°C
Immersion Time:10s±1s
Then measured after exposure in the room
condition for 24h±2h.
0.76
2.8
1.78
Chi
p
Coil Pattern
Solder resist
Substrate
Substrate
F
Chip Coil
45
R230
F
Deflection
45 Product
Pressure jig
(in mm)
Reference Onl Sgec N0.JELF243A70115B701
Spec No.JELF243A-0115B-01 P.5/11
MURATA MFG.CO., LTD
Reference Only
8.Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
8.1 Heat Resistance Appearance:No damage
Inductance Change: within ±5%
Q Change: within ±20%
Temperature:125°C±2°C
Time:1000h (+48h,0h)
Then measured after exposure in the room
condition for 24h±2h.
8.2 Cold Resistance Temperature:-55°C±2°C
Time:1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24±2 h.
8.3 Humidity Temperature:85°C±2°C
Humidity:85%(RH)
Time:1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2h.
8.4 Temperature
Cycle
1 cycle:
1 step:-55°C±2°C / 30min±3 min
2 step:Ordinary temp. / 10min to 15 min
3 step:+125°C±2°C / 30min±3 min
4 step:Ordinary temp. / 30min±3 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24h±2h.
9.Specification of Packaging
9.1 Appearance and Dimensions of plastic tape (8mm-wide, 4mm-pitch)
Dimension of the Cavity is measured at the bottom side.
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the plastic tape and sealed by Cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Plastic tape 5N min.
Cover tape 10N min.
2.3±0.1
φ
1.5
1.55±0.1
4.0±0.1
2.0±0.05
4.0±0.1
+0.1
-0
1.75±0.1
3.5±0.05
8.0±0.3
1.1±0.1
き出し方向
0.25
±
0.05
Direction of feed
(in mm)
1.8±0.1 1.65±0.1
Reference Onl m% Pla Sgec N0.JELF243A70115B701 0000 XXX
Spec No.JELF243A-0115B-01 P.6/11
MURATA MFG.CO., LTD
Reference Only
165 to 180 degree FCover tape
Plastic tape
9.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force 0.1N to 0.6N
(minimum value is typical)
9.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( cover tape and empty tape) and trailer-tape (empty tape) as follows.
(in mm)
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number( 1) , RoHS Marking ( 2),
Quantity etc ・・・
1) <Expression of Inspection No.> □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) <Expression of RoHS Marking > ROHS Y ()
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking ( 2) ,Quantity, etc ・・・
9.8. Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
10. Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
Empty tape
190 min.
Leader
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180
φ
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
Cover tape
+1
-0
Label
W
D
Label
H
Chip Coll Sold /Subs 1m 11.2 Flux, Solder -Use rosin»based f Includes middie ac Don'l use highly a Don'l use waler-s -Use Sn»3.0Ag»0.5 -Slandard thicknes 11.3 Flellow soldering co -Pre»heating shoul surface is limited lhal lhe lemperalu Insufficiem pre-he qualily. -Slandard solderin The excessive iim in lhe delerioralio -Reflow soldering p Pre»he Heating Peak le Cycle 0
Spec No.JELF243A-0115B-01 P.7/11
MURATA MFG.CO., LTD
Reference Only
11. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance
or solderability may be affected, or result to "position shift" in soldering process.
(in mm)
11.2 Flux, Solder
Use rosin-based flux.
Includes middle activator equivalent to 0.06(wt)% to 0.1(wt) % Chlorine.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder.
Standard thickness of solder paste : 100μm to 150μm.
11.3 Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way
that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245°C±3°C 260°C,10s
Cycle of reflow 2 times 2 times
Limit Profile
Standard Profile
90s±30s
230
260℃
245℃±3℃
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
0.76
2.8
1.78
Chi
p
Coil Pattern
Solder resist
Substrate
Reference Onl Sgec N0.JELF243A70115B701 I’ a I’ n I " Q I " _/_ m’fl _/7 4w
Spec No.JELF243A-0115B-01 P.8/11
MURATA MFG.CO., LTD
Reference Only
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter Φ3mm max.
Soldering time 3(+1,-0)s
Times 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
11.5 Solder Volume
Solder shall be used not to be exceed the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/2TtT
Tthickness of electrode
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
Products direction
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
Poor example
Good example
b
a
Recommendable(t)
Upper Limit
T
Recommendable(t)
Upper Limit
T
Seam
Slit
AD
BC
b
a
Length:a
<
b
Reference Onl SQec N0.JELF243A»O115B»01 ©|:|-'Cl Screw/Hole Recummended
Spec No.JELF243A-0115B-01 P.9/11
MURATA MFG.CO., LTD
Reference Only
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin,
or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine
by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted
on your board.
11.9 Caution for use
Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be
touched to the winding portion to prevent the breaking of wire.
Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.10 Notice of product handling at mounting
In some mounting machines,when picking up components support pin pushes up the components from the
bottom of plastic tape. In this case, please remove the support pin. The support pin may damage the
components and break wire.
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
Reference Onl Sgec N0.JELF243A70115B701
Spec No.JELF243A-0115B-01 P.10/11
MURATA MFG.CO., LTD
Reference Only
11.12 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature -10°C to 40°C
Humidity 15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause
oxidization of electrode, resulting in poor solderability.
Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and
so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
12 ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
Sgec N0.JELF243A70115B701 Reference Onl Fifi
Spec No.JELF243A-0115B-01 P.11/11
MURATA MFG.CO., LTD
Reference Only
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
Zm= V1 Zx=
V2
I 1 I
2
(3) Thus,the relation between Zx and Zm is following;
Zx= α Zm-β where, α= D / A =1
1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm : measured impedance of short chip
Zssa: residual impedance of short chip (0.771nH)
Yom: measured admittance when opening the fixture
(4) Lx shall be calculated with the following equation.
V1=A B V2
I 1C D I 2
Lx= Im(Zx) , Qx = Im(Zx) Lx : Inductance of chip coil
2πf Re(Zx) Qx : Q of chip coil
f : Measuring frequency
AB
CD
Zm Zx
V
12
12
ProductTest fixtureTest Head
II
V
<Electrical Performance:Measuring Method of Inductance/Q>

Products related to this Datasheet

FIXED IND 180NH 800MA 580MOHM SM
Available Quantity: 3,292
Unit Price: 0.51
FIXED IND 15NH 1.5A 120MOHM SMD
Available Quantity: 4,790
Unit Price: 0.53
FIXED IND 47NH 1.25A 200MOHM SMD
Available Quantity: 2,190
Unit Price: 0.51
FIXED IND 12NH 2.4A 40 MOHM SMD
Available Quantity: 2,103
Unit Price: 0.51
FIXED IND 100NH 1.05A 350MOHM SM
Available Quantity: 2,000
Unit Price: 0.22609
FIXED IND 13NH 2.4A 40 MOHM SMD
Available Quantity: 2,000
Unit Price: 0.22609
FIXED IND 15NH 1.5A 120MOHM SMD
Available Quantity: 2,000
Unit Price: 0.22609
FIXED IND 15NH 1.5A 120MOHM SMD
Available Quantity: 2,000
Unit Price: 0.21505
FIXED IND 20NH 2.2A 50 MOHM SMD
Available Quantity: 2,000
Unit Price: 0.22609
FIXED IND 20NH 2.2A 50 MOHM SMD
Available Quantity: 2,000
Unit Price: 0.21505
FIXED IND 24NH 1.4A 150MOHM SMD
Available Quantity: 2,000
Unit Price: 0.21505
FIXED IND 27NH 2A 70 MOHM SMD
Available Quantity: 2,000
Unit Price: 0.22609
FIXED IND 33NH 1.5A 120MOHM SMD
Available Quantity: 2,000
Unit Price: 0.21505
FIXED IND 36NH 1.9A 80 MOHM SMD
Available Quantity: 2,000
Unit Price: 0.21505
FIXED IND 39NH 1.9A 80 MOHM SMD
Available Quantity: 2,000
Unit Price: 0.21505
FIXED IND 43NH 1.55A 120MOHM SMD
Available Quantity: 2,000
Unit Price: 0.22609
FIXED IND 43NH 1.55A 120MOHM SMD
Available Quantity: 2,000
Unit Price: 0.21505
FIXED IND 68NH 1.25A 200MOHM SMD
Available Quantity: 2,000
Unit Price: 0.21505
FIXED IND 8.2NH 1.5A 90MOHM SMD
Available Quantity: 2,000
Unit Price: 0.21505
FIXED IND 160NH 930MA 460MOHM SM
Available Quantity: 2,000
Unit Price: 0.21505
FIXED IND 7.5NH 2.4A 40MOHM SMD
Available Quantity: 1,990
Unit Price: 0.51
FIXED IND 6.8NH 3A 30 MOHM SMD
Available Quantity: 1,938
Unit Price: 0.51
FIXED IND 8.2NH 1.5A 90MOHM SMD
Available Quantity: 1,910
Unit Price: 0.53
FIXED IND 33NH 1.5A 120MOHM SMD
Available Quantity: 1,859
Unit Price: 0.53
FIXED IND 180NH 800MA 580MOHM SM
Available Quantity: 1,842
Unit Price: 0.53
FIXED IND 82NH 1.2A 240MOHM SMD
Available Quantity: 1,719
Unit Price: 0.53
FIXED IND 150NH 930MA 460MOHM SM
Available Quantity: 1,749
Unit Price: 0.53
FIXED IND 12NH 2.4A 40 MOHM SMD
Available Quantity: 1,736
Unit Price: 0.53
FIXED IND 18NH 2.2A 50 MOHM SMD
Available Quantity: 1,727
Unit Price: 0.51
FIXED IND 130NH 950MA 420MOHM SM
Available Quantity: 1,621
Unit Price: 0.53