LQG15WZyyyy02D Series Spec Datasheet by Murata Electronics

SpecNoJELFZABBrmWDrOT Re fe r e n c e o n
SpecNo.JELF243B-9117D-01 P.1 / 12
MURATA MFG.CO., LTD
Reference Only
CHIP COIL (CHIP INDUCTORS) LQG15WZ□□□□02D
Murata Standard Reference Specification [AEC-Q200]
1.Scope
This reference specification applies to Chip coil (Chip Inductors) LQG15WZ series for Automotive Electoronics based on
AEC-Q200 except for Power train and Safety.
2.Part Numbering
(ex) LQ G 15 W Z 1N0 S 0 2 D
Product ID Struture Dimension Applications Category Inductance Tolerance Features Electrode Pakaging
(L×W) and for Automotive D:Taping
Characteristics Electoronics
3.Rating
Operating Temperature Range. –55°C to +125°C
Storage Temperature Range. –55°C to +125°C
Customer
Part Number MURATA
Part Number
Inductance
(nH) Tolerance Q
(min.)
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Rated
Current
(mA)
ESD Rank
1C:1kV
(*1)(refer to below comment)
LQG15WZ0N7B02D
0.7
B:±0.1nH
C:±0.2nH
S:±0.3nH
- 0.03
15000
1200
1C
LQG15WZ0N7C02D
LQG15WZ0N7S02D
LQG15WZ0N8B02D
0.8
LQG15WZ0N8C02D
LQG15WZ0N8S02D
LQG15WZ0N9B02D
0.9
LQG15WZ0N9C02D
LQG15WZ0N9S02D
LQG15WZ1N0B02D
1.0
LQG15WZ1N0C02D
LQG15WZ1N0S02D
LQG15WZ1N1B02D
1.1 14000
LQG15WZ1N1C02D
LQG15WZ1N1S02D
LQG15WZ1N2B02D
1.2 13000
LQG15WZ1N2C02D
LQG15WZ1N2S02D
LQG15WZ1N3B02D
1.3
12000
LQG15WZ1N3C02D
LQG15WZ1N3S02D
LQG15WZ1N4B02D
1.4
23
0.04
1000
LQG15WZ1N4C02D
LQG15WZ1N4S02D
LQG15WZ1N5B02D
1.5 11000
LQG15WZ1N5C02D
LQG15WZ1N5S02D
LQG15WZ1N6B02D
1.6
10000
LQG15WZ1N6C02D
LQG15WZ1N6S02D
LQG15WZ1N7B02D
1.7
LQG15WZ1N7C02D
LQG15WZ1N7S02D
LQG15WZ1N8B02D
1.8 9000
LQG15WZ1N8C02D
LQG15WZ1N8S02D
LQG15WZ1N9B02D
1.9 0.05 8000
LQG15WZ1N9C02D
LQG15WZ1N9S02D
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MURATA MFG.CO., LTD
Reference Only
Customer
Part Number MURATA
Part Number
Inductance
(nH) Tolerance Q
(min.)
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Rated
Current
(mA)
ESD Rank
1C:1kV
(*1)(refer to below comment)
LQG15WZ2N0B02D
2.0
B:±0.1nH
C:±0.2nH
S:±0.3nH 23
0.05
8000
1000
1C
LQG15WZ2N0C02D
LQG15WZ2N0S02D
LQG15WZ2N1B02D
2.1
0.06
LQG15WZ2N1C02D
LQG15WZ2N1S02D
LQG15WZ2N2B02D
2.2
LQG15WZ2N2C02D
LQG15WZ2N2S02D
LQG15WZ2N3B02D
2.3 0.07 7000
LQG15WZ2N3C02D
LQG15WZ2N3S02D
LQG15WZ2N4B02D
2.4 0.06
6500
LQG15WZ2N4C02D
LQG15WZ2N4S02D
LQG15WZ2N5B02D
2.5
0.07
900
LQG15WZ2N5C02D
LQG15WZ2N5S02D
LQG15WZ2N6B02D
2.6
LQG15WZ2N6C02D
LQG15WZ2N6S02D
LQG15WZ2N7B02D
2.7
LQG15WZ2N7C02D
LQG15WZ2N7S02D
LQG15WZ2N8B02D
2.8
0.08
LQG15WZ2N8C02D
LQG15WZ2N8S02D
LQG15WZ2N9B02D
2.9
LQG15WZ2N9C02D
LQG15WZ2N9S02D
LQG15WZ3N0B02D
3.0
6000
LQG15WZ3N0C02D
LQG15WZ3N0S02D
LQG15WZ3N1B02D
3.1
0.09
LQG15WZ3N1C02D
LQG15WZ3N1S02D
LQG15WZ3N2B02D
3.2
LQG15WZ3N2C02D
LQG15WZ3N2S02D
LQG15WZ3N3B02D
3.3 0.08
LQG15WZ3N3C02D
LQG15WZ3N3S02D
LQG15WZ3N4B02D
3.4
0.09
LQG15WZ3N4C02D
LQG15WZ3N4S02D
LQG15WZ3N5B02D
3.5 5800
LQG15WZ3N5C02D
LQG15WZ3N5S02D
LQG15WZ3N6B02D
3.6
5500
LQG15WZ3N6C02D
LQG15WZ3N6S02D
LQG15WZ3N7B02D
3.7
0.10
LQG15WZ3N7C02D
LQG15WZ3N7S02D
LQG15WZ3N8B02D
3.8 5000
LQG15WZ3N8C02D
LQG15WZ3N8S02D
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MURATA MFG.CO., LTD
Reference Only
Customer
Part Number MURATA
Part Number
Inductance
(nH) Tolerance Q
(min.)
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Rated
Current
(mA)
ESD Rank
1C:1kV
(*1)(refer to below comment)
LQG15WZ3N9B02D
3.9
B:±0.1nH
C:±0.2nH
S:±0.3nH
23
0.09
5000
900
1C
LQG15WZ3N9C02D
LQG15WZ3N9S02D
LQG15WZ4N1B02D
4.1
0.10
800
LQG15WZ4N1C02D
LQG15WZ4N1S02D
LQG15WZ4N3B02D
4.3
LQG15WZ4N3C02D
LQG15WZ4N3S02D
LQG15WZ4N7B02D
4.7 0.11
LQG15WZ4N7C02D
LQG15WZ4N7S02D
LQG15WZ5N1B02D
5.1 0.12
4500
LQG15WZ5N1C02D
LQG15WZ5N1S02D
LQG15WZ5N6B02D
5.6
0.13
LQG15WZ5N6C02D
LQG15WZ5N6S02D
LQG15WZ5N8B02D
5.8
4000
700
LQG15WZ5N8C02D
LQG15WZ5N8S02D
LQG15WZ6N2B02D
6.2
LQG15WZ6N2C02D
LQG15WZ6N2S02D
LQG15WZ6N8G02D
6.8
G:±2%
H:±3%
J:±5%
0.14
LQG15WZ6N8H02D
LQG15WZ6N8J02D
LQG15WZ7N3G02D
7.3 0.17
600
LQG15WZ7N3H02D
LQG15WZ7N3J02D
LQG15WZ7N5G02D
7.5
0.16
LQG15WZ7N5H02D
LQG15WZ7N5J02D
LQG15WZ8N2G02D
8.2 3600
550
LQG15WZ8N2H02D
LQG15WZ8N2J02D
LQG15WZ8N7G02D
8.7
0.17
3500
LQG15WZ8N7H02D
LQG15WZ8N7J02D
LQG15WZ9N1G02D
9.1 3400
LQG15WZ9N1H02D
LQG15WZ9N1J02D
LQG15WZ9N5G02D
9.5 0.21
3300 500
LQG15WZ9N5H02D
LQG15WZ9N5J02D
LQG15WZ10NG02D
10 0.19
LQG15WZ10NH02D
LQG15WZ10NJ02D
LQG15WZ11NG02D
11 0.22 3000
450
LQG15WZ11NH02D
LQG15WZ11NJ02D
LQG15WZ12NG02D
12 0.24
2800
LQG15WZ12NH02D
LQG15WZ12NJ02D
LQG15WZ13NG02D
13 0.26 400
LQG15WZ13NH02D
LQG15WZ13NJ02D
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MURATA MFG.CO., LTD
Reference Only
Customer
Part Number MURATA
Part Number
Inductance
(nH) Tolerance Q
(min.)
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Rated
Current
(mA)
ESD Rank
1C:1kV
(*1)(refer to below comment)
LQG15WZ15NG02D
15
G:±2%
H:±3%
J:±5%
23 0.28
2300
400
1C
LQG15WZ15NH02D
LQG15WZ15NJ02D
LQG15WZ16NG02D
16 20
0.8
260
LQG15WZ16NH02D
LQG15WZ16NJ02D
LQG15WZ18NG02D
18 22
LQG15WZ18NH02D
LQG15WZ18NJ02D
LQG15WZ19NG02D
19
20
0.8
LQG15WZ19NH02D
LQG15WZ19NJ02D
LQG15WZ20NG02D
20
1.1
2100
LQG15WZ20NH02D
LQG15WZ20NJ02D
LQG15WZ22NG02D
22
230
LQG15WZ22NH02D
LQG15WZ22NJ02D
LQG15WZ23NG02D
23 22
2000
LQG15WZ23NH02D
LQG15WZ23NJ02D
LQG15WZ24NG02D
24
20
1.2
LQG15WZ24NH02D
LQG15WZ24NJ02D
LQG15WZ27NG02D
27
1.3 1700
LQG15WZ27NH02D
LQG15WZ27NJ02D
LQG15WZ30NG02D
30
220
LQG15WZ30NH02D
LQG15WZ30NJ02D
LQG15WZ33NG02D
33
1.5
1600
LQG15WZ33NH02D
LQG15WZ33NJ02D
LQG15WZ36NG02D
36
190
LQG15WZ36NH02D
LQG15WZ36NJ02D
LQG15WZ39NG02D
39
1400
LQG15WZ39NH02D
LQG15WZ39NJ02D
LQG15WZ40NG02D
40
LQG15WZ40NH02D
LQG15WZ40NJ02D
LQG15WZ43NG02D
43
22
1.6
LQG15WZ43NH02D
LQG15WZ43NJ02D
LQG15WZ47NG02D
47
1300
LQG15WZ47NH02D
LQG15WZ47NJ02D
LQG15WZ51NG02D
51
1.8
LQG15WZ51NH02D
LQG15WZ51NJ02D
LQG15WZ56NG02D
56 1200
180
LQG15WZ56NH02D
LQG15WZ56NJ02D
LQG15WZ62NG02D
62 1.9 1100
LQG15WZ62NH02D
LQG15WZ62NJ02D
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MURATA MFG.CO., LTD
Reference Only
Customer
Part Number MURATA
Part Number
Inductance
(nH) Tolerance Q
(min.)
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Rated
Current
(mA)
ESD Rank
1C:1kV
(*1)(refer to below comment)
LQG15WZ68NG02D
68
G:±2%
H:±3%
J:±5%
22
2.0
1100
160
1C
LQG15WZ68NH02D
LQG15WZ68NJ02D
LQG15WZ72NG02D
72
2.2
LQG15WZ72NH02D
LQG15WZ72NJ02D
LQG15WZ75NG02D
75
LQG15WZ75NH02D
LQG15WZ75NJ02D
LQG15WZ82NG02D
82
2.3
900
LQG15WZ82NH02D
LQG15WZ82NJ02D
LQG15WZ91NG02D
91
23
LQG15WZ91NH02D
LQG15WZ91NJ02D
LQG15WZR10G02D
100 2.5
150
LQG15WZR10H02D
LQG15WZR10J02D
LQG15WZR11G02D
110
22
2.7
800
LQG15WZR11H02D
LQG15WZR11J02D
LQG15WZR12G02D
120 140
LQG15WZR12H02D
LQG15WZR12J02D
LQG15WZR13G02D
130 2.9
110
LQG15WZR13H02D
LQG15WZR13J02D
LQG15WZR15G02D
150 3.0
LQG15WZR15H02D
LQG15WZR15J02D
(*1) Standard Testing Conditions
Unless otherwise specified In case of doubt
Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C ± 2°C
Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH)
Atmospheric Pressure : 86kPa to 106 kPa
4. Appearance and Dimensions
Unit Mass (Typical value)
0.001g
(in mm)
Electrode
Polarity Marking
1.0±0.05
0.6±0.05
0.20.06
0.5±0.1
SpecNo.JELF243B79117D701 Re fe r e n C e O n I y No Tame A o A s E P M < r="" p="" m="" p="" c="">
SpecNo.JELF243B-9117D-01 P.6 / 12
MURATA MFG.CO., LTD
Reference Only
5.Electrical Performance
No. Item Specification Test Method
5.1
Inductance Inductance shall meet item 3. Measuring Equipment:
Keysight E4991A or equivalent
Measuring Frequency:100MHz (Inductance)
250MHz (Q)
Measuring Condition:
Test signal level/about 0dBm
Electrode spaces / 0.5mm
Electricallength/10mm
Weight/about 1N to 5N
Measuring Fixture: Keysight 16197A
Position coil under test as shown in below and
contact coil with each terminal by adding weight.
Polarity marking should be a topside,and polarity
marking should be in the direction of the fixture
for position of chip coil.
Measuring Method:See the endnote
[Electrical Performance:Measuring Method of
Inductance/Q]
5.2
Q Q shall meet item 3.
5.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter
5.4 Self Resonant
Frequency
(S.R.F)
S.R.F shall meet item 3. Measuring Equipment:
Keysight N5230A or equivalent
5.5 Rated Current Self temperature rise shall be
limited to 25°C max. The allowable current is applied.
6.Q200 Requirement
6.1.Performance (based on Table 5 for Magnetics(Inductors / Transformer)
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200 Murata Specification / Deviation
No Stress Test Method
3 High
Temperature
Exposure
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Table A
4 Temperature
Cycling 1000cycles
-40 deg C to +125 deg C
Set for 24hours at room
temperature,then
measured.
Meet Table A after testing.
7 Biased Humidity 1000hours at 85 deg C, 85%RH
unpowered. Meet Table A after testing.
8 Operational Life
A
pply 125 deg C 1000hours
Set for 24hours at room
temperature, then measured
Meet Table A after testing.
9 External Visual
V
isual inspection No abnormalities
10 Physical Dimension Meet ITEM 4
Style and Dimensions No defects
12 Resistance
t
o Solvents Per
MIL-STD-202
Method 215
Not Applicable
13 Mechanical Shock Per MIL-STD-202
Method 213
Condition C : 100g’s(0.98N),
6ms, Half sine, 12.3ft/s
Meet Table A after testing.
Appearance No damage
Inductance
Change
(at 100MHz) Within ±10%
SpecNoJELFZABBrmWDrOT Re fe r e n c e o n I 5 T s P 2 E P s P E F P B E D Tame B H T P A
SpecNo.JELF243B-9117D-01 P.7 / 12
MURATA MFG.CO., LTD
Reference Only
AEC-Q200 Murata Specification / Deviation
No Stress Test Method
14
V
ibration 5g's(0.049N) for 20 minutes,
12cycles each of 3 oritentations
est from 10-2000Hz.
Meet Table A after testing.
15 Resistance
to Soldering Heat No-heating
Solder temperature
260C+/-5 deg C
Immersion time 10s
Meet Table A after testing.
Pre-heating 150C +/-10 deg C, 60s to 90s
17 ESD Per AEC-Q200-002 ESD Rank: refer to the Item3 (Rating).
Meet Table A after testing
18 Solderbility Per J-STD-002 Method b : Not Applicable
90% of the terminations is to be soldered.
19 Electrical
Characterization Measured : Inductance No defects
20 Flammability Per UL-94 Not Applicable
21 Board Flex Epoxy-PCB(1.6mm)
Deflection 2mm(min)
Holding time 60s
Meet Table B after testing.
Table B
Appearance No damage
DC
resistance
Change Within ±10%
22
T
erminal Strength Per AEC-Q200-006
A
force of 17.7N
f
or 60s
Murata Deviation Request: 5N
No defects
7.Specification of Packaging
7.1 Appearance and Dimensions of paper tape (8mm-wide)
(in mm)
7.2 Specification of Taping
(1) Packing quantity (standard quantity)
10,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by top tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Top tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,and
are not continuous. The Specified quantity per reel is kept.
7.3 Pull Strength
Top tape 5N min.
φ1.5±0.1
4.0±0.1 2.0±0.05
0.75±0.04
1.18±0.04
3.5±0.05
1.75±0.05
8.00±0.2
0.8以下
向識別マ
出し方向
1.18±0.05
0.75±0.05
1.75±0.1
PolarityMarking
Directionoffeed
0.8max.
0.69
1.18
0.85max
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MURATA MFG.CO., LTD
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7.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force 0.1N to 0.6N
(minimum value is typical)
7.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
(in mm)
7.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1) ,RoHS Marking(2),
Quantity etc ・・・
1) <Expression of Inspection No.> □□ OOOO 
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digi : Day
(3) Serial No.
2) <Expression of RoHS Marking> ROHS – Y ()
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
7.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking(2) ,Quantity, etc ・・・
7.8. Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
8.
!Caution
8.1 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
8.2 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be
caused by the abnormal function or the failure of our product.
Empty tape
190 min.
Leader
Trailer
2.0±0.5
13.0±0.2
21.0±0.8
180
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
Top tape
+1
-0
Label
W
D
Label
H
F
165 to 180 degree Cover tape
Base tape
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MURATA MFG.CO., LTD
Reference Only
8.3 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
9. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9.1 Land pattern designing
a 0.5
b 1.2
c 0.65
(in mm)
9.2 Flux, Solder
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder.
Standard thickness of solder paste : 100μm to 150μm.
9.3 Reflow soldering conditions
Inductance value may be changed a little due to the amount of solder.
So, the chip coil shall be soldered by reflow so that the solder volume can be controlled.
Pre-heating should be in such a way that the temperature difference between solder and
product surface is limited to 150°C max. Cooling into solvent after soldering also should be in
such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245°C±3°C 260°C,10s
Cycle of reflow 2 times 2 times
a
b
Chip Coil LandSolder Resist
c
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3℃
220℃
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
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9.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1,-0)s
Time 2 times
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
9.5 Solder Volume
Solder shall be used not to be exceed the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/3TtT
Tthickness of product
9.6 Mount Shock
Over Mechanical stress to products at mounting process causes crack and electrical failure etc.
9.7 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subjected to the mechanical stress due to
warping the board.
Products direction
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
Upper Limit
Recommendable
t
Poor example
Good example
b
a
Perforation
Slit
A
B
C
D
SpecNo.JELF243B-9117D-01 ©D:|]->|]:I] Screw Hula Recommend 9.8 Cleanlng Condlllons Products shall be cleaned on the lullowing conditions. (1) Cleaning temperature shall be limited to echo ma (2) Ultrasonic cleaning shall comply with the lollowmg phenomenon at the mounted products and P.C.B Power : 20 W/l max. Frequency :28kH (3) Cleaner t. Alcohol type cleaner lsopropyl alcohol (IPA) 2. Aoueous agent PINE ALPHA snoos (4) There shall be no residual llux and residual cleaner products shall be dried completely atter rinse with (5) Other cleaning Please contact us. 9.9 Resln coatlng The inductance value may change and/or it may af curestress of resin to be used tor coating I molding pro you select resin. in prior to use, please make the reliability evaluation wi 9.10 Handllng ol 3 substrale Atter mounting products on a substrate, do not app lwisling lo the substrate when cropping the subsl substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in Bending . Twis 9.11 Storage and Handlng Requlremenls (1) Storage period Use the products within 6 months after deliveld. Solderabllity should be checked if this period is e (2) Storage conditions - Plcducls should be stored in lhe warehouse on Temperature 40°C to 40°C Humidity. 15% to 35% relative humidity Nu rapi Don't keep products in corrosive gases suc oxidization ol electrode, resulting in poor sold -Products should be storaged on the palette for the p 'Prcducls should be storaged in lhe warehouse wi -Products should be storaged under the airiight (3) Handling Condition Care should be taken when transporting or handling p MURATA MFG Reference 0n y
SpecNo.JELF243B-9117D-01 P.11 / 12
MURATA MFG.CO., LTD
Reference Only
(3)
Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
9.8 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,
products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
(5) Other cleaning Please contact us.
9.9 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high
cure-stress of resin to be used for coating / molding products. So please pay your careful attention when
you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
9.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
9.11 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after deliverd.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature: -10°C to 40°C
Humidity: 15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause
oxidization of electrode, resulting in poor solderability.
Products should be storaged on the palette for the prevention of the influence from humidity, dust and so on.
Products should be storaged in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be storaged under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
Screw Hole
Recommend
SpecNoJELFZABBrm 1 7001 Reference Only
SpecNo.JELF243B-9117D-01 P.12 / 12
MURATA MFG.CO., LTD
Reference Only
10
!Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
V
1 A B V
2
I 1 C D I
2
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
V
1 V
2
I
1 I 2
(3) Thus,the relation between Zx and Zm is following;
Zm-β where, α= D / A =1
1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm:measured impedance of short chip
Zss:residual impedance of short chip (0.556nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx) Im(Zx) Lx :Inductance of chip coil
2πf Re(Zx) Qx:Q of chip coil
f :Measuring frequency
=
Zm= Zx=
Zx=
Lx= Qx=
<Electrical Performance:Measuring Method of Inductance/Q>
AB
CD
Zm Zx
V
12
12
ProductTest fixtureTest Head
II
V