Zynq UltraScale+ MPSoC Overview Datasheet by AMD

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Product Specification 1

trademarks of Xilinx in the United States and other countries. AMBA, AMBA Designer, Arm, Arm1176JZ-S, CoreSight, Cortex, and PrimeCell are trademarks of Arm in the

EU and other countries. PCI, PCIe, and PCI Express are trademarks of PCI-SIG and are used under license. All other trademarks are the property of their respective owners.

General Description

The Zynq® UltraScale+™ MPSoC family is based on the Xilinx® UltraScale™ MPSoC architecture. This

family of products integrates a feature-rich 64-bit quad-core or dual-core Arm® Cortex™-A53 and

dual-core Arm Cortex-R5 based processing system (PS) and Xilinx programmable logic (PL) UltraScale

architecture in a single device. Also included are on-chip memory, multiport external memory interfaces,

and a rich set of peripheral connectivity interfaces.

Processing System (PS)

Arm Cortex-A53 Based Application

Processing Unit (APU)

•Quad-core or dual-core

•CPU frequency: Up to 1.5GHz

•Extendable cache coherency

•Armv8-A Architecture

o64-bit or 32-bit operating modes

oTrustZone security

oA64 instruction set in 64-bit mode,

A32/T32 instruction set in 32-bit mode

•NEON Advanced SIMD media-processing engine

•Single/double precision Floating Point Unit (FPU)

•CoreSight™ and Embedded Trace Macrocell (ETM)

•Accelerator Coherency Port (ACP)

•AXI Coherency Extension (ACE)

•Power island gating for each processor core

•Timer and Interrupts

oArm Generic timers support

oTwo system level triple-timer counters

oOne watchdog timer

oOne global system timer

•Caches

o32KB Level 1, 2-way set-associative

instruction cache with parity (independent for

each CPU)

o32KB Level 1, 4-way set-associative data

cache with ECC (independent for each CPU)

o1MB 16-way set-associative Level 2 cache

with ECC (shared between the CPUs)

Dual-core Arm Cortex-R5 Based

Real-Time Processing Unit (RPU)

•CPU frequency: Up to 600MHz

•Armv7-R Architecture

oA32/T32 instruction set

•Single/double precision Floating Point Unit (FPU)

•CoreSight™ and Embedded Trace Macrocell

(ETM)

•Lock-step or independent operation

•Timer and Interrupts:

oOne watchdog timer

oTwo triple-timer counters

•Caches and Tightly Coupled Memories (TCMs)

o32KB Level 1, 4-way set-associative

instruction and data cache with ECC

(independent for each CPU)

o128KB TCM with ECC (independent for each

CPU) that can be combined to become 256KB

in lockstep mode

On-Chip Memory

•256KB on-chip RAM (OCM) in PS with ECC

•Up to 36Mb on-chip RAM (UltraRAM) with ECC in

•Up to 35Mb on-chip RAM (block RAM) with ECC

in PL

•Up to 11Mb on-chip RAM (distributed RAM) in PL

Zynq UltraScale+ MPSoC Data Sheet:

Overview

DS891 (v1.7) November 12, 2018 Product Specification

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Zynq UltraScale+ MPSoC Data Sheet: Overview

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Product Specification 2

Arm Mali-400 Based GPU

•Supports OpenGL ES 1.1 and 2.0

•Supports OpenVG 1.1

•GPU frequency: Up to 667MHz

•Single Geometry Processor, Two Pixel Processors

•Pixel Fill Rate: 2 Mpixels/sec/MHz

•Triangle Rate: 0.11 Mtriangles/sec/MHz

•64KB L2 Cache

•Power island gating

External Memory Interfaces

•Multi-protocol dynamic memory controller

•32-bit or 64-bit interfaces to DDR4, DDR3,

DDR3L, or LPDDR3 memories, and 32-bit

interface to LPDDR4 memory

•ECC support in 64-bit and 32-bit modes

•Up to 32GB of address space using single or dual

rank of 8-, 16-, or 32-bit-wide memories

•Static memory interfaces

oeMMC4.51 Managed NAND flash support

oONFI3.1 NAND flash with 24-bit ECC

o1-bit SPI, 2-bit SPI, 4-bit SPI (Quad-SPI), or

two Quad-SPI (8-bit) serial NOR flash

8-Channel DMA Controller

•Two DMA controllers of 8-channels each

•Memory-to-memory, memory-to-peripheral,

peripheral-to-memory, and scatter-gather

transaction support

Serial Transceivers

•Four dedicated PS-GTR receivers and

transmitters supports up to 6.0Gb/s data rates

oSupports SGMII tri-speed Ethernet, PCI

Express® Gen2, Serial-ATA (SATA), USB3.0,

and DisplayPort

Dedicated I/O Peripherals and

Interfaces

•PCI Express — Compliant with PCIe® 2.1 base

specification

oRoot complex and End Point configurations

ox1, x2, and x4 at Gen1 or Gen2 rates

•SATA Host

o1.5, 3.0, and 6.0Gb/s data rates as defined by

SATA Specification, revision 3.1

oSupports up to two channels

•DisplayPort Controller

oUp to 5.4Gb/s rate

oUp to two TX lanes (no RX support)

•Four 10/100/1000 tri-speed Ethernet MAC

peripherals with IEEE Std 802.3 and IEEE Std 1588

revision 2.0 support

oScatter-gather DMA capability

oRecognition of IEEE Std 1588 rev.2 PTP frames

oGMII, RGMII, and SGMII interfaces

oJumbo frames

•Two USB 3.0/2.0 Device, Host, or OTG peripherals,

each supporting up to 12 endpoints

oUSB 3.0/2.0 compliant device IP core

oSuper-speed, high- speed, full-speed, and

low-speed modes

oIntel XHCI- compliant USB host

•Two full CAN 2.0B-compliant CAN bus interfaces

oCAN 2.0-A and CAN 2.0-B and ISO 118981-1

standard compliant

•Two SD/SDIO 2.0/eMMC4.51 compliant

controllers

•Two full-duplex SPI ports with three peripheral

chip selects

•Two high-speed UARTs (up to 1Mb/s)

•Two master and slave I2C interfaces

•Up to 78 flexible multiplexed I/O (MIO) (up to

three banks of 26 I/Os) for peripheral pin

assignment

•Up to 96 EMIOs (up to three banks of 32 I/Os)

connected to the PL

Interconnect

•High-bandwidth connectivity within PS

and between PS and PL

•Arm AMBA® AXI4-based

•QoS support for latency and bandwidth control

•Cache Coherent Interconnect (CCI)

System Memory Management

•System Memory Management Unit (SMMU)

•Xilinx Memory Protection Unit (XMPU)

Platform Management Unit

•Power gates PS peripherals, power islands, and

power domains

•Clock gates PS peripheral user firmware option

Configuration and Security Unit

•Boots PS and configures PL

•Supports secure and non-secure boot modes

System Monitor in PS

•On-chip voltage and temperature sensing

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Product Specification 3

Programmable Logic (PL)

Configurable Logic Blocks (CLB)

•Look-up tables (LUT)

•Flip-flops

•Cascadable adders

36Kb Block RAM

•True dual-port

•Up to 72 bits wide

•Configurable as dual 18Kb

UltraRAM

•288Kb dual-port

•72 bits wide

•Error checking and correction

DSP Blocks

•27 x 18 signed multiply

•48-bit adder/accumulator

•27-bit pre-adder

Programmable I/O Blocks

•Supports LVCMOS, LVDS, and SSTL

•1.0V to 3.3V I/O

•Programmable I/O delay and SerDes

JTAG Boundary-Scan

•IEEE Std 1149.1 Compatible Test Interface

PCI Express

•Supports Root complex and End Point

configurations

•Supports up to Gen3 speeds

•Up to five integrated blocks in select devices

100G Ethernet MAC/PCS

•IEEE Std 802.3 compliant

•CAUI-10 (10x 10.3125Gb/s) or

CAUI-4 (4x 25.78125Gb/s)

•RSFEC (IEEE Std 802.3bj) in CAUI-4 configuration

•Up to four integrated blocks in select devices

Interlaken

•Interlaken spec 1.2 compliant

•64/67 encoding

•12 x 12.5Gb/s or 6 x 25Gb/s

•Up to four integrated blocks in select devices

Video Encoder/Decoder (VCU)

•Available in EV devices

•Accessible from either PS or PL

•Simultaneous encode and decode

•H.264 and H.265 support

System Monitor in PL

•On-chip voltage and temperature sensing

•10-bit 200KSPS ADC with up to 17 external inputs

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Product Specification 4

Feature Summary

Table 1: Zynq UltraScale+ MPSoC: CG Device Feature Summary

ZU2CG ZU3CG ZU4CG ZU5CG ZU6CG ZU7CG ZU9CG

Application Processing Unit Dual-core Arm Cortex-A53 MPCore with CoreSight; NEON & Single/Double Precision Floating Point;

32KB/32KB L1 Cache, 1MB L2 Cache

Real-Time Processing Unit Dual-core Arm Cortex-R5 with CoreSight; Single/Double Precision Floating Point; 32KB/32KB L1

Cache, and TCM

Embedded and External

Memory 256KB On-Chip Memory w/ECC; External DDR4; DDR3; DDR3L; LPDDR4; LPDDR3;

External Quad-SPI; NAND; eMMC

General Connectivity 214 PS I/O; UART; CAN; USB 2.0; I2C; SPI; 32b GPIO; Real Time Clock; WatchDog Timers; Triple

Timer Counters

High-Speed Connectivity 4 PS-GTR; PCIe Gen1/2; Serial ATA 3.1; DisplayPort 1.2a; USB 3.0; SGMII

System Logic Cells 103,320 154,350 192,150 256,200 469,446 504,000 599,550

CLB Flip-Flops 94,464 141,120 175,680 234,240 429,208 460,800 548,160

CLB LUTs 47,232 70,560 87,840 117,120 214,604 230,400 274,080

Distributed RAM (Mb) 1.2 1.8 2.6 3.5 6.9 6.2 8.8

Block RAM Blocks 150 216 128 144 714 312 912

Block RAM (Mb) 5.3 7.6 4.5 5.1 25.1 11.0 32.1

UltraRAM Blocks 0 0 48 64 0 96 0

UltraRAM (Mb) 0 0 13.5 18.0 0 27.0 0

DSP Slices 240 360 728 1,248 1,973 1,728 2,520

CMTs 3344484

Max. HP I/O(1) 156 156 156 156 208 416 208

Max. HD I/O(2) 96 96 96 96 120 48 120

System Monitor 2222222

GTH Transceiver 16.3Gb/s(3) 0 0 16 16 24 24 24

GTY Transceivers 32.75Gb/s0000000

Transceiver Fractional PLLs0088121212

PCIe Gen3 x16 0022020

150G Interlaken 0000000

100G Ethernet w/ RS-FEC0000000

Notes:

1. HP = High-performance I/O with support for I/O voltage from 1.0V to 1.8V.

2. HD = High-density I/O with support for I/O voltage from 1.2V to 3.3V.

3. GTH transceivers in the SFVC784 package support data rates up to 12.5Gb/s. See Table 2.

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Product Specification 5

Table 2: Zynq UltraScale+ MPSoC: CG Device-Package Combinations and Maximum I/Os

Package

(1)(2)(3)(4)(5)

Package

Dimensions

(mm)

ZU2CG ZU3CG ZU4CG ZU5CG ZU6CG ZU7CG ZU9CG

HD, HP

GTH, GTY HD, HP

GTH, GTY

SBVA484(6) 19x19 24, 58

0, 0 24, 58

0, 0

SFVA625 21x21 24, 156

0, 0 24, 156

0, 0

SFVC784(7) 23x23 96, 156

0, 0 96, 156

4, 0 96, 156

4, 0

FBVB900 31x31 48, 156

16, 0 48, 156

16, 0

FFVC900 31x31 48, 156

16, 0 48, 156

16, 0

FFVB1156 35x35 120, 208

24, 0 120, 208

24, 0

FFVC1156 35x35 48, 312

20, 0

FFVF1517 40x40 48, 416

24, 0

Notes:

1. Go to Ordering Information for package designation details.

2. FB/FF packages have 1.0mm ball pitch. SB/SF packages have 0.8mm ball pitch.

3. All device package combinations bond out 4 PS-GTR transceivers.

4. All device package combinations bond out 214 PS I/O except ZU2CG and ZU3CG in the SBVA484 and SFVA625 packages,

which bond out 170 PS I/Os. Packages that bond out 170 PS I/O support DDR 32-bit only.

5. Packages with the same last letter and number sequence, e.g., A484, are footprint compatible with all other UltraScale

devices with the same sequence. The footprint compatible devices within this family are outlined.

6. All 58 HP I/O pins are powered by the same VCCO supply.

7. GTH transceivers in the SFVC784 package support data rates up to 12.5Gb/s.

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Product Specification 6

Table 3: Zynq UltraScale+ MPSoC: EG Device Feature Summary

ZU2EG ZU3EG ZU4EG ZU5EG ZU6EG ZU7EG ZU9EG ZU11EG ZU15EG ZU17EG ZU19EG

Application Processing Unit Quad-core Arm Cortex-A53 MPCore with CoreSight; NEON & Single/Double Precision Floating Point; 32KB/32KB L1 Cache, 1MB L2 Cache

Real-Time Processing Unit Dual-core Arm Cortex-R5 with CoreSight; Single/Double Precision Floating Point; 32KB/32KB L1 Cache, and TCM

Embedded and External

Memory 256KB On-Chip Memory w/ECC; External DDR4; DDR3; DDR3L; LPDDR4; LPDDR3;

External Quad-SPI; NAND; eMMC

General Connectivity 214 PS I/O; UART; CAN; USB 2.0; I2C; SPI; 32b GPIO; Real Time Clock; WatchDog Timers; Triple Timer Counters

High-Speed Connectivity 4 PS-GTR; PCIe Gen1/2; Serial ATA 3.1; DisplayPort 1.2a; USB 3.0; SGMII

Graphic Processing Unit Arm Mali™-400 MP2; 64KB L2 Cache

System Logic Cells 103,320 154,350 192,150 256,200 469,446 504,000 599,550 653,100 746,550 926,194 1,143,450

CLB Flip-Flops 94,464 141,120 175,680 234,240 429,208 460,800 548,160 597,120 682,560 846,806 1,045,440

CLB LUTs 47,232 70,560 87,840 117,120 214,604 230,400 274,080 298,560 341,280 423,403 522,720

Distributed RAM (Mb) 1.21.82.63.56.96.28.89.111.38.09.8

Block RAM Blocks 150 216 128 144 714 312 912 600 744 796 984

Block RAM (Mb) 5.3 7.6 4.5 5.1 25.1 11.0 32.1 21.1 26.2 28.0 34.6

UltraRAM Blocks 0 0 48 64 0 96 0 80 112 102 128

UltraRAM (Mb) 0 0 13.5 18.0 0 27.0 0 22.5 31.5 28.7 36.0

DSP Slices 240 360 728 1,248 1,973 1,728 2,520 2,928 3,528 1,590 1,968

CMTs 3344484841111

Max. HP I/O(1) 156 156 156 156 208 416 208 416 208 572 572

Max. HD I/O(2) 96 96 96 96 120 48 120 96 120 96 96

System Monitor 22222222222

GTH Transceiver 16.3Gb/s(3) 0 0 16 16 24 24 24 32 24 44 44

GTY Transceivers 32.75Gb/s00000001602828

Transceiver Fractional PLLs008812121224123636

PCIe Gen3 x16 00220204045

150G Interlaken 00000001024

100G Ethernet w/ RS-FEC00000002024

Notes:

1. HP = High-performance I/O with support for I/O voltage from 1.0V to 1.8V.

2. HD = High-density I/O with support for I/O voltage from 1.2V to 3.3V.

3. GTH transceivers in the SFVC784 package support data rates up to 12.5Gb/s. See Table 4.

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Product Specification 7

Table 4: Zynq UltraScale+ MPSoC: EG Device-Package Combinations and Maximum I/Os

Package

(1)(2)(3)(4)(5)

Package

Dimensions

(mm)

ZU2EG ZU3EG ZU4EG ZU5EG ZU6EG ZU7EG ZU9EG ZU11EG ZU15EG ZU17EG ZU19EG

HD, HP

GTH, GTY HD, HP

GTH, GTY

SBVA484(6) 19x19 24, 58

0, 0 24, 58

0, 0

SFVA625 21x21 24, 156

0, 0 24, 156

0, 0

SFVC784(7) 23x23 96, 156

0, 0 96, 156

4, 0 96, 156

4, 0

FBVB900 31x31 48, 156

16, 0 48, 156

16, 0

FFVC900 31x31 48, 156

16, 0 48, 156

16, 0

FFVB1156 35x35 120, 208

24, 0 120, 208

24, 0

FFVC1156 35x35 48, 312

20, 0 48, 312

20, 0

FFVB1517 40x40 72, 416

16, 0 72, 572

16, 0

FFVF1517 40x40 48, 416

24, 0 48, 416

32, 0

FFVC1760 42.5x42.5 96, 416

32, 16 96, 416

32, 16

FFVD1760 42.5x42.5 48, 260

44, 28 48, 260

44, 28

FFVE1924 45x45 96, 572

44, 0 96, 572

44, 0

Notes:

1. Go to Ordering Information for package designation details.(5)

2. FB/FF packages have 1.0mm ball pitch. SB/SF packages have 0.8mm ball pitch.

3. All device package combinations bond out 4 PS-GTR transceivers.

4. All device package combinations bond out 214 PS I/O except ZU2EG and ZU3EG in the SBVA484 and SFVA625 packages, which bond out 170 PS I/Os.

5. Packages with the same last letter and number sequence, e.g., A484, are footprint compatible with all other UltraScale devices with the same sequence. The footprint

compatible devices within this family are outlined.

6. All 58 HP I/O pins are powered by the same VCCO supply.

7. GTH transceivers in the SFVC784 package support data rates up to 12.5Gb/s.

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Product Specification 8

Table 5: Zynq UltraScale+ MPSoC: EV Device Feature Summary

ZU4EV ZU5EV ZU7EV

Application Processing Unit Quad-core Arm Cortex-A53 MPCore with CoreSight; NEON & Single/Double Precision Floating Point;

32KB/32KB L1 Cache, 1MB L2 Cache

Real-Time Processing Unit Dual-core Arm Cortex-R5 with CoreSight; Single/Double Precision Floating Point; 32KB/32KB L1

Cache, and TCM

Embedded and External

Memory 256KB On-Chip Memory w/ECC; External DDR4; DDR3; DDR3L; LPDDR4; LPDDR3;

External Quad-SPI; NAND; eMMC

General Connectivity 214 PS I/O; UART; CAN; USB 2.0; I2C; SPI; 32b GPIO; Real Time Clock; WatchDog Timers; Triple

Timer Counters

High-Speed Connectivity 4 PS-GTR; PCIe Gen1/2; Serial ATA 3.1; DisplayPort 1.2a; USB 3.0; SGMII

Graphic Processing Unit Arm Mali™-400 MP2; 64KB L2 Cache

Video Codec 1 1 1

System Logic Cells 192,150 256,200 504,000

CLB Flip-Flops 175,680 234,240 460,800

CLB LUTs 87,840 117,120 230,400

Distributed RAM (Mb) 2.6 3.5 6.2

Block RAM Blocks 128 144 312

Block RAM (Mb) 4.5 5.1 11.0

UltraRAM Blocks 48 64 96

UltraRAM (Mb) 13.5 18.0 27.0

DSP Slices 728 1,248 1,728

CMTs 4 4 8

Max. HP I/O(1) 156 156 416

Max. HD I/O(2) 96 96 48

System Monitor 2 2 2

GTH Transceiver 16.3Gb/s(3) 16 16 24

GTY Transceivers 32.75Gb/s 0 0 0

Transceiver Fractional PLLs 8 8 12

PCIe Gen3 x16 2 2 2

150G Interlaken 0 0 0

100G Ethernet w/ RS-FEC 0 0 0

Notes:

1. HP = High-performance I/O with support for I/O voltage from 1.0V to 1.8V.

2. HD = High-density I/O with support for I/O voltage from 1.2V to 3.3V.

3. GTH transceivers in the SFVC784 package support data rates up to 12.5Gb/s. See Table 6.

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Product Specification 9

Table 6: Zynq UltraScale+ MPSoC: EV Device-Package Combinations and Maximum I/Os

Package

(1)(2)(3)(4)

Package

Dimensions

(mm)

ZU4EV ZU5EV ZU7EV

HD, HP

GTH, GTY HD, HP

GTH, GTY

SFVC784(5) 23x23 96, 156

4, 0 96, 156

4, 0

FBVB900 31x31 48, 156

16, 0 48, 156

16, 0

FFVC1156 35x35 48, 312

20, 0

FFVF1517 40x40 48, 416

24, 0

Notes:

1. Go to Ordering Information for package designation details.

2. FB/FF packages have 1.0mm ball pitch. SF packages have 0.8mm ball pitch.

3. All device package combinations bond out 4 PS-GTR transceivers.

4. Packages with the same last letter and number sequence, e.g., C784, are footprint compatible with all other UltraScale

devices with the same sequence. The footprint compatible devices within this family are outlined.

5. GTH transceivers in the SFVC784 package support data rates up to 12.5Gb/s.

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Product Specification 10

Zynq UltraScale+ MPSoCs

A comprehensive device family, Zynq UltraScale+ MPSoCs offer single-chip, all programmable,

heterogeneous multiprocessors that provide designers with software, hardware, interconnect, power,

security, and I/O programmability. The range of devices in the Zynq UltraScale+ MPSoC family allows

designers to target cost-sensitive as well as high-performance applications from a single platform using

industry-standard tools. While each Zynq UltraScale+ MPSoC contains the same PS, the PL, Video hard

blocks, and I/O resources vary between the devices.

The Zynq UltraScale+ MPSoCs are able to serve a wide range of applications including:

•Automotive: Driver assistance, driver information, and infotainment

•Wireless Communications: Support for multiple spectral bands and smart antennas

•Wired Communications: Multiple wired communications standards and context-aware network services

•Data Centers: Software Defined Networks (SDN), data pre-processing, and analytics

•Smarter Vision: Evolving video-processing algorithms, object detection, and analytics

•Connected Control/M2M: Flexible/adaptable manufacturing, factory throughput, quality, and safety

The UltraScale MPSoC architecture provides processor scalability from 32 to 64 bits with support for

virtualization, the combination of soft and hard engines for real-time control, graphics/video processing,

waveform and packet processing, next-generation interconnect and memory, advanced power

management, and technology enhancements that deliver multi-level security, safety, and reliability. Xilinx

offers a large number of soft IP for the Zynq UltraScale+ MPSoC family. Stand-alone and Linux device

drivers are available for the peripherals in the PS and the PL. Xilinx’s Vivado® Design Suite, SDK™, and

PetaLinux development environments enable rapid product development for software, hardware, and

systems engineers. The Arm-based PS also brings a broad range of third-party tools and IP providers in

combination with Xilinx's existing PL ecosystem.

The Zynq UltraScale+ MPSoC family delivers unprecedented processing, I/O, and memory bandwidth in

the form of an optimized mix of heterogeneous processing engines embedded in a next-generation,

high-performance, on-chip interconnect with appropriate on-chip memory subsystems. The

heterogeneous processing and programmable engines, which are optimized for different application

tasks, enable the Zynq UltraScale+ MPSoCs to deliver the extensive performance and efficiency required

to address next-generation smarter systems while retaining backwards compatibility with the original

Zynq-7000 All Programmable SoC family. The UltraScale MPSoC architecture also incorporates multiple

levels of security, increased safety, and advanced power management, which are critical requirements of

next-generation smarter systems. Xilinx’s embedded UltraFast™ design methodology fully exploits the

Table 7: Zynq UltraScale+ MPSoC Device Features

CG Devices EG Devices EV Devices

APU Dual-core Arm Cortex-A53 Quad-core Arm Cortex-A53 Quad-core Arm Cortex-A53

RPU Dual-core Arm Cortex-R5 Dual-core Arm Cortex-R5 Dual-core Arm Cortex-R5

GPU – Mali-400MP2 Mali-400MP2

VCU – – H.264/H.265

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Product Specification 11

ASIC-class capabilities afforded by the UltraScale MPSoC architecture while supporting rapid system

development.

The inclusion of an application processor enables high-level operating system support, e.g., Linux. Other

standard operating systems used with the Cortex-A53 processor are also available for the

Zynq UltraScale+ MPSoC family. The PS and the PL are on separate power domains, enabling users to

power down the PL for power management if required. The processors in the PS always boot first, allowing

a software centric approach for PL configuration. PL configuration is managed by software running on the

CPU, so it boots similar to an ASSP.

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Product Specification 12

Processing System

Application Processing Unit (APU)

The key features of the APU include:

•64-bit quad-core Arm Cortex-A53 MPCores. Features associated with each core include:

oArm v8-A Architecture

oOperating target frequency: up to 1.5GHz

oSingle and double precision floating point:

4SP/2DPFLOPs

oNEON Advanced SIMD support with single and double precision floating point instructions

oA64 instruction set in 64-bit operating mode, A32/T32 instruction set in 32-bit operating mode

oLevel 1 cache (separate instruction and data, 32KB each for each Cortex-A53 CPU)

– 2-way set-associative Instruction Cache with parity support

– 4-way set-associative Data Cache with ECC support

oIntegrated memory management unit (MMU) per processor core

oTrustZone for secure mode operation

oVirtualization support

•Ability to operate in single processor, symmetric quad processor, and asymmetric quad-processor modes

•Integrated 16-way set-associative 1MB Unified Level 2 cache with ECC support

•Interrupts and Timers

oGeneric interrupt controller (GIC-400)

oArm generic timers (4 timers per CPU)

oOne watchdog timer (WDT)

oOne global timer

oTwo triple timers/counters (TTC)

•CoreSight debug and trace support

oEmbedded Trace Macrocell (ETM) for instruction trace

oCross trigger interface (CTI) enabling hardware breakpoints and triggers

•ACP interface to PL for I/O coherency and Level 2 cache allocation

•ACE interface to PL for full coherency

•Power island gating on each processor core

•Optional eFUSE disable per core

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Product Specification 13

Real-Time Processing Unit (RPU)

•Dual-core Arm Cortex-R5 MPCores. Features associated with each core include:

oArm v7-R Architecture (32-bit)

oOperating target frequency: Up to 600MHz

oA32/T32 instruction set support

o4-way set-associative Level 1 caches (separate instruction and data, 32KB each) with ECC support

oIntegrated Memory Protection Unit (MPU) per processor

o128KB Tightly Coupled Memory (TCM) with ECC support

oTCMs can be combined to become 256KB in lockstep mode

•Ability to operate in single-processor or dual-processor modes (split and lock-step)

•Dedicated SWDT and two Triple Timer Counters (TTC)

•CoreSight debug and trace support

oEmbedded Trace Macrocell (ETM) for instruction and trace

oCross trigger interface (CTI) enabling hardware breakpoints and triggers

•Optional eFUSE disable

Full-Power Domain DMA (FPD-DMA) and Low-Power Domain DMA

(LPD-DMA)

•Two general-purpose DMA controllers one in the full-power domain (FPD-DMA) and one in the low-power

domain (LPD-DMA)

•Eight independent channels per DMA

•Multiple transfer types:

oMemory-to-memory

oMemory-to-peripheral

oPeripheral-to-memory and

oScatter-gather

•8 peripheral interfaces per DMA

•TrustZone per DMA for optional secure operation

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Product Specification 14

Xilinx Memory Protection Unit (XMPU)

•Region based memory protection unit

•Up to 16 regions

•Each region supports address alignment of 1MB or 4KB

•Regions can overlap; the higher region number has priority

•Each region can be independently enabled or disabled

•Each region has a start and end address

Graphics Processing Unit (GPU)

•Supports OpenGL ES 1.1 & 2.0

•Supports OpenVG 1.1

•Operating target frequency: up to 667MHz

•Single Geometry Processor and two Pixel processor

•Pixel Fill Rate: 2 Mpixel/sec/MHz

•Triangle Rate: 0.11 Mtriangles/sec/MHz

•64KB Level 2 Cache (read-only)

•4X and 16X Anti-aliasing Support

•ETC1 texture compression to reduce external memory bandwidth

•Extensive texture format support

oRGBA 8888, 565, 1556

oMono 8, 16

oYUV format support

•Automatic load balancing across different graphics shader engines

•2D and 3D graphic acceleration

•Up to 4K texture input and 4K render output resolutions

•Each geometry processor and pixel processor supports 4KB page MMU

•Power island gating on each GPU engine and shared cache

•Optional eFUSE disable

Dynamic Memory Controller (DDRC)

•DDR3, DDR3L, DDR4, LPDDR3, LPDDR4

•Target data rate: Up to 2400Mb/s DDR4 operation in -1 speed grade

•32-bit and 64-bit bus width support for DDR4, DDR3, DDR3L, or LPDDR3 memories, and 32-bit bus width

support for LPDDR4 memory

•ECC support (using extra bits)

•Up to a total DRAM capacity of 32GB

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Product Specification 15

•Low power modes

oActive/precharge power down

oSelf-refresh, including clean exit from self-refresh after a controller power cycle

•Enhanced DDR training by allowing software to measure read/write eye and make delay adjustments

dynamically

•Independent performance monitors for read path and write path

•Integration of PHY Debug Access Port (DAP) into JTAG for testing

The DDR memory controller is multi-ported and enables the PS and the PL to have shared access to a

common memory. The DDR controller features six AXI slave ports for this purpose:

•Two 128-bit AXI ports from the Arm Cortex-A53 CPU(s), RPU (Arm Cortex-R5 and LPD peripherals), GPU,

high speed peripherals (USB3, PCIe & SATA), and High Performance Ports (HP0 & HP1) from the PL

through the Cache Coherent Interconnect (CCI)

•One 64-bit port is dedicated for the Arm Cortex-R5 CPU(s)

•One 128-bit AXI port from the DisplayPort and HP2 port from the PL

•One 128-bit AXI port from HP3 and HP4 ports from the PL

•One 128-bit AXI port from General DMA and HP5 from the PL

High-Speed Connectivity Peripherals

PCIe

•Compliant with the PCI Express Base Specification 2.1

•Fully compliant with PCI Express transaction ordering rules

•Lane width: x1, x2, or x4 at Gen1 or Gen2 rates

•1 Virtual Channel

•Full duplex PCIe port

•End Point and single PCIe link Root Port

•Root Port supports Enhanced Configuration Access Mechanism (ECAM), Cfg Transaction generation

•Root Port support for INTx, and MSI

•Endpoint support for MSI or MSI-X

o1 physical function, no SR-IOV

oNo relaxed or ID ordering

oFully configurable BARs

oINTx not recommended, but can be generated

oEndpoint to support configurable target/slave apertures with address translation and Interrupt

capability

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Product Specification 16

SATA

•Compliant with SATA 3.1 Specification

•SATA host port supports up to 2 external devices

•Compliant with Advanced Host Controller Interface ('AHCI') ver. 1.3

•1.5Gb/s, 3.0Gb/s, and 6.0Gb/s data rates

•Power management features: supports partial and slumber modes

USB 3.0

•Two USB controllers (configurable as USB 2.0 or USB 3.0)

•Up to 5.0Gb/s data rate

•Host and Device modes

oSuper Speed, High Speed, Full Speed, and Low Speed

oUp to 12 endpoints

oThe USB host controller registers and data structures are compliant to Intel xHCI specifications

o64-bit AXI master port with built-in DMA

oPower management features: Hibernation mode

DisplayPort Controller

•4K Display Processing with DisplayPort output

oMaximum resolution of 4K x 2K-30 (30Hz pixel rate)

oDisplayPort AUX channel, and Hot Plug Detect (HPD) on the output

oRGB YCbCr, 4:2:0; 4:2:2, 4:4:4 with 6, 8, 10, and 12b/c

oY-only, xvYCC, RGB 4:4:4, YCbCr 4:4:4, YCbCr 4:2:2, and YCbCr 4:2:0 video format with 6,8,10 and

12-bits per color component

o256-color palette

oMultiple frame buffer formats

o1, 2, 4, 8 bits per pixel (bpp) via a palette

o16, 24, 32bpp

oGraphics formats such as RGBA8888, RGB555, etc.

•Accepts streaming video from the PL or dedicated DMA controller

•Enables Alpha blending of graphics and Chroma keying

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Product Specification 17

•Audio support

oA single stream carries up to 8 LPCM channels at 192kHz with 24-bit resolution

oSupports compressed formats including DRA, Dolby MAT, and DTS HD

oMulti-Stream Transport can extend the number of audio channels

oAudio copy protection

o2-channel streaming or input from the PL

oMulti-channel non-streaming audio from a memory audio frame buffer

•Includes a System Time Clock (STC) compliant with ISO/IEC 13818-1

•Boot-time display using minimum resources

Platform Management Unit (PMU)

•Performs system initialization during boot

•Acts as a delegate to the application and real-time processors during sleep state

•Initiates power-up and restart after the wake-up request

•Maintains the system power state at all time

•Manages the sequence of low-level events required for power-up, power-down, reset, clock gating, and

power gating of islands and domains

•Provides error management (error handling and reporting)

•Provides safety check functions (e.g., memory scrubbing)

The PMU includes the following blocks:

•Platform management processor

•Fixed ROM for boot-up of the device

•128KB RAM with ECC for optional user/firmware code

•Local and global registers to manage power-down, power-up, reset, clock gating, and power gating

requests

•Interrupt controller with 16 interrupts from other modules and the inter-processor communication

interface (IPI)

•GPI and GPO interfaces to and from PS I/O and PL

•JTAG interface for PMU debug

•Optional User-Defined Firmware

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Product Specification 18

Configuration Security Unit (CSU)

•Triple redundant Secure Processor Block (SPB) with built-in ECC

•Crypto Interface Block consisting of

o256-bit AES-GCM

oSHA-3/384

o4096-bit RSA

•Key Management Unit

•Built-in DMA

•PCAP interface

•Supports ROM validation during pre-configuration stage

•Loads First Stage Boot Loader (FSBL) into OCM in either secure or non-secure boot modes

•Supports voltage, temperature, and frequency monitoring after configuration

Xilinx Peripheral Protection Unit (XPPU)

•Provides peripheral protection support

•Up to 20 masters simultaneously

•Multiple aperture sizes

•Access control for a specified set of address apertures on a per master basis

•64KB peripheral apertures and controls access on per peripheral basis

I/O Peripherals

The IOP unit contains the data communication peripherals. Key features of the IOP include:

Triple-Speed Gigabit Ethernet

•Compatible with IEEE Std 802.3 and supports 10/100/1000Mb/s transfer rates (Full and Half duplex)

•Supports jumbo frames

•Built-in Scatter-Gather DMA capability

•Statistics counter registers for RMON/MIB

•Multiple I/O types (1.8, 2.5, 3.3V) on RGMII interface with external PHY

•GMII interface to PL to support interfaces as: TBI, SGMII, and RGMII v2.0 support

•Automatic pad and cyclic redundancy check (CRC) generation on transmitted frames

•Transmitter and Receive IP, TCP, and UDP checksum offload

•MDIO interface for physical layer management

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Product Specification 19

•Full duplex flow control with recognition of incoming pause frames and hardware generation of

transmitted pause frames

•802.1Q VLAN tagging with recognition of incoming VLAN and priority tagged frames

•Supports IEEE Std 1588 v2

SD/SDIO 3.0 Controller

In addition to secure digital (SD) devices, this controller also supports eMMC 4.51.

•Host mode support only

•Built-in DMA

•1/4-Bit SD Specification, version 3.0

•1/4/8-Bit eMMC Specification, version 4.51

•Supports primary boot from SD Card and eMMC (Managed NAND)

•High speed, default speed, and low-speed support

•1 and 4-bit data interface support

oLow speed clock 0-400KHz

oDefault speed 0-25MHz

oHigh speed clock 0-50MHz

•High speed Interface

oSD UHS-1: 208MHz

oeMMC HS200: 200MHz

•Memory, I/O, and SD cards

•Power control modes

•Data FIFO interface up to 512B

UART

•Programmable baud rate generator

•6, 7, or 8 data bits

•1, 1.5, or 2 stop bits

•Odd, even, space, mark, or no parity

•Parity, framing, and overrun error detection

•Line break generation and detection

•Automatic echo, local loopback, and remote loopback channel modes

•Modem control signals: CTS, RTS, DSR, DTR, RI, and DCD (from EMIO only)

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Product Specification 20

SPI

•Full-duplex operation offers simultaneous receive and transmit

•128B deep read and write FIFO

•Master or slave SPI mode

•Up to three chip select lines

•Multi-master environment

•Identifies an error condition if more than one master detected

•Selectable master clock reference

•Software can poll for status or be interrupt driven

I2C

•128-bit buffer size

•Both normal (100kHz) and fast bus data rates (400kHz)

•Master or slave mode

•Normal or extended addressing

•I2C bus hold for slow host service

GPIO

•Up to 128 GPIO bits

oUp to 78-bits from MIO and 96-bits from EMIO

•Each GPIO bit can be dynamically programmed as input or output

•Independent reset values for each bit of all registers

•Interrupt request generation for each GPIO signals

•Single Channel (Bit) write capability for all control registers include data output register, direction control

•Read back in output mode

CAN

•Conforms to the ISO 11898 -1, CAN2.0A, and CAN 2.0B standards

•Both standard (11-bit identifier) and extended (29-bit identifier) frames

•Bit rates up to 1Mb/s

•Transmit and Receive message FIFO with a depth of 64 messages

•Watermark interrupts for TXFIFO and RXFIFO

•Automatic re-transmission on errors or arbitration loss in normal mode

•Acceptance filtering of four acceptance filters

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Product Specification 21

•Sleep Mode with automatic wake-up

•Snoop Mode

•16-bit timestamping for receive messages

•Both internal generated reference clock and external reference clock input from MIO

•Guarantee clock sampling edge between 80 to 83% at 24MHz reference clock input

•Optional eFUSE disable per port

USB 2.0

•Two USB controllers (configurable as USB 2.0 or USB 3.0)

•Host, device and On-The-Go (OTG) modes

•High Speed, Full Speed, and Low Speed

•Up to 12 endpoints

•8-bit ULPI External PHY Interface

•The USB host controller registers and data structures are compliant to Intel xHCI specifications.

•64-bit AXI master port with built-in DMA

•Power management features: hibernation mode

Static Memory Interfaces

The static memory interfaces support external static memories.

•ONFI 3.1 NAND flash support with up to 24-bit ECC

•1-bit SPI, 2-bit SPI, 4-bit SPI (Quad-SPI), or two Quad-SPI (8-bit) serial NOR flash

•8-bit eMMC interface supporting managed NAND flash

NAND ONFI 3.1 Flash Controller

•ONFI 3.1 compliant

•Supports chip select reduction per ONFI 3.1 spec

•SLC NAND for boot/configuration and data storage

•ECC options based on SLC NAND

o1, 4, or 8 bits per 512+spare bytes

o24 bits per 1024+spare bytes

•Maximum throughput as follows

oAsynchronous mode (SDR) 24.3MB/s

oSynchronous mode (NV-DDR) 112MB/s (for 100MHz flash clock)

•8-bit SDR NAND interface

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Product Specification 22

•Two chip selects

•Programmable access timing

•1.8V and 3.3V I/O

•Built-in DMA for improved performance

Quad-SPI Controller

•4 bytes (32-bit) and 3 bytes (24-bit) address width

•Maximum SPI Clock at Master Mode at 150MHz

•Single, Dual-Parallel, and Dual-Stacked mode

•32-bit AXI Linear Address Mapping Interface for read operation

•Up to two chip select signals

•Write Protection Signal

•Hold signals

•4-bit bidirectional I/O signals

•x1/x2/x4 Read speed required

•x1 write speed required only

•64-byte Entry FIFO depth to improve QSPI read efficiency

•Built-in DMA for improved performance

Video Encoder/Decoder (VCU)

Zynq UltraScale+ MPSoCs include a Video codec (encoder/decoder) available in the devices designated

with the EV suffix. The VCU is located in the PL and can be accessed from either the PL or PS.

•Simultaneous Encode and Decode through separate cores

•H.264 high profile level 5.2 (4Kx2K-60)

•H.265 (HEVC) main, main10 profile, level 5.1, high Tier, up to 4Kx2K-60 rate

•8 and 10 bit encoding

•4:2:0 and 4:2:2 chroma sampling

•8Kx4K-15 rate

•Multi-stream up to total of 4Kx2K-60 rate

•Low Latency mode

•Can share the PS DRAM or use dedicated DRAM in the PL

•Clock/power management

•OpenMax Linux drivers

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Product Specification 23

Interconnect

All the blocks are connected to each other and to the PL through a multi-layered Arm Advanced

Microprocessor Bus Architecture (AMBA) AXI interconnect. The interconnect is non-blocking and supports

multiple simultaneous master-slave transactions.

The interconnect is designed with latency sensitive masters, such as the Arm CPU, having the shortest

paths to memory, and bandwidth critical masters, such as the potential PL masters, having high

throughput connections to the slaves with which they need to communicate.

Traffic through the interconnect can be regulated through the Quality of Service (QoS) block in the

interconnect. The QoS feature is used to regulate traffic generated by the CPU, DMA controller, and a

combined entity representing the masters in the IOP.

PS Interfaces

PS interfaces include external interfaces going off-chip or signals going from PS to PL.

PS External Interfaces

The Zynq UltraScale+ MPSoC’s external interfaces use dedicated pins that cannot be assigned as PL pins.

These include:

•Clock, reset, boot mode, and voltage reference

•Up to 78 dedicated multiplexed I/O (MIO) pins, software-configurable to connect to any of the internal I/O

peripherals and static memory controllers

•32-bit or 64-bit DDR4/DDR3/DDR3L/LPDDR3 memories with optional ECC

•32-bit LPDDR4 memory with optional ECC

•4 channels (TX and RX pair) for transceivers

MIO Overview

The IOP peripherals communicate to external devices through a shared pool of up to 78 dedicated

multiplexed I/O (MIO) pins. Each peripheral can be assigned one of several pre-defined groups of pins,

enabling a flexible assignment of multiple devices simultaneously. Although 78 pins are not enough for

simultaneous use of all the I/O peripherals, most IOP interface signals are available to the PL, allowing use

of standard PL I/O pins when powered up and properly configured. Extended multiplexed I/O (EMIO) allows

unmapped PS peripherals to access PL I/O.

Port mappings can appear in multiple locations. For example, there are up to 12 possible port mappings

for CAN pins. The PS Configuration Wizard (PCW) tool aids in peripheral and static memory pin mapping.

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Product Specification 24

Transceiver (PS-GTR)

The four PS-GTR transceivers, which reside in the full power domain (FPD), support data rates of up to

6.0Gb/s. All the protocols cannot be pinned out at the same time. At any given time, four differential pairs

can be pinned out using the transceivers. This is user programmable via the high-speed I/O multiplexer

(HS-MIO).

•A Quad transceiver PS-GTR (TX/RX pair) able to support following standards simultaneously

ox1, x2, or x4 lane of PCIe at Gen1 (2.5Gb/s) or Gen2 (5.0Gb/s) rates

o1 or 2 lanes of DisplayPort (TX only) at 1.62Gb/s, 2.7Gb/s, or 5.4Gb/s

o1 or 2 SATA channels at 1.5Gb/s, 3.0Gb/s, or 6.0Gb/s

o1 or 2 USB3.0 channels at 5.0Gb/s

o1-4 Ethernet SGMII channels at 1.25Gb/s

•Provides flexible host-programmable multiplexing function for connecting the transceiver resources to the

PS masters (DisplayPort, PCIe, Serial-ATA, USB3.0, and GigE).

Table 8: MIO Peripheral Interface Mapping

Peripheral

Interface MIO EMIO

Quad-SPI

NAND Yes No

USB2.0: 0,1 Yes: External PHY No

SDIO 0,1 Yes Yes

SPI: 0,1

I2C: 0,1

CAN: 0,1

GPIO

Yes

CAN: External PHY

GPIO: Up to 78 bits

Yes

CAN: External PHY

GPIO: Up to 96 bits

GigE: 0,1,2,3 RGMII v2.0:

External PHY Supports GMII, RGMII v2.0 (HSTL), RGMII v1.3, MII, SGMII, and

1000BASE-X in Programmable Logic

UART: 0,1 Simple UART:

Only two pins (TX and RX) Full UART (TX, RX, DTR, DCD, DSR, RI, RTS, and CTS) requires either:

•Two Processing System (PS) pins (RX and TX) through MIO and six

additional Programmable Logic (PL) pins, or

•Eight Programmable Logic (PL) pins

Debug Trace Ports Yes: Up to 16 trace bits Yes: Up to 32 trace bits

Processor JTAG Yes Yes

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Product Specification 25

HS-MIO

The function of the HS-MIO is to multiplex access from the high-speed PS peripheral to the differential

pair on the PS-GTR transceiver as defined in the configuration registers. Up to 4 channels of the

transceiver are available for use by the high-speed interfaces in the PS.

PS-PL Interface

The PS-PL interface includes:

•AMBA AXI4 interfaces for primary data communication

oSix 128-bit/64-bit/32-bit High Performance (HP) Slave AXI interfaces from PL to PS.

– Four 128-bit/64-bit/32-bit HP AXI interfaces from PL to PS DDR.

– Two 128-bit/64-bit/32-bit high-performance coherent (HPC) ports from PL to cache coherent

interconnect (CCI).

oTwo 128-bit/64-bit/32-bit HP Master AXI interfaces from PS to PL.

oOne 128-bit/64-bit/32-bit interface from PL to RPU in PS (PL_LPD) for low latency access to OCM.

oOne 128-bit/64-bit/32-bit AXI interface from RPU in PS to PL (LPD_PL) for low latency access to PL.

oOne 128-bit AXI interface (ACP port) for I/O coherent access from PL to Cortex-A53 cache memory.

This interface provides coherency in hardware for Cortex-A53 cache memory.

oOne 128-bit AXI interface (ACE Port) for Fully coherent access from PL to Cortex-A53. This interface

provides coherency in hardware for Cortex-A53 cache memory and the PL.

•Clocks and resets

oFour PS clock outputs to the PL with start/stop control.

oFour PS reset outputs to the PL.

Table 9: HS-MIO Peripheral Interface Mapping

Peripheral Interface Lane0 Lane1 Lane2 Lane3

PCIe (x1, x2 or x4) PCIe0 PCIe1 PCIe2 PCIe3

SATA (1 or 2 channels) SATA0 SATA1 SATA0 SATA1

DisplayPort (TX only) DP1 DP0 DP1 DP0

USB0 USB0 USB0 USB0 –

USB1 – – – USB1

SGMII0 SGMII0 – – –

SGMII1 – SGMII1 – –

SGMII2 – – SGMII2 –

SGMII3 – – – SGMII3

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Product Specification 26

High-Performance AXI Ports

The high-performance AXI4 ports provide access from the PL to DDR and high-speed interconnect in the

PS. The six dedicated AXI memory ports from the PL to the PS are configurable as either 128-bit, 64-bit,

or 32-bit interfaces. These interfaces connect the PL to the memory interconnect via a FIFO interface. Two

of the AXI interfaces support I/O coherent access to the APU caches.

Each high-performance AXI port has these characteristics:

•Reduced latency between PL and processing system memory

•1KB deep FIFO

•Configurable either as 128-bit, 64-bit, or 32-bit AXI interfaces

•Multiple AXI command issuing to DDR

Accelerator Coherency Port (ACP)

The Zynq UltraScale+ MPSoC accelerator coherency port (ACP) is a 64-bit AXI slave interface that provides

connectivity between the APU and a potential accelerator function in the PL. The ACP directly connects the

PL to the snoop control unit (SCU) of the Arm Cortex-A53 processors, enabling cache-coherent access to

CPU data in the L2 cache. The ACP provides a low latency path between the PS and a PL-based accelerator

when compared with a legacy cache flushing and loading scheme. The ACP only snoops access in the CPU

L2 cache, providing coherency in hardware. It does not support coherency on the PL side. So this interface

is ideal for a DMA or an accelerator in the PL that only requires coherency on the CPU cache memories. For

example, if a MicroBlaze™ processor in the PL is attached to the ACP interface, the cache of MicroBlaze

processor will not be coherent with Cortex-A53 caches.

AXI Coherency Extension (ACE)

The Zynq UltraScale+ MPSoC AXI coherency extension (ACE) is a 64-bit AXI4 slave interface that provides

connectivity between the APU and a potential accelerator function in the PL. The ACE directly connects the

PL to the snoop control unit (SCU) of the Arm Cortex-A53 processors, enabling cache-coherent access to

Cache Coherent Interconnect (CCI). The ACE provides a low-latency path between the PS and a PL-based

accelerator when compared with a legacy cache flushing and loading scheme. The ACE snoops accesses to

the CCI and the PL side, thus, providing full coherency in hardware. This interface can be used to hook up

a cached interface in the PL to the PS as caches on both the Cortex-A53 memories and the PL master are

snooped thus providing full coherency. For example, if a MicroBlaze processor in the PL is hooked up using

an ACE interface, then Cortex-A53 and MicroBlaze processor caches will be coherent with each other.

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Product Specification 27

Programmable Logic

This section covers the information about blocks in the Programmable Logic (PL).

Device Layout

UltraScale architecture-based devices are arranged in a column-and-grid layout. Columns of resources are combined

in different ratios to provide the optimum capability for the device density, target market or application, and device

cost. At the core of UltraScale+ MPSoCs is the processing system that displaces some of the full or partial columns

of programmable logic resources. Figure 1 shows a device-level view with resources grouped together. For simplicity,

certain resources such as the processing system, integrated blocks for PCIe, configuration logic, and System Monitor

are not shown.

Resources within the device are divided into segmented clock regions. The height of a clock region is 60 CLBs. A bank

of 52 I/Os, 24 DSP slices, 12 block RAMs, or 4 transceiver channels also matches the height of a clock region. The

width of a clock region is essentially the same in all cases, regardless of device size or the mix of resources in the

region, enabling repeatable timing results. Each segmented clock region contains vertical and horizontal clock

routing that span its full height and width. These horizontal and vertical clock routes can be segmented at the clock

region boundary to provide a flexible, high-performance, low-power clock distribution architecture. Figure 2 is a

representation of a device divided into regions.

X-Ref Target - Figure 1

Figure 1: Device with Columnar Resources

I/O, Clocking, Memory Interface Logic

CLB, DSP, Block RAM

Transceivers

CLB, DSP, Block RAM

DS891_01_012915

X-Ref Target - Figure 2

Figure 2: Column-Based Device Divided into Clock Regions

Clock Region Width

Clock

Region

Height

DS891_02_012915

For graphical representation only, does not represent a real device.

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Product Specification 28

Input/Output

All Zynq UltraScale+ MPSoCs have I/O pins for communicating to external components. In addition, in the

MPSoC’s PS, there are another 78 I/Os that the I/O peripherals use to communicate to external

components, referred to as multiplexed I/O (MIO). If more than 78 pins are required by the I/O peripherals,

the I/O pins in the PL can be used to extend the MPSoC interfacing capability, referred to as extended MIO

(EMIO).

The number of I/O pins in the PL of Zynq UltraScale+ MPSoCs varies depending on device and package.

Each I/O is configurable and can comply with a large number of I/O standards. The I/Os are classed as

high-performance (HP), or high-density (HD). The HP I/Os are optimized for highest performance

operation, from 1.0V to 1.8V. The HD I/Os are reduced-feature I/Os organized in banks of 24, providing

voltage support from 1.2V to 3.3V.

All I/O pins are organized in banks, with 52 HP pins per bank or 24 HD pins per bank. Each bank has one

common VCCO output buffer power supply, which also powers certain input buffers. Some single-ended

input buffers require an internally generated or an externally applied reference voltage (VREF). VREF pins

can be driven directly from the PCB or internally generated using the internal VREF generator circuitry

present in each bank.

I/O Electrical Characteristics

Single-ended outputs use a conventional CMOS push/pull output structure driving High towards VCCO or

Low towards ground, and can be put into a high-Z state. The system designer can specify the slew rate and

the output strength. The input is always active but is usually ignored while the output is active. Each pin

can optionally have a weak pull-up or a weak pull-down resistor.

Most signal pin pairs can be configured as differential input pairs or output pairs. Differential input pin

pairs can optionally be terminated with a 100Ω internal resistor. All UltraScale architecture-based devices

support differential standards beyond LVDS, including RSDS, BLVDS, differential SSTL, and differential

HSTL. Each of the I/Os supports memory I/O standards, such as single-ended and differential HSTL as well

as single-ended and differential SSTL. The Zynq UltraScale+ family includes support for MIPI with a

dedicated D-PHY in the I/O bank.

3-State Digitally Controlled Impedance and Low Power I/O Features

The 3-state Digitally Controlled Impedance (T_DCI) can control the output drive impedance (series

termination) or can provide parallel termination of an input signal to VCCO or split (Thevenin) termination

to VCCO/2. This allows users to eliminate off-chip termination for signals using T_DCI. In addition to board

space savings, the termination automatically turns off when in output mode or when 3-stated, saving

considerable power compared to off-chip termination. The I/Os also have low power modes for IBUF and

IDELAY to provide further power savings, especially when used to implement memory interfaces.

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I/O Logic

Input and Output Delay

All inputs and outputs can be configured as either combinatorial or registered. Double data rate (DDR) is

supported by all inputs and outputs. Any input or output can be individually delayed by up to 1,250ps of

delay with a resolution of 5–15ps. Such delays are implemented as IDELAY and ODELAY. The number of

delay steps can be set by configuration and can also be incremented or decremented while in use. The

IDELAY and ODELAY can be cascaded together to double the amount of delay in a single direction.

ISERDES and OSERDES

Many applications combine high-speed, bit-serial I/O with slower parallel operation inside the device. This

requires a serializer and deserializer (SerDes) inside the I/O logic. Each I/O pin possesses an IOSERDES

(ISERDES and OSERDES) capable of performing serial-to-parallel or parallel-to-serial conversions with

programmable widths of 2, 4, or 8 bits. These I/O logic features enable high-performance interfaces, such

as Gigabit Ethernet/1000BaseX/SGMII, to be moved from the transceivers to the SelectIO interface.

High-Speed Serial Transceivers

Ultra-fast serial data transmission between devices on the same PCB, over backplanes, and across even

longer distances is becoming increasingly important for scaling to 100 Gb/s and 400 Gb/s line cards.

Specialized dedicated on-chip circuitry and differential I/O capable of coping with the signal integrity

issues are required at these high data rates.

Three types of transceivers are used in Zynq UltraScale+ MPSoCs: GTH, GTY, and PS-GTR. All transceivers

are arranged in groups of four, known as a transceiver Quad. Each serial transceiver is a combined

transmitter and receiver. Table 10 compares the available transceivers.

The following information in this section pertains to the GTH and GTY only.

The serial transmitter and receiver are independent circuits that use an advanced phase-locked loop (PLL)

architecture to multiply the reference frequency input by certain programmable numbers between 4 and

25 to become the bit-serial data clock. Each transceiver has a large number of user-definable features and

parameters. All of these can be defined during device configuration, and many can also be modified

during operation.

Table 10: Transceiver Information

Zynq UltraScale+ MPSoCs

Type PS-GTR GTH GTY

Qty 4 0–44 0–28

Max. Data Rate 6.0Gb/s 16.3Gb/s 32.75Gb/s

Min. Data Rate 1.25Gb/s 0.5Gb/s 0.5Gb/s

Applications

•PCIe Gen2

•USB

•Ethernet

•Backplane

•HMC •100G+Optics

•Chip-to-Chip

•25G+Backplane

•HMC

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Transmitter

The transmitter is fundamentally a parallel-to-serial converter with a conversion ratio of 16, 20, 32, 40, 64,

or 80 for the GTH and 16, 20, 32, 40, 64, 80, 128, or 160 for the GTY. This allows the designer to trade off

datapath width against timing margin in high-performance designs. These transmitter outputs drive the

PC board with a single-channel differential output signal. TXOUTCLK is the appropriately divided serial

data clock and can be used directly to register the parallel data coming from the internal logic. The

incoming parallel data is fed through an optional FIFO and has additional hardware support for the

8B/10B, 64B/66B, or 64B/67B encoding schemes to provide a sufficient number of transitions. The

bit-serial output signal drives two package pins with differential signals. This output signal pair has

programmable signal swing as well as programmable pre- and post-emphasis to compensate for PC board

losses and other interconnect characteristics. For shorter channels, the swing can be reduced to reduce

power consumption.

Receiver

The receiver is fundamentally a serial-to-parallel converter, changing the incoming bit-serial differential

signal into a parallel stream of words, each 16, 20, 32, 40, 64, or 80 bits in the GTH or 16, 20, 32, 40, 64, 80,

128, or 160 for the GTY. This allows the designer to trade off internal datapath width against logic timing

margin. The receiver takes the incoming differential data stream, feeds it through programmable DC

automatic gain control, linear and decision feedback equalizers (to compensate for PC board, cable,

optical and other interconnect characteristics), and uses the reference clock input to initiate clock

recognition. There is no need for a separate clock line. The data pattern uses non-return-to-zero (NRZ)

encoding and optionally ensures sufficient data transitions by using the selected encoding scheme.

Parallel data is then transferred into the device logic using the RXUSRCLK clock. For short channels, the

transceivers offer a special low-power mode (LPM) to reduce power consumption by approximately 30%.

The receiver DC automatic gain control and linear and decision feedback equalizers can optionally

“auto-adapt” to automatically learn and compensate for different interconnect characteristics. This

enables even more margin for tough 10G+ and 25G+ backplanes.

Out-of-Band Signaling

The transceivers provide out-of-band (OOB) signaling, often used to send low-speed signals from the

transmitter to the receiver while high-speed serial data transmission is not active. This is typically done

when the link is in a powered-down state or has not yet been initialized. This benefits PCIe and SATA/SAS

and QPI applications.

Integrated Blocks for PCI Express Designs

Zynq UltraScale+ MPSoCs include integrated blocks for PCIe that are compliant PCI Express Base

Specification Revision 3.1 and can operate with a lane width of up to x8 and a speed up to 8.0GT/s (Gen3).

All integrated blocks for PCIe can be configured as Endpoint or Root Port. The Root Port can be used to

build the basis for a compatible Root Complex, to allow custom chip-to-chip communication via the PCI

Express protocol, and to attach ASSP Endpoint devices, such as Ethernet Controllers or Fibre Channel

HBAs, to the MPSoC.

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This block is highly configurable to system design requirements and can operate 1, 2, 4, 8, or 16 lanes at

up to 2.5Gb/s, 5.0Gb/s, 8.0Gb/s, or 16Gb/s data rates. For high-performance applications, advanced

buffering techniques of the block offer a flexible maximum payload size of up to 1,024 bytes. The

integrated block interfaces to the integrated high-speed transceivers for serial connectivity and to block

RAMs for data buffering. Combined, these elements implement the Physical Layer, Data Link Layer, and

Transaction Layer of the PCI Express protocol.

Xilinx provides LogiCORE™ IP options to configure the integrated blocks for PCIe in all UltraScale and

UltraScale+ devices. This includes AXI Streaming interfaces at the PCIe packet level and more advanced IP

such as AXI to PCIe Bridges and DMA engines. This IP gives the designer control over many configurable

parameters such as link width and speed, maximum payload size, and reference clock frequency. For a

complete list of features that can be configured for each of the IP, go to the specific Product Guide.

Integrated Block for Interlaken

Some UltraScale architecture-based devices include integrated blocks for Interlaken. Interlaken is a

scalable chip-to-chip interconnect protocol designed to enable transmission speeds from 10Gb/s to

150Gb/s. The Interlaken integrated block in the UltraScale architecture is compliant to revision 1.2 of the

Interlaken specification with data striping and de-striping across 1 to 12 lanes. Permitted configurations

are: 1 to 12 lanes at up to 12.5Gb/s and 1 to 6 lanes at up to 25.78125Gb/s, enabling flexible support for

up to 150Gb/s per integrated block. With multiple Interlaken blocks, certain UltraScale architecture-based

devices enable easy, reliable Interlaken switches and bridges.

Integrated Block for 100G Ethernet

Compliant to the IEEE Std 802.3ba, the 100G Ethernet integrated blocks in the UltraScale architecture

provide low latency 100Gb/s Ethernet ports with a wide range of user customization and statistics

gathering. With support for 10 x 10.3125Gb/s (CAUI) and 4 x 25.78125Gb/s (CAUI-4) configurations, the

integrated block includes both the 100G MAC and PCS logic with support for IEEE Std 1588v2 1-step and

2-step hardware timestamping.

In UltraScale+ devices, the 100G Ethernet blocks contain a Reed Solomon Forward Error Correction

(RS-FEC) block, compliant to IEEE Std 802.3bj, that can be used with the Ethernet block or stand alone in

user applications. These families also support OTN mapping mode in which the PCS can be operate

without using the MAC.

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Clock Management

The clock generation and distribution components in UltraScale architecture-based devices are located

adjacent to the columns that contain the memory interfacing and input and output circuitry. This tight

coupling of clocking and I/O provides low-latency clocking to the I/O for memory interfaces and other I/O

protocols. Within every clock management tile (CMT) resides one mixed-mode clock manager (MMCM),

two PLLs, clock distribution buffers and routing, and dedicated circuitry for implementing external

memory interfaces.

Mixed-Mode Clock Manager

The mixed-mode clock manager (MMCM) can serve as a frequency synthesizer for a wide range of

frequencies and as a jitter filter for incoming clocks. At the center of the MMCM is a voltage-controlled

oscillator (VCO), which speeds up and slows down depending on the input voltage it receives from the

phase frequency detector (PFD).

Three sets of programmable frequency dividers (D, M, and O) are programmable by configuration and

during normal operation via the Dynamic Reconfiguration Port (DRP). The pre-divider D reduces the input

frequency and feeds one input of the phase/frequency comparator. The feedback divider M acts as a

multiplier because it divides the VCO output frequency before feeding the other input of the phase

comparator. D and M must be chosen appropriately to keep the VCO within its specified frequency range.

The VCO has eight equally-spaced output phases (0°, 45°, 90°, 135°, 180°, 225°, 270°, and 315°). Each

phase can be selected to drive one of the output dividers, and each divider is programmable by

configuration to divide by any integer from 1 to 128.

The MMCM has three input-jitter filter options: low bandwidth, high bandwidth, or optimized mode.

Low-Bandwidth mode has the best jitter attenuation. High-Bandwidth mode has the best phase offset.

Optimized mode allows the tools to find the best setting.

The MMCM can have a fractional counter in either the feedback path (acting as a multiplier) or in one

output path. Fractional counters allow non-integer increments of 1/8 and can thus increase frequency

synthesis capabilities by a factor of 8. The MMCM can also provide fixed or dynamic phase shift in small

increments that depend on the VCO frequency. At 1,600MHz, the phase-shift timing increment is 11.2ps.

PLL

With fewer features than the MMCM, the two PLLs in a clock management tile are primarily present to

provide the necessary clocks to the dedicated memory interface circuitry. The circuit at the center of the

PLLs is similar to the MMCM, with PFD feeding a VCO and programmable M, D, and O counters. There are

two divided outputs to the device fabric per PLL as well as one clock plus one enable signal to the memory

interface circuitry.

Zynq UltraScale+ MPSoCs are equipped with five additional PLLs in the PS for independently configuring

the four primary clock domains with the PS: the APU, the RPU, the DDR controller, and the I/O peripherals.

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Clock Distribution

Clocks are distributed throughout Zynq UltraScale+ MPSoCs via buffers that drive a number of vertical

and horizontal tracks. There are 24 horizontal clock routes per clock region and 24 vertical clock routes per

clock region with 24 additional vertical clock routes adjacent to the MMCM and PLL. Within a clock region,

clock signals are routed to the device logic (CLBs, etc.) via 16 gateable leaf clocks.

Several types of clock buffers are available. The BUFGCE and BUFCE_LEAF buffers provide clock gating at

the global and leaf levels, respectively. BUFGCTRL provides glitchless clock muxing and gating capability.

BUFGCE_DIV has clock gating capability and can divide a clock by 1 to 8. BUFG_GT performs clock division

from 1 to 8 for the transceiver clocks. In MPSoCs, clocks can be transferred from the PS to the PL using

dedicated buffers.

Memory Interfaces

Memory interface data rates continue to increase, driving the need for dedicated circuitry that enables

high performance, reliable interfacing to current and next-generation memory technologies. Every

Zynq UltraScale+ MPSoC includes dedicated physical interfaces (PHY) blocks located between the CMT

and I/O columns that support implementation of high-performance PHY blocks to external memories such

as DDR4, DDR3, QDRII+, and RLDRAM3. The PHY blocks in each I/O bank generate the address/control

and data bus signaling protocols as well as the precision clock/data alignment required to reliably

communicate with a variety of high-performance memory standards. Multiple I/O banks can be used to

create wider memory interfaces.

As well as external parallel memory interfaces, Zynq UltraScale+ MPSoC can communicate to external

serial memories, such as Hybrid Memory Cube (HMC), via the high-speed serial transceivers. All

transceivers in the UltraScale architecture support the HMC protocol, up to 15Gb/s line rates. UltraScale

architecture-based devices support the highest bandwidth HMC configuration of 64 lanes with a single

device.

Configurable Logic Block

Every Configurable Logic Block (CLB) in the UltraScale architecture contains 8 LUTs and 16 flip-flops. The

LUTs can be configured as either one 6-input LUT with one output, or as two 5-input LUTs with separate

outputs but common inputs. Each LUT can optionally be registered in a flip-flop. In addition to the LUTs

and flip-flops, the CLB contains arithmetic carry logic and multiplexers to create wider logic functions.

Each CLB contains one slice. There are two types of slices: SLICEL and SLICEM. LUTs in the SLICEM can be

configured as 64-bit RAM, as 32-bit shift registers (SRL32), or as two SRL16s. CLBs in the UltraScale

architecture have increased routing and connectivity compared to CLBs in previous-generation Xilinx

devices. They also have additional control signals to enable superior register packing, resulting in overall

higher device utilization.

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Interconnect

Various length vertical and horizontal routing resources in the UltraScale architecture that span 1, 2, 4, 5,

12, or 16 CLBs ensure that all signals can be transported from source to destination with ease, providing

support for the next generation of wide data buses to be routed across even the highest capacity devices

while simultaneously improving quality of results and software run time.

Block RAM

Every UltraScale architecture-based device contains a number of 36Kb block RAMs, each with two

completely independent ports that share only the stored data. Each block RAM can be configured as one

36Kb RAM or two independent 18Kb RAMs. Each memory access, read or write, is controlled by the clock.

Connections in every block RAM column enable signals to be cascaded between vertically adjacent block

RAMs, providing an easy method to create large, fast memory arrays, and FIFOs with greatly reduced

power consumption.

All inputs, data, address, clock enables, and write enables are registered. The input address is always

clocked (unless address latching is turned off), retaining data until the next operation. An optional output

data pipeline register allows higher clock rates at the cost of an extra cycle of latency. During a write

operation, the data output can reflect either the previously stored data or the newly written data, or it can

remain unchanged. Block RAM sites that remain unused in the user design are automatically powered

down to reduce total power consumption. There is an additional pin on every block RAM to control the

dynamic power gating feature.

Programmable Data Width

Each port can be configured as 32K × 1; 16K × 2; 8K × 4; 4K × 9 (or 8); 2K × 18 (or 16); 1K × 36 (or 32); or

512 × 72 (or 64). Whether configured as block RAM or FIFO, the two ports can have different aspect ratios

without any constraints. Each block RAM can be divided into two completely independent 18Kb block

RAMs that can each be configured to any aspect ratio from 16K × 1 to 512 × 36. Everything described

previously for the full 36Kb block RAM also applies to each of the smaller 18Kb block RAMs. Only in simple

dual-port (SDP) mode can data widths of greater than 18 bits (18Kb RAM) or 36 bits (36Kb RAM) be

accessed. In this mode, one port is dedicated to read operation, the other to write operation. In SDP mode,

one side (read or write) can be variable, while the other is fixed to 32/36 or 64/72. Both sides of the

dual-port 36Kb RAM can be of variable width.

Error Detection and Correction

Each 64-bit-wide block RAM can generate, store, and utilize eight additional Hamming code bits and

perform single-bit error correction and double-bit error detection (ECC) during the read process. The ECC

logic can also be used when writing to or reading from external 64- to 72-bit-wide memories.

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FIFO Controller

Each block RAM can be configured as a 36Kb FIFO or an 18Kb FIFO. The built-in FIFO controller for

single-clock (synchronous) or dual-clock (asynchronous or multirate) operation increments the internal

addresses and provides four handshaking flags: full, empty, programmable full, and programmable empty.

The programmable flags allow the user to specify the FIFO counter values that make these flags go active.

The FIFO width and depth are programmable with support for different read port and write port widths on

a single FIFO. A dedicated cascade path allows for easy creation of deeper FIFOs.

UltraRAM

UltraRAM is a high-density, dual-port, synchronous memory block used in some UltraScale+ families. Both

of the ports share the same clock and can address all of the 4K x 72 bits. Each port can independently read

from or write to the memory array. UltraRAM supports two types of write enable schemes. The first mode

is consistent with the block RAM byte write enable mode. The second mode allows gating the data and

parity byte writes separately. Multiple UltraRAM blocks can be cascaded together to create larger memory

arrays. UltraRAM blocks can be connected together to create larger memory arrays. Dedicated routing in

the UltraRAM column enables the entire column height to be connected together. This makes UltraRAM an

ideal solution for replacing external memories such as SRAM. Cascadable anywhere from 288Kb to 36Mb,

UltraRAM provides the flexibility to fulfill many different memory requirements.

Error Detection and Correction

Each 64-bit-wide UltraRAM can generate, store and utilize eight additional Hamming code bits and

perform single-bit error correction and double-bit error detection (ECC) during the read process.

Digital Signal Processing

DSP applications use many binary multipliers and accumulators, best implemented in dedicated DSP

slices. All UltraScale architecture-based devices have many dedicated, low-power DSP slices, combining

high speed with small size while retaining system design flexibility.

Each DSP slice fundamentally consists of a dedicated 27 × 18 bit twos complement multiplier and a 48-bit

accumulator. The multiplier can be dynamically bypassed, and two 48-bit inputs can feed a

single-instruction-multiple-data (SIMD) arithmetic unit (dual 24-bit add/subtract/accumulate or quad

12-bit add/subtract/accumulate), or a logic unit that can generate any one of ten different logic functions

of the two operands.

The DSP includes an additional pre-adder, typically used in symmetrical filters. This pre-adder improves

performance in densely packed designs and reduces the DSP slice count by up to 50%. The 96-bit-wide

XOR function, programmable to 12, 24, 48, or 96-bit widths, enables performance improvements when

implementing forward error correction and cyclic redundancy checking algorithms.

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The DSP also includes a 48-bit-wide pattern detector that can be used for convergent or symmetric

rounding. The pattern detector is also capable of implementing 96-bit-wide logic functions when used in

conjunction with the logic unit.

The DSP slice provides extensive pipelining and extension capabilities that enhance the speed and

efficiency of many applications beyond digital signal processing, such as wide dynamic bus shifters,

memory address generators, wide bus multiplexers, and memory-mapped I/O register files. The

accumulator can also be used as a synchronous up/down counter.

System Monitor

The System Monitor blocks in the UltraScale architecture are used to enhance the overall safety, security,

and reliability of the system by monitoring the physical environment via on-chip power supply and

temperature sensors.

All UltraScale architecture-based devices contain at least one System Monitor. The System Monitor in

UltraScale+ devices is similar to the Kintex UltraScale and Virtex UltraScale devices but with the addition

of a PMBus interface.

Zynq UltraScale+ MPSoCs contain one System Monitor in the PL and an additional block in the PS. The

System Monitor in the PL has the same features as the block in UltraScale+ FPGAs. See Table 11.

In FPGAs and the MPSoC PL, sensor outputs and up to 17 user-allocated external analog inputs are

digitized using a 10-bit 200 kilo-sample-per-second (kSPS) ADC, and the measurements are stored in

registers that can be accessed via internal FPGA (DRP), JTAG, PMBus, or I2C interfaces. The I2C interface

and PMBus allow the on-chip monitoring to be easily accessed by the System Manager/Host before and

after device configuration.

The System Monitor in the MPSoC PS uses a 10-bit, 1 mega-sample-per-second (MSPS) ADC to digitize the

sensor inputs. The measurements are stored in registers and are accessed via the Advanced Peripheral Bus

(APB) interface by the processors and the PMU in the PS.

Table 11: Key System Monitor Features

Zynq UltraScale+ MPSoC PL Zynq UltraScale+ MPSoC PS

ADC 10-bit 200kSPS 10-bit 1MSPS

Interfaces JTAG, I2C, DRP, PMBus APB

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Packaging

The UltraScale architecture-based devices are available in a variety of organic flip-chip and lidless flip-chip

packages supporting different quantities of I/Os and transceivers. Maximum supported performance can

depend on the style of package and its material. Always refer to the specific device data sheet for

performance specifications by package type.

In flip-chip packages, the silicon device is attached to the package substrate using a high-performance

flip-chip process. Decoupling capacitors are mounted on the package substrate to optimize signal

integrity under simultaneous switching of outputs (SSO) conditions.

System-Level Features

Several functions span both the PS and PL and include:

•Reset Management

•Clock Management

•Power Domains

•PS Boot and Device Configuration

•Hardware and Software Debug Support

Reset Management

The reset management function provides the ability to reset the entire device or individual units within it.

The PS supports these reset functions and signals:

•External and internal power-on reset signal

•Warm reset

•Watchdog timer reset

•User resets to PL

•Software, watchdog timer, or JTAG provided resets

•Security violation reset (locked down reset)

Clock Management

The PS in Zynq UltraScale+ MPSoCs is equipped with five phase-locked loops (PLLs), providing flexibility

in configuring the clock domains within the PS. There are four primary clock domains of interest within the

PS. These include the APU, the RPU, the DDR controller, and the I/O peripherals (IOP). The frequencies of

all of these domains can be configured independently under software control.

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Power Domains

The Zynq UltraScale+ MPSoC contains four separate power domains. When they are connected to

separate power supplies, they can be completely powered down independently of each other without

consuming any dynamic or static power. The processing system includes:

•Full Power Domain (FPD)

•Low Power Domain (LPD)

•Battery Powered Domain (BPD)

In addition to these three Processing System power domains, the PL can also be completely powered

down if connected to separate power supplies.

The Full Power Domain (FPD) consists of the following major blocks:

•Application Processing Unit (APU)

•DMA (FP-DMA)

•Graphics Processing Unit (GPU)

•Dynamic Memory Controller (DDRC)

•High-Speed I/O Peripherals

The Low Power Domain (LPD) consists of the following major blocks:

•Real-Time Processing Unit (RPU)

•DMA (LP-DMA)

•Platform Management Unit (PMU)

•Configuration Security Unit (CSU)

•Low-Speed I/O Peripherals

•Static Memory Interfaces

The Battery Power Domain (BPD) is the lowest power domain of the Zynq UltraScale+ MPSoC processing

system. In this mode, all the PS is powered off except the Real-Time Clock (RTC) and battery-backed RAM

(BBRAM).

Power Examples

Power for the Zynq UltraScale+ MPSoCs varies depending on the utilization of the PL resources, and the

frequency of the PS and PL. To estimate power, use the Xilinx Power Estimator (XPE) at:

http://www.xilinx.com/products/design_tools/logic_design/xpe.htm

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PS Boot and Device Configuration

Zynq UltraScale+ MPSoCs use a multi-stage boot process that supports both a non-secure and a secure

boot. The PS is the master of the boot and configuration process. For a secure boot, the AES-GCM,

SHA-3/384 decrypts and authenticates the images while the 4096-bit RSA block authenticates the image.

Upon reset, the device mode pins are read to determine the primary boot device to be used: NAND,

Quad-SPI, SD, eMMC, or JTAG. JTAG can only be used as a non-secure boot source and is intended for

debugging purposes. The CSU executes code out of on-chip ROM and copies the first stage boot loader

(FSBL) from the boot device to the OCM.

After copying the FSBL to OCM, one of the processors, either the Cortex-A53 or Cortex-R5, executes the

FSBL. Xilinx supplies example FSBLs or users can create their own. The FSBL initiates the boot of the PS and

can load and configure the PL, or configuration of the PL can be deferred to a later stage. The FSBL

typically loads either a user application or an optional second stage boot loader (SSBL), such as U-Boot.

Users obtain example SSBL from Xilinx or a third party, or they can create their own SSBL. The SSBL

continues the boot process by loading code from any of the primary boot devices or from other sources

such as USB, Ethernet, etc. If the FSBL did not configure the PL, the SSBL can do so, or again, the

configuration can be deferred to a later stage.

The static memory interface controller (NAND, eMMC, or Quad-SPI) is configured using default settings.

To improve device configuration speed, these settings can be modified by information provided in the

boot image header. The ROM boot image is not user readable or callable after boot.

Hardware and Software Debug Support

The debug system used in Zynq UltraScale+ MPSoCs is based on the Arm CoreSight architecture. It uses

Arm CoreSight components including an embedded trace controller (ETC), an embedded trace Macrocell

(ETM) for each Cortex-A53 and Cortex-R5 processor, and a system trace Macrocell (STM). This enables

advanced debug features like event trace, debug breakpoints and triggers, cross-trigger, and debug bus

dump to memory. The programmable logic can be debugged with the Xilinx Vivado Logic Analyzer.

Debug Ports

Three JTAG ports are available and can be chained together or used separately. When chained together, a

single port is used for chip-level JTAG functions, Arm processor code downloads and run-time control

operations, PL configuration, and PL debug with the Vivado Logic Analyzer. This enables tools such as the

Xilinx Software Development Kit (SDK) and Vivado Logic Analyzer to share a single download cable from

Xilinx.

When the JTAG chain is split, one port is used to directly access the Arm DAP interface. This CoreSight

interface enables the use of Arm-compliant debug and software development tools such as Development

Studio 5 (DS-5™). The other JTAG port can then be used by the Xilinx FPGA tools for access to the PL,

including configuration bitstream downloads and PL debug with the Vivado Logic Analyzer. In this mode,

users can download to and debug the PL in the same manner as a stand-alone FPGA.

(I XILINX, www.xi|inx.com

Zynq UltraScale+ MPSoC Data Sheet: Overview

DS891 (v1.7) November 12, 2018 www.xilinx.com

Product Specification 40

Ordering Information

Table 12 shows the speed and temperature grades available in the different device families.

The ordering information shown in Figure 3 applies to all packages in the Zynq UltraScale+ MPSoCs.

Table 12: Speed Grade and Temperature Grade

Device

Family Devices

Speed Grade and Temperature Grade

Commercial

(E) Industrial

(I)

0°C to +85°C 0°C to +100°C 0°C to +110°C –40°C to +100°C

Zynq

UltraScale+

Devices

-2E (0.85V) -2I (0.85V)

-2LE(1)(2) (0.85V or 0.72V)

-1E (0.85V) -1I (0.85V)

-1LI(2) (0.85V or 0.72V)

ZU2EG

ZU3EG

-2E (0.85V) -2I (0.85V)

-2LE(1)(2) (0.85V or 0.72V)

-1E (0.85V) -1I (0.85V)

-1LI(2) (0.85V or 0.72V)

ZU4EG

ZU5EG

ZU6EG

ZU7EG

ZU9EG

ZU11EG

ZU15EG

ZU17EG

ZU19EG

-3E (0.90V)

-2E (0.85V) -2I (0.85V)

-2LE(1)(2) (0.85V or 0.72V)

-1E (0.85V) -1I (0.85V)

-1LI(2) (0.85V or 0.72V)

Devices

-3E (0.90V)

-2E (0.85V) -2I (0.85V)

-2LE(1)(2) (0.85V or 0.72V)

-1E (0.85V) -1I (0.85V)

-1LI(2) (0.85V or 0.72V)

Notes:

1. Devices labeled with the speed/temperature grade of -2LE can operate for a limited time at a junction temperature

between 100°C and 110°C. Timing parameters adhere to the same speed file at 110°C as they do below 110°C, regardless

of operating voltage (nominal voltage of 0.85V or a low-voltage of 0.72V). Operation up to Tj = 110°C is limited to 1% of

the device lifetime and can occur sequentially or at regular intervals as long as the total time does not exceed 1% of the

device lifetime.

2. In Zynq UltraScale+ MPSoCs, when operating the PL at low voltage (0.72V), the PS operates at nominal voltage (0.85V)

Zynq UltraScale+ MPSoC Data Sheet: Overview

DS891 (v1.7) November 12, 2018 www.xilinx.com

Product Specification 41

X-Ref Target - Figure 3

Figure 3: Zynq UltraScale+ MPSoC Ordering Information

Example:

Xilinx Commercial

ZU: Zynq UltraScale+

Speed Grade

-1: Slowest

-L1: Low Power

-2: Mid

-L2: Low Power

-3: Fastest

Temperature Grade

E: Extended

I: Industrial

F: Lid

B: Lidless

Package Designator and Pin Count

(Footprint Identifier)

F: Flip-chip with 1.0mm Ball Pitch

S: Flip-chip with 0.8mm Ball Pitch

DS891_03_091216

1) -L1 and -L2 are the ordering codes for the low power -1L and -2L speed grades, respectively.

ZU -1 V C1156 EFF

V: RoHS 6/6

Value Index

Processor System Identifier

C: Dual APU; Dual RPU

E: Quad APU; Dual RPU; Single GPU

Engine Type

G: General Purpose

V: Video

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Product Specification 42

Revision History

The following table shows the revision history for this document:

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LIABILITY.

Date Version Description of Revisions

11/12/2018 1.7 Updated PCIe information throughout document: PCI Express, Table 1, Table 3, Table 5,

Table 10, and Integrated Blocks for PCI Express Designs.

08/21/2018 1.6 Changed document classification to Product Specification. Updated Note 4 in Table 2.

07/12/2017 1.5 Updated Application Processing Unit (APU); Real-Time Processing Unit (RPU); Table 1;

Table 3; Table 5; Table 12 (-2E footnote).

02/15/2017 1.4 Updated DSP count in Table 1, Table 3, and Table 5. Updated I/O Electrical

Characteristics. Updated Table 12 with -2E speed grade.

09/23/2016 1.3 Updated Table 2; Table 3; Table 4; Table 6; Graphics Processing Unit (GPU); and NAND

ONFI 3.1 Flash Controller.

06/03/2016 1.2 Added CG devices: Updated Table 1; Table 2; Table 3; Table 4; Table 5; Table 6; and

Table 12. Added Video Encoder/Decoder (VCU); Table 7; and Power Examples (removed

XPE Computed Range table). Updated: General Description; Arm Cortex-A53 Based

Application Processing Unit (APU); Zynq UltraScale+ MPSoCs; Dynamic Memory

Controller (DDRC); and Figure 3.

01/28/2016 1.1 Updated Table 1 and Table 2.

11/24/2015 1.0 Initial Xilinx release.

Zynq UltraScale+ MPSoC Overview Datasheet by AMD

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