LQW2BASyyyy00L Ref Spec Datasheet by Murata Electronics

SQecNo.JELF243A70084NrO1 LQW2BA38N2GOOL LQWZBASSNZJOOL LQW2BAS1ONGOOL LQWZBAS10NJOOL LQW2BAS1ZNGOOL LQWZBAS12NJOOL LQW2BAS15NGOOL LQWZBAS15NJOOL LQW2BAS15NGOOI; LQWZBAS18NJOOL LQW2BASZZNGOOL LQWZBASZ2NJOOL LQW2BA324NGOOL LQWZBASZ4NJOOL LQW2BASZ7NGOOL LQWZBASZ7NJOOL LQW2BA333NGOOL LQWZBA833NJOOL LQW2BA336NGOOL LQWZBASBGNJOOL LQW2BA339NGOOL LQWZBASBQNJOOL LQW2BA343NGOOL LQWZBASA3NJOOL LQW2BA347NGOOL LQWZBASIWNJOOL LQW2BA356NGOOI; LQWZBASSGNJOOL LQW2BASGBNGOOL LQWZBASBBNJOOL LQW2BA382NGOOL LQWZBASS2NJOOL LQW2BA391NGOOL LQWZBASQ1 NJOOL LQW2BASR1OGOOL LQWZBASR1OJOOL
SpecNo.JELF243A-0084N-01 P.1/11
MURATA MFG.CO.,LTD
Reference Onl
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CHIP COIL (CHIP INDUCTORS) LQW2BAS□□□□00L REFERENCE SPECIFICATION
1. Scope
This Reference specification applies to LQW2BAS_00 series, Chip coil (Chip Inductors).
2. Part Numbering
(ex) LQ W 2B A S 2N8 J 0 0 L
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W) and
L:Taping
Characteristics
∗B:Bulk
∗Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3. Rating
・Operating Temperature Range –55°C ~ +125°C
・Storage Temperature Range. –55°C ~ +125°C
Customer
Part Number
MURATA Part
Number
Inductance Q
(min.)
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Rated
Current
(mA)
(nH) Tolerance
LQW2BAS2N7J00L 2.7
J：±5%
80 0.03 15000 910
LQW2BAS2N8J00L 2.8 0.06 12200 800
LQW2BAS3N0J00L 3.0 65
LQW2BAS5N6J00L 5.6 0.08 5900
600
LQW2BAS6N0J00L 6.0 70 0.03 4500
LQW2BAS6N8J00L 6.8
50
0.11 5600
LQW2BAS7N5J00L 7.5 0.14 4800
LQW2BAS8N2G00L 8.2
G：±2%
J：±5%
0.12 4400
LQW2BAS8N2J00L
LQW2BAS10NG00L 10 60 0.10 4300
LQW2BAS10NJ00L
LQW2BAS12NG00L 12
50
0.15 4000
LQW2BAS12NJ00L
LQW2BAS15NG00L 15 0.17 3200
LQW2BAS15NJ00L
LQW2BAS18NG00L 18 0.20 3100
LQW2BAS18NJ00L
LQW2BAS22NG00L 22 55
0.22
2600
500
LQW2BAS22NJ00L
LQW2BAS24NG00L 24 50 2400
LQW2BAS24NJ00L
LQW2BAS27NG00L 27 55 0.25 2580
LQW2BAS27NJ00L
LQW2BAS33NG00L 33
G：±2%
J：±5%
60
0.27
2150
LQW2BAS33NJ00L
LQW2BAS36NG00L 36 55 1900
LQW2BAS36NJ00L
LQW2BAS39NG00L 39
60
0.29 2000
LQW2BAS39NJ00L
LQW2BAS43NG00L 43 0.34 1800
LQW2BAS43NJ00L
LQW2BAS47NG00L 47 0.31 1700
LQW2BAS47NJ00L
LQW2BAS56NG00L 56 0.34 1600
LQW2BAS56NJ00L
LQW2BAS68NG00L 68 0.38 1500
LQW2BAS68NJ00L
LQW2BAS82NG00L 82
65
0.42
1330
400
LQW2BAS82NJ00L
LQW2BAS91NG00L 91 0.48
LQW2BAS91NJ00L
LQW2BASR10G00L 100 0.46 1250
LQW2BASR10J00L
SQeCNoJELFZASArOOHANrm LQWZBASR1 1GOOL LQWZBASR11JO0L LQWZBASR1ZGOOL LQWZBASR12JO0L LQWZBASR1SGOOL LQWZBASR1 SJOOL LQWZBASR18GOOL LQWZBASR1 HJOOL LQWZBASRZZGOOL LQWZBASRZZJOOL LQWZBASRZAGOOL LQWZBASRZAJOOL LQWZBASR27GOOL LQWZBASRZNOOL LQWZBASRSSGOOL LQWZBASRSSJOOL 1.5L02
SpecNo.JELF243A-0084N-01 P.2/11
MURATA MFG.CO.,LTD
Reference Onl
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Customer
Part Number
MURATA Part
Number
Inductance Q
(min.)
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Rated
Current
(mA)
(nH) Tolerance
LQW2BASR11G00L 110
G：±2%
J：±5%
50
0.48
1100
400
LQW2BASR11J00L
LQW2BASR12G00L 120 0.51
LQW2BASR12J00L
LQW2BASR15G00L 150 0.56
920
LQW2BASR15J00L
LQW2BASR18G00L 180 0.64
LQW2BASR18J00L
LQW2BASR22G00L 220 0.70 820
LQW2BASR22J00L
LQW2BASR24G00L 240 44
1.00
770
350
LQW2BASR24J00L
LQW2BASR27G00L 270
48
730
LQW2BASR27J00L
LQW2BASR33G00L 330 1.40 650 310
LQW2BASR33J00L
LQW2BASR39J00L 390
J：±5%
1.50 600 290
LQW2BASR47J00L 470 33 1.76 300 250
LQW2BASR56J00L 560
23
1.90 270 230
LQW2BASR68J00L 680 2.20 250 190
LQW2BASR82J00L 820 2.35 230 180
LQW2BAS1R0J00L 1000 2.40 200 170
4. Testing Conditions
《Unless otherwise specified》 《In case of doubt》
Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C±2°C
Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH)
Atmospheric Pressure : 86kPa to 106 kPa
5. Appearance and Dimensions
■Unit Mass (Typical value)
0.014g
1.42±0.1
0.25±0.15
1.5±0.2
0.5±0.1
(in mm)
2.09±0.2 1.53±0.2
SQecNo.JELF243A70084NsO1 Measuring Melho \imlled to 40°C max. 6.3 DC Resistance DC Resisiance shaH meet iiern 3 Measuring Equip 6.4 Seii Resonam 3m: snail rneei Ilem 3. Measuring Equip Frequeney(SRi=) 6.5 Raled Current Self iernperaiure rise shall be The raled eurren MURATA MFG CO,,LTD
SpecNo.JELF243A-0084N-01 P.3/11
MURATA MFG.CO.,LTD
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6. Electrical Performance
No. Item Specification Test Method
6.1 Inductance Inductance shall meet item 3.
Measuring Equipment：KEYSIGHT 4287A or equivalent
Measuring Frequency：
<Inductance> 250MHz / 2.7nH～ 39nH
200MHz / 43nH～ 68nH
150MHz / 82nH～ 120nH
100MHz / 150nH～ 390nH
50MHz / 470nH
25MHz / 560nH～1000nH
<Q> 1500MHz / 2.7nH～ 3.0nH
1000MHz / 5.6nH～ 8.2nH
500MHz / 10nH～ 100nH
250MHz / 110nH～ 390nH
100MHz / 470nH
50MHz / 560nH～1000nH
Measuring Condition：Test signal level / about 0dBm
Electrode spaces / 2.0 mm
Electrical length / 10.0mm
Weight / about 1N~3N
Measuring Fixture：KEYSIGHT 16197A
Position coil under test as shown in below and contact coil
with each terminal by adding weight.
Measuring Method：See the endnote.
<Electrical Performance：Measuring
Method of Inductance / Q>
6.2 Q Q shall meet item 3.
6.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment：Digital multi meter
6.4 Self Resonant
Frequency(SRF)
S.R.F shall meet item 3. Measuring Equipment：KEYSIGHT 8753C or equivalent
6.5 Rated Current Self temperature rise shall be
limited to 40°C max.
The rated current is applied.
1.5mm
SQECNOJELF243A70084N701 28 cn‘pCon /, ,f' Apphe Force He‘d 7 2 Bending Test Subs Spee Defle He‘d 7 3 Vibrauon (mm mm 196m Twme 7 4 smderammy Tne wemng area 0! me electrode Flux . snan be at ‘9351 90% covered with new comer coatmg Sclde PrerH Sclde Imme 7 5 Resws‘ance 10 Appearance , No damage Flux . SD‘dermg Heat Inductance cnange - wmnin 15% Sclde PrerH Sclde Imme Then [or 24 MURATA MFG,CO.,LTD
SpecNo.JELF243A-0084N-01 P.4/11
MURATA MFG.CO.,LTD
Reference Only
7. Mechanical Performance
No. Item Specification Test Method
7.1
Shear Test
Chip coil shall not be damaged
after tested as test method.
Substrate：Glass-epoxy substrate
(in mm)
Applied Direction：
Force：10N
Hold Duration：5s±1s
7.2 Bending Test Substrate：Glass-epoxy substrate
(100mm×40mm×1.0mm)
Speed of Applying Force：1mm / s
Deflection：3mm
Hold Duration：5s
7.3 Vibration Oscillation Frequency：10Hz~2000Hz~10Hz
for 15 min
Total amplitude 3 mm or Acceleration amplitude
196m/s
2
whichever is smaller.
Time：A period of 2 hours in each of 3 mutually
perpendicular directions.(Total 6hours)
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux：Ethanol solution of rosin, 25(wt)% Includes
activator equivalent to 0.06(wt)% chlorine.
(immersed for 5s to 10s)
Solder：Sn-3.0Ag-0.5Cu
Pre-Heating：150°C±10°C / 60s to 90s
Solder Temperature：240°C±5°C
Immersion Time：3s±1s
7.5 Resistance to
Soldering Heat
Appearance：No damage
Inductance Change：within ±5%
Flux：Ethanol solution of rosin, 25(wt)% Includes
activator equivalent to 0.06(wt)% chlorine.
(immersed for 5s to 10s)
Solder：Sn-3.0Ag-0.5Cu
Pre-Heating：150°C±10°C / 60s to 90s
Solder Temperature：270°C±5°C
Immersion Time：10s±1s
Then measured after exposure in the room condition
for 24h±2h.
Substrate
F
Chip Coil
45
R230
F
Deflection
45 Product
Pressure jig
(in mm)
0.76
2.8
1.78
Chip Coil Pattern
Solder resist
Substrate
W Reference Onl
SpecNo.JELF243A-0084N-01 P.5/11
MURATA MFG.CO.,LTD
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8. Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
8.1 Heat Resistance Appearance：No damage
Inductance Change：within ±5%
Q Change：within ±20%
Temperature：125°C±2°C
Time：1000h (+48h,0h)
Then measured after exposure in the room condition
for 24h±2h.
8.2 Cold Resistance Temperature：-55°C±2°C
Time：1000h (+48h,-0h)
Then measured after exposure in the room condition
for 24±2 h.
8.3 Humidity Temperature：85°C±2°C
Humidity：85%(RH)
Time：1000h (+48h,-0h)
Then measured after exposure in the room condition
for 24h±2h.
8.4 Temperature
Cycle
1 cycle：
1 step：-55°C±2°C / 30min±3 min
2 step：Ordinary temp. / 10min to 15 min
3 step：+125°C±2°C / 30min±3 min
4 step：Ordinary temp. / 30min±3 min
Total of 10 cycles
Then measured after exposure in the room condition
for 24h±2h.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape (8mm-wide, 4mm-pitch)
・Dimension of the Cavity is measured at the bottom side.
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
Sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Plastic tape 5N min.
Cover tape 10N min.
(in mm)
2.3±0.1
φ
1.5
1.55±0.1
4.0±0.1
2.0±0.05
4.0±0.1
+0.1
-0
1.75±0.1
3.5±0.05
8.0±0.3
1.1±0.1
引き出し方向
0.25
±
0.05
Direction of feed 1.65±0.1
1.8±0.1
W Reference Onl iMm
SpecNo.JELF243A-0084N-01 P.6/11
MURATA MFG.CO.,LTD
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9.4 Peeling off force of cover tape
Speed of Peeling off 300mm / min
Peeling off force 0.1N to 0.6N
(minimum value is typical)
9.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
(in mm)
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･
∗1) <Expression of Inspection No.> □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking » ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,
Quantity, etc ･･･
9.8. Specification of Outer Case
Outer Case Dimensions (mm) Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
∗ Above Outer Case size is typical. It depends on a quantity
of an order.
10. Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
W
D
Label
H
165 to 180 degree FCover tape
Plastic tape
Empty tape
190 min.
Leader
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180
φ
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
Cover tape
+1
-0
Label
SQecNo.JELF243A70084NrO1 Chip Can 2 8 ,r «: . / / ("SUM , / J“ 1,. Subs 11.2 Flux, Solder 'Use rcsm based flu Indudes mldd‘e acl Dom use highly acl Don“ use walerrsol - Use SnVSDAgrOfyC - Standard mwckness 11. 3 Reflow soldering con -Pre heating shou‘d 150 c max Cooling |im1|ed|o100"C ma Insumment preheat - Standard so‘denng The excessive Ilmn producl quaMy -Reflow somenng pro Prerhea Heahng Peak 19 Cyc‘e o
SpecNo.JELF243A-0084N-01 P.7/11
MURATA MFG.CO.,LTD
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11. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
(in mm)
11.2 Flux, Solder
・Use rosin-based flux.
Includes middle activator equivalent to 0.06(wt)% to 0.1(wt)% Chlorine.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste : 100μm to 150μm.
11.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
･Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C～180°C 、90s±30s
Heating above 220°C､30s～60s above 230°C､60s max.
Peak temperature 245°C±3°C 260°C,10s
Cycle of reflow 2 times 2 times
0.76
2.8
1.78
Chip Coil Pattern
Solder resist
Substrate
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3℃
220℃
30s～60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
SQECNOJELF243A70034N701 /\—/D\_|j/\ , ”Ear mm r fli/ (a) Mounlmg Componems Near Screw Horcs When a componem Is mounled near a screw hole, n may be affected by Ihe board deflection mal occurs durrrrg the ughlenmg o! Ihe screw, Mounl Ihe componem in a posmcn as far away from the screw holes as possrcre ©E-> Screw Hole Rec MURATA MFG,CO.,LTD
SpecNo.JELF243A-0084N-01 P.8/11
MURATA MFG.CO.,LTD
Reference Only
11.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1,-0)s
Time 2 times
Note：Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products
due to the thermal shock.
11.5 Solder Volume
・ Solder shall be used not to be exceed the upper limits as shown below.
・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/2T≦t≦T
T：thickness of electrode
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
Products shall be located in the sideways
direction (Length:a＜b) to the mechanical
stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface. A > D ∗1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from
the board separation surface. A > C
∗1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Recommendable(t)
Upper Limit
T
⇔
Recommendable(t)
Upper Limit
T
⇔
〈
Poor example
〉〈
Good example
〉
b
a
Seam
Slit
AD
BC
b
a
Length:a
<
b
Screw Hole Recommended
W Reference On
SpecNo.JELF243A-0084N-01 P.9/11
MURATA MFG.CO.,LTD
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11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at
the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
11.9 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to
the winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.10 Notice of product handling at mounting
In some mounting machines,when picking up components support pin pushes up the components from the bottom of plastic
tape. In this case, please remove the support pin. The support pin may damage the components and break wire.
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
11.13 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,
chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking
of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
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SpecNo.JELF243A-0084N-01 P.10/11
MURATA MFG.CO.,LTD
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12. Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2) You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before ordering.
To keep compatibility to other vender’s product, Inductance and Q value shall be measured in following method.
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
Zm= V1 ， Zx=
V2
I 1 I
2
(3) Thus,the relation between Zx and Zm is following；
Zx= α Zm-β where, α= D / A =1
1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm ： measured impedance of short chip
Zss ： residual impedance of short chip (=equivalent series Inductance X)
Yom： measured admittance when opening the fixture
Important：X：Zss shall be defined as correction value to fit nominal inductance of other venders’ products.
Please input X value instead of equivalent series Inductance (Short L) on test equipment calibration.
(4) Lx and Qx shall be calculated with the following equation.
Lx= Im(Zx) , Qx = Im(Zx) f：Measuring frequency
2πf Re(Zx)
Inductance and Q value shall be measured after this calibration setting.
In addition, Q value should be measured under our standard calibration setting of residual impedance, 0.771nH.
V1=A B V2
I 1C D I 2
< Electrical Performance:Measuring Method of Inductance / Q >
AB
CD
Zm Zx
V
12
12
ProductTest fixtureTest Head
II
V
W Reference On
SpecNo.JELF243A-0084N-01 P.11/11
MURATA MFG.CO.,LTD
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Chart. equivalent series Inductance to fit nominal inductance of other venders’ products.
MURATA
Part Number
Inductance
X
[nH]
equivalent series
Inductance
Measuring
Frequency
LQW2BAS2N7_00 0.121 250
LQW2BAS2N8_00 0.171 250
LQW2BAS3N0_00 0.131 250
LQW2BAS5N6_00 -0.009 250
LQW2BAS6N0_00 0.031 250
LQW2BAS6N8_00 0.301 250
LQW2BAS7N5_00 -0.299 250
LQW2BAS8N2_00 0.271 250
LQW2BAS10N_00 -0.229 250
LQW2BAS12N_00 0.371 250
LQW2BAS15N_00 0.051 250
LQW2BAS18N_00 -0.029 250
LQW2BAS22N_00 0.491 250
LQW2BAS24N_00 -0.389 250
LQW2BAS27N_00 0.931 250
LQW2BAS33N_00 0.481 250
LQW2BAS36N_00 0.531 250
LQW2BAS39N_00 0.771 250
LQW2BAS43N_00 -0.689 200
LQW2BAS47N_00 1.091 200
LQW2BAS56N_00 0.331 200
LQW2BAS68N_00 0.811 200
LQW2BAS82N_00 -0.839 150
LQW2BAS91N_00 -1.339 150
LQW2BASR10_00 0.171 150
LQW2BASR11_00 1.371 150
LQW2BASR12_00 -1.629 150
LQW2BASR15_00 -0.029 100
LQW2BASR18_00 4.071 100
LQW2BASR22_00 0.771 100
LQW2BASR24_00 3.071 100
LQW2BASR27_00 -1.429 100
LQW2BASR33_00 4.071 100
LQW2BASR39_00 0.971 100
LQW2BASR47_00 -8.829 50
LQW2BASR56_00 -8.229 25
LQW2BASR68_00 -2.229 25
LQW2BASR82_00 -8.029 25
LQW2BAS1R0_00 -6.329 25