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LQW15ANyyyy00D Spec Datasheet by Murata Electronics

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SQecNo ELF243A0050AA01 Reference On y Se‘f LQW|5AN1NSBOOD LQW15AN1NSCUUD LQW15AN1NGCUUD LQW15AN1N7CUUD LQW15AN1NSCUUD LQWisANzNABOOD LQW15AN2NACUUD LQW|5AN2NSBOOD LQW15AN2NSCUUD LQW|5AN2NEBOOD LQW15AN2NGCUUD LQW|5AN2N7BOOD LQW15AN2N7CUUD LQW|5AN2NEBOOD LQW15AN2NSCUUD LQW|5AN2NSBOOD LQW15AN2NQCUUD LQW|5AN3NDBOOD LQW15AN3NOCUUD LQWisANsm BOOD LQW15AN3N1€UUD LQW|5AN3NZBOOD LQW15AN3NZCUUD LQW|5AN3NSBOOD LQW15AN3NQCUUD LQWisAN4N1BOOD LQW15AN4N1€UUD LQW|5AN4NSBOOD LQW15AN4N3€UUD MURATA MFG couLTD
Spec No.JELF243A-0050AA-01 P.1/14
MURATA MFG.CO.,LTD
Reference Only
CHIP COIL (CHIP INDUCTORS) LQW15AN□□□□00D Reference Specification
1.Scope
This Reference Specification applies to LQW15AN_00 series, Chip coil (Chip Inductors).
2.Part Numbering
(ex) LQ W 15 A N 1N5 B 0 0 D
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W) and
D:Taping
Characteristics
*B:Bulk
* Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3.Rating
Operating Temperature Range. –55°C ~ +125°C
Storage Temperature Range. –55°C ~ +125°C
Customer
Part Number
MURATA
Part Number
Inductance Q
(min.)
DC
Resistance
( max.)
Self
Resonant
Frequency
(GHz min.)
Rated
Current
(mA)
(nH) Tolerance
LQW15AN1N5B00D
1.5
B:±0.1nH
C:±0.2nH
D:±0.5nH
10
0.03 18.0 1000
LQW15AN1N5C00D
LQW15AN1N5D00D
LQW15AN1N6C00D
1.6
C:±0.2nH
D:±0.5nH
0.07
17.0
750
LQW15AN1N6D00D
LQW15AN1N7C00D
1.7 0.10 640
LQW15AN1N7D00D
LQW15AN1N8C00D
1.8 0.16 16.0 460
LQW15AN1N8D00D
LQW15AN2N4B00D
2.4
B:±0.1nH
C:±0.2nH
D:±0.5nH
20
0.05
15.0
850
LQW15AN2N4C00D
LQW15AN2N4D00D
LQW15AN2N5B00D
2.5
LQW15AN2N5C00D
LQW15AN2N5D00D
LQW15AN2N6B00D
2.6
LQW15AN2N6C00D
LQW15AN2N6D00D
LQW15AN2N7B00D
2.7
LQW15AN2N7C00D
LQW15AN2N7D00D
LQW15AN2N8B00D
2.8
LQW15AN2N8C00D
LQW15AN2N8D00D
LQW15AN2N9B00D
2.9
0.07 750
LQW15AN2N9C00D
LQW15AN2N9D00D
LQW15AN3N0B00D
3.0
LQW15AN3N0C00D
LQW15AN3N0D00D
LQW15AN3N1B00D
3.1 0.13
14.0
570
LQW15AN3N1C00D
LQW15AN3N1D00D
LQW15AN3N2B00D
3.2 15 0.17 500
LQW15AN3N2C00D
LQW15AN3N2D00D
LQW15AN3N9B00D
3.9
25 0.07 10.0 750
LQW15AN3N9C00D
LQW15AN3N9D00D
LQW15AN4N1B00D
4.1
LQW15AN4N1C00D
LQW15AN4N1D00D
LQW15AN4N3B00D
4.3
LQW15AN4N3C00D
LQW15AN4N3D00D
SQecNo ELF243A0050AA01 Reference On y Se‘f LQW|5AN4NABOOD LQW15AN4NACOOD LQW|5AN4NSBOOD LQW15AN4NSCOOD LQW|5AN4NEBOOD LQW15AN4NGCOOD LQW|5AN4N7BOOD LQW15AN4N7COOD LQW|5AN4NEBOOD LQW15AN4NSCOOD LQW|5AN4NSBOOD LQW15AN4NQCOOD LQW|5AN5NDBOOD LQW15AN5NOCOOD LQW|5AN5NI BOOD LQW15AN5N1€OOD LQW|5AN5NEBOOD LQW15AN5NSCOOD LQW|5AN6NZBOOD LQW15ANENZCOOD LQW|5AN6NSBOOD LQW15ANENSCUUD LQWisANGNABOOD LQW15ANENACOOD LQW|5AN6NSBOOD LQW15ANENSCOOD LQW|5AN6NEBOOD LQW15ANENGCOOD LQW|5AN6N7BOOD LQW15ANEN7COOD LQW|5AN6NBGODD LQW15ANENSHOOD LQW|5AN6NBGODD LQW15ANEN9HOOD LQWISAN7NUGODD LQW15AN7NOHOOD LQW|5AN7N1 GOOD LQW1 5AN7N| HOOD LQWisAN7NQGOOD LQW15AN7N2HOOD MURATA MFG couLTD
Spec No.JELF243A-0050AA-01 P.2/14
MURATA MFG.CO.,LTD
Reference Only
Customer
Part Number
MURATA
Part Number
Inductance Q
(min.)
DC
Resistance
( max.)
Self
Resonant
Frequency
(GHz min.)
Rated
Current
(mA)
(nH) Tolerance
LQW15AN4N4B00D
4.4
B:±0.1nH
C:±0.2nH
D:±0.5nH
25
0.07
8.0
750
LQW15AN4N4C00D
LQW15AN4N4D00D
LQW15AN4N5B00D
4.5
LQW15AN4N5C00D
LQW15AN4N5D00D
LQW15AN4N6B00D
4.6
LQW15AN4N6C00D
LQW15AN4N6D00D
LQW15AN4N7B00D
4.7
LQW15AN4N7C00D
LQW15AN4N7D00D
LQW15AN4N8B00D
4.8
LQW15AN4N8C00D
LQW15AN4N8D00D
LQW15AN4N9B00D
4.9
0.12 600
LQW15AN4N9C00D
LQW15AN4N9D00D
LQW15AN5N0B00D
5.0
LQW15AN5N0C00D
LQW15AN5N0D00D
LQW15AN5N1B00D
5.1
LQW15AN5N1C00D
LQW15AN5N1D00D
LQW15AN5N8B00D
5.8
0.09 700
LQW15AN5N8C00D
LQW15AN5N8D00D
LQW15AN6N2B00D
6.2
LQW15AN6N2C00D
LQW15AN6N2D00D
LQW15AN6N3B00D
6.3
6.0
LQW15AN6N3C00D
LQW15AN6N3D00D
LQW15AN6N4B00D
6.4
LQW15AN6N4C00D
LQW15AN6N4D00D
LQW15AN6N5B00D
6.5
LQW15AN6N5C00D
LQW15AN6N5D00D
LQW15AN6N6B00D
6.6
LQW15AN6N6C00D
LQW15AN6N6D00D
LQW15AN6N7B00D
6.7
LQW15AN6N7C00D
LQW15AN6N7D00D
LQW15AN6N8G00D
6.8
G:±2%
H:±3%
J:±5%
LQW15AN6N8H00D
LQW15AN6N8J00D
LQW15AN6N9G00D
6.9
0.13 570
LQW15AN6N9H00D
LQW15AN6N9J00D
LQW15AN7N0G00D
7.0
LQW15AN7N0H00D
LQW15AN7N0J00D
LQW15AN7N1G00D
7.1
LQW15AN7N1H00D
LQW15AN7N1J00D
LQW15AN7N2G00D
7.2
LQW15AN7N2H00D
LQW15AN7N2J00D
SQecNo ELF243A0050AA01 Reference On y Se‘f LQWisANmaGODD LQW15AN7N3HUUD LQWISAN7NSGODD LQW15AN7N5HUUD LQW|5ANSNZGODD LQW15ANBN2HUUD LQW|5ANSNEGODD LQW15ANBN6HUUD LQW|5ANSN7GODD LQW15ANBN7HUUD LQW|5ANSNBGODD LQW15ANBNSHUUD LQW|5ANSNBGODD LQW15ANBN9HUUD LQW|5AN9NUGODD LQW15AN9NOHUUD LQWisANQM GOOD LQW15AN9N1HUUD LQW|5AN9NQGODD LQW15AN9N2HUUD LQW|5AN9NSGODD LQW15AN9N3HUUD LQWisANQNAGODD LQW15AN9N4HUUD LQW|5AN9NSGODD LQW15AN9N5HUUD LQW|5AN9NEGODD LQW15AN9N6HUUD LQW|5AN9N7GODD LQW15AN9N7HUUD LQW|5AN9NBGODD LQW15AN9NSHUUD LQW|5AN9NSGODD LQW15AN9N9HUUD LQW|5AN|0NGODD LQW15AN1UNHUUD LQW|5AN| |NGODD LQW15AN1 1NHUUD LQW|5AN|2NGODD LQW15AN12NHUUD MURATA MFG couLTD
Spec No.JELF243A-0050AA-01 P.3/14
MURATA MFG.CO.,LTD
Reference Only
Customer
Part Number
MURATA
Part Number
Inductance Q
(min.)
DC
Resistance
( max.)
Self
Resonant
Frequency
(GHz min.)
Rated
Current
(mA)
(nH) Tolerance
LQW15AN7N3G00D
7.3
G:±2%
H:±3%
J:±5%
25
0.13 6.0 570
LQW15AN7N3H00D
LQW15AN7N3J00D
LQW15AN7N5G00D
7.5
LQW15AN7N5H00D
LQW15AN7N5J00D
LQW15AN8N2G00D
8.2
0.14
5.5
540
LQW15AN8N2H00D
LQW15AN8N2J00D
LQW15AN8N6G00D
8.6
LQW15AN8N6H00D
LQW15AN8N6J00D
LQW15AN8N7G00D
8.7
LQW15AN8N7H00D
LQW15AN8N7J00D
LQW15AN8N8G00D
8.8
LQW15AN8N8H00D
LQW15AN8N8J00D
LQW15AN8N9G00D
8.9
LQW15AN8N9H00D
LQW15AN8N9J00D
LQW15AN9N0G00D
9.0
LQW15AN9N0H00D
LQW15AN9N0J00D
LQW15AN9N1G00D
9.1
LQW15AN9N1H00D
LQW15AN9N1J00D
LQW15AN9N2G00D
9.2
LQW15AN9N2H00D
LQW15AN9N2J00D
LQW15AN9N3G00D
9.3
LQW15AN9N3H00D
LQW15AN9N3J00D
LQW15AN9N4G00D
9.4
LQW15AN9N4H00D
LQW15AN9N4J00D
LQW15AN9N5G00D
9.5
LQW15AN9N5H00D
LQW15AN9N5J00D
LQW15AN9N6G00D
9.6
LQW15AN9N6H00D
LQW15AN9N6J00D
LQW15AN9N7G00D
9.7
LQW15AN9N7H00D
LQW15AN9N7J00D
LQW15AN9N8G00D
9.8
LQW15AN9N8H00D
LQW15AN9N8J00D
LQW15AN9N9G00D
9.9
LQW15AN9N9H00D
LQW15AN9N9J00D
LQW15AN10NG00D
10 0.17
500
LQW15AN10NH00D
LQW15AN10NJ00D
LQW15AN11NG00D
11
30 0.14
LQW15AN11NH00D
LQW15AN11NJ00D
LQW15AN12NG00D
12
LQW15AN12NH00D
LQW15AN12NJ00D
SQecNo ELF243A0050AA01 Reference On y Se‘f LQW|5AN| SNGODD LQW15AN13NHUUD LQW|5AN|5NGODD LQW15AN15NHUUD LQW|5AN|6NGODD LQW15AN1ENHUUD LQW|5AN|SNGODD LQW15AN1BNHUUD LQW|5AN|9NGODD LQW15AN19NHUUD LQW|5AN20NGODD LQW15AN20NHUUD LQW|5AN22NGODD LQW15AN22NHUUD LQW|5AN23NGODD LQW15AN23NHUUD LQW|5AN24NGODD LQW15AN24NHUUD LQW|5AN27NGODD LQW15AN27NHUUD LQW|5AN30NGODD LQW15AN30NHUUD LQW|5AN33NGODD LQW15AN33NHUUD LQW|5AN36NGODD LQW15AN36NHUUD LQW|5AN39NGODD LQW15AN39NHUUD LQW|5AN40NGODD LQW15AN40NHUUD LQW|5AN43NGODD LQW15AN43NHUUD LQW|5AN47NGODD LQW15AN47NHUUD LQW|5AN5| NGODD LQW15AN51NHUUD LQW|5AN56NGODD LQW15AN56NHUUD LQW|5AN62NGODD LQW15AN62NHUUD MURATA MFG couLTD
Spec No.JELF243A-0050AA-01 P.4/14
MURATA MFG.CO.,LTD
Reference Only
Customer
Part Number
MURATA
Part Number
Inductance Q
(min.)
DC
Resistance
( max.)
Self
Resonant
Frequency
(GHz min.)
Rated
Current
(mA)
(nH) Tolerance
LQW15AN13NG00D
13
G:±2%
H:±3%
J:±5%
25 0.21
5.0
430
LQW15AN13NH00D
LQW15AN13NJ00D
LQW15AN15NG00D
15 30 0.16 460
LQW15AN15NH00D
LQW15AN15NJ00D
LQW15AN16NG00D
16
25
0.24
4.5
370
LQW15AN16NH00D
LQW15AN16NJ00D
LQW15AN18NG00D
18
0.27
LQW15AN18NH00D
LQW15AN18NJ00D
LQW15AN19NG00D
19
LQW15AN19NH00D
LQW15AN19NJ00D
LQW15AN20NG00D
20
4.0
LQW15AN20NH00D
LQW15AN20NJ00D
LQW15AN22NG00D
22
0.30 310
LQW15AN22NH00D
LQW15AN22NJ00D
LQW15AN23NG00D
23 3.8
LQW15AN23NH00D
LQW15AN23NJ00D
LQW15AN24NG00D
24
0.52 3.5 280
LQW15AN24NH00D
LQW15AN24NJ00D
LQW15AN27NG00D
27
LQW15AN27NH00D
LQW15AN27NJ00D
LQW15AN30NG00D
30 0.58 3.3 270
LQW15AN30NH00D
LQW15AN30NJ00D
LQW15AN33NG00D
33
0.63
3.2
260
LQW15AN33NH00D
LQW15AN33NJ00D
LQW15AN36NG00D
36 3.1
LQW15AN36NH00D
LQW15AN36NJ00D
LQW15AN39NG00D
39
0.70 3.0 250
LQW15AN39NH00D
LQW15AN39NJ00D
LQW15AN40NG00D
40
LQW15AN40NH00D
LQW15AN40NJ00D
LQW15AN43NG00D
43
LQW15AN43NH00D
LQW15AN43NJ00D
LQW15AN47NG00D
47
1.08
2.9
210
LQW15AN47NH00D
LQW15AN47NJ00D
LQW15AN51NG00D
51 2.85
LQW15AN51NH00D
LQW15AN51NJ00D
LQW15AN56NG00D
56 1.17 2.8 200
LQW15AN56NH00D
LQW15AN56NJ00D
LQW15AN62NG00D
62 20 1.82 2.6 145
LQW15AN62NH00D
LQW15AN62NJ00D
Sgec No.JELF243A70050AA701 Re fe re n c e O n y SEW LOW! SANGSNGODD LOW! 5AN72NGODD LOW! 5AN75NGODD LOW! SANSZNGODD LOW! SANS! NGODD MURATA MFG COHLTD
Spec No.JELF243A-0050AA-01 P.5/14
MURATA MFG.CO.,LTD
Reference Only
Customer
Part Number
MURATA
Part Number
Inductance Q
(min.)
DC
Resistance
( max.)
Self
Resonant
Frequency
(GHz min.)
Rated
Current
(mA)
(nH) Tolerance
LQW15AN68NG00D
68
G:±2%
J:±5%
20
1.96
2.5
140
LQW15AN68NJ00D
LQW15AN72NG00D
72
2.10 135
LQW15AN72NJ00D
LQW15AN75NG00D
75 2.4
LQW15AN75NJ00D
LQW15AN82NG00D
82 2.24 2.3 130
LQW15AN82NJ00D
LQW15AN91NG00D
91 2.38 2.1 125
LQW15AN91NJ00D
LQW15ANR10J00D
100 J:±5% 2.52 1.5 120
LQW15ANR12J00D
120 2.66 1.0 110
4. Testing Conditions
Unless otherwise specified In case of doubt
Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C±2°C
Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH)
Atmospheric Pressure : 86kPa to 106 kPa
5. Appearance and Dimensions
Unit mass (Typical value)
0.0008g
(in mm)
*Dimension of W
Inductance W (in mm)
1N523N 0.6±0.1
24NR12 0.5±0.1
1.0±0.1
0.2±0.1
0.2±0.1
0.5±0.1
W
0.1±0.05
0.5±0.1
Sgec No.JELF243A70050AA701 Re fe re n c e O n MURATA MFG COHLTD
Spec No.JELF243A-0050AA-01 P.6/14
MURATA MFG.CO.,LTD
Reference Only
6.Electrical Performance
No. Item Specification Test Method
6.1
Inductance Inductance shall meet item 3. Measuring Equipment:
KEYSIGHT E4991A or equivalent
Measuring Frequency:
<Inductance> 100MHz
<Q> 250MHz/ 1.5nH~43nH
200MHz/ 47nH~68nH
150MHz/ 72nH~120nH
Measuring Condition:
Test signal level / about 0dBm
Electrical length / 0.94cm
Measuring Fixture: KEYSIGHT 16193A
Position coil under test as shown in below and
contact coil with each terminal by adding weight.
Measuring Method: See the endnote.
<Electrical Performance:Measuring
Method of Inductance/Q>
6.2 Q Q shall meet item 3.
6.3 DC Resistance DC Resistance shall meet item 3.
Measuring Equipment:Digital multi meter
6.4 Self Resonant
Frequency(S.R.F)
S.R.F shall meet item 3. Measuring Equipment:KEYSIGHT N5230A
or equivalent
6.5 Rated Current Self temperature rise shall be
limited to 20°C max.
The rated current is applied.
7.Mechanical Performance
No. Item Specification Test Method
7.1
Shear Test
Chip coil shall not be damaged
after tested as test method.
Substrate:Glass-epoxy substrate
(in mm)
Applied Direction:
Force:5N
Hold Duration:5s±1s
7.2 Bending Test Substrate:Glass-epoxy substrate
(100mm×40mm×0.8mm)
Speed of Applying Force:1mm / s
Deflection:2mm
Hold Duration:5s
(in mm)
0.5mm
45
R340
F
Deflection
45 Product
Pressure jig
Substrate
F
Chip Coil
1.2
0.65
0.5
Chip Coil
Pattern
Solder resist
Substrate
Sgec No.JELF243A70050AA701 Re fe re n c e O n I y MURATA MFG COHLTD
Spec No.JELF243A-0050AA-01 P.7/14
MURATA MFG.CO.,LTD
Reference Only
No. Item Specification Test Method
7.3 Vibration Chip coil shall not be damaged
after tested as test method.
Oscillation Frequency:
10Hz~55Hz~10Hz for 1 min
Total Amplitude:1.5mm
Testing Time:
A period of 2 hours in each of mutually
perpendicular directions.
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux:Ethanol solution of rosin,25(wt)%
Includes activator equivalent to 0.06(wt)%
chlorine.(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
7.5 Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±5%
Flux:Ethanol solution of rosin,25(wt)%
Includes activator equivalent to 0.06(wt)%
Chlorine.(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:270°C±5°C
Immersion Time:10s±1s
Then measured after exposure in the room
condition for 24h±2h.
8.Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
8.1 Heat Resistance Appearance:No damage
Inductance Change: within ±5%
Q Change: within ±20%
Temperature:125°C±2°C
Time:1000h (+48h,0h)
Then measured after exposure in the room
condition for 24h±2h.
8.2 Cold Resistance Temperature:-55°C±2°C
Time:1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2 h.
8.3 Humidity Temperature:70°C±2°C
Humidity:90%(RH) to 95%(RH)
Time:1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2h.
8.4 Temperature
Cycle
1 cycle:
1 step:-55°C±2°C / 30min±3 min
2 step:Ordinary temp. / 10min to 15 min
3 step:+125°C±2°C / 30min±3 min
4 step:Ordinary temp. / 10min to15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24h±2h.
Sgec No.JELF243A70050AA701 Re fe re n c e O n I [Kain #44 Hi; 4::4, Hi LP. 1E —> 08m MURATA MFG COHLTD
Spec No.JELF243A-0050AA-01 P.8/14
MURATA MFG.CO.,LTD
Reference Only
9.Specification of Packaging
9.1 Appearance and Dimensions of paper tape (8mm-wide)
(in mm)
Inductance A* (mm)
(Tolerance ±0.03)
B* (mm)
(Tolerance ±0.03)
1N5, 2N42N8, 3N94N8, 5N86N8, 8N29N9, 11N, 12N, 15N 0.69 1.18
1N61N8, 2N9, 3N0, 3N1, 3N2, 4N95N1, 6N9-7N5, 10N, 13N,
16N23N, R10, R12 0.66 1.18
24N91N 0.64 1.18
Typical value
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
10,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by Cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Cover tape 5N min.
9.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force 0.1 to 0.6N
(minimum value is typical)
9.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( cover tape and empty tape) and trailer-tape (empty tape) as follows.
(in mm)
F
Cover tape
Base tape
165
°
to 180
Empty tape
190 min.
Leader
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180
φ
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
Cover tape
+1
-0
Label
A
1.18±0.03
2.0±0.05
2.0±0.05
4.0±0.1
φ
1.
3.5±0.05
8.0±0.2
0.8 max.
0.1
0
1.75±0.1
Direction of feed
B
Sgec No.JELF243A70050AA701 Re fe re n c e O n mw MURATA MFG COHLTD
Spec No.JELF243A-0050AA-01 P.9/14
MURATA MFG.CO.,LTD
Reference Only
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1) ,RoHS Marking(2),
Quantity etc ・・・
1) <Expression of Inspection No.> □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) <Expression of RoHS Marking > ROHS Y ()
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (2) ,Quantity, etc ・・・
9.8. Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
10. Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance
or solderability may be affected, or result to "position shift" in soldering process.
(in mm)
a 0.50
b 1.2
c 0.65
W
D
Label
H
a
b
c
Chip Coil
Solder resist
Land
Sgec No.JELF243A70050AA701 Re fe re n c e O n I MURATA MFG COHLTD
Spec No.JELF243A-0050AA-01 P.10/14
MURATA MFG.CO.,LTD
Reference Only
11.2 Flux, Solder
Use rosin-based flux.
Includes middle activator equivalent to 0.06(wt)% to 0.1(wt) % Chlorine.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder.
Standard thickness of solder paste : 100μm to 150μm.
11.3 Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way
that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245°C±3°C 260°C,10s
Cycle of reflow 2 times 2 times
11.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1,-0)s
Time 2 times
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
11.5 Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/3TtT
Tthickness of product
Limit Profile
Standard Profile
90s±30s
230
260℃
245℃±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Recommendable(t)
Upper Limit
T
Recommendable(t)
Upper Limit
T
Sgec N0.JELF243A»0050AA»01 /\/D\@/\ ”050‘ 30000( $ f |:| ham V?W W\\/A\V @IZI—IZI chewHo‘e Recnmmended MURATA MFG COHLTD
Spec No.JELF243A-0050AA-01 P.11/14
MURATA MFG.CO.,LTD
Reference Only
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
Products direction
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Poor example
Good example
b
a
Seam
Slit
AD
BC
b
a
Length:a
<
b
Sgec No.JELF243A»OO5OAA»01 Re fe re n c e O n MURATA MFG COHLTD
Spec No.JELF243A-0050AA-01 P.12/14
MURATA MFG.CO.,LTD
Reference Only
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin,
or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine
by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted
on your board.
11.9 Caution for use
Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched
to the winding portion to prevent the
breaking of wire.
Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.10 Notice of product handling at mounting
In some mounting machines,when picking up components support pin pushes up the components from the
bottom of base tape. In this case, please remove the support pin. The support pin may damage the
components and break wire.
In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser
recognition. (There is no problem with the permeation and reflection type.)
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
Sgec No.JELF243A70050AA701 Re fe re n c e O n MURATA MFG COHLTD
Spec No.JELF243A-0050AA-01 P.13/14
MURATA MFG.CO.,LTD
Reference Only
11.12 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature -10°C to 40°C
Humidity 15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause
oxidization of electrode, resulting in poor solderability.
Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and
so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
12 ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
Sgec N0.JELF243A70050AA701 2m: |s Reference Onl MURATA MFG COHLTD
Spec No.JELF243A-0050AA-01 P.14/14
MURATA MFG.CO.,LTD
Reference Only
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
Zm= V1 Zx=
V2
I 1 I
2
(3) Thus,the relation between Zx and Zm is following;
Zx= α Zm-β where, α= D / A =1
1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm : measured impedance of short chip
Zssa: residual impedance of short chip (0.556nH)
Yom: measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
V1=A B V2
I 1C D I 2
Lx= Im(Zx) , Qx = Im(Zx) Lx : Inductance of chip coil
2πf Re(Zx) Qx : Q of chip coil
f
: Measuring frequency
<Electrical Performance:Measuring Method of Inductance/Q>
AB
CD
Zm Zx
V
12
12
ProductTest fixtureTest Head
II
V

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