LQH32PByyyyN0L Ref Sheet Datasheet by Murata Electronics

SgecNo JELF243A70099F701 Re fe re n c e O n y 5 Dwmenslon
SpecNo.JELF243A-0099F-01 P1/8
MURATA MFG.CO., LTD
Reference Only
CHIP COIL (CHIP INDUCTORS) LQH32PB□□□□N0REFERENCE SPECIFICATION
1. Scope
This reference specification applies to LQH32PB_N0 Series, Chip coil (Chip Inductors).
2. Part Numbering
(ex) LQ H 32 P B 1R0 N N 0 L
Product ID Structure Dimension Applications Category Inductance Tolerance Dimension Other Packaging
(L×W) and
(T) L:Taping
Characteristics
3. Rating
Operating Temperature Range.
(Ambient temperature; Self-temperature rise is not included) -40 to +105°C
(Product temperature; Self- temperature rise is included) -40 to +125°C
Storage Temperature Range. -40 to +125°C
Customer
Part Number
MURATA
Part Number
Inductance DC
Resistance
()
Self
Resonant
Frequency
(MHz min)
3 Rated Current(mA)
1 Based on
Inductance
change
2 Based on
Temperature rise
(μH) Tolerance
(%)
Ambient
temperature
85
Ambient
temperature
105
LQH32PBR47NN0L 0.47
N:±30
0.030±20% 100 3400 2550 1600
LQH32PB1R0NN0L 1.0 0.045±20% 100 2300 2050 1320
LQH32PB1R5NN0L 1.5 0.057±20% 70 1750 1750 1010
LQH32PB2R2NN0L 2.2 0.076±20% 70 1550 1600 970
LQH32PB3R3NN0L 3.3 0.12±20% 50 1250 1200 670
LQH32PB4R7NN0L 4.7 0.18±20% 40 1000 1000 530
LQH32PB6R8NN0L 6.8 0.24±20% 40 850 850 510
LQH32PB100MN0L 10
M:±20
0.38±20% 30 750 700 380
LQH32PB150MN0L 15 0.57±20% 20 600 520 320
LQH32PB220MN0L 22 0.81±20% 20 500 450 240
LQH32PB330MN0L 33 1.15±20% 13 380 390 190
LQH32PB470MN0L 47 1.78±20% 11 330 310 140
LQH32PB680MN0L 68 2.28±20% 11 280 275 120
LQH32PB101MN0L 100 2.70±20% 8 180 250 110
LQH32PB121MN0L 120 4.38±20% 8 170 200 80
1: When applied Rated current to the Products, Inductance will be within ±30% of nominal Inductance value.
2: When applied Rated current to the Products, temperature rise caused by self-generated heat shall be limited
to 40°C max.
3: Keep the temperature (ambient temperature plus self-generation of heat) under 125°C.
4. Testing Conditions
Unless otherwise specified In case of doubt
Temperature : Ordinary Temperature (15 to 35°C) Temperature : 20 ± 2°C
Humidity : Ordinary Humidity (25 to 85 % (RH)) Humidity : 60 to 70 % (RH)
Atmospheric Pressure : 86 to 106 kPa
SgecNo JELF243A70099F701 Re fe re n c e O n I y @
SpecNo.JELF243A-0099F-01 P2/8
MURATA MFG.CO., LTD
Reference Only
5. Appearance and Dimensions
Unit Mass (Typical value)
0.044
6. Electrical Performance
No. Item Specification Test Method
6.1 Inductance Inductance shall meet item 3. Measuring Equipment : KEYSIGHT 4192A or equivalent
Measuring Frequency: 1MHz
6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment: Digital multi meter
6.3 Self Resonant
Frequency(S.R.F)
S.R.F shall meet item 3. Measuring Equipment: KEYSIGHT E4991A or equivalent
7. Mechanical Performance
No. Item Specification Test Method
7.1 Shear Test Chip coil shall not be damaged.
Substrate: Glass-epoxy substrate
Force: 10N
Hold Duration: 5±1s
7.2 Bending Test Chip coil shall not be damaged.
Substrate: Glass-epoxy substrate
(100×40×1.0mm)
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 5s
(in mm)
7.3 Vibration Chip coil shall not be damaged.
Oscillation Frequency : 10 to 2000 to 10Hz for 20 min
Total amplitude : 1.5 mm or Acceleration amplitude
98 m/s2 whichever is smaller.
Testing Time: A period of 2 hours in each of 3 mutually
perpendicular directions.
(Total 6 hours)
2.5±0.2
2.7±0.2 2.5±0.2
1.55±0.15
3.2±0.3
0.9±0.31.3±0.2 0.9±0.3
No marking.
A:
2.8max.
(in mm)
Chip Coil
Substrate
45
R230
F
Deflection
45 Product
Pressure jig
SgecNo JELF243A70099F701 Re fe re n c e O n y
SpecNo.JELF243A-0099F-01 P3/8
MURATA MFG.CO., LTD
Reference Only
No. Item Specification Test Method
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90s
Solder Temperature: 240±5°C
Immersion Time: 3±1 s
7.5 Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±10%
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90s
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room condition for
24±2 hours.
8. Environmental Performance (It shall be soldered on the substrate.)
No. Item Specification Test Method
8.1 Heat Resistance Appearance: No damage
Inductance Change: within ± 10%
DC Resistance Change: within ± 10%
Temperature: 105±2°C
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
8.2 Cold Resistance Temperature: -40±2°C
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
8.3 Humidity Temperature: 85±2°C
Humidity: 80~85%(RH)
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
8.4 Temperature
Cycle
1 cycle:
1 step: -40±2°C / 30±3 min
2 step: Ordinary temp. / 10 to 15 min
3 step: +105±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 min
Total of 100 cycles
Then measured after exposure in the room condition
for 24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
Dimension of the Cavity is measured
at the bottom side.
(in mm)
2.9±0.2 2.0±0.05
4.0±0.1
Direction of feed
1.7±0.2
Lead- in/out wire
4.0±0.1
3.6±0.2
8.0±0.2
1.75±0.13.5±0.05
φ
1.5
-0
+0.1
0.2
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
( )
SgecNo JELF243A70099F701 Re fe re n c e O n y 0000 m *X(é)
SpecNo.JELF243A-0099F-01 P4/8
MURATA MFG.CO., LTD
Reference Only
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape 10N min.
Cover tape 5N min.
9.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force 0.2 to 0.7N
(minimum value is typical)
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ・・・
1) <Expression of Inspection No.> □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2) ,Quantity, etc ・・・
165 to 180 degree FCover tape
Plastic tape
190 min
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
210 min
φ
60±
13±1.4
φ
180
±0
3
1
0
(in mm)
Trailer
:
160 min.
Direction of feed
Empty tape
Leader
Cover tape
Label
0
1
m F 9 9 0 0 A 3 4 2 F L E J o N c e S (m mm) 797/ A272272 ézy/AZV/AZV/A z z z 72 A //AZ7// V/A
SpecNo.JELF243A-0099F-01 P5/8
MURATA MFG.CO., LTD
Reference Only
9.8. Specification of Outer Case
Outer Case Dimensions (mm) Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity
of an order.
10. Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
(in mm)
11.2 Flux, Solder
Flux
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100μm to 150μm
Other flux (except above) Please contact us for details, then use.
W
D
Label
H
1.3
2.0
Chip Coil
Land 3.8
Solder Resist
SgecNo JELF243A70099F701 Re fe re n c e O n I y
SpecNo.JELF243A-0099F-01 P6/8
MURATA MFG.CO., LTD
Reference Only
11.3 soldering conditions (Reflow)
Pre-heating should be in such a way that the temperature difference between solder and product surface is
limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature
difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in
the deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1,-0)s
Times 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the products due to the thermal shock.
11.5 Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/3T t T
(T: Lower flange thickness)
150
90s±30s Time(s)
245℃±3℃
Temp.
(℃)
220℃
30s~60s
180
260℃
230℃
60s max
Limit Profile
Standard Profile
Upper Limit
Recommendable
Tt
SgecNoJELFZASA—OOQQF-Ol /\—/\fl/\ )0030( D )0000‘ $ 7‘ |:| \f—W (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, @ CI _p |:| it may be affected by the board deflection that occurs during the tightening of the screw, Mount the component Screw Hele Rec in a position as far away from the screw holes as possible. 11.7 Cleaning Conditions Products shall be cleaned on the following conditions, (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power: 20 W I I max, Frequency : 28kHz to 40kHz Time : 5 minutes max. (3) Cleaner Alcoholrbased cleaner. IPA Aqueous agent. PINE ALPHA 811008 (A) There shall be no residual flux and residual cleaner after cleaning. in the case of using aqueous agent, products shall be dried completely afler rinse with de-io order to remove the cleaner, (5) Other cleaning Please contact us, 11.8 Resin coating The inductance value may change due to high cure»stress of resin to be used lor coating/molding pr An open circuit issue may occur by mechanical stress caused by the resin. amount/cured shape of r or operating condition etc. Some resin contains some impurities or chloride possible to generate chl by hydrolysis under some operating condition may cause corrosion ol wire ol cull. leading to open c So. please pay your careful attention when you select resin in case of coating/molding the products Prior to use the coating resin. please make sure no reliability issue is observed by evaluating produc on your board, MURATA MFG.CO., LTD
SpecNo.JELF243A-0099F-01 P7/8
MURATA MFG.CO., LTD
Reference Only
11.6 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
Products direction
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface. A > D 1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from
the board separation surface. A > C
1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max.
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin,
or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine
by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted
on your board.
Poor example
Good example
b
a
Seam
Slit
AD
BC
b
a
Length:a
<
b
Screw Hole Recommended
SgecNo.JELF243A»0099F»01 Re fe re n c e O n I y 12.15
SpecNo.JELF243A-0099F-01 P8/8
MURATA MFG.CO., LTD
Reference Only
11.9 Caution for use
Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched
to the winding portion to prevent the breaking of wire.
Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
11.11 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity : 15 to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as
sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
Products should not be stored on bulk packaging condition to prevent the chipping of the core and
the breaking of winding wire caused by the collision between the products.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
12. Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering