DLW5BTMyyyTQy Series Spec Datasheet by Murata Electronics

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Sgec. No. JEFL243070025J701 [Tesmng Commons [ ] 7000 5000 DLLvSaTMJaan 3 E 5000 Dstawzsnm 5 fl 3 3m” ' mwsaTMszQz 22000 w m m 1000 0 0 20 4° 50 80 ‘00 Operating Temperature (“0)
Spec. No. JEFL243C-0025J-01 P 1/10
MURATA MFG CO.,LTD.
Wire Wound Chip Common Mode Choke Coil
DLW5BTM
□□□
TQ2
Reference Specification
1. Scope
This reference specification applies to Wire Wound Chip Common Mode Choke Coil.
2. Part Numbering
(ex.) DL W 5B T M 102 T Q 2 L
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
(1) Chip Common Mode Choke Coil
(2) Structure (W : Winding Type)
(3) Dimension (L×W)
(4) Type
(5) Category (M : Laser Marking Type)
3.Rating
Customer
Part Number
MURATA
Part Number
Impedance
at 10MHz,
Under Standard
Tesiting Conditions
(Ω min.)
Impedance
at 100MHz,
Under Standard
Tesiting Conditions
(Ω Typ.)
Rated
Voltage
V(DC)
Withstanding
Voltage
V(DC)
Rated
Current
(A)
DC
Resistance
(Rdc)
(Ωmax.)
Insulation
Resistance
(MΩ min.)
DLW5BTM101TQ2L
10 100
100 250
6 0.013
10
DLW5BTM101TQ2K
DLW5BTM101TQ2B
DLW5BTM251TQ2L
20 250 5 0.020
DLW5BTM251TQ2K
DLW5BTM251TQ2B
DLW5BTM501TQ2L
30 500 4 0.027
DLW5BTM501TQ2K
DLW5BTM501TQ2B
DLW5BTM102TQ2L
60 1000 2.5 0.034
DLW5BTM102TQ2K
DLW5BTM102TQ2B
DLW5BTM142TQ2L
100 1400 2 0.056
DLW5BTM142TQ2K
DLW5BTM142TQ2B
Operating Temperature : - 40 °C to + 105 °C Storage Temperature : - 40 °C to + 105 °C
(6) Impedance (Typ. at 100MHz)
(7) Circuit
(8) Features
(9) Number of Line
(10) Packaging Code L : Taping (φ180mm/reel) / K : Taping (φ330mm/reel)
B : Bulk
*Derating
Reference Only Sgec. No. JEFL243070025J701 yle and 3E
Spec. No. JEFL243C-0025J-01 P 2/10
MURATA MFG CO.,LTD.
4. Standard Testing Conditions
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. 15 ºC to 35 °C Temperature : 20 °C ± 2 °C
Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH) Humidity : 60 %(RH) to 70 %(RH)
Atmospheric pressure : 86 kPa to 106 kPa
5. Style and Dimensions
Unit Mass (Typical value)
0.21g
in: mm
No polarity
6. Marking
7. Electrical Performance
No. Item Specifications Test Method
7.1 Impedance
(|Z|) (at 10MHz)
Meet item 3. Measuring Equipment :KEYSIGHT 4191A or the equivalents.
Measuring Frequency : 10MHz (ref. Item 10.)
7.2 Insulation
Resistance
(I.R.)
Measuring Equipment : R8340A or the equivalents.
Test Voltage : 100V
Time : within 60 s (ref. Item 10.)
7.3 DC Resistance
(Rdc)
Measuring Current : 100 mA max. (ref. Item 10.)
(In case of doubt in the above mentioned standard
condition,measure by 4 terminal method.)
7.4 Withstanding
Voltage
Products shall not be damaged. Voltage : 250 V(DC)
Time : 60 s
Charge Current : 1 mA max. (ref. Item 10.)
Equivalent Circuites
Top of the tape Tape
DLW5BT
Sprocket Hole
marking
(L)5.0±0.3
(W)5.0±0.3
3.6±0.3
±0.3
1.3
±0.3
0.9
±0.3
1.3
1.7
±0.3
1.7
±0.3
1.3
±0.3
:
Electrode
④③
0.5
min.
0.45min.
2.35±0.15
3.0±0.5
0.5±0.3
:
M
arking
(TOP)
Sgec. No. JEFL243070025J701 Reference Only Tame 1 gt:
Spec. No. JEFL243C-0025J-01 P 3/10
MURATA MFG CO.,LTD.
8. Mechanical Performance
No. Item Specifications Test Method
8.1 Appearance and
Dimensions
Meet item 5. Visual Inspection and measured with Slide
Calipers.
8.2 Bonding Strength
and
Core Strength
No evidence of chipping,breakage.
No evidence of coming off
glass-epoxy substrate.
Applying Force (F) : 10N
Applying Time : 5 ± 1s
8.3 Body strength No evidence of chipping,breakage. Applying Force (F) : 10N
Applying Time : 5 ± 1s
8.4 Bending
Strength
Meet Table 1.
Table 1
Substrate : Glass-epoxy (t=1.6mm)
Deflection : 2mm
Keeping Time : 30 s
Speed of Applying Force : 0.5 mm/s
Appearance No damaged.
Impedance
change
(at 10MHz)
within ± 20%
I.R. 10MΩ min.
Withstanding
Voltage No damaged.
8.5 Vibration Products shall be soldered on the substrate.
Oscillation Frequency : 10 to 55 to 10Hz for 1 min.
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of
3 mutually perpendicular
directions(Total 6 hours).
8.6 Drop Products shall be dropped concrete or steel board.
Method : free fall
Height : 1m
The Number of Times : 10 Times
8.7 Solderability The electrodes shall be at least
90% covered with new solder
coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre heating : 150 ± 10°C, 1 minute.
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 245±5°C
Immersion Time : 4 ± 1s
Immersion and Immersion rates : 25mm/s
8.8 Resistance to
Soldering heat
Meet Table 1. Flux : Ethanol solution of rosin,25(wt)%
Pre heating : 150 ± 10°C, 1 minute.
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270 ± 5°C
Immersion Time : 5 ± 1s
Immersion and Immersion rates : 25mm/s
Then measured after exposure in the room
condition for 4 to 48 hours.
45
R340
F
Deflection
45 Product
Pressure jig
(in mm)
Pressure jig
F
Product
Substrate
Test board fixture
FNozzle
Product
Substrate
Test board fixture
Stainless
Product
tweezers
Sgec. No. JEFL243070025J701 Reference Only
Spec. No. JEFL243C-0025J-01 P 4/10
MURATA MFG CO.,LTD.
9. Enviromental Performance (Product shall be soldered on the glass-epoxy substrate (t=1.6mm).)
No. Item Specifications Test Method
9.1 Temperature
Cycle
Meet Table 1. 1 cycle
1 step : -40 °C (+0, -3)°C / 30min (+ 3,- 0) min
2 step : Ordinary temp. / 3 min max.
3 step : +105 °C (+3, -0)°C / 30min (+ 3,- 0) min
4 step : Ordinary temp. / 3 min max.
Total of 100 cycles
Then measured after exposure in the room
condition for 4 to 48 hours.
9.2 Humidity Temperature : 40 ± 2 °C
Humidity : 90 to 95 %(RH)
Time : 1000 h (+48 h , -0 h)
Then measured after exposure in the room
condition for 4 to 48 hours.
9.3 Humidity Load Temperature : 40 ± 2 °C
Humidity : 90 to 95 %(RH)
Test Voltage : Rated Voltage
Time : 1000 h (+48 h , -0 h)
Then measured after exposure in the room
condition for 4 to 48 hours. (ref. Item 10.)
9.4 Heat life Temperature : 105 ± 2 °C
Test Voltage : 2times for Rated Voltage
Time : 1000 h (+48 h , -0 h)
Then measured after exposure in the room
condition for 4 to 48 hours. (ref. Item 10.)
9.5 Cold Resistance Temperature : - 40 ± 2 °C
Time : 1000 h (+48 h , -0 h)
Then measured after exposure in the room
condition for 4 to 48 hours. (ref. Item 10.)
10. Terminal to be Tested When measuring and supplying the voltage, the following terminal is applied.
No. Item Terminal to be Tested
10.1 Impedance (|Z|)
(Measurement Terminal)
10.2 DC Resistance (Rdc)
(Measurement Terminal)
10.3 Insulation Resistance (I.R.)
(Measurement Terminal)
10.4 Withstanding Voltage
(Measurement Terminal)
10.5 Humidity Load (Supply Terminal)
10.6 Heat Life (Supply Terminal)
Terminal Terminal
Terminal
Sgec No JEFL24SC 025.] 01 DLWSBT _TQ series 1annu CnmmnnMudE mwsanmzroz LWSBTWGQTO \ “100 wsETMsmT wsamzwoz wasmummz * mm \mpadance (ohm wséw ‘ mm Dun/5mm mm Dwisawsaw vissmm r mmwm mm“. mode Wu 1000 Fveuuenty (MHz) 2.710.
Spec. No. JEFL243C-0025J-01 P 5/10
MURATA MFG CO.,LTD.
11. Impedance Frequency Characteristics (Typical)
12. Specification of Packaging
12.1. Appearance and Dimensions
*Dimension of the Cavity is measured
at the bottom side.
(in mm)
12.2. Specification of Taping
(1) Packing quantity (Standard quantity) φ180 mm reel : 700 pcs. / reel φ330 mm reel :2500 pcs. / reel
(2) Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous.The specified quantity per reel is kept.
12.3. Pull Strength of Plastic Tape
Plastic Tape 5 N min.
Cover Tape 10 N min.
12.4. Peeling off force of Cover Tape
0.2N to 0.7N (minimum value is typical.)
Speed of Peeling off : 300 mm / min
165 to 180 degree FCover tape
Plastic tape
2.7±0.1
0.4±0.05
8.0±0.1
4.0±0.1
φ
1.5
5.5±0.1
5.5
12.0±0.2
2.0±0.05
0.1
0
5.5±0.1
1.75±0.1
Direction of feed
±0.05
Sgec. No. JEFL243C-0025J-01 ape, Trailer and Reel e (cover lape only and emply lape) and lraHer-lape (emply lape) as mm reel) » Trailer 160 mm. Leader 190 mm. 210 mm. T 1 Label .:;> Dlreclion of feed (in mm) mm reel) » er(v1), m w Outer Case Dimensions Slandard Reel I g w D H A 186 186 93
Spec. No. JEFL243C-0025J-01 P 6/10
MURATA MFG CO.,LTD.
12.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
« Packaging Code : L (φ180mm reel) »
« Packaging Code : K (φ330mm reel) »
12.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc
1) « Expression of Inspection No. » □□ OOOO 
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
12.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking (2), Quantity, etc
12.8 Specification of Outer Case
Reel
Outer Case Dimensions
(mm)
Standard Reel
Quantity in
Outer Case
(Reel)
W D H
φ180mm 186 186 93 4
φ330mm 340 340 85 4
Above Outer Case size is typical. It depends on a quantity of an order.
13.
! Caution
13.1. Mounting Direction
Mount products in right direction.
Wrong direction which is 90 ° rotated from right direction cause not open or short circuit but also flames
or other serious trouble.
right direction wrong direction
ZZ
160 min. 210 min.
190 min.
13.0±0.2
21.0±0.8
180±
60±
13±
17±1.4
1
0
0
3
Direction of feed
Trailer
1
0
Leader
Empty Tape Cover tape
(in mm)
Label
2.0±0.5
2.0±0.5
13.0±0.5
21.0±0.8
330±2.0
50 min.
14±1.5
2.0±0.5 (in mm)
210 min.
190 min.
Leader
Empty Tape Cover tape
Direction of feed
Trailer
160 min.
Label
W
D
Label
H
eference OnlyI Sgec. No. JEFL24SC-0025J-01 Use rosin-based flux,(wi:h convening ch‘orine conlenl 0.06 lo 0.1(wl)%. ). action
Spec. No. JEFL243C-0025J-01 P 7/10
MURATA MFG CO.,LTD.
13.2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles, rains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
14.Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
14.1. Flux and Solder
Flux Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ),
but not highly acidic flux
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
14.2. Assembling
< Exclusive use of Reflow soldering >
Flow soldering may cause deterioration in insulation resistance.
So,reflow soldering shall be applied for this product.
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C max. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
Not enough preheating may cause deterioration in insulation resistance and / or crank or ceramic body.
14.3. Cleaning Conditions
Do not clean after soldering. If cleaning, please contact us.
14.4. Resin coating
The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under
some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful
attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating resin,
please make sure no reliability issue is observed by evaluating products mounted on your board.
14.5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
Products direction
Products shall be location the sideways
direction (Length:ab) to the mechanical
stress.
Poor example
Good example
b
a
Sgec. No. JEFL24SC-0025J-01 eference OnlyI ”TE“? )oooot )oooo: 1 |:| (3) Mounting Components Nea When a component is m during the tightening of possible. (0):“ Screw Hole Rec 14.6. Attention Regarding P.C.B. D < the="" arrangement="" of="" products="" 'p.c.b.="" shall="" be="" designed="" so="" far="" from="" the="" portion="" of="" perfo="" 'the="" portion="" of="" perforation="" sh="" as="" narrow="" as="" possible="" and="" s="" so="" as="" not="" to="" be="" applied="" the="" s="" ofp="" c="" b="" separation="" 'producls="" shall="" not="" be="" arrang="" line="" of="" a="" series="" of="" holes="" whe="" are="" big="" holes="" in="" p.c.b.="" (because="" the="" stress="" concen="" line="" of="" holes.)="">< products="" placmg=""> Support pins shall be set un to prevent causing a warp to during placing the products side of P.C.B.. < p.c.b.="" separation=""> 'P.C.B. shall not be separate P.C.B. shall be separated w Gill J] “% [g .2,
Spec. No. JEFL243C-0025J-01 P 8/10
MURATA MFG CO.,LTD.
Pick- up nozzle
Support pin
P.C.B.
Product
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore
A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes as
possible.
14.6. Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
•The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the case
of P.C.B. separation.
Products shall not be arranged on the
line of a series of holes when there
are big holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
< Products Placing >
Support pins shall be set under P.C.B.
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B..
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
×
×
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Product
P.C.B.
Hole
×
Perforation
Slit
A
B
C
D
Screw Hole Recommended
Reference Only Sgec. No. JEFL243070025J701 \V x L | If I E \ Lil CI
Spec. No. JEFL243C-0025J-01 P 9/10
MURATA MFG CO.,LTD.
14.7. Standard Land Dimensions
14.8. Reflow Soldering
(1) Standard printing pattern of solder paste
Standard thickness of solder paste
should be 150 to 200µm.
Solderability is subject to reflow condition
and thermal conductivity.
Please make sure that your product has been evaluated
in view of your specifications with our product being
mounted to your product.
Use the solder paste printing pattern of the
right pattern.
For the resist and copper foil pattern,
use standard land dimensions.
Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
(2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 250±3°C 260°C, 10s
Cycle of reflow 2 times 2 times
0.9
2.9
5.5
1.3
3.3
4.7
(in mm)
150
90s±30s Time(s)
250±3℃
Tem
p
.
(℃)
220℃
30~60s
180
260℃
230℃
60s max.
Limit Profile
Standard Profile
0.9
2.9
5.5
1.3
3.3
4.7
*
①②③④
indicates terminal number
.
Resist
Copper foil pattern
No pattern
(in mm)
Reference Only Sgec. No. JEFL2430»0025J»01
Spec. No. JEFL243C-0025J-01 P 10/10
MURATA MFG CO.,LTD.
14.9. Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being mounted
by reflow soldering.
· Pre-heating: 150°C, 1 min Soldering iron output: 30W max.
· Tip temperature: 350°C max. Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. Times : 2times max.
Notes: Do not touch the products directly with the soldering iron.
14.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
14.11 Brushing of neighborhood of products
When you clean the neighborhood of products such as connector pins, bristles of cleaning brush
shall not be touched to the winding portion to prevent the breaking of wire.
14.12. Operating Environment
Do not use this product under the following environmental conditions,on deterioration of the performance,
such as inslation resistance may result from the use.
(1) in corrosive gases (acidic gases,alkaline gases,chlorine,sulfur gases,organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent,may splash on the products.
14.13. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10 °C to +40 °C
Humidity : 15 % to 85% relative humidity No rapid change on temperature and humidity.
Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration.
Poor solderabirity due to the oxidized electrode.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Avoid storing the product by itself bare (i.e.exposed directly to air).
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
15.
!Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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