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PICO-CLASP 1.0 W/B
SINGLE ROW VT SMT INNER LOCK GOLD PLATING
0.1 MICRO-METER
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
5044490000-SD
PSD
000
A
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE SHEET 6 1 OF 6
DIMENSION UNITS
SCALE
mm
NTS
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.2
2 PLACES
±
0.2
1 PLACE
±
0.2
0 PLACES
±
0.2
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
CURRENT REV DESC:
EC NO: 614886
DRWN:
AISHIKAWA
2019/04/02
CHK'D:
AIDA
2019/04/03
APPR:
KOMURAKAMI
2019/04/05
INITIAL REVISION:
DRWN:
AISHIKAWA
2019/04/02
APPR:
KOMURAKAMI
2019/04/05
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
504449
FORMAT: tb-prod-A3
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2019/04/05 01:07:48
3.5
0.25
0.5
3.0
1.0
A0.12
CIRCUIT No.1
INDICATOR MARK
(PICTH)
0.13
0.1 1.1
0.6
3.5
5.41
0.66
4
1
2
3
3
2
1
4
4.0 7.0
5
3.0 6.0
4
2.0 5.0
3
1.0 4.0
2
BA極数
CIRCUIT SIZE
(COVER TAPE)
(COVER TAPE)
(SOLDERING AREA)
1.05
(SOLDERING AREA)
TABLE 1
2
8
B
8
5
2
NOTES
1. 本製品は極数によって、ロック形状が変わりますので御注意願います。
THE LOCK SHAPE OF THIS PRODUCT CHANGES ACCORDING TO THE NUMBER OF CIRCUIT.
2~5 CIRCUITS:フリクションロック FRICTION LOCK
6~15 CIRCUITS:インナーポジティブロック INNER POSITIVE LOCK
材料及び仕上げ(めっき仕様):TABLE 1,2 参照
MATERIAL AND FINISHES : SEE TABLE 1 AND 2
3. 製品仕様書:PS-504449-001
PRODUCT SPECIFICATION:
4. 梱包形態:SEE SHEET 4
PACKAGING INFORMATION:
嵌合相手:501330 シリーズ
MATES WITH:501330 SERIES
6. アプリケーション仕様書(コネクタ取扱い説明書):5013300000-AS A00(JAPANESE)/-A01(ENGLISH)
APPLICATION SPECIFICATION(CONNECTOR MANUAL):
7. ソルダーピン及びネイルの平坦度:0.1 MAX.
SOLDER PIN AND NAIL COPLANARITY: 0.1 MAX.
偶数極に適応
APPLY FOR EVEN CIRCUIT
9. その他金めっき厚品及び錫めっき品は以下の図面を御参照下さい。
PLEASE REFER TO THE FOLLOWING DRAWING
FOR OTHER GOLD PLATING VERSION AND TIN PLATING VERSION.
CIRCUIT 1
CIRCUIT N
PLATING
PLATING
THICKNESS
[micro-meter MIN.]
SERIES No. DRAWING No.
TIN 1.0 501331 5013310000-SD PSD 000
GOLD 0.38 203556 2035560000-SD PSD 000
0.76 203557 2035570000-SD PSD 000
0.05
(STAND OFF)
番号
NO.
部品
PART
材質
MATERIAL
ウエハー
WAFER
ポリアミド(PA), UL94V-0, 色:SEE SHEET 6
POLYAMIDE(PA), UL94V-0, COLOR : SEE SHEET 6
ソルダーピン
SOLDER PIN
リン青銅
PHOSPHOR BRONZE
接点部
CONTACT AREA
金めっき: 0.1 MICRO-METER MIN.
GOLD PLATING
テール部
TAIL AREA
金めっき: 0.1 MICRO-METER MIN.
GOLD PLATING
下地めっき
UNDER PLATING
ニッケルめっき:1.0 MICRO-METER MIN.
NICKEL
ネイル
NAIL
リン青銅
PHOSPHOR BRONZE
テール部
TAIL AREA
錫めっき: 1.0 MICRO-METER MIN.
MATTE TIN PLATING
下地めっき
UNDER PLATING
ニッケルめっき:1.0 MICRO-METER MIN.
NICKEL
カバーテープ
COVER TAPE
ポリイミドテープ
POLYIMIDE TAPE
(COVER TAPE)
CAV NO.
MOLD NO.
TRADE MARK
0.35 1.22
(SOLDERING AREA)
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E