TMDS171RGZEVM User Guide Datasheet by Texas Instruments

View All Related Products | Download PDF Datasheet
l TEXAS INSTRUMENTS (SLLSEN7)
1
SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
HDMI is a registered trademark of HDMI Licensing, LLC.
Total Phase, Aardvark I2C/SPI are trademarks of Total Phase, Inc..
User's Guide
SLLU217AApril 2015Revised April 2016
TMDS171 RGZ EVM
This document describes how to use and configure the TMDS171 RGZ EVM and provides
recommendations for system hardware implementation. These recommendations are only guidelines and
it is the designer’s responsibility to consider all system characteristics and requirements. Engineers should
refer to the TMDS171 datasheet (SLLSEN7) for technical details such as device operation, terminal
description, and so forth.
Contents
1 Overview ...................................................................................................................... 2
1.1 What is the TMDS171? ............................................................................................ 2
1.2 What is the TMDS171 EVM?...................................................................................... 2
1.3 What is Included in the TMDS171 EVM?........................................................................ 2
1.4 What Does This EVM Look Like? ................................................................................ 3
2 Hardware Description ....................................................................................................... 4
2.1 Video Connectors for TMDS171 Ports........................................................................... 4
2.2 Local I2C Access.................................................................................................... 4
2.3 Enable/Reset ........................................................................................................ 5
2.4 Power................................................................................................................. 5
2.5 Jumper Configuration .............................................................................................. 6
2.6 Component Population Configuration............................................................................ 7
2.7 USB Interface via TUSB3410 ..................................................................................... 8
3 Quick Start Guide .......................................................................................................... 11
4 References.................................................................................................................. 11
5 EVM Bill of Materials....................................................................................................... 12
6 EVM Schematics ........................................................................................................... 14
7 EVM Layout ................................................................................................................. 21
8 Total Phase Aardvark I2C Host Adapter Scripts ....................................................................... 24
List of Figures
1 TMDS171 RGZ EVM........................................................................................................ 3
2 TMDS171 RGZ EVM REVB................................................................................................ 3
3 TMDS171 RGZ EVM Block Diagram...................................................................................... 4
4 Eye Scan Opening Tab ..................................................................................................... 8
5 Register Status/Control Tab................................................................................................ 9
6 TMDS171 Device with TMDS Clock Ratio set to 1/10 ................................................................ 10
7 TMDS171 Device with TMDS Clock Ratio set to 1/40 ................................................................ 11
8 HDMI Input Connector..................................................................................................... 14
9 TMDS171 RGZ Schematic (48-Pin QFN)............................................................................... 15
10 HDMI TX Connector ....................................................................................................... 16
11 TMDS171 Select Options ................................................................................................ 17
12 RESET Circuit .............................................................................................................. 18
13 Power Schematics (1.1-V and 3.3-V Regulators)...................................................................... 19
14 TUSB3410 Schematic ..................................................................................................... 20
15 Layer 1 (Top) ............................................................................................................... 21
l TEXAS INSTRUMENTS
Overview
www.ti.com
2SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
16 Layer 2 (GND) .............................................................................................................. 21
17 Layer 3 (Power) ............................................................................................................ 22
18 Layer 4 (Power) ............................................................................................................ 22
19 Layer 5 (GND) .............................................................................................................. 23
20 Layer 6 (Bottom)............................................................................................................ 23
List of Tables
1 Aardvark I2C (J5) Pin-out................................................................................................... 4
2 TMDS171 Target I2C Address ............................................................................................. 5
3 SW1 DIP Switch Setting .................................................................................................... 6
4 EVM Bill of Materials....................................................................................................... 12
1 Overview
1.1 What is the TMDS171?
The TMDS171 is a digital video interface (DVI) or high-definition multimedia interface (HDMI®) retimer.
The TMDS171 supports four TMDS channels, audio return channel (SPDIF_IN/ARC_OUT), and digital
display control (DDC) interfaces. The TMDS171 supports signaling rates up to 6Gbps to allow for the
highest resolutions of 4k/2k/60p 24-bits per pixel and up to WUXGA 16-bit color depth or 1080p with
higher refresh rates. The TMDS171 can be configured to support the HDMI standard. The TMDS171 will
automatically configure itself as a re-driver at low data rate (< 1.0Gbps) or as a re-timer above this data
rate by default, or it can be set to re-driver-only or re-timer-only modes.
1.2 What is the TMDS171 EVM?
The TMDS171 EVM is a printed-circuit board (PCB) created to help customers evaluate the TMDS171
device for video applications with HDMI interfaces. This EVM can also be used as a hardware reference
design for implementation of the TMDS171 in the RGZ package. PCB design and layout files can be
provided upon request to provide PCB design illustrations of the routing and placement rules with a
TMDS171 or DP159 RGZ component.
Note that the EVM design supports the TMDS171, DP159, and DP159 thru HDMI applications, so it
contains many components that would not be needed by a typical TMDS171 application. A separate
reference design specific to TMDS171 and DP159 are available for customers.
1.3 What is Included in the TMDS171 EVM?
The major components of the EVM are as below:
• TMDS171RGZ
Standard HDMI source connector (receptacle)
Standard HDMI sink connector (receptacle)
DC power regulators
• I2C programming interface for external I2C host connection
USB interface (utility available)
l TEXAS INSTRUMENTS HDMI Source Unused DP Source inu Adapter HDMI Sonic: Izc Aamvavk Intel-tune
www.ti.com
Overview
3
SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
1.4 What Does This EVM Look Like?
Figure 1. TMDS171 RGZ EVM
Figure 2. TMDS171 RGZ EVM REVB
l TEXAS INSTRUMENTS
SCL_CTL
SDA_CTL
IN0P/N
IN1P/N
IN2P/N
IN3P/N
AUXP/N
TMDS171
(48-Pin QFN)
DDC - Snoop Only for TMDS171
TMDS_D2P/N
TMDS_D1P/N
TMDS_D0P/N
TMDS_CLKP/N
DDC_SCL/SDA
HDMI Connector Bottom
HDMI Connector
USB2
Connector
5-V Dongle 5-V to 3.3-V LDO
3.3-V to 1.1-V LDO
TUSB3410
Aardvark
Connector
Copyright © 2016, Texas Instruments Incorporated
Hardware Description
www.ti.com
4SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
2 Hardware Description
Figure 3 illustrates the EVM block diagram.
Figure 3. TMDS171 RGZ EVM Block Diagram
2.1 Video Connectors for TMDS171 Ports
The EVM has two HDMI connections for video. P1 and P2 are standard HDMI connectors (Molex 4715-
10001). There is a third video connection on the board for DisplayPort (J2), this function is not supported
on the TMDS171RGZ EVM.
2.2 Local I2C Access
The J5 input connector provides access to the local I2C signal of the TMDS171. Note that I2C signal levels
should be at 3.3 V when the I2C interface is accessed through the connector.
A standalone external I2C host can be connected via J5 for debug and control purposes. An example of an
external I2C Host controller is the Total Phase™ Aardvark I2C/SPI™ Host Adapter (Total Phase Part#:
TP240141). Sample scripts for this I2C host controller are provided by request.
Table 1. Aardvark I2C (J5) Pin-out
J5 Pin # Description J5 Pin # Description
1 SCL_CTL 2 GND
3 SDA_CTL 4 NC
5 NC 6 NC
7 NC 8 NC
9 NC 10 GND
l TEXAS INSTRUMENTS
www.ti.com
Hardware Description
5
SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
(1) The target I2C address for TMDS171 can be modified by the EVM jumper settings.
Table 2. TMDS171 Target I2C Address
TMDS171 I2C(1) Target Address
Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (W/R)
A6 A5 A4 A3 A2 A1 A0
10111100/1
7 Bit Address = 5Eh
2.3 Enable/Reset
There are three device enable or reset options to use with the EVM.
1. Supervisor circuitry option
This is the default configuration on the TMDS171 EVM. The enable (EN) signal is held low until the
power good (PG) from the 3.3-V voltage regulator reaches a stable high voltage level and then is
released high.
2. RC timing option
C26 external capacitor and internal resistor are used to control the EN ramp time after the device is
powered on. C26 is DNI (Do Not Install option), by default. C26 must be installed and R77 must be
uninstalled to enable this option.
3. External control option
A push button (SW1) is provided for manual control of the TMDS171 EN/OE input.
2.4 Power
A DC Power Jack (J9) to accept a 5-V wall power adapter is provided on the EVM. The DC Power Jack
(CUI Inc. PJ-202AH) has an inner diameter of 2.1 mm and an outer diameter of 5.5 mm. The tip of the 5-V
power supply must be positive. A 5-V power supply of at least 1.0 A that meets the above requirements
can be used to power the TMDS171 RGZ EVM. Power is provided to the EVM when SW2 is set to
position 1.
CAUTION
Do not plug in any power source higher than the configured voltage (5 V).
Alternately, it is possible to power the EVM by connecting a USB Micro cable to a host and setting SW2 to
position 3. Using the EVM in this manner may exceed USB compliance requirements for power
consumption.
Note that to prevent any back-driving of 5 V in the system, most TMDS171 EVMs have been modified to
receive 5 V from the HDMI source connection to drive the Board_5V. This has been done by removing U6
and installing R104 on the EVMs.
l TEXAS INSTRUMENTS
Hardware Description
www.ti.com
6SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
2.5 Jumper Configuration
Jumpers are provided to operate the device and EVM in different configurations.
Table 3. SW1 DIP Switch Setting
DIP SW
No Signal Name Description Default Config
J1 HPD_SRC JP 1–2 for DP159 thru HDMI JP 2–3
JP 2–3 for TMDS171 Allows for 3.3 V to 5 V transition of HPD_SRC signal
NC for DP159
J3 I2_EN_PIN JP 1–2 for I2C ENABLE JP 2–3
JP 2–3 for PIN STRAP Enables device configuration from I2C or pin straps
NC – N/A
J4 SCL JP 1–2 for USB IF to I2C JP 1–2
JP 2–3 for EXT IF to I2C USB I2C Interface
NC – N/A
J6 SDA JP 1–2 for USB IF to I2C JP 1–2
JP 2–3 for EXT IF to I2C USB I2C Interface
NC – N/A
J7 HDMI_SEL_TEST_A1 JP 1–2 for: JP 2–3
I2C Addr bit A1 = 1, when I2C_EN = H
Test mode, when I2C_EN = L
JP 2–3 for:
I2C Addr bit A1 = 0, when I2C_EN = H
Normal mode, when I2C_EN = L
NC for weak internal pulldown (Normal mode)
J8 VSADJ JP 1–2 for 7 k JP 1–2
JP 2–3 for adjustable resistance The default value is 4.64 kΩearly EVMs (prior to revision
B)
NC – N/A
J10 SLEW_CTL JP 1–2 for fastest data rate NC
JP 2–3 for 20 ps slow
NC for 40 ps slow
J11 SIG_EN JP 1–2 for Signal Detect Enabled NC
JP 2–3 for Signal Detect Disabled
NC for internal pulldown (Signal Detect Disabled)
J12 EQ_SEL_A0 JP 1–2 for: NC
I2C Addr bit A0 = 1, when I2C_EN = H
Fixed EQ at 14 dB at 3G, when I2C_EN = L
JP 2–3 for:
I2C Addr bit A0 = 0, when I2C_EN = H
Fixed EQ at 7.5 dB at 3G, when I2C_EN = L
NC for Adaptive EQ
J14 TX_TERM_CTL JP 1–2 for no transmit term NC
JP 2–3 for transmit term in 150–300 ohm
NC for auto select of term
J15 PRE_SEL JP 1–2 for –5 dB NC
JP 2–3 for –2.5 dB
NC for 0 dB
J16 CEC CTL JP 1–2 for DP159 thru HDMI JP 2–3
JP 2–3 for TMDS171 Shorts HDMI_CEC_SRC to HDMI_CEC_SINK
NC for DP159
J17 SWAP_POL JP 1–2 for RX Polarity Swap (Retimer Mode Only) NC
JP 2–3 for RX Lane Swap
NC for normal
l TEXAS INSTRUMENTS
www.ti.com
Hardware Description
7
SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
2.6 Component Population Configuration
To allow the TMDS171 EVM to support both the TMDS171 RGZ device and the DP159 RGZ device, there
are many components that must be removed, placed, or modified, depending on the board configuration.
Here is a summary of the component configuration for the TMDS171. In addition, the unused source
receptacle can be depopulated.
Function Reference Designator TMDS171
DIFFERENTIAL PAIR - IN C11, C12, C13, C14, C15, C16, C24, C25 populated with 0 Ω
DIFFERENTIAL PAIR - HDMI IN R14, R15, R18, R19, R20, R21, R22, R23 populated with 0 Ω
SDA / SCL - HDMI R24, R25 populated with 0 Ω
DIFFERENTIAL PAIR - DP IN R112, R109, R111, R108, R110, R107, R106,
R105 not populated
SDA / SCL / HPD - DP R33, R31, R32 not populated
ARC / SPDIF to DP C2, C3 not populated
ARC / SPDIF to HDMI C4, C5, C6, C7, R34 populated with 1 µF / 0 Ω
ARC / SPDIF SHORT R113, R114 not populated
PULL UP DIFFERENTIAL PAIR HDMI OUT (not
on revision B) R37, R38, R39, R40, R41, R42, R43, R44 not populated
DIFFERENTIAL PAIR - HDMI OUT (not on
revision B) R47, R48, R49, R50, R51, R52, R53, R54 populated with 0 Ω
PULL UP DIFFERENTIAL PAIR HDMI IN R1, R2, R3, R4, R6, R7, R8, R9 not populated
2.6.1 HPD Snoop Option – not available prior to Revision B EVM
To accommodate systems that do not properly resend DDC commands after HPD goes low, TI has
implemented an HPD snoop mode on the TMDS171RGZ revision B EVM. This mode allows the HPD line
to be routed around the TMDS171, but remain connected to the TMDS171 on the sink side to allow the
TMDS171 to snoop its state. This snoop mode is disabled by default on the TMDS171RGZ revision B
EVMs.
Pop R131, no pop R129, R130 for HPD on
No pop R131, pop R129, R130 for HPD snoop only
2.6.2 DDC Snoop Option – not available prior to Revision B EVM
To accommodate systems that do not properly support clock stretching on the DDC lines, TI implemented
a snoop mode on the TMDS171RGZ revision B EVM. This mode allows the DDC lines to be routed
around the TMDS171, but remain connected to the TMDS171 on the sink side to allow the TMDS171 to
snoop the DDC traffic. This snoop mode is enabled by default on the TMDS171RGZ revision B EVMs.
Pop R16, R17, R24, R25. No pop R123, R124, R125, R126 - TMDS171, DDC on
No pop R16, R17, R24, R25. Pop R123, R124, R125, R126 - TMDS171, DDC snoop only
l TEXAS INSTRUMENTS 45 EyeScan Tad ‘I‘hv Cum uter EyEScan Seflings 0, L 2, {4 DH! 7 e 5 4 3 2 1 D Busaecrmmmmflm‘am Lane 0 Lanes 0 Persls‘ence . u RepeaI De‘ay mg“ C ‘ Wme Lump VSca V n Lane 1 Lane 2 Lane a 1% Eyeman ‘fi Regisfie! Siamslcnnirol i Advanced RegisierAccess Imenaze Vemon 1 05 fi m INSTRUMENTS
Hardware Description
www.ti.com
8SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
2.7 USB Interface via TUSB3410
Install the Eye Scan software from TI
J6 must be set to SDA – SDA_USB
J4 must be set to SCL – SCL_USB
Attached the USB micro cable to J13 and to the host computer
Start the Eye Scan software
Figure 4 illustrates the Eye Scan opening tab.
Figure 4. Eye Scan Opening Tab
TEXAS INSTRUMENTS .9 Ewscm ’fiv E m Compuler a smsopuanssmmsfimm Interface [D Regrgers Dame \D Revsran Va‘ue Refresh msc Comml LHDonmMEwalz‘mmsmusl RXPatIenVevmsSmusl PLLSmsIRXEQszsIMSQTesl ElmiComl‘ ‘1 Lane Swap ‘2: Ral Tc \ v ‘1 Pmanly Swap Athuangu v r, a mask Lane Acuvny Detect Euuah: Jrvtmmfld n‘ u Famed Puwer Dawn , Amrmg w an: L1 HDP Auto Power Down Made AppIny/Tx Changes [1 HPDSNKJHATLEN Q Equanzer \El Evescan | m Register scamslconuol If Advanced RegflerAcoeu‘ [menace Version 105 fl Thus mmmam
www.ti.com
Hardware Description
9
SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
Confirm that the SN65DP149/159/TMDS171/171 interface is present and selected. If it is not, check the
USB connection and confirm that the driver is loaded in Device Manager.
Figure 5. Register Status/Control Tab
l TEXAS INSTRUMENTS {9 EyeScan Tool =- ‘ 35 ‘ t G . a a Compmel 9 sN65DP149I159/TMDS171/1a1 xmefiace \D Regwsters Devwce‘D TMDS181 Rewsmn VaMEOD Refresh MISC Cantu?! HDML Comm ‘Equahlmmn sums \ RxPanem Verrfier sums PLL Stamsl Rx EQ smug | MISC Tes: | Ermr (2mm Slew Rate Comm Data Ompm Swmg HDMLSEL v‘ Duck mum Swmg Transmu Termmamn— HDM‘ deemphasws @ DDC data me D nnc trammg bmzkmnmmn [fl TMDS C‘uck Rana 1/10olTMDs b» p‘ v \El Eyescnn‘ 6 Register Sfaluslconlml ‘1‘ Advanced RegislelAcceu Interface Version 1.05 k TEXAS INSTRUMENTS
Hardware Description
www.ti.com
10 SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
Select the Register Status/Control tab and click Refresh.
Figure 6. TMDS171 Device with TMDS Clock Ratio set to 1/10
TEXAS INSTRUMENTS ’flv E a! Comumer ‘) SN65DP149/159ITMDS171I181 imam-IDS iD Registers DeviceiD TMDsm Revisiunvaiuzoo MLSC Commii How Conlmi iEqualizahon Status | Rx Pattem Venfer smug PLL Siaiusl RX EQ Siaiusl MISC Ten | Enov Emmi Siew Rate Comrai 1 (sinwesx) v Data ompm swmg HDMLSEL v cimk ompm Swing Set by Dana Rate v Transmm Terminani_ HDMi deremphasrs DDC daia raie m DDC training biockfuncliun TMDS Ciuck Ram 1/40 afTMDS m u v i Eyescani I] Register staluslcommi 4* Advanced RegisfierAccess I lnterfaze Versmn 105 w Tms INSTRUMENTS TMDS171 Produci Preview Aardvark I20/SPI Hosi Adagter User Manual HighrDeiinition Muliimedia lmerface Specificaiion Version 1.4b. HighrDeiinition Munimedia Imerface Specification Version 2.0
www.ti.com
Quick Start Guide
11
SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
If using a generator or source that does not support DDC clock stretching per the I2C specification, when
running at HDMI speeds it may be necessary to force the TMDS Clock Ratio Bit. Select the HDMI Control
tab and check the DDC clock training block function, change the TMDS Clock Ratio: to 1/40.
Figure 7. TMDS171 Device with TMDS Clock Ratio set to 1/40
3 Quick Start Guide
1. Apply 5-V power to the EVM, turn on SW2. LED D2 should light up.
2. If using external I2C adapter instead of pin straps, please configure the TMDS171 at this step.
3. Plug in an HDMI source using a standard HDMI cable into P1 (Standard HDMI connector).
4. Plug in an HDMI video sink device into P2 (Standard HDMI connector) using a standard HDMI cable.
5. Video output on HDMI sink should be observed
4 References
1. TMDS171 Product Preview
2. Aardvark I2C/SPI Host Adapter User Manual
3. High-Definition Multimedia Interface Specification Version 1.4b.
4. High-Definition Multimedia Interface Specification Version 2.0
l TEXAS INSTRUMENTS
EVM Bill of Materials
www.ti.com
12 SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
5 EVM Bill of Materials
Table 4. EVM Bill of Materials
QTY Reference Part PCB Footprint Manufacturer Part Number
6 C1, C4, C5, C6, C7, C52 1 µF 603 Taiyo Yuden LMK107B7105KA-T
12 C9, C10, C17, C18, C19, C21,
C23, C29, C40, C46, C59, C60 0.1 µF 402 Yageo CC0402KRX5R6BB104
5 C8, C20, C35, C36, C57 10 µF 805 TDK C2012X5R1A106K125AB
1 C31 10 µF 805 TDK C2012X5R1C106K085AC
8C11, C12, C13, C14, C15, C16,
C24, C25 0Ωresistors 201 TDK C0603X5R0J104M
5 C22, C37, C41, C42, C47 0.01 µF 402
1 C26 - DNI DNI_200 nF 402
1 C27 18 pF 402 AVX 04025A180JAT2A
1 C28 220 pF 402
1 C30 220 µF 7343 Kemet T495X337K010ATE060
1 C34 3.3 nF 402
1 C32 22 µF 805
2 C39, C58 2.2 µF 805
27
R31, R32, R33, R35, R87, R92,
R93, R105, R106, R107, R108,
R109, R110, R111, R112, R113,
R114, R120, C2, C3, C38, R129,
R130, R24, R25, R16, R17
DNI 402 / 201
2 C45, C49 22 pF 402
2 C50, C51 33 pF 402
1 D1 Zener 6V SOT23 Diodes Inc. MMBZ5233B-FDICT-ND
1 D2 LED Green 0805 805 Lite On LTST-C171GKT
1 JP1 JUMPER HDR_THVT_1x2_100
13 J1, J3, J4, J6, J7, J8, J10, J11,
J12, J14, J15, J16, J17 HDR3X1 M 0.1 HDR_THVT_1x3_100 3M 961103-6404-AR
1 J2 Display_Port_Connector_Sink_0 DISPLAYPORT Molex 47272-0001
1 J5 Header 5x2 0.1" thru-hole con_thvt_shrd_2x5_100_m 3M N2510-6002-RB
1 J9 2.1mm x 5.5mm PJ-202AH CUI Inc. PJ-202AH (PJ-002AH)
1 J13 USB Micro B USB Micro B FCI 10103592-0001LF
17
LP1, LP2, LP3, LP4, LP5, LP6,
LP7, LP8, LP9, LP10, LP11,
LP12, LP13, LP14, LP15, LP16,
LP17
LP TESTLOOP KOBIKONN 151-103-RC
1 L1 2.2 µH 1008 TDK VLS252010ET-2R2M
1 L2 1 µH 1008 TDK NLCV25T-1R0M-EFR
1 P1 HDMI_IN CON_HDMI_RT_19_0p50mm Molex 471510001
1 P2 HDMI_OUT CON_HDMI_RT_19_0p50mm Molex 471510001
2 Q1, Q2 FDV301N_NFET_8V SOT23 Fairchild Semiconductor FD301N
8R1, R2, R3, R4, R6, R7, R8, R9 -
DNI DNI 201
1 R5 100 402
6R10, R11, R99, R100, R101,
R121 1K 402
3 R12, R27, R81 100K 402
1 R13 10 402
13 R14, R15, R18, R19, R20, R21,
R22, R23, R34, R123, R124,
R125, R126 0 201
4 R28, R29, R58, R59 2K 402
8R77, R80, R83, R84, R89, R104,
R122, R131 0 402
1 R30 1M 402
1 R127 500K 402
1 R36 75 402
1 R56 27K 402
16 R57, R60, R61, R62, R63, R64,
R65, R66, R67, R68, R69, R70,
R71, R72, R73, R74 65K 402
l TEXAS INSTRUMENTS
www.ti.com
EVM Bill of Materials
13
SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
Table 4. EVM Bill of Materials (continued)
QTY Reference Part PCB Footprint Manufacturer Part Number
1 R75 7K 402
1 R76 PTV09 10K POT THRUHOLE BOURNS PTV09A-4015F-B103
3 R78, R98, R102 10K 402
2 R79, R88 4.7K 402
1 R82 500 402
1 R85 750K 402
1 R86 240K 402
1 R90 1.87K 402
1 R91 4.42K 402
1 R94 1.5K 402
2 R95, R96 33 201
1 R103 15K 402
3 R45, R46, R115 47K 402
1 SW1 PB_SWITCH SW_MOM_2NO OMRON B3SN-3012P
1 SW2 3POS_SPDT THRUHOLE_3POS NKK Switches MS13ANW03
1 U1 TMDS171RGZ 48_RGZ TI
1 U9 SN74AUP1G04 DCK TI SN74AUP1G04DCKR
1 U2 - DNI SN74CBT1G125 - DNI DCK TI SN74CBT1G125DCKR
1 U3 TPS3808G30DBVT 6DBV TI TPS3808G30DBVT
1 U4 TPS62150A RGT16 TI TPS62150ARGTT
1 U6 - DNI TPS61240 - DNI 6DRV TI TPS61240DRVT
1 U5 TPS74201RGWT RGW20 TI TPS74201RGWT
1 U7 TUSB3410 LQFP32 TI TUSB3410VF
1 U8 24LC256 8SOIC ON Semiconductor CAT24C256W
1 Y1 12 MHz Crystal ECX-32 ECS Inc. ECS-120-20-33-TR
1 U16 TPD2E001 drl_5pin TI TPD2E001
l TEXAS INSTRUMENTS 9W
DisplayPort++
HDMI RX JP 1-2 for DP159 thru HDMI
JP 2-3 for TMDS171
NC for DP159
JP 1-2 for DP159 thru HDMI
JP 2-3 for TMDS171
NC for DP159
Pop 50 ohm pullups on IN_Dxx lines for DP159 thru HDMI
No pop 50 ohm pullups on IN_Dxx lines for DP159
No pop 50 ohm pullups on IN_Dxx lines for TMDS171
Pop 0 ohm series on IN_Dxx lines for DP159 thru HDMI, TMDS171
No pop 0 ohm series on IN_Dxx lines for DP159
Pop R104 if U6 is no pop - TMDS171
No pop R104 if U6 is pop - DP159
No pop for TMDS171
No pop for DP159
Pop 0 ohm series on IN_Dxx lines, DP_Sxx_SRC lines for DP159
No pop 0 ohm series on IN_Dxx lines, DP_Sxx_SRC lines for DP159 thru HDMI, TMDS171
Pop R16, R17, R24, R25. No pop R123, R124, R125, R126 - TMDS171, DDC on
No pop R16, R17, R24, R25. Pop R123, R124, R125, R126 - TMDS171, DDC snoop only
Pop 2K resistors on R16, R17, pop R24, R25, no pop R123, R124, R125, R126 for DP159 thru HDMI
No pop R16, R17, R126, R125, R24, R25 for DP159
DP_SCL_SRC
DP_SDA_SRC
DPRX_GND
C_DPRX_LN1N
C_DPRX_LN1P
C_DPRX_LN3N
C_DPRX_LN3P
C_DPRX_LN2N
C_DPRX_LN2P
C_DPRX_LN0N
C_DPRX_LN0P
CEC_SRC
DP_CAD
HDMI_CEC_SRC
HDMI_SCL_SRC_IN
HDMI_SDA_SRC_IN
HPD_SRC_HDMI_RX_CONN
HPD_SRC_HDMI_RX_CONN
HPD_SRC
HPD_SRC_CONN
ARC_OUT
HDMI_CEC_SNK
HDMI_CEC_SRC
CEC_SRC
HPD_SRC
ARC_OUT
HDMI_IN_5V
BOARD_3P3V
BOARD_5V
BOARD_5V
BOARD_3P3V
CEC_SRC PAGE4
IN_D2P PAGE2,3
IN_D2N PAGE2,3
IN_D1P PAGE2,3
IN_D1N PAGE2,3
IN_D0P PAGE2,3
IN_D0N PAGE2,3
IN_CLKP PAGE2,3
IN_CLKN PAGE2,3
HPD_SRC PAGE3
AUX_SRCN/ARC_OUTPAGE3 AUX_SRCP/SPDIF_IN PAGE3
SPDIF_IN PAGE4
SCL_SRC PAGE2,3
SDA_SRC PAGE2,3
HDMI_CEC_SNK PAGE4
IN_CLKN PAGE2,3
IN_CLKP PAGE2,3
IN_D0N PAGE2,3
IN_D0P PAGE2,3
IN_D1N PAGE2,3
IN_D1P PAGE2,3
IN_D2N PAGE2,3
IN_D2P PAGE2,3
SCL_SRC PAGE2,3
SDA_SRC PAGE2,3
HDMI_SDA_SRC PAGE2,3
HDMI_SCL_SRC PAGE2,3
HPD_SRC_CONNPAGE4
P1
HDMI_IN
HDMI_IN
11
22
33
44
55
66
77
88
99
10 10
11 11
12 12
13 13
14 14
15 15
16 16
17 17
18 18
19 19
Case1
20
Case2
21 Case3 22
Case4 23
R4
50
0201
5%
Q1
FDV301N_NFET_8V
1
2
3
R9
50
0201
5%
R21 0
R108 0
R11
1K
0402
R113
DNI
0402
LP3
ARC_OUT
R8
50
0201
5%
R123
0
LP15
LP1
AUX_SRCN
R22 0
R34 0
LP16
R109 0
R124
0
R35
DNI
0402
5%
R7
50
0201
5%
LP17
C6
1 uF
R114
DNI
0402
R23 0
R3
50
0201
5%
R125
0
R6
50
0201
5%
R110 0
LP4
SPDIF_IN
R36
75
0402
5%
J2
Display_Port_Connector_Sink_0 - DNI
DISPLAYPORT IN
GND7
21
GND8
22
GND9
23
GND10
24
ML_3n 1
GND1 2
ML_3p 3
ML_2n 4
GND2 5
ML_2p 6
ML_1n 7
GND3 8
ML_1p 9
ML_0n 10
GND4 11
ML_0p 12
CAD (GND) 13
DP_CEC (GND) 14
AUX_p (SCL) 15
GND6 16
AUX_n (SDA) 17
HPD 18
DP_PWR_RTN 19
DP_PWR 20
R126
0
R14 0
R16
47K
0402
5%
R5
100
0402
R27
100K
0402
5%
C2
0.1uF
R104 0
R2
50
0201
5%
R12
100K
0402
R111 0
R15 0
C3
0.1uF
Q2
FDV301N_NFET_8V
1
2
3
C4
1 uF
R105 0
R127
500K
0402
R112 0
R33 0
R28
2K
0402
5%
R1
50
0201
5%
R17
47K
0402
5%
J1
HDR3X1 M .1
HPD_SRC
1
2
3
R18 0
R25 0
D1
Zener 6V
1
2
3
R32 0
C5
1 uF
R30
1M
0402
5%
R106 0
R29
2K
0402
5%
R13
10
0402
R19 0
R31 0
R24 0
R10
1K
0402
C7
1 uF
R107 0
LP2
AUX_SRCP
R20 0
C1
1 uF
J16
HDR3X1 M .1
CEC CTL
1
2
3
Copyright © 2016, Texas Instruments Incorporated
EVM Schematics
www.ti.com
14 SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
6 EVM Schematics
Figure 8 through Figure 14 illustrate the EVM schematics.
Figure 8. HDMI Input Connector
l TEXAS INSTRUMENTS <>> mm mm <>
Pop caps on IN_Dxx lines for DP159
Pop 0 ohm on IN_Dxx lines for TMDS171
Pop R131, no pop R129, R130 for HPD on
No pop R131, pop R129, R130 for HPD snoop only
VDD_1P1V
VCC_3P3V
VCC_3P3VVDD_1P1V
BOARD_5V
OUT_CLKP PAGE4
OUT_CLKN PAGE4
OUT_D2P PAGE4
OUT_D2N PAGE4
OUT_D1P PAGE4
OUT_D1N PAGE4
OUT_D0P PAGE4
OUT_D0N PAGE4
HPD_SNK PAGE4
SDA_SNK PAGE4
SCL_SNK PAGE4
SLEW_CTL PAGE5
OEPAGE6
AUX_SRCN/ARC_OUTPAGE2
AUX_SRCP/SPDIF_INPAGE2
SCL_SRCPAGE2
SDA_SRCPAGE2
IN_D2PPAGE2
IN_D2NPAGE2
IN_D1PPAGE2
IN_D1NPAGE2
IN_D0PPAGE2
IN_D0NPAGE2
IN_CLKPPAGE2
IN_CLKNPAGE2
HPD_SRCPAGE2
I2C_EN_PINPAGE5
SCL_CTLPAGE5
SDA_CTLPAGE5
PRE_SELPAGE5
EQ_SEL_A0PAGE5
HDMI_SEL#_TEST_A1 PAGE5
TX_TERM_CTL PAGE5
SIG_ENPAGE5
SWAP/POLPAGE5
CEC_ENPAGE4
VSADJ PAGE5
HDMI_SCL_SRC PAGE2,3
HDMI_SDA_SRC PAGE2,3
HPD_SNK PAGE4
HPD_SRC_CONNPAGE2
C12
0.1uF
C23
0.1uF
C8
10uF
C18
0.1uF
R129 0
C13
0.1uF
C20
10uF
C9
0.1uF
TMDS171RGZ
U1
48 PIN RGZ, HSIO
SWAP/POL
1
IN_D2P
2
IN_D2N
3
HPD_SRC
4
IN_D1P
5
IN_D1N
6
GND1
7
IN_D0P
8
IN_D0N
9
I2C_EN/PIN
10
IN_CLKP
11
IN_CLKN
12 OUT_CLKN 25
OUT_CLKP 26
HDMI_SEL#/A1 27
OUT_D0N 28
OUT_D0P 29
GND3 30
OUT_D1N 31
OUT_D1P 32
HPD_SNK 33
OUT_D2N 34
OUT_D2P 35
TX_TERM_CTL 36
VDD4 37
SCL_SNK 38
SDA_SNK 39
SLEW_CTL 40
GND4 41
OE 42
VCC2 43
AUX_SRCN/ARC_OUT 44
AUX_SRCP/SPDIF_IN 45
SCL_SRC 46
SDA_SRC 47
VDD5 48
VCC1
13
VDD1
14
SCL_CTL
15
SDA_CTL
16
SIG_EN
17
CEC_EN/NC
18
GND2
19
PRE_SEL
20
EQ_SEL/A0
21
VSADJ
22
VDD2
23
VDD3
24
PAD 49
C19
0.1uF
C14
0.1uF
C11
0.1uF
C10
0.1uF
C15
0.1uF
C16
0.1uF
R130
1K
0402
5%
C24
0.1uF
C21
0.1uF
R131 0
C25
0.1uF
C22
0.01uF
C17
0.1uF
Copyright © 2016, Texas Instruments Incorporated
www.ti.com
EVM Schematics
15
SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
Figure 9. TMDS171 RGZ Schematic (48-Pin QFN)
l TEXAS INSTRUMENTS HDMI TX No pop U2 for TMDS171
HDMI TX
Pop U2 DP159 thru HDMI, DP159
No pop U2 for TMDS171
Pop 2K resistors on R45, R46 for TMDS171, DDC on
Pop 47K resistors on R45, R46 for TMDS171, DDC snoop only
Pop 2K resistors on R45, R46 for DP159
HDMI_CEC_SNK
BOARD_5V BOARD_5V
BOARD_3P3V
BOARD_5V
OUT_D2P PAGE3
OUT_D2N PAGE3
OUT_D1P PAGE3
OUT_D1N PAGE3
OUT_D0P PAGE3
OUT_D0N PAGE3
OUT_CLKP PAGE3
OUT_CLKN PAGE3
SDA_SNK PAGE3
SCL_SNK PAGE3
HPD_SNK PAGE3
SPDIF_IN PAGE2
HDMI_CEC_SNK PAGE2
CEC_SRCPAGE2
CEC_ENPAGE3
LP10
R56
27K
0402
5%
LP11 LP12
R45
47K
0402
5%
LP13
R46
47K
0402
5%
LP14
U2
SN74CBT1G125 - DNI
OE
1
A
2
GND
3B4
VCC 5
U9
SN74AUP1G04
NC
1
A
2
GND
3Y4
VCC 5
P2
HDMI_OUT
HDMI OUT
11
22
33
44
55
66
77
88
99
10 10
11 11
12 12
13 13
14 14
15 15
16 16
17 17
18 18
19 19
Case1
20
Case2
21 Case3 22
Case4 23
Copyright © 2016, Texas Instruments Incorporated
EVM Schematics
www.ti.com
16 SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
Figure 10. HDMI TX Connector
*9 TEXAS INSTRUMENTS
AARDVARK
CONNECTOR
Three place switches - hi, lo, no connect
Sampled at POR
I2C_EN_HI
I2C_EN_LO
PRE_SEL_HI
PRE_SEL_LO
EQ_SEL_HI
EQ_SEL_LO
SLEW_CTL_HI
SLEW_CTL_LO
SWAP_POL_HI
SWAP_POL_LO
SIG_EN_HI
SIG_EN_LO
TX_TERM_CTL_HI
TX_TERM_CTL_LO
VCC_3P3V
VCC_3P3V
VCC_3P3V
VCC_3P3V
VCC_3P3V
VCC_3P3V
VCC_3P3V
VCC_3P3V VCC_3P3V
I2C_EN_PIN PAGE3
PRE_SEL PAGE3
EQ_SEL_A0 PAGE3
SLEW_CTL PAGE3
SCL_CTLPAGE3
SDA_CTLPAGE3
SWAP/POL PAGE3
HDMI_SEL#_TEST_A1 PAGE3
SIG_EN PAGE3 TX_TERM_CTL PAGE3
SDA_CTL_USB PAGE8
SCL_CTL_USB PAGE8
VSADJ PAGE3
R76 - DNI
PTV09 10K POT
R61
65K
0402
5%
R57
65K
0402
5%
R69
65K
0402
5%
J14
HDR3X1 M .1
TX_TERM_CTL
LO
HI
1
2
3
J12
HDR3X1 M .1
EQ_SEL_A0
LO
HI
1
2
3
R68
65K
0402
5%
R65
65K
0402
5%
R62
65K
0402
5%
R70
65K
0402
5%
J7
HDR3X1 M .1
HDMI_SEL#/TEST/A1
LO
HI
1
2
3
R115
47K - DNI
0402
5%
R71
65K
0402
5%
R72
65K
0402
5%
R60
65K
0402
5%
R59
2K
0402
5%
R67
65K
0402
5%
J17
HDR3X1 M .1
SWAP/POL
LO
HI
1
2
3
J8
HDR3X1 M .1
DEFAULT
VSADJ
POT
1
2
3
R66
65K
0402
5%
J10
HDR3X1 M .1
SLEW_CTL
LO
HI
1
2
3
J4
HDR3X1 M .1
SCL
SCL_USB
SCL_AAR
1
2
3
R58
2K
0402
5%
R75
7K
0402
1%
R63
65K
0402
5%
R64
65K
0402
5%
R73
65K
0402
5%
J15
HDR3X1 M .1
PRE_SEL
LO
HI
1
2
3
R74
65K
0402
5%
J5
Header 5x2 0.1" thru-hole
AARDVARK I2C
2
4
6
8
10
1
3
5
7
9
J6
HDR3X1 M .1
SDA
SDA_USB
SDA_AAR
1
2
3
J11
HDR3X1 M .1
SIG_EN
LO
HI
1
2
3
J3
HDR3X1 M .1
I2C_EN_PIN
LO
HI
1
2
3
Copyright © 2016, Texas Instruments Incorporated
www.ti.com
EVM Schematics
17
SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
Figure 11. TMDS171 Select Options
l TEXAS INSTRUMENTS RESET CIRCUIT
RESET CIRCUIT
Pop C26 and depop
R77 if not using the
Reset SW.
TPS3808_CTPB_MANUAL_RESET
VCC_3P3V
BOARD_3P3V
VCC_3P3V OE PAGE3
REG_PGPAGE7
R77 0
U3
TPS3808
RESET#
1
GND
2
MR#
3CT 4
SENSE 5
VDD 6
C27
18pF
C28
220pF
N.O.
SW1
PB_SWITCH
BOARD RESET
1
2
4
3
C29
0.1uF
R79
4.7K
0402
5%
C26
DNI_200nF
R78
10K
0402
5%
R80 0
Copyright © 2016, Texas Instruments Incorporated
EVM Schematics
www.ti.com
18 SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
Figure 12. RESET Circuit
l TEXAS INSTRUMENTS
1.1V LDO REGULATOR
5.0V BOOST
3.3V BUCK REGULATOR - 4V to 17V input
REG_PG
EN1P2
SS1P2
FB_1PT2V
PWRIN_SW
FB_3PT3V
BOARD_3P3V
BOARD_1P1V
BOARD_3P3V
VDD_1P1V
VCC_3P3V
BOARD_3P3V
USB_5V
BOARD_5V
BOARD_3P3V
BOARD_IN
REG_PG PAGE6
SW2
3POS - SPDT
WALL - OFF - USB 5V
1
2
3
C32
22uF
R91
4.42K
0402
1%
D2
LED Green 0805
5V PWR
R88
4.7K
0402
5%
R87
DNI
0402
5%
R82
500
0402
5%
R120
DNI 0402
C57
10uF
R90
1.87K
0402
1%
C38
DNI
C31
10uF
R84 0
LP7
C37
0.01uF
U4
TPS62150A
SW1 1
SW2 2
SW3 3
PG 4
FB 5
AGND
6
FSW 7
DEF 8
SS/TR
9
AVIN
10 PVIN1
11 PVIN2
12 EN
13
VOS
14
PGND1
15 PGND2
16
PAD
17
LP8
GND
R81
100K
0402
L1
2.2 uH
LP9
GND
R85
750K
0402
1%
C36
10uF
C34
3.3 nF
C35
10uF
R86
240K
0402
1%
L2
1 uH - DNI
T
S
J9
2.1mm x 5.5mm
1
2
3
LP6
1.1V
C58
2.2uF - DNI
U5
TPS74201RGWT
OUT1 1
NC1
2
NC2
3
NC3
4
IN1
5
IN2
6
IN3
7
IN4
8
PG 9
BIAS
10
EN
11
GND
12
NC4
13
NC5
14
SS
15
FB 16
NC6
17
OUT4 18
OUT3 19
OUT2 20
PAD
21
R89 0
+
C30
330uF
U6
TPS61240 - DNI
GND 1
VOUT 2
FB 3
EN
4
L
5
VIN
6
PAD
7
LP5
3.3V
R83
0
0402
Copyright © 2016, Texas Instruments Incorporated
www.ti.com
EVM Schematics
19
SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
Figure 13. Power Schematics (1.1-V and 3.3-V Regulators)
l TEXAS INSTRUMENTS
EVM Schematics
www.ti.com
20 SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
Figure 14. TUSB3410 Schematic
l TEXAS INSTRUMENTS
www.ti.com
EVM Layout
21
SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
7 EVM Layout
Figure 15 through Figure 20 illustrate the PCB layout images for the EVM.
Figure 15. Layer 1 (Top)
Figure 16. Layer 2 (GND)
{L} TEXAS INSTRUMENTS
EVM Layout
www.ti.com
22 SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
Figure 17. Layer 3 (Power)
Figure 18. Layer 4 (Power)
{L} TEXAS INSTRUMENTS @ © ‘ © ._- 6 3.0 ©...©.©.© © © .©u u fi©@ ©© . ©©
www.ti.com
EVM Layout
23
SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
TMDS171 RGZ EVM
Figure 19. Layer 5 (GND)
Figure 20. Layer 6 (Bottom)
l TEXAS INSTRUMENTS
Total Phase Aardvark I2C Host Adapter Scripts
www.ti.com
24 SLLU217AApril 2015Revised April 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
Revision History
8 Total Phase Aardvark I2C Host Adapter Scripts
Request the latest scripts from your TI representative.
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (April, 2015) to A Revision ......................................................................................................... Page
Changed signal rate to 6Gbps and resolutions support to 4k/2k/60p in the What is the TMDS171? section................. 2
Changed and added text, added TMDS171 Device with TMDS Clock Ratio set to 1/40 image and changed all other GUI
images in the USB Interface via TUSB3410 section.................................................................................. 8
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
SPACER
SPACER
SPACER
SPACER
SPACER
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18328日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
SPACER
4EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
spacer
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated

Products related to this Datasheet

EVAL BOARD FOR TMDS171
Available Quantity: 1
Unit Price: 358.8