Connected Sensors Building Automation Systems Guide Datasheet by Texas Instruments

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{I} TEXAS INSTRUMENTS
www.ti.com/buildingAutomation 2015
Connected Sensors
Building Automation
Systems Guide
2 | Connected Sensors Building Automation Systems Guide 2015 Texas Instruments
Connected Sensors Building Automation Systems Guide
Table of Contents and Sensor Solutions
Introduction
Monitoring devices or nodes in
building control systems, fire safety
systems, lighting control, and other
building automation and Internet
of Things (IoT) applications are
becoming more prevalent in
today’s world.
The use of connected sensors has
a wide range of uses in building
automation applications, from
monitoring human safety and
security, controlling the environ-
ment and ambience specified by
the comfort preferences of the end
user, or either periodic or continu-
ous data logging of environmental
and system data to detect irregular
system conditions.
Texas Instruments (TI) has a broad
portfolio of products that cater to
connected sensing in building
automation applications. This
portfolio ranges from innovative
sensor analog front-end products
to low-power wireless connectivity
solutions.
Temperature Sensing
Part No. Type
Local Sensor Accuracy
(Max) At Given Temp
Range (±°C)
Supply
Current
(Max) (µA)
Supply
Range (V) Interface
Infrared Sensor
Accuracy (Max)
(±°C)
Operating
Temp.
(°C) Pin / Package
Approx.
Price
(US$ | 1ku)
LMT70/70A Analog ±0.2°C from 20 to 90 12 2.0 to 5.5 Analog Out –55 to 150 4DSBGA 0.54 / 0.65
LMT84 Analog ±2.7°C from –50 to 150 8.1 1.5 to 5.5 Analog Out –50 to 150 5SC70 0.18
TMP112 Digital ±0.5°C from 0 to 65 10 1.4 to 3.6 I2C, SMBus,
2-wire –40 to 125 6SOT 0.90
TMP75 Digital ±2°C from –25 to 85 85 2.7 to 5.5 I2C, SMBus,
2-wire –40 to 125 8SOIC, 8VSSOP 0.45
TMP007 Contactless ±1°C from –40 to 125 350 2.2 to 5.5 I2C, SMBus 3 –40 to 125 8DSBGA 1.90
Humidity and Temperature Sensing
Part No.
Relative
Humidity
Accuracy
(Typ) (%RH)
RH Operating
Range (Typ)
(%RH)
Temperature
Accuracy
(Typ) (°C)
Supply
Range
(V)
Average
Supply
Current (Typ)
(µA) Interface
Operating
Temp.
(°C)
Pin /
Package
Approx. Price
(US$ | 1ku)
HDC1000/1050 ±3 0 - 100 ±0.2 3 to 5 1.2 @ 1 sps I2C
40 to 125 8DSBGA, 6DFN 2.20
HDC1008 ±4 0 - 100 ±0.2 3 to 5 1.2 @ 1 sps I2C
40 to 125 8DSBGA 1.76
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars. Preview products are listed in bold teal.
Sensor Solutions
TI has a rich, five-decade history of sensing innovation and, combined with best-in-class sensing technologies, tools, and
resources, we continue to deliver better solutions today and new possibilities for tomorrow.
Learn more about sensor solutions at: www.ti.com/sensing
Table of Contents
Sensor Solutions
2 Temperature Sensing
2 Humidity and Temperature Sensing
2 Ambient Light Sensing
3 Inductance Sensing
3 Capacitance Sensing
3 Hall Effect Sensor
Amplifiers and Comparators
4 Low Power Amplifiers
4 General Purpose Amplifiers
4 Comparators
4 Analog-to-Digital Converters
Wireless Connectivity
5 Wi-Fi
5 Sub-1GHz
5 Bluetooth®
5 ZigBee®
5 NFC
Embedded Processing Solutions
7 MSP430 Low Power FRAM MCUs
7 MSP430 Low Power MCUs
7 ARM Based MCUs and MPUs
Power Management
8 DC/DC Switching Regulators
8 Linear Regulators
8 Voltage Reference
9 AC/DC Converters
9 Ultra Low Power Harvester
Power Management IC
9 System Timer
9 Load Switches
Haptic Drivers
10 Piezo Drivers
10 Haptic Drivers
Interface and Protection
11 Integrated ESD Protection
11 High Performance TVs Diodes
11 Peripheral Drivers
11 RS-485
11 eFuses
Texas Instruments Connected Sensors Building Automation Systems Guide 2015 | 3
Sensor Solutions
Ambient Light Sensor with Human Eye Visibility
The OPT3001 is a single-chip lux meter, measuring the intensity of light as
visible by the human eye. The precision spectral response and strong IR
rejection of the device enables the OPT3001 to accurately meter the intensity
of light as seen by the human eye regardless of light source. The strong IR
rejection also aids in maintaining high accuracy when industrial design calls
for mounting the sensor under dark glass for aesthetics.
Spectral Response: The OPT3001 and Human Eye
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Normalized Response
Wavelength (nm)
300 400 500 600 700 800 900 1000
Ambient Light Sensing
Part No.
Supply
Range
(Nom) (V)
Iq (Max)
(µA)
Lux
Range
(Nom)
Dark Re-
sponse @ 0
Lux (Max)
Gain
Selection Interface Benefits
Operating
Temp.
(°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
OPT3001 1.6 to 3.6 2 0.01 to
83K 1 Code 11 Gains with
Auto-ranging I2C
Matches photopic response
of the human eye
Rejects > 99% (Typ) of IR
40 to 85 USON 0.99
Inductance Sensing
Part No.
Key
Applications Special Features
Input
Channels
L
(Inductance)
Resolution
(Bits)
Supply
Range
Active
State
Current
(mA) Interface
Sensor
Frequency
(Hz)
Operating
Temp.
(°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
LDC1312/4
• Position
• Sensing
Angle/Rotation
sensing
• Contactless sensing
• Ultralow cost sensors
(coils, PCB coils)
• Immune to dust, dirt etc.
2 / 4 12 2.7 to
3.6 2.1 I2C 1k to 10M
40 to
125
WSON,
WQFN
2.38 /
3.50
LDC1612/4
• Position
Sensing
• Angle/Rotation
sensing
• Contactless sensing
• Ultralow cost sensors
(coils, PCB coils)
• Immune to dust, dirt etc.
2 / 4 28 2.7 to
3.6 2.1 I2C 1k to 10M
40 to
125
WSON,
WQFN
3.25 /
4.75
Capacitance Sensing
Part No.
Input
Channels Special Features
Shield
Drive
Channels
Special
Features
Supply
Range
Supply
Current
(mA) Interface
Prog.
Sampling Rate
(Typ) (SPS)
Operating
Temp.
(°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
FDC1004 4• Liquid level sensing
(with interferers) 2Integrated
Shield Drivers 3 to 3.6 0.75 I2C 100 / 200 / 400
40 to 125 WSON 2.50
FDC2114/12 4 / 2 • Proximity Sensing
• Liquid Level Sensing EMI
resistant core
2.7 to
3.6 2.1 I2C 40 to 4080
40 to 125 WQFN 2.38 / 3.50
FDC2214/12 4 / 2 • Proximity Sensing
• Liquid Level Sensing EMI
resistant core
2.7 to
3.6 2.1 I2C 40 to 13300
40 to 125 WQFN 3.25 / 4.75
Hall Effect Sensor
Part No. Type Type
Supply
Range Output
Output
Bandwidth
(Typ) (kHz)
Operating
Temp. (°C) Pin / Package
Approx. Price
(US$ | 1ku)
DRV5013/23/33 Digital Latch / Switch / Omnipolar Switch 2.5 to 38 Open Drain
40 to 125 SOT-23, TO-92 0.29
DRV5053 Analog Analog Bipolar 2.5 to 38 0.2 to 1.8 V 10
40 to 125 SOT-23, TO-92 0.31
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars. New products are listed in bold red.
Find the Perfect Sensor Reference Design to Get Started
16-Button Keypad using the LDC1314
Inductive-to-Digital Converter
Reference Design - TIDA-00509
Key Features
• Contactless buttons with superior reliability over
electrical/mechanical contact solutions
• Support simultaneous button presses
TI Devices
LDC1314
LP2985-N
MSP430F5528
Backlight and Smart Lighting Control by
Ambient Light and Proximity Sensor
Reference Design - TIDA-00373
Key Features
• Good Human Eye Spectral Matching
• Dynamically Adjusts Backlight Brightness
• UV Filter for Outdoor Using
TI Devices
OPT3001
FDC1004
HDC1000
MSP430FR5969
4 | Connected Sensors Building Automation Systems Guide 2015 Texas Instruments
Amplifier and Comparator Solutions
Texas Instruments delivers a broad portfolio of amplifier and linear solutions including precision and high speed op amps,
instrumentation and differential amplifers along with comparators. TI has an amplifier suited for any application.
Learn more about Amplifier solutions at: www.ti.com/amplifier
Low Power Amplifiers
Part No.
Supply
Range (V) Channels
Iq per
ch. (Max)
(mA)
GBW (Typ)
(MHz)
Slew Rate
(Typ) (V/µs)
CMRR
(Typ)
(dB)
Offset
Voltage @
25°C (Max)
(mV)
Offset
Drift
(Typ)
(µV/°C) Rail-Rail
Operating
Temp.
(°C)
Approx.
Price
(US$ | 1ku)
LMV611/2/4 1.8 to 5.5 1 / 2 / 4 0.21 1.5 0.42 60 4 5.5 RRIO –40 to 125 0.22 / 0.25 /
0.30
LPV521 1.6 to 5.5 1 0.0004 0.0062 0.0024 102 1 0.4 RRIO –40 to 125 0.49
OPA369 1.8 to 5.5 1 0.0012 0.012 0.005 100 0.75 0.4 RRIO –40 to 85 0.65
OPA349 1.8 to 5.5 1 0.002 0.065 0.02 52 10 15 RRIO 0 to 70 0.50
General Purpose Amplifiers
Part No.
Supply
Range (V) Channels
Iq per
ch. (Max)
(mA)
GBW (Typ)
(MHz)
Slew Rate
(Typ) (V/µs)
CMRR
(Typ)
(dB)
Offset
Voltage @
25°C (Max)
(mV)
Offset
Drift
(Typ)
(µV/°C)
Operating
Temp.
(°C)
Approx. Price
(US$ | 1ku)
TLC271/2/4 3 to 16 1 / 2 / 4 1.6 1.7 3.6 65 10 1.8 –40 to 85 0.31 / 0.41 / 0.60
LM2904 3 to 26 2 0.6 0.7 0.3 50 7 7 –40 to 125 0.07
LM358 3 to 32 2 0.6 0.7 0.3 65 7 7 0 to 70 0.07
OPAx313 1.8 to 5.5 1, 2, 4 0.06 1 0.5 70 2.5 2 -40 to 125 0.26 / 0.38 / 0.55
OPAx314 1.8 to 5.5 1, 2, 4 0.21 3 1.5 75 2.5 1 -40 to 125 0.30 / 0.45 / 0.65
OPAx316 1.8 to 5.5 1, 2, 4 0.5 10 6 76 2.5 2 -40 to 125 0.48 / 0.72 / 1.08
OPAx170 2.7 to 36 1, 2, 4 0.145 1.2 0.5 104 1.8 0.3 -40 to 125 0.40 / 0.60 / 0.90
OPAx171 2.7 to 36 1, 2, 4 0.595 3 1.5 104 1.8 0.3 -40 to 125 0.40 / 0.60 / 0.90
OPAx172 2.7 to 36 1, 2, 4 1.8 10 10 90 1 0.3 -40 to 125 0.65 / 0.99 / 1.49
Comparators
Part No. Type
Supply
Range (V) Channels
tRESP
Low-to-
High (µs)
Iq per
ch. (Max)
(mA)
Input
Bias
Current
(±) (Max)
(nA) VICR (V)
Offset
Voltage
@ 25°C
(Max)
(mV)
Operating
Temp.
(°C)
Approx. Price
(US$ | 1ku)
TLV3691 Push-Pull 0.9 to 6.5 1 24 0.00015 0.1 -0.1 to 6.6 15 –40 to 85 0.40
TLV3012 Push-Pull 1.8 to 5.5 1 6 0.005 0.01 -0.2 to 5.7 12 –40 to 85 0.75
TLC3702 Push-Pull 3 to 16 2 1.1 0.02 0.03 0 to 15 5 –40 to 85 0.36
TLV1701/2/4 Open
Collector 2.2 to 36 1, 2, 4 0.56 0.075 15 2.2 to 36 2.5 -40 to 125 0.38 / 0.61 / 0.97
Analog-to-Digital Converters
Part No. Type
Resolution
(bits)
Sample
Rate
(SPS)
Input
Channels Interface
Supply
Range
(V) Features
Operating
Temp.
(°C)
Approx. Price
(US$ | 1ku)
ADS7040/1/2/3/4 SAR 8 to 12 1000 1 SPI 0 to 3.6 Nanowatt Power Consumption -40 to 125 1.00 / 1.60 / 2.10
ADS1018 ΣΔ12 3300 4 SPI 2 to 5.5 Temp. Sensor (0.5°C accurate) -40 to 125 1.15
ADS1120/1220 ΣΔ16, 24 2000 4 SPI 2.3 to
5.5 Single cycle setting, sensor, IDACs -40 to 125 3.15 / 3.95
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars.
Texas Instruments Connected Sensors Building Automation Systems Guide 2015 | 5
Wireless Connectivity
Wi-Fi
Part No. Benefits TI Designs and Development Tools
CC3200 SimpleLink Wi-Fi Wireless MCU with ARM Cortex®-M4, Integrated Wi-Fi Connectivity, security, low power,
ease of use: Certified Wi-Fi modules available
CC3200MODLAUNCHXL, TIDA-00372,
TIDC-CC3200SMARTPLUG,
TIDC-CC3200CAMBOOST
CC3100
SimpleLink Wi-Fi Wireless Network Processor: provides easy Wi-Fi connectivity for building automation
applications. Fully integrated 802.11 b/b/n radio, baseband, and MAC. Connect serialy Interface to
any 8, 16, or 32-bit micro-controllers. Certified Wi-Fi modules available
CC3100MODBOOST
WL1837MOD High performance, low power, certified combo modules integrating Wi-Fi + Bluetooth + Bluetooth Low
Energy. Connects to any Linux Processor with SDIO interface, available up to 85°C, 2.4GHz and 5GHz WL1837MODCOM8I
Sub-1GHz
Part No. Benefits TI Designs and Development Tools
CC1200 High performance, long distance, low power radio transceiver: optimized for wide band applications CC1200DK, CC1200EMK-868-930, TIDC-CHN
CC1120 High performance, long distance, low power radio transceiver: optimized for Narrowband
CC1120DK, CC1120EMK-169,
CC1120EMK-420-470, CC1120EMK-868-915,
TIDC-MULTIBAND-WMBUS
CC1101 Ultra-low power radio transceiver CC1101DK433, CC1101DK868-915,
TIDM-SUB1GHZ-MESH-NETWORK
CC1310 SimpleLink Ultra-low power ARM® Cortex®-M Based Wireless MCU TIDA-00484
Bluetooth®
Part No. Benefits TI Designs and Development Tools
CC2650 SimpleLink Wi-Fi Ultra-Low power ARM® Cortex®-M Based Wireless MCU: multi-standard supported
Bluetooth Low-Energy, 6LowPAN and ZigBee. Ideal for end point sensors
CC2650DK, CC2650STK,
TIDA-00374
CC2640 SimpleLink Wi-Fi Ultra-Low power ARM® Cortex®-M Based Wireless MCU supporting Bluetooth Low-
Energy: ultra-low power, small size and ease of use. Ideal for end point sensors
CC2650DK, CC2650STK,
TIDA-00374
CC2540T Extreme temperature Bluetooth Low Energy (up to 125 degree C) wireless MCU combined with low power
and ease of use
CC2541DK-MINI,
TIDC-BLUETOOTH-LOW-ENERGY-LONG-RANGE,
TIDC-BLUETOOTH-SMART-TO-RS-485-GATEWAY
CC2564MODA Dual Mode Bluetooth (Bluetooth Low energy + Bluetooth Classic) transceivers module with antenna inte-
grated: low-power, stable and robust SW stack
CC256XQFNEM
CC2564MODAEM (RTM September)
ZigBee®
Part No. Benefits TI Designs and Development Tools
CC2630 SimpleLink Wi-Fi Ultra-Low power ARM® Cortex®-M Based Wireless MCU : ideal for end point sensors CC2650DK, CC2650STK,
TIDA-00374
CC2530 ZigBee Wireless MCU: enables robust network nodes to be built with very low total bill-of-material costs
CC2530DK, CC2530EMK,
CC2531EM-IOT-HOME-GATEWAY-RD,
CC2530-CC2592EM-RD
CC2538 512kB ARM® Cortex®-M Based Wireless MCU: handle complex network stacks with security, demanding
applications, and over-the-air download
CC2538DK, CC2538EMK,
TIDC-ZNP-HOST-SW3
NFC
Part No. Benefits TI Designs and Development Tools
RF430FRL152H 13.56-MHz transponder chip with a programmable 16-bit MSP430 low-power microcontroller. Optimized
for operation in fully passive (battery-less) or single-cell battery-powered (semi-active) mode.
TIDM-RF430-TEMPSENSE,
TIDM-RF430FRLSENSE
RF430CL330H NFC Tag Type 4 device which combines a wireless NFC interface and a wired SPI/I2C interface to connect
the device to a host TIDA-00217
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars. New products are listed in bold red.
With the industry’s broadest wireless connectivity portfolio
TI offers cost-effective, low-power solutions for short-range,
long-range, mesh, and IP networks
Learn more about Wireless Connectivity solutions at:
www.ti.com/wireless
Smallest Power Source
Required
Li-Ion
AAA
Coin
Cell
No
Battery
Technology
NFC/RFID
BLE/ANT
Sub-1 GHz
2.4 GHz
2.4 GHz
Proprietary
BLE/ANT
ZigBee
RF4CE
6LoWPAN
Wi-Fi
6 | Connected Sensors Building Automation Systems Guide 2015 Texas Instruments
Embedded Processing Solutions
Wireless Connectivity
Microcontrollers and processors from Texas Instruments offer a broad range of performance and power consumption options.
From MSP430 MCU with ultra-low power consumption to the Sitara™ AM335x family with integrated multi-protocol industrial
communications support to connect various kinds of sensors in real-time for better automation; TI is tailored to meet your
design challenges.
Learn more about Microcontroller solutions at: www.ti.com/msp430 and www.ti.com/msp432.
Learn more about processor solutions at: www.ti.com/processors.
MSP430 Low Power FRAM MCUs
Part No.
Frequency
(MHz)
Non-volatile
Memory (KB)
SRAM (KB)
GPIO
I2C
SPI
UART
DMA
ADC
Comparator
(Channels)
Timers
16-Bit
Multipliers
AES
Additional
Features
Operating
Temp. (°C)
Package
Approx.Price
(US$ | 1ku)
MSP430FR4133 16 15.5 2 60 1 2 1 0 ADC10-10ch 0 2 N/A N/A LCD, RTC, BOR,
Temp Sensor –40 to 85 LQFP,
TSSOP 1.55
MSP430FR5969 16 64 2 40 1 3 2 3 ADC12-16ch 16 5 32x32 AES256 RTC, BOR, IrDA,
Temp Sensor –40 to 85 VQFN 2.35
MSP430FR6972 16 64 2 51 2 4 2 3 ADC12-8ch 8 5 32x32 AES256
LCD, RTD, BOR,
IrDA, Temp
Sensor
–40 to 85 LQFP 2.55
MSP430FR6989 16 128 2 83 2 4 2 3 ADC12-16ch 16 5 32x32 AES256
LCD, RTC, Scan
I/F, BOR, IrDA,
Temp Sensor
–40 to 85 LQFP 4.50
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars. New products are listed in bold red.
Find the Perfect Connectivity Reference Design to Get Started
SimpleLink Bluetooth Smart®/
Multi-Standard SensorTag
Reference Design - CC2650STK-RD
Key Features
• More Sensors! 10 Sensors including light, humidity,
pressure, magnetic, accelerometer, gyroscope, and others
• Flexibility for IoT applications; Enable ZigBee or 6LoWPAN through a firmware upgrade
TI Devices
CC2650
TMP007
OPT3001
HDC1000
Wired (UART or RS-485) to Wi-Fi®
Bridge with 24-VAC Power
Reference Design - TIDA-00375,
TIDA-00485, TIDA-00486
Key Features
• Add Wi-Fi® Connectivity to an existing wired network
Wide Input Voltage Range of 18- to 30-VAC, 12- to 48-VDC
• Galvanically Isolated or Non-Isolated variations
TI Devices
CC3200MOD
CC3100MOD
LM5160
LMR16006
Battery-less NFC/RFID
Temperature Sensing Patch
Reference Design -
TIDM-RF430-TEMPSENSE
Key Features
• No batteries required
“Over the air” configuration of the ADC
• Different antenna configurations allow many form factors
TI Devices
RF430FRL152H
Dynamic Field Powered NFC Reference
Design for Data Logging and Security
Applications
Reference Design - TIDA-00217
Key Features
• User can receive updated information
from a field unit
• Battery-less sensor interface; NFC reader provides
TI Devices
TMP103
RF430CL330H
MSP430FR5969
SimpleLink Wi-Fi® CC3200 Smart Plug
Reference Design -
TIDC-CC3200SMARTPLUG
Key Features
• Single-Phase energy measurement that calculates Current, Voltage, Power, and Energy
• SimpleLink™ Wi-Fi® connectivity over 802.11 b/g/n networks from any mobile device
• Isolated flyback power supply to provide Constant-Voltage and Constant-Current output
regulation without optical coupler”
TI Devices
CC3200
UCC28910
TPS61097A-33
Texas Instruments Connected Sensors Building Automation Systems Guide 2015 | 7
FRAM Technology
Ferroelectric Random Access Memory (FRAM) is a
memory technology that combines the best of Flash
and SRAM. It is non-volatile like Flash, but offers fast
and low power writes, write endurance of 1015 cycles,
code and data security that is less vulnerable to
attackers than Flash/EEPROM, resistance to radiation
and electromagnetic fields, and unmatched flexibility.
This memory technology has been around for decades,
but is now being integrated in MSP430 ultra-low-power
microcontrollers (MCUs) to bring its unique advantages
to real-world applications such as energy harvesting,
data security, remote sensing or data logging, and
many others.
All-in-one: FRAM MCU delivers max benefits
Specifications FRAM SRAM EEPROM Flash
Non-volatile
Retains data w/o power Yes No Yes Yes
Write speed
(13 KB) 10ms <10ms 2 secs 1 sec
Average active Power [µA/MHz]
16 bit word access by the CPU 100 <60 50,000+ 230
Write
endurance 1015 Unlimited 100,000 10,000
Soft Errors Below
Measurable Limits Yes Yes Yes
Bit-wise
programmable Yes Yes No No
Unified Memory
Flexible code and data partitioning Yes No No No
Embedded Processing Solutions
MSP430 Low Power MCUs
Part No.
Frequency
(MHz)
Non-volatile
Memory (KB)
SRAM (KB)
GPIO
I2C
SPI
UART
ADC
Comparator
(Channels)
Timers
16-Bit
Multipliers
Additional
Features
Operating
Temp. (°C)
Package
Approx.Price
(US$ | 1ku)
MSP430G2553 16 16 0.5 24 1 1 1 ADC10-8ch 8 2 N/A Temp Sensor, BOR, IrDA –40 to 85 TSSOP,
VQFN 0.90
MSP430G2955 16 56 4 32 1 2 1 ADC10-12ch 8 3 N/A Temp Sensor, BOR, IrDA –40 to 85 TSSOP,
VQFN 1.30
MSP430F2274 16 32 1 32 1 1 1 ADC10-12ch 0 2 N/A Temp Sensor, BOR,
OpAmp
–40 to 105
–40 to 85
DSBGA,
TSSOP,
VQFN
1.80
MSP430I2041 16 32 2 16 1 2 1 SigmaDelta
24-4ch 0 2 16 x16 Temp Sensor, BOR, IrDA -40 to 105 TSSOP,
VQFN 1.75
ARM Based MCUs and MPUs
Part No. ARM CPU Benefits TI Designs and Dev. Tools
MSP432P401R ARM Cortex-M4F MSP432P4x microcontrollers are the ideal combination of TI's MSP430 low-power DNA, advanced mixed-signal
features, and the high-performance processing capabilities of ARM®'s 32-bit Cortex®-M4F RISC engine. MSP-EXP432P401R
AM3352 ARM Cortex-A8
Sitara™ AM335x ARM Cortex-A8 Processors deliver the right balance of performance (300 MHz to 1 GHz of
processing power), Interfaces (DDR3, LCD, Touch Screen Controller), and Connectivity (UART and Industrial
Protocols)
Beaglebk, TMDXEVM3358
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars. New products are listed in bold red.
Find the Perfect MCU Reference Design to Get Started
Thermostat Implementation with
FRAM Microcontroller
Reference Design - TIDM-FRAM-THERMOSTAT
Key Features
• 0°C to 35°C Temperature Measurement with 0.1°C Resolution
• 3.4 inch LCD Display
• Ultra-Low Power: 1.8 µA Standby Current
TI Devices
MSP430FR4133
SN65HVD75
TPS782
Smoke Detector with Ultra Low Power MCU
Reference Design - TIDM-G2xxSMOKEDETECTOR
Key Features
• Passive infrared (PIR) smoke chamber with discrete
Amplification circuitry to ADC input
• Low power (2.07 µA) and small code size (<1 KB Flash)
• One timer and multiple GPIOs for proprietary comms
TI Devices
OPT3001
FDC1004
HDC1000
MSP430FR5969
8 | Connected Sensors Building Automation Systems Guide 2015 Texas Instruments
Texas Instruments offers complete power solutions with a full line of high-performance products. These products, which
range from standard linear regulators to highly efficient DC/DC converters and battery management, are tailored to meet your
design challenges.
Learn more about Power Management solutions at: www.ti.com/power and www.ti.com/powerlab
Power Management
DC/DC Switching Regulators
Part No. Topology
Supply
Range (V)
Output
Voltage (V)
Output
Current
(Max) (A)
Switching
Frequency
(Max) (kHz)
Duty Cycle
(Max) (%)
Iq (Typ)
(mA)
Operating
Temp. (°C) Pin / Package
Approx.
Price
(US$ | 1ku)
Vin < 24V
TPS82740A Buck Module 2.2 to 5.5 1.8 to 2.5 0.2 2000 100 0.00036 –40 to 85 9uSIP 1.50
TPS62730 Buck 1.9 to 3.9 1.9, 2.1, 2.3 0.1 3000 100 0.025 –40 to 85 6SON 0.55
TPS62080 Buck 2.3 to 6 0.5 to 6 1.2 2000 100 0.0045 –40 to 85 8WSON 0.75
TPS62160 Buck 3 to 17 0.9 to 6 1 2500 100 0.017 –40 to 85 8VSSOP, 8WSON 0.80
TPS61291 Boost 0.9 to 5.0 2.5, 3.0, 3.3 0.2 0.005 –40 to 85 6SON 0.68
TPS61098 Boost 0.7 to 4.5 2.2 to 4.3 0.1 0.0003 -40 to 85 6WSON 0.72
TPS61220 Boost 0.7 to 5.5 1.8 to 5.5 0.1 2000 90 0.005 –40 to 85 6SC70 0.43
Wide Vin (Vin 24V)
TPS62175 Buck 4.7 to 28 1 to 6 0.5 1000 100 0.0048 -40 to 85 10WSON 0.70
LM25017/8/9 Buck 7.5 to 48 1.25 to 40 0.65 / 0.3
/ 0.1 1000 90 1.75 –40 to 125 8WSON, 8SO
PowerPAD
1.25 / 1.12 /
0.81
TPS54160A Buck 3.5 to 60 0.8 to 58 1.5 2500 98 0.138 –40 to 125 10MSOP/10SON 1.58
TPS54060A Buck 3.5 to 60 0.8 to 58 0.5 2500 98 0.116 –40 to 150 10MSOP/10SON 1.27
TPS54061 Buck 4.7 to 60 0.8 to 58 0.2 1100 98 0.09 –40 to 150 8SON 1.04
Linear Regulators
Part No. Supply
Range (V)
Output
Voltage (V)
Output
Current
(Max) (A)
Iq (Typ)
(mA)
Output
Options
Accuracy
(Max) (%)
PSRR @
100kHz (dB)
Operating
Temp.
(°C)
Pin / Package Approx. Price
(US$ | 1ku)
Vin < 24V
TPS799 2.7 to 6.5 1.2 to 4.5 0.2 0.04 Adj. or Fixed 2 38 –40 to 125 5DSBGA, 5SOT, 6SON 0.28
TLV1117 2.7 to 15 1.25 to 13.7 0.8 0.08 Adjustable 1 28 –40 to 125 3TO, 4SOT, 8SON 0.18
TPS7A37 2.2 to 5.5 1.2 to 5.4 1 0.4 Adj. or Fixed 1 32 –40 to 125 6SON 0.66
LP5907 2.2 to 5.5 1.2 to 4.5 0.25 0.012 Fixed 2 60 –40 to 125 4DSBGA, 4X2SON, 5SOT-23 0.14
Wide Vin (Vin ≥ 24V)
TPS709 2.7 to 30 1.2 to 6 0.15 0.001 Fixed 2 26 –40 to 125 5SOT-23, 6SON 0.39
LP2951/LP2951-N 2 to 30 1.2 to 29 0.1 0.075 Adjustable 2 53 –40 to 125 8SOIC 0.18
TPS7A16 3 to 60 1.2 to 18.5 0.1 0.005 Adj. or Fixed 2 26 –40 to 125 8SON, 8MSOP-PowerPAD 1.39
LM317 3 to 40 1.25 to 37 1.5 0.05 Adjustable 4 0 to 125 4SOT, 3TO, 2PFM 0.18
LM2936 5.5 to 60 3 to 5 0.05 0.015 Fixed 3 35 –40 to 125 3TO-92, 4SOT-223, 8SOIC,
8VSSOP, 3TO-252 0.62
Voltage Reference
Part No.
Supply
Range (V)
Output
Voltage (V)
Iout/Iz
(Max)
(mA)
Iq (Typ)
(µA)
Initial
Accuracy
(%)
0.1-10Hz
Noise (Max)
(µVpp)
Temp.
Coeff (Typ)
(ppm/°C)
Operating
Temp. (°C) Pin / Package
Approx.
Price
(US$ | 1ku)
REF3312 2.7 to 5.5 2.5 5 3.9 0.15 70 9 –40 to 125 3SC70, 5SOT-23, 8UQFN 0.85
REF5030 3.2 to 18 3 10 800 0.05 9 3 –40 to 125 8SOIC, 8VSSOP 1.35
ATL431 2.5 to 36 2.5 to 36 100 20 0.5
1 –40 to 125
–40 to 85 3SOT-23 0.19
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars. New products are listed in bold red.
Texas Instruments Connected Sensors Building Automation Systems Guide 2015 | 9
AC/DC Converters
Part No.
Power
Level
(Typ) (W)
Current
Mode Topologies
Maximum
Practical
Frequency
Soft
Start
700-V
Start-Up
Circuit
110-V
Start-Up
Circuit
Operating
Temp.
(°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
Green Mode PWM Controllers
UCC28722 Up to 25 3Flyback w/PSR for Bipolar Power Device 80 kHz 3 3 -40 to 125 6SOT-23 0.25
UCC28700/1/2/3 Up to 30 3Flyback w/PSR 130 kHz 3-20 to 125 6SOT-26 0.35
Switchers with Integrated FETs
UCC28880 <5 High Voltage Switcher for Non-Isolated
AC/DC Conversion 66 kHz 3 3 -40 to 125 7SOIC 0.55
UCC28910 <10 3High Voltage Flyback Switcher w/PSR 115 kHz 3 3 -40 to 125 7SOIC 0.75
Ultra Low Power Harvester Power Management IC
Part No. Description Benefits TI Designs
BQ25570 Power Management IC which efficiently extracts microwatts (uW) to milliwatts (mW)
of power generated from high output impedance DC Sources like photo voltaic
(solar) or thermal electric generators (TEG).
Integrates nanopower buck converter and high efficient boost charger TIDA-00242
BQ25505
A high efficiency nano-boost charger that charges a rechargeable
energy resevoir, and also provides battery back-up though a
nonrechargeable battery to extend run-time.
TIDA-00100
System Timer
Part No.
Supply
Current
(Typ) (µA)
Supply
Range
Prog. Delay
Range
Manual
Reset Additional Notes
Programmable
Timer Interval
(s)
Timekeeping
Accuracy
(Typ) (%)
Operating
Temp. (°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
TPL5100 0.030 1.8 to 5 Yes No MOS-Driver 0.1 to 7200 1 –40 to 105 6SOT 0.40
TPL5110 0.035 1.8 to 5 Yes Yes MOS-Driver 0.1 to 7200 1 –40 to 105 6SOT 0.40
TPL5111 0.035 1.8 to 5 Yes Yes Active Low MOS-Driver,
Active High LDO Enable 0.1 to 7200 1 –40 to 105 6SOT
Load Switches
Part No.
Vin (Max)
(V) Imax (A)
Ron @ 3.6V
(Typ) (mΩ)
Leakage
Current
(µA) (Typ) Channels
Special
Features
Operating
Temp. (°C) Pin / Package
Approx.
Price
(US$ | 1ku)
Single Channel Devices
TPS22860 1.65 to 5.5 0.1 1300 0.02 1 –40 to 85 6SC70, 6SOT-23 0.25
TPS22907 1.1 to 3.6 1 44 0.5 1 –40 to 85 4CSP (0.5 pitch) 0.22
TPS22918 1.05 to 5.5 2 46 2 1 –40 to 85 6SOT-23
TPS22954 0.7 to 5.5 5 14 5 1 Voltage Monitor (PG Pin) –40 to 105 10SON 0.36
Multi-channel Devices
TPS22960 1.62 to 5.5 0.5/ch 435 0.47 2 –40 to 85 8SOT-23, 8µQFN 0.36
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars. New products are listed in bold red. Preview products are listed in bold teal.
Power Management
Duty-Cycled Power Design Theory for Star Networks
One method to achieve extremely long battery life is through
the use of a nano-power system timer. This type of device
is intended to replace the internal timer of any standard
microcontroller with a discrete analog system timer that
consumes much less power than the MCUs internal timer.
The nano-power timer can also bring an MCU out of sleep
mode by means of a pin interrupt, or to completely shut
off power to the system, in whole, or in part. This reduces
the system off-state current draw to the tens or hundreds
of nanoamps.
TIDA-00484 Block Diagram which Demonstrates a Duty-Cycled Sensor Node
Duty Cycled
System
Coin Cell
Battery
(CR2032)
TPL5111
(Nano-power
system timer)
TPS61291
(DC/DC
Boost)
DRV
TPS22860
(Ultra-low leakage
load switch)
3.3V
VBATT
VOUT
(3.3V or
VBATT)
I2C
HDC1000
(Humidity &
Temp. Sensor)
CC1310
(ARM + Sub-1
GHZ)
10 | Connected Sensors Building Automation Systems Guide 2015 Texas Instruments
Power Management
Piezo Driver
Part No.
Maximum
Differential
Output Voltage
(Vpp)
Maximum Single-
Ended Output
Voltage (Vp)
Supply
Voltage (V)
Small-signal
Bandwidth
(kHz)
Gain-
Bandwidth
(kHz)
Load
Capacitance
(µF)
Slew Rate
(V/µs)
Operating
Temp. (°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
DRV2700 ±100 1000 3 to 5.5 20 550 4.7 0.6 –40 to 85 QFN 4.95
Haptic Driver
Part No.
Haptic
Acutator Type
Input
Signal
Supply
Voltage (V)
Startup
Time (ms)
Vout (Max)
(V)
Iq (Typ)
(mA)
Shutdown Current
(Typ) (uA)
Operating
Temp. (°C)
Pin /
Package
Approx. Price
(US$ | 1ku)
DRV2605L ERM, LRA PWM,
Analog, I2C2 to 5.2 0.7 5.5 0.5 4 –40 to 85 10VSSOP,
9DSBGA 1.65
DRV2667 Piezo PWM,
Analog, I2C3 to 5.5 2 200 0.13 –40 to 85 20QFN 2.95
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars. New products are listed in bold red.
Texas Instruments offers a complete line of haptic devices which have the ability to drive eccentric rotating mass (ERM), linear
resonant actuator (LRA), and piezoelectric actuators. With TI’s haptic drivers you can add that extra sensory element that is
missing in modern day touch interfaces.
Learn more about Haptic Feedback solutions at: www.ti.com/haptics
Haptic
Find the Perfect Low Power Reference Design to Get Started
Humidity & Temp Sensor Node for 2.4-GHz Star
Networks Enabling 10+ Year Coin Cell Battery Life
Reference Design - TIDA-00374
Key Features
• Use of nano-power system timer results in 10+ years
of battery life on a coin cell battery
• ±3% relative humidity accuracy, ±0.2°C temperature accuracy
TI Devices
TPL5110
TS5A3160
CC2650
HDC1000
Humidity & Temp Sensor Node for Sub 1-GHz Star
Networks Enabling 10+ Year Coin Cell Battery Life
Reference Design - TIDA-00484
Key Features
• Use of nano-power system timer results in 10+ years
of battery life on a coin cell battery
• ±3% relative humidity accuracy, ±0.2°C temperature accuracy
TI Devices
TPL5111
TPS22860
TPS61291
CC1310
Energy Buffering for Long-Life Battery Applications
Reference Design - PMP9753
Key Features
• Efficient Super Capacitor Charging
• Peak Power Assistance
• Longer Battery Runtime
TI Devices
TPL5110
TS5A3160
CC2650
HDC1000
110-VAC to 5-VDC @ 30-mA Non-Isolated Power
Supply Reference Design
Reference Design - TIDA-00379
Key Features
• Solution does not require a custom transformer
• Optimized, low-cost BOM
• Output ripple of less than 10-mV
TI Devices
UCC28880
LP2985-50
Find the Perfect Haptic Reference Design to Get Started
Touch on Metal Buttons with Integrated
Haptic Feedback
Reference Design - TIDA-00314
Key Features
• Replaces Mechanical Buttons with Inductive-Sensing Based Touch on Metal Detection
• Customizable Haptic Feedback and Waveforms Provide High Quality User Experience
• Programmable Button Sensitivity (from Light Touch to Hard Press)
TI Devices
DRV2605L
DRV2667
LDC1614
MSP430F5528
Piezo Speaker Strobe Notification
Reference Design
Reference Design - TIDA-00376
Key Features
• 86.5 dBA @ 3m (520 Hz Square Wave)
• 80.5 dBA @ 3m (2.84 kHz Sine Wave)
• 77.5 dBA @ 3m (Pre-Recorded Speech)
• 300 candela @ 3m (Flash Mode)
TI Devices
DRV2700
LMV344
LM3550
MSP430FR5969
Texas Instruments Connected Sensors Building Automation Systems Guide 2015 | 11
Integrated ESD Protection
Part No. Interface Channels
IO
Capacitance
(Typ) (pF)
Breakdown
Voltage
(Min) (V)
IEC
61000-4-2
Contact
(+/- kV)
IEC
61000-4-2\
Air-Gap
(+/- kV)
Special
Features
Current Limit
Rating
(Min) (mA)
Operating
Temperature
Range(C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
TPD4F003
LCD
Display,
Memory /
SIM Card
4 17 6 12 20 EMI Filter –40 to 85 WSON 0.18
High Performance TVS Diodes
Part No. Interface Channels
IO
Capacitance
(Typ) (pF)
Breakdown
Voltage
(Min) (V)
IEC
61000-4-2
Contact
(+/- kV)
IEC
61000-4-2
Air-Gap
(+/- kV)
Bi-/
Uni-Directional
Operating
Temp. (°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
TPD1E10B06 Audio, General
Purpose 1 12 6 30 30 Bi-Directional –40 to 125 X1SON 0.05
TPD2E007 RS-232/485,
CAN, Audio 2 15 14 8 15 Bi-Directional –40 to 85 DSLGA, SC70 0.20
Peripheral Drivers
Part No. Type
Peak Out-
put Current
(mA)
Output
Voltage
(Max) (V)
Delay Time
(Typ) (ns)
Input Com-
patibility
Drives per
Package Gate
Output
Clamp
Diodes
Operating
Temp. (°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
TPL7407L NMOS Array 600 40 250 CMOS, TTL 7 INVERT Yes
40 to 125 16SOIC,
16TSSOP 0.20
ULN2003A
Darlington
Transistor
Array
500 50 250 CMOS, TTL 7 INVERT Yes
20 to 70
16SO,
16SOIC,
16TSSOP
0.14
RS-485
Part No. TX/RX Duplex
Supply
Voltage
(V) Features
Signaling Rate
(Mbps)
HBM ESD
(kV)
Receiver
Fail-Safe Nodes
Pin /
Package
Approx.
Price
(US$ | 1ku)
SN65HVD72 1/1 Half 3.3 High Hysteresis, ±12kV IEC
61000-4-2 ESD, ±4kV EFT 0.25 15 Short, Open,
Idle 256
8SOIC,
8SON,
*VSSOP
0.70
SN65HVD82 1/1 Half 5 Low Power, ±12kV IEC
61000-4-2 ESD, ±4kV EFT 0.25 16 Short, Open,
Idle 256 8SOIC 1.00
SN65HVD3082E/5E/8E 1/1 Half 5
Ultra-Low Power, Optimized
for Low, Medium, & High
Speeds
0.2, 1, 20 15 Short, Open,
Idle 256
8SOIC,
8MSOP,
8PDIP
0.90, 1.00,
1.10
eFuses
Part No.
Supply
Range (V)
Vabsmax_
cont (V)
Current Limit
Threshold (A)
Current
Limit
Accuracy
Internal
FET RON
(mOhm)
Fault
Response
On_Off
Control
Input(s) Special Features
Pin /
Package
Approx.
Price
(US$ | 1ku)
TPS25921A 4.5 to 18 20 0.4 to 1.6 ±2% @
1A 90 Auto Retry ENUV, OV No Rsense Required 8SOIC 0.50
TPS25926 4.5 to 13.8 20 2 to 5 ±8% @
3.7A 30 Auto Retry ENUV BLK FET Driver, Output
Clamp, No Rsense Required 10VSON 0.55
TPS25927 4.5 to 18 20 1 to 5 ±15% @
2.1A 30 Auto Retry ENUV BLK FET Driver, No Rsense
Required 10VSON 0.55
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars.
Interface and Protection
Texas Instruments offers a comprehensive interface portfolio enabling system connectivity. With a variety of communication
standards such as CAN, UART, USB, RS-232, RS-485 and 10-/100-Mbit Ethernet, TI delivers a variety of options for your
interface needs.
Learn more about Wired Connectivity solutions at: www.ti.com/interface and www.ti.com/esd
Now more powerful 0 Industry's largest reference design library - Over 1 ,000 power management reference desgins . Enhanced search tool: Parameters, topologies, keyword, application. or product - Direct access to fully tested analog, embedded processor, and connectivity reverence designs E I This robust tool offers complete solutions across the board. i TEXAS INSTRUMENTS
© 2015 Texas Instruments Incorporated
Printed in U.S.A. by (Printer, City, State) SZZY004
TI Worldwide Technical Support
Internet
TI Semiconductor Product Information Center Home Page
support.ti.com
TI E2E™ Community Home Page
e2e.ti.com
Product Information Centers
Americas Phone +1(512) 434-1560
Brazil Phone 0800-891-2616
Mexico Phone 0800-670-7544
Fax +1(972) 927-6377
Internet/Email support.ti.com/sc/pic/americas.htm
Europe, Middle East, and Africa
Phone
European Free Call 00800-ASK-TEXAS
(00800 275 83927)
International +49 (0) 8161 80 2121
Russian Support +7 (4) 95 98 10 701
Note: The European Free Call (Toll Free) number is not active in all countries.
If you have technical difficulty calling the free call number, please use the
international number above.
Fax +(49) (0) 8161 80 2045
Internet www.ti.com/asktexas
Direct Email asktexas@ti.com
Japan
Phone Domestic (toll-free number) 0120-92-3326
Fax International +81-3-3344-5317
Domestic 0120-81-0036
Internet/Email International support.ti.com/sc/pic/japan.htm
Domestic www.tij.co.jp/pic
Asia
Phone Toll-Free Number
Note: Toll-free numbers may not support
mobile and IP phones.
Australia 1-800-999-084
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Hong Kong 800-96-5941
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International +86-21-23073444
Fax +86-21-23073686
Email tiasia@ti.com or ti-china@ti.com
Internet support.ti.com/sc/pic/asia.htm
B012014
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