Panasonic
%
7
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Infrared Array Sensor Grid-EYE (AMG88)
Tolerance range
85
15
Humidity (%RH)
(Avoid freezing
at 0 °C 32 °F
or below)
(Avoid dew
condensation at
0 °C 32 °F or below)
Temperature (°C, °F)
0
+32
80
+176
−20
−4
Temperature (°C, °F)
Humidity (%RH)
Tolerance range
0
+32
80
+176
−20
−4
(Avoid dew
condensation)
(Avoid freezing
at 0 °C 32 °F
or below)
85
15
Low gain typeHigh gain type
T1
T2
T3
t1t2
■ Other precautions
These specifications are for individual components.
Before use, carefully check the performance and quality
under actual use conditions to enhance stability.
1) Once the individual sensor is dropped, do not
use. Drop may cause functional disorders.
2) Writing to the unspecified register/with the
unspecified bit may cause malfunction and
performance deterioration. (please consult us)
3) Misconnection and use beyond the specified
temperature range may damage the product.
4) Once below shocks are applied, do not
use the product as applying highfrequency
oscillation to the sensor body may damage the
product.
• Contact with metal objects
• Contact with other sensors
5) Follow the instructions below as static
electricity may damage the product.
• For storage and transportation, avoid plastic
containers which are easily electrified.
• When storing and transporting the sensor,
choose the environment where static
electricity is hardly generated (e.g., humidity
between 45 and 60 %) and protect
the product by using electroconductive
packaging materials.
• Once unpacked, perform antistatic
countermeasures.
(1) Operators handling sensors must wear
antistatic cloths and human body
grounding devices.
(2) Cover the surface of workbench by
electro-conductive plates and ground
measuring instruments and jigs.
(3) Use the soldering iron which has a small
leakage current or ground the soldering
tip.
(4) Ground the assembling equipment.
• Use a stabilized power supply. A power
superimposed noise may cause malfunction.
■ Range of using ambient temperature (using
ambient humidity)
The sensor can continuously operate within the range
of using ambient temperature (using ambient humidity).
However, ensure that humidity is within the range below
as humidity varies according to temperature. Avoid the
continuous operation near the operational limit. Before
use, check the stability under the usage environment
as high humidity or high temperatures generally
accelerates deterioration of the electronic component.
• The temperature range does not guarantee the
durability
■ Mounting
Use the land of the printed-circuit boardon which
the sensor is securely fixed. The recommended
printed-circuit board is FR4 (thickness 1.6 mm 0.063
inch). When mounting on the deprecated circuit
board, carefully check the performance and quality
under actual use conditions before use.
• A large noise on the power supply may cause
malfunction. Place the recommended capacitor near
the sensor (within 20 mm 0.787 inch of the wiring
pattern length) between sensor input terminals
(VDD-GND) to secure power superimposed noise
resistance. Test with the actual machine and re-
select the capacitor with optimal capacitance.
• Prevent the metal part of other electronic
components from contacting with the sensor
body as the upper face (where part numbers are
imprinted) of the sensor is GND.
■ Soldering
When soldering, avoid the external thermal influence.
Heat deformation may damage the sensor or deteriorate
its performance. Use the non-corrosive rosin flux.
1) Manual soldering
• Raise the temperature of the soldering tip
between 350 and 400 °C 662 and 752 °F
(30 and 60 W) and solder within 3 seconds.
• The sensor output may vary if the load is
applied on the terminal during soldering.
• Keep the soldering tip clean.
2) Reflow soldering
Below are recommended temperature profiles/
conditions of reflow.
• When printing cream solder, the screen
printing method is recommended.
• For the foot pattern, see the recommended
diagram of the printed-circuit board.
• Carefully align the terminal with the pattern
as self-alignment may not be reliable.
• The temperature of the profile is the value
measured near the terminal on the printed-
circuit board.
• After reflowing, when performing reflow
soldering on the back surface of the circuit
board, use an adhesive to fix the board.
T1 = 150 to 180 °C
302 °F to 356 °F
T2 = 230 °C 446 °F
T3 = Below 250 °C 482 °F
t1 = 60 to 120 sec.
t2 = Less than 30sec.
3) After soldering, do not apply stress on the
soldered part when cutting or bending the
circuit board.
4) Rework soldering
• Complete rework at a time.
•
Use a flattened soldering tip when performing
rework on the solder bridge. Do not add the flux.
• Keep the soldering tip below the temperature
described in the specifications.
5) Prevent human hands or metal pieces from
contacting with the sensor terminal. Such
contact may cause anomalous outlets as the
terminal is exposed to the atmosphere.
6) After soldering, prevent chemical agents from
adhering to the sensor when applying coating to
avoid insulation deterioration of the circuit board.
Aug. 201500