LZ1-00CW02 by ams-OSRAM USA INC. Datasheet

LED EI'IGIn AM nsnm ausmiss

High Luminous Efficacy Cool White LED Emitter

LZ1-00CW02

Key Features

 High Luminous Efficacy Cool White LED

 Ultra-small foot print – 4.4mm x 4.4mm

 Surface mount ceramic package with integrated glass lens

 Low Thermal Resistance (6.0°C/W)

 Electrically neutral thermal path

 Spatial color uniformity across radiation pattern

 JEDEC Level 1 standard for Moisture Sensitivity Level

 Lead (Pb) free and RoHS compliant

 Reflow solderable

 Available on tape and reel or with MCPCB

Typical Applications

 Architectural lighting

 Street lighting

 Display Backlighting

 Flashlight and Portable lighting

 Signaling

 Automotive

 Horticulture

Description

The LZ1-00CW02 Cool White LED emitter provides 315 lumens at 3.2W power dissipation in an extremely small

package. With a 4.4mm x 4.4mm footprint, this package provides exceptional luminous flux density. LED Engin’s

patent-pending thermally insulated phosphor layer provides a spatially uniform color across the radiation pattern

and a consistent CCT over time and temperature. The high quality materials used in the package are chosen to

optimize light output and minimize stresses which results in monumental reliability and lumen maintenance. The

robust product design thrives in outdoor applications with high ambient temperatures and high humidity.

LED EI'IGIn AM osnm ausmzss ED

2

Part number options

Base part number

Part number

Description

LZ1-00CW02-xxxx

LZ1 emitter

LZ1-10CW02-xxxx

LZ1 emitter on Standard Star MCPCB

Bin kit option codes

CW, Cool White (5000K – 6500K)

Kit number

suffix

Min

flux

Bin

Chromaticity bins

Description

0055

P

2U, 2Y, 3U, 2A, 2D, 3A, 2B, 2C, 3B, 2V, 2X, 3V

Flux bin P and above; full distribution

flux; 5500K bin

0065

P

1U, 1A, 1B, 1V, 1Y, 1D, 1C, 1X, 2U, 2A, 2B, 2V

Flux bin P and above; full distribution

flux; 6500K bin

LED EI'IGII'I AM osnm msmzss Planckian Locus 5!

3

0.28

0.30

0.32

0.34

0.36

0.38

0.40

0.28 0.30 0.32 0.34 0.36 0.38

CIEy

CIEx

1U

1Y

1V

1A

1B

1C

1D

1X

2U

2A

2B

2V

2Y

2C

2D

2X

3U

3Y

3A

3B

3C

3D

3V

3X

Planckian Locus

Cool White Chromaticity Groups

Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.

Coordinates are listed below in the table.

LED EI'IGIn AM osnm msmzss 5!

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Cool White Bin Coordinates

Bin code

CIEx

CIEy

Bin code

CIEx

CIEy

Bin code

CIEx

CIEy

Bin code

CIEx

CIEy

1U

0.3068

0.3113

1A

0.3048

0.3207

1B

0.3028

0.3304

1V

0.3005

0.3415

0.3144

0.3186

0.313

0.329

0.3115

0.3391

0.3099

0.3509

0.3161

0.3059

0.3144

0.3186

0.313

0.329

0.3115

0.3391

0.3093

0.2993

0.3068

0.3113

0.3048

0.3207

0.3028

0.3304

0.3068

0.3113

0.3048

0.3207

0.3028

0.3304

0.3005

0.3415

1Y

0.3144

0.3186

1D

0.313

0.329

1C

0.3115

0.3391

1X

0.3099

0.3509

0.3221

0.3261

0.3213

0.3373

0.3205

0.3481

0.3196

0.3602

0.3231

0.312

0.3221

0.3261

0.3213

0.3373

0.3205

0.3481

0.3161

0.3059

0.3144

0.3186

0.313

0.329

0.3115

0.3391

0.3144

0.3186

0.313

0.329

0.3115

0.3391

0.3099

0.3509

2U

0.3222

0.3243

2A

0.3215

0.335

2B

0.3207

0.3462

2V

0.3196

0.3602

0.329

0.33

0.329

0.3417

0.329

0.3538

0.329

0.369

0.329

0.318

0.329

0.33

0.329

0.3417

0.329

0.3538

0.3231

0.312

0.3222

0.3243

0.3215

0.335

0.3207

0.3462

0.3222

0.3243

0.3215

0.335

0.3207

0.3462

0.3196

0.3602

2Y

0.329

0.33

2D

0.329

0.3417

2C

0.329

0.3538

2X

0.329

0.369

0.3366

0.3369

0.3371

0.349

0.3376

0.3616

0.3381

0.3762

0.3361

0.3245

0.3366

0.3369

0.3371

0.349

0.3376

0.3616

0.329

0.318

0.329

0.33

0.329

0.3417

0.329

0.3538

0.329

0.33

0.329

0.3417

0.329

0.3538

0.329

0.369

3U

0.3366

0.3369

3A

0.3371

0.349

3B

0.3376

0.3616

3V

0.3381

0.3762

0.344

0.3428

0.3451

0.3554

0.3463

0.3687

0.348

0.384

0.3429

0.3299

0.344

0.3427

0.3451

0.3554

0.3463

0.3687

0.3361

0.3245

0.3366

0.3369

0.3371

0.349

0.3376

0.3616

0.3366

0.3369

0.3371

0.349

0.3376

0.3616

0.3381

0.3762

3Y

0.344

0.3428

3D

0.3451

0.3554

3C

0.3463

0.3687

3X

0.348

0.384

0.3515

0.3487

0.3533

0.362

0.3551

0.376

0.3571

0.3907

0.3495

0.3339

0.3515

0.3487

0.3533

0.362

0.3551

0.376

0.3429

0.3299

0.344

0.3427

0.3451

0.3554

0.3463

0.3687

0.344

0.3428

0.3451

0.3554

0.3463

0.3687

0.348

0.384

LED EHGIFI w MSW-L 4mm

5

Luminous Flux Bins

Table 1:

Bin

Code

Minimum

Luminous Flux (ΦV)

@ IF = 1000mA [1,2]

(lm)

Maximum

Luminous Flux (ΦV)

@ IF = 1000mA [1,2]

(lm)

Typical

Luminous Flux (ΦV)

@ IF = 1200mA [2]

(lm)

P

182

228

229

Q

228

285

282

R

285

356

310

Notes for Table 1:

1. Luminous flux performance is measured at 10ms pulse, TC = 25oC. LED Engin maintains a tolerance of ± 10% on flux measurements.

Forward Voltage Bins

Table 2:

Bin

Code

Minimum

Forward Voltage (VF)

@ IF = 1000mA [1]

(V)

Maximum

Forward Voltage (VF)

@ IF = 1000mA [1]

(V)

0

2.8

3.8

Notes for Table 2:

1. Forward voltage is measured at 10ms pulse, TC = 25oC. LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.

LED EnGIn w mm 4 ms»

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Absolute Maximum Ratings

Table 3:

Parameter

Symbol

Value

Unit

DC Forward Current at TJ(MAX)=135°C [1]

IF

1200

mA

DC Forward Current at TJ(MAX)=150°C [1]

IF

1000

mA

Peak Pulsed Forward Current

[2]

IFP

2000

mA

Reverse Voltage

VR

See Note 3

V

Storage Temperature

Tstg

-40 ~ +150

°C

Junction Temperature

TJ

150

°C

Soldering Temperature

[4]

Tsol

260

°C

Notes for Table 3:

1. Maximum DC forward current is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 11 for current derating.

2: Pulse forward current conditions: Pulse Width ≤ 10msec and Duty cycle ≤ 10%.

3. LEDs are not designed to be reverse biased.

4. Solder conditions per JEDEC J-STD-020D. See Reflow Soldering Profile Figure 3.

5. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ1-00CW02 in an electrostatic protected area (EPA).

An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.

Optical Characteristics @ TC = 25°C

Table 4:

Parameter

Symbol

Typical

Unit

Luminous Flux (@ IF = 1000mA/ 1200mA)

ΦV

315/ 360

lm

PPF[1] 400-700nm (@ IF = 1000mA/ 1200mA)

4.8/ 5.5

umol/s

Luminous Efficacy (@ IF = 350mA)

η

113

lm/W

Luminous Efficacy (@ IF = 1000mA)

η

98

lm/W

Correlated Color Temperature

CCT

5500

K

Color Rendering Index (CRI)

Ra

75

Viewing Angle

[2]

2Θ1/2

95

Degrees

Total Included Angle

[3]

Θ0.9V

115

Degrees

Notes for Table 4:

1. PPF is Photosynthetic Photon Flux.

2. Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.

3. Total Included Angle is the total angle that includes 90% of the total luminous flux.

Electrical Characteristics @ TC = 25°C

Table 5:

Parameter

Symbol

Typical

Unit

Forward Voltage (@ IF = 1000mA)

VF

3.20

V

Forward Voltage (@ IF = 1200mA)

VF

3.25

V

Temperature Coefficient

of Forward Voltage

ΔVF/ΔTJ

-2.0

mV/°C

Thermal Resistance

(Junction to Case)

RΘJ-C

6.0

°C/W

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7

IPC/JEDEC Moisture Sensitivity Level

Table 6 - IPC/JEDEC J-STD-20D.1 MSL Classification:

Soak Requirements

Floor Life

Standard

Accelerated

Level

Time

Conditions

Time (hrs)

Conditions

Time (hrs)

Conditions

1

Unlimited

≤ 30°C/

85% RH

168

+5/-0

85°C/

85% RH

n/a

Notes for Table 6:

1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and

includes the maximum time allowed out of the bag at the distributor’s facility.

Average Lumen Maintenance Projections

Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for

solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original

light output remaining at a defined time period.

Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, above 70%

Lumen Maintenance at 50,000 hours of operation at a forward current of 1000 mA. This projection is based on

constant current operation with junction temperature maintained at or below 125°C.

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8

Mechanical Dimensions (mm)

Figure 1: Package outline drawing

Notes for Figure 1:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

2. This emitter pin-out is reversed to that of LZ1-00xx00 and LZ1-00Rx02.

3. Thermal contact, Pad 5, is electrically neutral.

Recommended Solder Pad Layout (mm)

Non-pedestal MCPCB Design Pedestal MCPCB Design

Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad for non-pedestal and pedestal design.

Notes for Figure 2a:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

2. Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate the high thermal resistance

dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system

thermal resistance.

3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter solder pins, especially the thermal pad. The total area covered by

solder voids should be less than 20% of the total emitter thermal pad area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and

may lead to higher failure rates due to thermal over stress.

4. This emitter is compatible with all LZ1 MCPCBs provided that the MCPCB design follows the recommended solder mask layout (Figure 2b).

Pin Out (Type 2)[2]

Pad

Function

1

Anode

2

Cathode

3

Cathode

4

Anode

5 [3]

Thermal

1

2

3

4

5

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Recommended Solder Mask Layout (mm)

Non-pedestal MCPCB Design Pedestal MCPCB Design

Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design.

Note for Figure 2b:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

Recommended 8mil Stencil Apertures Layout (mm)

Figure 2c: Recommended 8mil stencil apertures layout for anode, cathode, and thermal pad.

Note for Figure 2c:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

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0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

Relatiive Intensity

Angular Displacement (Degrees)

Reflow Soldering Profile

Figure 3: Reflow soldering profile for lead free soldering.

Typical Radiation Pattern

Figure 4: Typical representative spatial radiation pattern.

LED EnGIn' AN osw msmEss 11

11

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

400 450 500 550 600 650 700 750 800

Relative Spectral Power

Wavelength (nm)

0

200

400

600

800

1,000

1,200

1,400

2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4

IF - Forward Current (mA)

VF - Forward Voltage (V)

Typical Relative Spectral Power Distribution

Figure 5: Relative spectral power vs. wavelength @ TC = 25°C.

Typical Forward Current Characteristics

Figure 6: Typical forward current vs. forward voltage @ TC = 25°C.

LED EnGIn' 12

12

0

20

40

60

80

100

120

0 200 400 600 800 1000 1200 1400

Relative Light Output (%)

IF - Forward Current (mA)

0

20

40

60

80

100

120

020 40 60 80 100 120

Relative Light Output (%)

TC - Case Temperature (oC)

Typical Relative Light Output over Current

Figure 7: Typical relative light output vs. forward current @ TC = 25°C.

Typical Relative Light Output over Temperature

Figure 8: Typical relative light output vs. case temperature.

LED EI'IGII'I AN 05w msmEss 13

13

-0.020

-0.015

-0.010

-0.005

0.000

0.005

0.010

0.015

0.020

020 40 60 80 100 120

Δ Cx, Δ Cy Chromaticity Coordinate Shift

TC - Case Temperature (oC)

Δ Cx

Δ Cy

-0.020

-0.015

-0.010

-0.005

0.000

0.005

0.010

0.015

0.020

0 200 400 600 800 1000 1200 1400

Δ Cx, Δ Cy Chromaticity Coordinate Shift

IF - Forward Current (mA)

Δ Cx

Δ Cy

Typical Chromaticity Coordinate Shift over Current

Figure 9: Typical chromaticity coordinate shift vs. forward current @ TC = 25°C.

Typical Chromaticity Coordinate Shift over Temperature

Figure 10: Typical chromaticity coordinate shift vs. case temperature

LED EnGIn AN 1:st «mm:

14

0

200

400

600

800

1000

1200

1400

025 50 75 100 125 150

IF - Forward Current (mA)

TA - Ambient Temperature (°C)

(TJ(MAX) = 135)

RΘJA = 9°C/W

RΘJA = 12°C/W

RΘJA = 15°C/W

Current De-rating

Figure 11: Maximum forward current vs. ambient temperature

Notes for Figure 11:

1. RΘJ-C [Junction to Case Thermal Resistance] for the LZ1-00CW02 is typically 6.0°C/W.

2. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].

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15

Emitter Tape and Reel Specifications (mm)

Figure 12: Emitter carrier tape specifications (mm).

Figure 13: Emitter reel specifications (mm).

Notes:

1. Small reel quantity: up to 500 emitters

2. Large reel quantity: 501-2500 emitters.

3. Single flux bin and single wavelength bin per reel.

Ø 178mm (SMALL REEL)

Ø 330mm (LARGE REEL)

16 LED EnGIn AN nsRAm msmEss

16

LZ1 MCPCB Family

Part number

Type of MCPCB

Diameter

(mm)

Emitter + MCPCB

Thermal Resistance

(oC/W)

Typical VF

(V)

Typical IF

(mA)

LZ1-1xxxxx

1-channel Star

19.9

6.0 + 1.5 = 7.5

3.2

1000

Mechanical Mounting of MCPCB

 MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to

substrate cracking and subsequently LED dies cracking.

 To avoid MCPCB bending:

o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.

o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3

screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will

increase the likelihood of board bending.

o It is recommended to always use plastics washers in combinations with the three screws.

o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after

tightening (with controlled torque) and then re-tighten the screws again.

Thermal interface material

 To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when

mounting the MCPCB on to the heat sink.

 There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal

epoxies. An example of such material is Electrolube EHTC.

 It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating

conditions.

 It is recommended to verify thermal design by measuring case temperature (Tc) during design phase.

Wire soldering

 To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.

Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is

recommended to use a solder iron of more than 60W.

 It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:

24-7068-7601)

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17

LZ1-1xxxxx

1 channel, Standard Star MCPCB (1x1) Dimensions (mm)

Notes:

 Unless otherwise noted, the tolerance = ± 0.2 mm.

 Slots in MCPCB are for M3 or #4-40 mounting screws.

 LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.

 LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.

 The thermal resistance of the MCPCB is: RΘC-B 1.5°C/W

Components used

MCPCB: HT04503 (Bergquist)

ESD/TVS diode: BZT52C5V1LP-7 (Diodes, Inc., for 1 LED die)

VBUS05L1-DD1 (Vishay Semiconductors, for 1 LED die)

Pad layout

Ch.

MCPCB

Pad

String/die

Function

1

1,2,3

1/A

Cathode -

4,5,6

Anode +

18 LED EnGIn AN nsRAm msmEss

18

About LED Engin

LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED

emitters, optics and light engines to create uncompromised lighting experiences for a wide range of

entertainment, architectural, general lighting and specialty applications. LuxiGenTM multi-die emitter and

secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a

target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented

compact ceramic package. Our LuxiTuneTM series of tunable white lighting modules leverage our LuxiGen emitters

and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of

new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior in-

source color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional

light is required. LED Engin is committed to providing products that conserve natural resources and reduce

greenhouse emissions; and reserves the right to make changes to improve performance without notice.

For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200.

.

LZ1-00CW02 Datasheet by ams-OSRAM USA INC.

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