AT93C46D/E Datasheet by Microchip Technology

View All Related Products | Download PDF Datasheet
6‘ MICRDCHIP
AT93C46D/AT93C46E
Three-wire Serial EEPROM 1-Kbit (128 x 8 or 64 x 16)
Features
Low-Voltage Operation:
– VCC = 1.8V to 5.5V
User-Selectable Internally Organized as 128 x 8 (1K) or 64 x 16 (1K)
Non-Selectable Internal Organization as 64 x 16 (1K), AT93C46E Only
Industrial Temperature Range: -40°C to +85°C
2 MHz Clock Rate (5V)
Self-Timed Write Cycle within 5 ms Maximum
High Reliability:
Endurance: 1,000,000 write cycles
Data retention: 100 years
Green Package Options (Lead-free/Halide-free/RoHS compliant)
Die Sale Options: Wafer Form and Tape and Reel
Packages
8-lead SOIC, 8-lead TSSOP, 8-pad UDFN, 8-lead PDIP and 8-ball VFBGA
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 1
Table of Contents
Features.......................................................................................................................... 1
Packages.........................................................................................................................1
1. Package Types (not to scale).................................................................................... 4
2. Pin Descriptions.........................................................................................................5
2.1. Chip Select (CS)...........................................................................................................................5
2.2. Serial Data Clock (SK)................................................................................................................. 5
2.3. Serial Data Input (DI)....................................................................................................................5
2.4. Serial Data Output (DO)............................................................................................................... 5
2.5. Ground (GND).............................................................................................................................. 6
2.6. Internal Organization (ORG)........................................................................................................ 6
2.7. Device Power Supply (VCC)......................................................................................................... 6
3. Description.................................................................................................................7
3.1. Block Diagram.............................................................................................................................. 7
4. Electrical Characteristics........................................................................................... 8
4.1. Absolute Maximum Ratings..........................................................................................................8
4.2. DC and AC Operating Range.......................................................................................................8
4.3. DC Characteristics....................................................................................................................... 8
4.4. AC Characteristics........................................................................................................................9
4.5. Synchronous Data Timing.......................................................................................................... 11
4.6. Electrical Specifications..............................................................................................................11
5. Device Commands and Addressing........................................................................ 13
5.1. READ......................................................................................................................................... 13
5.2. Erase/Write Enable (EWEN)...................................................................................................... 14
5.3. Erase/Write Disable (EWDS)..................................................................................................... 14
5.4. ERASE....................................................................................................................................... 15
5.5. WRITE........................................................................................................................................15
5.6. Write All (WRAL)........................................................................................................................ 16
5.7. Erase All (ERAL)........................................................................................................................ 16
6. Packaging Information.............................................................................................18
6.1. Package Marking Information.....................................................................................................18
7. Revision History.......................................................................................................30
The Microchip Website..................................................................................................32
Product Change Notification Service.............................................................................32
Customer Support......................................................................................................... 32
Product Identification System........................................................................................33
AT93C46D/AT93C46E
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 2
Microchip Devices Code Protection Feature................................................................. 33
Legal Notice...................................................................................................................34
Trademarks................................................................................................................... 34
Quality Management System........................................................................................ 35
Worldwide Sales and Service........................................................................................36
AT93C46D/AT93C46E
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 3
1. Package Types (not to scale)
CS
SK
DI
DO
Vcc
NC
ORG(2)
GND
8-pad UDFN(1)
(Top View)
8-lead PDIP/SOIC/TSSOP
(Top View)
CS 1
2
3
4
8
7
6
5
SK
DI
DO
Vcc
NC
ORG(2)
GND
1
2
3
4
8
7
6
5
CS
SK
DI
DO
Vcc
NC
ORG
GND
8-ball VFBGA(1)
(Top View)
1
2
3
4 5
6
7
8
Note: 
1. This package is only available on the AT93C46D.
2. ORG pin is No Connect (NC) on the AT93C46E device.
AT93C46D/AT93C46E
Package Types (not to scale)
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 4
(2)
2. Pin Descriptions
The descriptions of the pins are listed in Table 2-1.
Table 2-1. Pin Function Table
Name 8Lead
PDIP
8Lead
SOIC
8Lead
TSSOP
8Pad
UDFN(1)
8-Ball
VFBGA
Function
CS 1 1 1 1 1 Chip Select
SK 2 2 2 2 2 Serial Data Clock
DI 3 3 3 3 3 Serial Data Input
DO 4 4 4 4 4 Serial Data Output
GND 5 5 5 5 5 Ground
ORG(2)6 6 6 6 6 Internal Organization
NC 7 7 7 7 7 No Connect
VCC 8 8 8 8 8 Device Power Supply
Note: 
1. The exposed pad on this package can be connected to GND or left floating.
2. The Internal Organization (ORG) pin is a No Connect (NC) on the AT93C46E device.
2.1 Chip Select (CS)
The Chip Select (CS) pin is used to control device selection. The AT93C46D/AT93C46E is selected when
the CS pin is high. When the device is not selected, data will not be accepted via the Serial Data Input
(DI) pin, and the Serial Output (DO) pin will remain in a high-impedance state.
2.2 Serial Data Clock (SK)
The Serial Data Clock (SK) pin is used to synchronize the communication between a master and the
AT93C46D/AT93C46E. Instructions, addresses or data present on the Serial Data Input (DI) pin is latched
in on the rising edge of SK, while output on the Serial Data Output (DO) pin is also clocked out on the
rising edge of SK.
2.3 Serial Data Input (DI)
The Serial Data Input (DI) pin is used to transfer data into the device. It receives instructions, addresses
and data. Data is latched on the rising edge of the Serial Data Clock (SK).
2.4 Serial Data Output (DO)
The Serial Data Output (DO) pin is used to transfer data out of the AT93C46D/AT93C46E. During a read
sequence, data is shifted out on this pin after the rising edge of the Serial Data Clock (SK).
This pin also outputs the Ready/Busy status of the part if CS is brought high after being low for a
minimum of tcs and an erase or write operation has been initiated.
AT93C46D/AT93C46E
Pin Descriptions
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 5
2.5 Ground (GND)
The ground reference for the power supply. The Ground (GND) pin should be connected to the system
ground.
2.6 Internal Organization (ORG)
The Internal Organization (ORG) pin is used to select between the x16 or x8 memory organizations of the
device. When the ORG pin is tied to VCC, the x16 memory organization is selected. When the ORG pin is
tied to VSS, the x8 memory organization is selected.
If the ORG pin is left unconnected and the application does not load the input beyond the capability of the
internal 1 MΩ pull-up resistor, then the x16 organization is selected.
Note:  This pin is a No Connect (NC) on the AT93C46E.
2.7 Device Power Supply (VCC)
The Device Power Supply (VCC) pin is used to supply the source voltage to the device. Operations at
invalid VCC voltages may produce spurious results and should not be attempted.
AT93C46D/AT93C46E
Pin Descriptions
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 6
Powevon
3. Description
The AT93C46D provides 1,024 bits of Serial Electrically Erasable and Programmable Read-Only Memory
(EEPROM) organized as 64 words of 16 bits each (when the ORG pin is connected to VCC) and 128
words of 8 bits each (when the ORG pin is tied to ground). The device is optimized for use in many
industrial and commercial applications where lowpower and lowvoltage operations are essential. The
AT93C46D is available in space-saving 8-lead SOIC, 8-lead TSSOP, 8-pad UDFN, 8-lead PDIP, and 8-
ball VFBGA packages. All packages operate from 1.8V to 5.5V.
The AT93C46E provides 1,024 bits of Serial Electrically Erasable and Programmable Read-Only Memory
(EEPROM) organized as 64 words of 16 bits each only. The AT93C46E does not offer the ORG pin so
organization is not user-selectable on this device. The device is optimized for use in many industrial and
commercial applications where lowpower and lowvoltage operations are essential. The AT93C46E is
also available in space-saving 8-lead SOIC, 8-lead TSSOP, and 8-lead PDIP packages. All packages
operate from 1.8V to 5.5V.
The AT93C46D/AT93C46E is enabled through the Chip Select (CS) pin and accessed via a three-wire
serial interface consisting of Data Input (DI), Data Output (DO), and Serial Data Clock (SK). Upon
receiving a READ instruction at DI, the address is decoded, and the data is clocked out serially on the DO
pin. The write cycle is completely self-timed, and no separate erase cycle is required before write. The
write cycle is only enabled when the part is in the Erase/Write Enable state. When CS is brought high
following the initiation of a write cycle, the DO pin outputs the Ready/Busy status of the part.
3.1 Block Diagram
DO
Memory
System Control
Module
High Voltage
Generation
Circuit
Address Register
and Counter
VCC
ORG(1)
GND
Power-on
Reset
Generator
Row Decoder
Data Register
SK
Clock
Generator
CS
DI
128 x 8(1)
or
64 x 16
EEPROM Array
Column Decoder
Output
Buffer
DODO
Note: 
1. The organization of the AT93C46E is not selectable by the ORG pin and defaults to 64x16. If the
x16 organization is the mode of choice and pin 6 (ORG) is left unconnected, Microchip
recommends using AT93C46E device.
AT93C46D/AT93C46E
Description
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 7
4. Electrical Characteristics
4.1 Absolute Maximum Ratings
Temperature under bias -55°C to +125°C
Storage temperature -65°C to +150°C
VCC 6.25V
Voltage on any pin with respect to ground -1.0V to +7.0V
DC output current 5.0 mA
ESD protection 2 kV
Note:  Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at these or any other
conditions above those indicated in the operation listings of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
4.2 DC and AC Operating Range
Table 4-1. DC and AC Operating Range
AT93C46D/AT93C46E
Operating Temperature (Case) Industrial Temperature Range -40°C to +85°C
VCC Power Supply Low-Voltage Grade 1.8V to 5.5V
4.3 DC Characteristics
Table 4-2. DC Characteristics(1)
Parameter Symbol Minimum Typical Maximum Units Test Conditions
Supply Voltage VCC1 1.8 5.5 V
Supply Voltage VCC2 2.7 5.5 V
Supply Voltage VCC3 4.5 5.5 V
Supply Current ICC1 0.5 2.0 mA VCC = 5.0V, Read at 1 MHz
Supply Current ICC2 0.5 2.0 mA VCC = 5.0V, Write at 1 MHz
Standby Current
(1.8V Option)
ISB1 0.4 1.0 μA VCC = 1.8V, CS = 0V
Standby Current
(2.7V Option)
ISB2 6.0 10.0 μA VCC = 2.7V, CS = 0V
Standby Current
(5.0V Option)
ISB3 10.0 15.0 μA VCC = 5.0V, CS = 0V
AT93C46D/AT93C46E
Electrical Characteristics
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 8
...........continued
Parameter Symbol Minimum Typical Maximum Units Test Conditions
Input Leakage
Current
IIL 0.1 1.0 μA VIN = 0 to VCC
Output Leakage
Current
ILO 0.1 1.0 μA VIN = 0 to VCC
Input LowVoltage VIL1 -0.6 0.8 V 2.7V ≤ VCC ≤ 5.5V (Note 2)
Input HighVoltage VIH1 2.0 — VCC + 1 V 2.7V ≤ VCC ≤ 5.5V (Note 2)
Input LowVoltage VIL2 -0.6 — VCC x 0.3 V 1.8V ≤ VCC ≤ 2.7V (Note 2)
Input HighVoltage VIH2 VCC x 0.7 VCC + 1 V 1.8V ≤ VCC ≤ 2.7V (Note 2)
Output
LowVoltage
VOL1 0.4 V 2.7V ≤ VCC ≤ 5.5V,
IOL = 2.1 mA
Output
HighVoltage
VOH1 2.4 V 2.7V ≤ VCC ≤ 5.5V,
IOH = -0.4 mA
Output
LowVoltage
VOL2 0.2 V 1.8V ≤ VCC ≤ 2.7V,
IOL = 0.15 mA
Output
HighVoltage
VOH2 VCC - 0.2 V 1.8V ≤ VCC ≤ 2.7V,
IOH = -100 µA
Note: 
1. Applicable over recommended operating range from: TA = -40°C to +85°C, VCC = 1.8V to 5.5V
(unless otherwise noted).
2. VIL min and VIH max are reference only and are not tested.
4.4 AC Characteristics
Table 4-3. AC Characteristics(1)
Parameter Symbol Minimum Typical Maximum Units Test Conditions
Clock Frequency, SK fSK 0 2 MHz 4.5V ≤ VCC ≤ 5.5V
0 1 MHz 2.7V ≤ VCC ≤ 5.5V
0 250 kHz 1.8V ≤ VCC ≤ 5.5V
High Time, SK tSKH 250 ns 4.5V ≤ VCC ≤ 5.5V
250 ns 2.7V ≤ VCC ≤ 5.5V
1000 ns 1.8V ≤ VCC ≤ 5.5V
Low Time, SK tSKL 250 ns 4.5V ≤ VCC ≤ 5.5V
250 ns 2.7V ≤ VCC ≤ 5.5V
1000 ns 1.8V ≤ VCC ≤ 5.5V
AT93C46D/AT93C46E
Electrical Characteristics
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 9
...........continued
Parameter Symbol Minimum Typical Maximum Units Test Conditions
Minimum CS Low
Time
tCS 250 ns 4.5V ≤ VCC ≤ 5.5V
250 ns 2.7V ≤ VCC ≤ 5.5V
1000 ns 1.8V ≤ VCC ≤ 5.5V
CS Setup Time tCSS 50 ns 4.5V ≤ VCC ≤ 5.5V,
Relative to SK
50 ns 2.7V ≤ VCC ≤ 5.5V,
Relative to SK
200 ns 1.8V ≤ VCC ≤ 5.5V,
Relative to SK
DI Setup Time tDIS 100 ns 4.5V ≤ VCC ≤ 5.5V,
Relative to SK
100 ns 2.7V ≤ VCC ≤ 5.5V,
Relative to SK
400 ns 1.8V ≤ VCC ≤ 5.5V,
Relative to SK
CS Hold Time tCSH 0 ns Relative to SK
DI Hold Time tDIH 100 ns 4.5V ≤ VCC ≤ 5.5V,
Relative to SK
100 ns 2.7V ≤ VCC ≤ 5.5V,
Relative to SK
400 ns 1.8V ≤ VCC ≤ 5.5V,
Relative to SK
Output Delay to 1 tPD1 250 ns 4.5V ≤ VCC ≤ 5.5V
250 ns 2.7V ≤ VCC ≤ 5.5V
1000 ns 1.8V ≤ VCC ≤ 5.5V
Output Delay to 0 tPD0 250 ns 4.5V ≤ VCC ≤ 5.5V
250 ns 2.7V ≤ VCC ≤ 5.5V
1000 ns 1.8V ≤ VCC ≤ 5.5V
CS to Status Valid tSV 250 ns 4.5V ≤ VCC ≤ 5.5V
250 ns 2.7V ≤ VCC ≤ 5.5V
1000 ns 1.8V ≤ VCC ≤ 5.5V,
AT93C46D/AT93C46E
Electrical Characteristics
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 10
...........continued
Parameter Symbol Minimum Typical Maximum Units Test Conditions
CS to DO in
Highimpedance
tDF 100 ns 4.5V ≤ VCC ≤ 5.5V,
CS = VIL
250 ns 2.7V ≤ VCC ≤ 5.5V,
CS = VIL
400 ns 1.8V ≤ VCC ≤ 5.5V,
CS = VIL
Write Cycle Time tWP 0.1 3 5 ms 1.8V ≤ VCC ≤ 5.5V
Note: 
1. Applicable over recommended operating range from TA = -40°C to +85°C, VCC = As Specified, CL =
1 TTL Gate and 100 pF (unless otherwise noted).
4.5 Synchronous Data Timing
Figure 4-1. Synchronous Data Timing
CS
SK
DI
DO (Read)
DO (Program)
VIH
VIL
VIH
VIL
VIH
VIL
VOH
VOL
VOH
VOL
Status Valid
tCSS
tDIS
tSV
tDIH
tPD0
tSKH tSKL
1µs(1)
tPD1
tCSH
tDF
tDF
Note: 
1. This is the minimum SK period.
4.6 Electrical Specifications
4.6.1 Power-Up Requirements and Reset Behavior
During a power-up sequence, the VCC supplied to the AT93C46D/AT93C46E should monotonically rise
from GND to the minimum VCC level, as specified in Table 4-1, with a slew rate no faster than 0.1 V/µs.
4.6.1.1 Device Reset
To prevent inadvertent write operations or any other spurious events from occurring during a power-up
sequence, the AT93C46D/AT93C46E includes a Power-on Reset (POR) circuit. Upon power-up, the
device will not respond to any commands until the VCC level crosses the internal voltage threshold (VPOR)
that brings the device out of Reset and into Standby mode.
AT93C46D/AT93C46E
Electrical Characteristics
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 11
The system designer must ensure the instructions are not sent to the device until the VCC supply has
reached a stable value greater than or equal to the minimum VCC level. Additionally, once the VCC is
greater than or equal to the minimum VCC level, the bus master must wait at least tPUP before sending the
first command to the device. See Power-up Conditions(1) for the values associated with these power-up
parameters.
Table 4-4. Power-up Conditions(1)
Symbol Parameter Min. Max. Units
tPUP Time required after VCC is stable before the device can accept commands 100 µs
VPOR Power-on Reset Threshold Voltage 1.5 V
tPOFF Minimum time at VCC = 0V between power cycles 500 ms
Note: 
1. These parameters are characterized but they are not 100% tested in production.
If an event occurs in the system where the VCC level supplied to the AT93C46D/AT93C46E drops below
the maximum VPOR level specified, it is recommended that a full power cycle sequence be performed by
first driving the VCC pin to GND, waiting at least the minimum tPOFF time and then performing a new
power-up sequence in compliance with the requirements defined in this section.
4.6.2 Pin Capacitance
Table 4-5. Pin Capacitance(1)
Symbol Test Condition Max. Units Conditions
COUT Output Capacitance (DO) 5 pF VOUT = 0V
CIN Input Capacitance (CS, SK, DI, ORG) 5 pF VIN = 0V
Note: 
1. This parameter is characterized but is not 100% tested in production.
4.6.3 EEPROM Cell Performance Characteristics
Table 4-6. EEPROM Cell Performance Characteristics
Operation Test Condition Min. Max. Units
Write Endurance(1)TA = 25°C, VCC = 5.0V 1,000,000 Write Cycles
Data Retention(1)TA = 55°C 100 Years
Note: 
1. Performance is determined through characterization and the qualification process.
AT93C46D/AT93C46E
Electrical Characteristics
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 12
5. Device Commands and Addressing
The AT93C46D/AT93C46E is accessed via a simple and versatile three-wire serial communication
interface. Device operation is controlled by seven instructions issued by the Host processor. A valid
instruction starts with a rising edge of CS and consists of a Start bit (SB), followed by the appropriate
opcode, and the desired memory address location.
Table 5-1. AT93C46D/AT93C46E Instruction Set
Instruction SB Opcode Address Data Comments
X8(1)X16(1)X8 X16
READ 1 10 A6A0A5A0Reads data stored in memory at
specified address.
EWEN 1 00 11XXXXXXX 11XXXXXX Write Enable must precede all
programming modes.
ERASE 1 11 A6A0A5A0Erases memory location ANA0.
WRITE 1 01 A6A0A5A0D7D0D15D0Writes memory location ANA0.
ERAL 1 00 10XXXXXXX 10XXXXXX Erases all memory locations. Valid
only at VCC3. See Table 4-2.
WRAL 1 00 01XXXXXXX 01XXXXXX D7D0D15D0Writes all memory locations. Valid
only at VCC3. See Table 4-2
EWDS 1 00 00XXXXXXX 00XXXXXX Disables all programming
instructions.
Note: 
1. The ‘X’ in the address field represent a “don’t care” bit, and must be sent to the device.
Table 5-2. Organization Key for Timing Diagrams
I/O AT93C46D/AT93C46E (1K)
x8(1)x16
ANA6A5
DND7D15
Note: 
1. The internal organization of the AT93C46E is x16 only.
5.1 READ
The READ instruction contains the address code for the memory location to be read. After the instruction
and address are decoded, data from the selected memory location is available at the DO pin. Output data
changes are synchronized with the rising edges of the SK pin.
Note:  A dummy bit (logic ‘0’) precedes the 8-bit or 16-bit data output string.
AT93C46D/AT93C46E
Device Commands and Addressing
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 13
mmmm %WO
Figure 5-1. READ Timing
High-impedance
CS
SK
DI
DO
1 1 0 AN A0
0 DN D0
tCS
5.2 Erase/Write Enable (EWEN)
To ensure data integrity, the part automatically goes into the Erase/Write Disable (EWDS) state when
power is first applied. An Erase/Write Enable (EWEN) instruction must be executed first before any
programming instructions can be carried out.
Note:  Once in the write enabled state, programming remains enabled until an EWDS instruction is
executed, or VCC power is removed from the part.
Figure 5-2. EWEN Timing
1 0 011 ...
CS
SK
DI
tCS
5.3 Erase/Write Disable (EWDS)
To protect against accidental data disturbance, the Erase/Write Disable (EWDS) instruction disables all
programming modes and should be executed after all programming operations. The operation of the
READ instruction is independent of both the EWEN and EWDS instructions and can be executed at any time.
AT93C46D/AT93C46E
Device Commands and Addressing
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 14
WW— % V WWW WC THREE L W
Figure 5-3. EWDS Timing
1 0 000 ...
CS
SK
DI
tCS
5.4 ERASE
The ERASE instruction programs all bits in the specified memory location to the logic ‘1’ state. The self-
timed erase cycle starts once the ERASE instruction and address are decoded. The DO pin outputs the
Ready/Busy status of the part if CS is brought high after being kept low for a minimum of tCS. A logic ‘1’ at
the DO pin indicates that the selected memory location has been erased, and the part is ready for
another instruction.
Figure 5-4. ERASE Timing
CS
SK
DI
DO High-impedance High-impedance
1 1 ...1 AN
tCS
tSV tDF
tWP
AN-1 AN-2 A0
Check
Status
Standby
Ready
Busy
5.5 WRITE
The WRITE instruction contains the 8 bits or 16 bits of data to be written into the specified memory
location. The self-timed programming cycle, tWP, starts after the last bit of data is received at DI pin . The
DO pin outputs the Ready/Busy status of the part if CS is brought high after being kept low for a minimum
of tCS. A logic ‘0’ at DO indicates that programming is still in progress. A logic ‘1’ indicates that the
memory location at the specified address has been written with the data pattern contained in the
instruction, and the part is ready for further instructions. A Ready/Busy status cannot be obtained if CS is
brought high after the end of the self-timed programming cycle, tWP.
AT93C46D/AT93C46E
Device Commands and Addressing
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 15
MWQX—
Figure 5-5. WRITE Timing
CS
SK
DI
tCS
tWP
1 1 AN DN
0 A0 D0
... ...
DO High-impedance Busy Ready
5.6 Write All (WRAL)
The Write All (WRAL) instruction programs all memory locations with the data patterns specified in the
instruction. The DO pin outputs the Ready/Busy status of the part if CS is brought high after being kept
low for a minimum of tCS.
Note:  The WRAL instruction is valid only at VCC3 (see Table 4-2).
Figure 5-6. WRAL Timing
5.7 Erase All (ERAL)
The Erase All (ERAL) instruction programs every bit in the memory array to the logic ‘1’ state and is
primarily used for testing purposes. The DO pin outputs the Ready/Busy status of the part if CS is brought
high after being kept low for a minimum of tCS.
Note:  The ERAL instruction is valid only at VCC3 (see Table 4-2).
AT93C46D/AT93C46E
Device Commands and Addressing
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 16
jmmmm KR? m‘mjfifi
Figure 5-7. ERAL Timing
CS
SK
DI
DO High-impedance High-impedance
CS
DI
DO
1 10 00
Ready
Busy
Check
Status
Standby
tWP
tCS
tSV tDF
AT93C46D/AT93C46E
Device Commands and Addressing
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 17
YY 7 Veal v = Year W = Work Week ofAssemb‘y "/a = Mlmmum Vouage 162016 20 2020 62016 0 2020 02 Week 2 L 18me Lot Number or Trace Code
6. Packaging Information
6.1 Package Marking Information
AT93C46D and AT93C46E: Package Marking Information
Catalog Number Truncation
AT93C46D Truncation Code ###: 46D
AT93C46E Truncation Code ###: 46E
Date Codes Voltages
YY = Year Y = Year WW = Work Week of Assembly % = Minimum Voltage
16: 2016 20: 2020 6: 2016 0: 2020 02: Week 2 L: 1.8V min
17: 2017 21: 2021 7: 2017 1: 2021 04: Week 4
18: 2018 22: 2022 8: 2018 2: 2022 ...
19: 2019 23: 2023 9: 2019 3: 2023 52: Week 52
Country of Origin Device Grade Atmel Truncation
CO = Country of Origin H or U: Industrial Grade AT: Atmel
ATM: Atmel
ATML: Atmel
Lot Number or Trace Code
NNN = Alphanumeric Trace Code (2 Characters for Small Packages)
8-pad UDFN
###
H%
NNN
2.0 x 3.0 mm Body
Note 2: Package drawings are not to scale
Note 1: designates pin 1
1.5 x 2.0 mm Body
8-ball VFBGA
###U
WNNN
8-lead SOIC
YYWWNNN
###% CO
ATMLHYWW
8-lead TSSOP
YYWWNNN
###%CO
ATHYWW
8-lead PDIP
YYWWNNN
###% CO
ATMLUYWW
AT93C46D/AT93C46E
Packaging Information
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 18
L— I-GEI-I 1D! DA
0.25 CA–B D
C
SEATING
PLANE
TOP VIEW
SIDE VIEW
VIEW A–A
0.10 C
0.10 C
Microchip Technology Drawing No. C04-057-SN Rev E Sheet 1 of 2
8X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
© 2017 Microchip Technology Inc.
R
12
N
h
h
A1
A2
A
A
B
e
D
E
E
2
E1
2
E1
NOTE 5
NOTE 5
NX b
0.10 CA–B
2X
H0.23
(L1)
L
R0.13
R0.13
VIEW C
SEE VIEW C
NOTE 1
D
AT93C46D/AT93C46E
Packaging Information
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 19
Microchip Technology Drawing No. C04-057-SN Rev E Sheet 2 of 2
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
© 2017 Microchip Technology Inc.
R
Foot Angle 0° - 8°
15°-
Mold Draft Angle Bottom
15°-
Mold Draft Angle Top
0.51-0.31
b
Lead Width
0.25-0.17
c
Lead Thickness
1.27-0.40LFoot Length
0.50-0.25hChamfer (Optional)
4.90 BSCDOverall Length
3.90 BSCE1Molded Package Width
6.00 BSCEOverall Width
0.25-0.10
A1
Standoff
--1.25A2Molded Package Thickness
1.75--AOverall Height
1.27 BSC
e
Pitch
8NNumber of Pins
MAXNOMMINDimension Limits
MILLIMETERSUnits
protrusions shall not exceed 0.15mm per side.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
4. Dimensioning and tolerancing per ASME Y14.5M
Notes:
§
Footprint L1 1.04 REF
5. Datums A & B to be determined at Datum H.
AT93C46D/AT93C46E
Packaging Information
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 20
WEDGE D Jim} ’H\
RECOMMENDED LAND PATTERN
Microchip Technology Drawing C04-2057-SN Rev E
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC]
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M1.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
© 2017 Microchip Technology Inc.
R
Dimension Limits
Units
CContact Pad Spacing
Contact Pitch
MILLIMETERS
1.27 BSC
MIN
E
MAX
5.40
Contact Pad Length (X8)
Contact Pad Width (X8)
Y1
X1
1.55
0.60
NOM
E
X1
C
Y1
SILK SCREEN
AT93C46D/AT93C46E
Packaging Information
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 21
Number of Fms Pmch OveraH Hewgm Mmded Package Thickness Slandofl OveraH Wwdlh Mmded Package wmm Mmded Package Length Foot Leng|h Footplinl Pom Ang‘e Lead Thmkness c Lead Width b
©2007 Microchip Technology Inc. DS00049AR-page 117
M
Packaging Diagrams and Parameters
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 0.65 BSC
Overall Height A 1.20
Molded Package Thickness A2 0.80 1.00 1.05
Standoff A1 0.05 0.15
Overall Width E 6.40 BSC
Molded Package Width E1 4.30 4.40 4.50
Molded Package Length D 2.90 3.00 3.10
Foot Length L 0.45 0.60 0.75
Footprint L1 1.00 REF
Foot Angle φ0° – 8°
Lead Thickness c 0.09 0.20
Lead Width b 0.19 0.30
D
N
E
E1
NOTE 1
1 2
b
e
c
A
A1
A2
L1 L
φ
Microchip Technology Drawing C04-086B
AT93C46D/AT93C46E
Packaging Information
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 22
8-Lead Plastic Thin Shrink Small Oulline (ST) - 4.4 mm Body [TSSOP] .—CI—— HUDH’ 5 L».— H \ ,l w lk SlLK SCREEN RECOMMENDED LAND PA'I'I'ERN um; MILLIMETERS Dlmanslon lells MlN l NOM | MAX Contacl Pllch E o 65 Bsc Comacl Pad Spaclng c1 5 90 Comm F'ad Wldm (xa) Xl 0.45 Contact Pad Length (x5) w 1 A5 Dlslanoe Between Pads (3 o 20 Noles' 1 Dlmenslonlng and lolerancmg per ASME YM 5M BSC Baslc Dimenslon Thenrellcally exam value Shawn wllhoul tolerances. Mlcrocmp Technology Drawing No cm-zoaeA
DS00049BC-page 96 2009 Microchip Technology Inc.
M
Packaging Diagrams and Parameters
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
AT93C46D/AT93C46E
Packaging Information
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 23
1w Ll u I'll—I'l'll'l —»|l:l|<— $="">
B
A
0.10 C
0.10 C
(DATUM B)
(DATUM A)
C
SEATING
PLANE
12
N
2X TOP VIEW
SIDE VIEW
NOTE 1
12
N
0.10 C A B
0.10 C A B
0.10 C
0.08 C
Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 1 of 2
2X
8X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy YNZ Package
© 2017 Microchip Technology Inc.
D
E
D2
E2 K
L8X b
e
e
2
0.10 C A B
0.05 C
A
(A3)
A1
BOTTOM VIEW
AT93C46D/AT93C46E
Packaging Information
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 24
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
© 2017 Microchip Technology Inc.
Number of Terminals
Overall Height
Terminal Width
Overall Width
Terminal Length
Exposed Pad Width
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E2
A3
e
L
E
N
0.50 BSC
0.152 REF
1.20
0.35
0.18
0.50
0.00
0.25
0.40
1.30
0.55
0.02
3.00 BSC
MILLIMETERS
MIN NOM
8
1.40
0.45
0.30
0.60
0.05
MAX
K-0.20 -Terminal-to-Exposed-Pad
Overall Length
Exposed Pad Length
D
D2 1.40
2.00 BSC
1.50 1.60
Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 2 of 2
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy YNZ Package
AT93C46D/AT93C46E
Packaging Information
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 25
RECOMMENDED LAND PATTERN
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
1.40
1.60
MILLIMETERS
0.50 BSC
MIN
E
MAX
Contact Pad Length (X8)
Contact Pad Width (X8)
Y1
X1
0.85
0.30
NOM
12
8
CContact Pad Spacing 2.90
Contact Pad to Center Pad (X8) G1 0.20
Thermal Via Diameter V
Thermal Via Pitch EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
© 2017 Microchip Technology Inc.
Microchip Technology Drawing C04-21355-Q4B Rev A
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy YNZ Package
X2
Y2
Y1
SILK SCREEN X1
E
C
EV
G2
G1
ØV
Contact Pad to Contact Pad (X6) G2 0.33
AT93C46D/AT93C46E
Packaging Information
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 26
B
A
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
eB
E
A
A1
A2
L
8X b
8X b1
D
E1
c
C
PLANE
.010 C
1 2
N
NOTE 1
TOP VIEW
END VIEWSIDE VIEW
e
AT93C46D/AT93C46E
Packaging Information
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 27
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e.100 BSC
Top to Seating Plane A - - .210
Molded Package Thickness A2 .115 .130 .195
Base to Seating Plane A1 .015
Shoulder to Shoulder Width E .290 .310 .325
Molded Package Width E1 .240 .250 .280
Overall Length D .348 .365 .400
Tip to Seating Plane L .115 .130 .150
Lead Thickness c.008 .010 .015
Upper Lead Width b1 .040 .060 .070
Lower Lead Width b.014 .018 .022
Overall Row Spacing eB - - .430
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
3.
1.
protrusions shall not exceed .010" per side.
2.
4.
Note s :
§
- -
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
Pin 1 visual index feature may vary, but must be located within the hatched area.
§ Significant Characteristic
Dimensioning and tolerancing per ASME Y14.5M
e
DATUM A DATUM A
e
b
e
2
b
e
2
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
AT93C46D/AT93C46E
Packaging Information
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 28
DRAWING NO. REV. TITLE GPC
8U3-1 G
7/1/14
8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch,
Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA) GXU
COMMON DIMENSIONS
(Unit of Measure - mm)
SYMBOL MIN NOM MAX NOTE
A
0.73 0.79 0.85
A1 0.09 0.14 0.19
A2 0.40 0.45 0.50
b 0.20 0.25 0.30 2
D
1.50 BSC
E
2.0 BSC
e
0.50 BSC
e1 0.25 REF
d
1.00 BSC
d1 0.25 REF
1. This drawing is for general information only.
2. Dimension ‘b’ is measured at maximum solder ball diameter.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
Notes:
A2
SIDE VIEW
A
PIN 1 BALL PAD CORNER
TOP VIEW
E
D
A1
b
8 SOLDER BALLS
BOTTOM VIEW
(d1)
d
4
3
2
(e1)
6
e
5
7
PIN 1 BALL PAD CORNER
1
8
2.
(4X)d0.10
B
d0.08 C
C
f0.10 C
j n 0.15 mC A B
j n 0.08mC
A
Note:  For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging.
AT93C46D/AT93C46E
Packaging Information
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 29
7. Revision History
Revision A (July 2019)
Updated to the Microchip template. Microchip DS20006224 replaces Atmel documents 5193 and 5207.
Updated Package Marking Information. Removed lead finish designation. Updated trace code format in
package markings. Updated section content throughout for clarification. Updated the 8U3-1 VFBGA
package drawing. Updated the PDIP, SOIC, TSSOP and UDFN package drawings to Microchip format.
Atmel AT93C46E 5207 Revision F (January 2015)
Updated ordering information section.
Atmel AT93C46D 5193 Revision H (January 2015)
Added the UDFN expanded quantity option and the ordering information section. Updated the 8MA2 and
8P3 package drawings.
Atmel AT93C46E 5207 Revision E (October 2014)
Added the part markings and ordering code detail. Updated the package outline drawings and the 8A2 to
8X. Updated the template, Atmel logos, and the disclaimer page.
Atmel AT93C46D 5193 Revision G (August 2014)
Updated package drawings, template, logos, and disclaimer page.
Atmel AT93C46E 5207 Revision D (January 2008)
Removed the ‘preliminary’ status.
Atmel AT93C46D 5193 Revision F (January 2008)
Removed the ‘preliminary’ status.
Atmel AT93C46E 5207 Revision C (November 2007)
Modified the ‘max’ value in AC Characteristics table.
Atmel AT93C46D 5193 Revision E (November 2007)
Modified the ‘max’ value in AC Characteristics table.
Atmel AT93C46E 5207 Revision B (August 2007)
Modified Part Marking Schemes.
Atmel AT93C46D 5193 Revision D (August 2007)
Moved Pinout figure. Added new feature for Die Sales. Modified Ordering Information table layout.
Modified Park Marking Schemes.
Atmel AT93C46D 5193 Revision C (June 2007)
Updated to new template. Added Product Markup Scheme. Added Technical email contact. Corrected
Figures 4 and 5.
AT93C46D/AT93C46E
Revision History
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 30
Atmel AT93C46D 5193 Revision B (February 2007)
Added ‘Ultra Thin’ description to 8-lead Mini-MAP package.
Atmel AT93C46E 5207 Revision A (January 2007)
Initial document release.
Atmel AT93C46D 5193 Revision A (January 2007)
Initial document release.
AT93C46D/AT93C46E
Revision History
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 31
The Microchip Website
Microchip provides online support via our website at http://www.microchip.com/. This website is used to
make files and information easily available to customers. Some of the content available includes:
Product Support – Data sheets and errata, application notes and sample programs, design
resources, users guides and hardware support documents, latest software releases and archived
software
General Technical Support – Frequently Asked Questions (FAQs), technical support requests,
online discussion groups, Microchip design partner program member listing
Business of Microchip – Product selector and ordering guides, latest Microchip press releases,
listing of seminars and events, listings of Microchip sales offices, distributors and factory
representatives
Product Change Notification Service
Microchip’s product change notification service helps keep customers current on Microchip products.
Subscribers will receive email notification whenever there are changes, updates, revisions or errata
related to a specified product family or development tool of interest.
To register, go to http://www.microchip.com/pcn and follow the registration instructions.
Customer Support
Users of Microchip products can receive assistance through several channels:
Distributor or Representative
Local Sales Office
Embedded Solutions Engineer (ESE)
Technical Support
Customers should contact their distributor, representative or ESE for support. Local sales offices are also
available to help customers. A listing of sales offices and locations is included in this document.
Technical support is available through the web site at: http://www.microchip.com/support
AT93C46D/AT93C46E
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 32
Product Identification System
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Product Family
93C = Microwire-compatible
Three-Wire Serial EEPROM
Device Density
Shipping Carrier Option
Package Device Grade or
Wafer/Die Thickness
Package Option
46 = 1-Kilobit
B = Bulk
T = Tape and Reel, Standard Quantity Option
E = Tape and Reel, Extended Quantity Option
H or U = Industrial Temperature Range
(-40°C to +85°C)
11 = 11mil Wafer Thickness
S = SOIC
T = TSSOP
Y = 2.0mm x 3.0mm UDFN
P = PDIP
U = VFBGA
WWU = Wafer Unsawn
AT93C46DN-SH-B
Device Organization
Package Variation (if applicable)
N = SOIC
Y6 = UDFN
U3 = VFBGA
D = User Selectable
E = 16 x 64 Only
Examples
Device Package Package
Drawing
Code
Package
Option
Organization Shipping
Carrier Option
Device Grade
AT93C46DN-SH-B SOIC SN S User Selectable Bulk (Tubes) Industrial
Temperature
(-40°C to 85°C)
AT93C46EN-SH-T SOIC SN S 16 X 64 Tape and Reel
AT93C46E-TH-B TSSOP ST T 16 X 64 Bulk (Tubes)
AT93C46D-TH-T TSSOP ST T User Selectable Tape and Reel
AT93C46DY6-YH-T UDFN Q4B Y User Selectable Tape and Reel
AT93C46DY6-YH-E UDFN Q4B Y User Selectable Extended Qty.,
Tape and Reel
AT93C46E-PU PDIP P P 16 X 64 Bulk (Tubes)
AT93C46DU3-UU-T VFBGA 8U3-1 U User Selectable Tape and Reel
Microchip Devices Code Protection Feature
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the
market today, when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of
these methods, to our knowledge, require using the Microchip products in a manner outside the
operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is
engaged in theft of intellectual property.
AT93C46D/AT93C46E
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 33
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their
code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the
code protection features of our products. Attempts to break Microchip’s code protection feature may be a
violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software
or other copyrighted work, you may have a right to sue for relief under that Act.
Legal Notice
Information contained in this publication regarding device applications and the like is provided only for
your convenience and may be superseded by updates. It is your responsibility to ensure that your
application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY
OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS
CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life
support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend,
indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting
from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual
property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks,
BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR,
HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB,
megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC,
picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC,
SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TempTrackr, TimeSource, tinyAVR,
UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed
Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge,
ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium,
TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController,
dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain,
Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient
Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE,
Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
AT93C46D/AT93C46E
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 34
The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2019, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-4748-1
AMBA, Arm, Arm7, Arm7TDMI, Arm9, Arm11, Artisan, big.LITTLE, Cordio, CoreLink, CoreSight, Cortex,
DesignStart, DynamIQ, Jazelle, Keil, Mali, Mbed, Mbed Enabled, NEON, POP, RealView, SecurCore,
Socrates, Thumb, TrustZone, ULINK, ULINK2, ULINK-ME, ULINK-PLUS, ULINKpro, µVision, Versatile
are trademarks or registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
Quality Management System
For information regarding Microchip’s Quality Management Systems, please visit http://
www.microchip.com/quality.
AT93C46D/AT93C46E
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 35
’8‘ MICFIDCHIP
AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/support
Web Address:
http://www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
Australia - Sydney
Tel: 61-2-9868-6733
China - Beijing
Tel: 86-10-8569-7000
China - Chengdu
Tel: 86-28-8665-5511
China - Chongqing
Tel: 86-23-8980-9588
China - Dongguan
Tel: 86-769-8702-9880
China - Guangzhou
Tel: 86-20-8755-8029
China - Hangzhou
Tel: 86-571-8792-8115
China - Hong Kong SAR
Tel: 852-2943-5100
China - Nanjing
Tel: 86-25-8473-2460
China - Qingdao
Tel: 86-532-8502-7355
China - Shanghai
Tel: 86-21-3326-8000
China - Shenyang
Tel: 86-24-2334-2829
China - Shenzhen
Tel: 86-755-8864-2200
China - Suzhou
Tel: 86-186-6233-1526
China - Wuhan
Tel: 86-27-5980-5300
China - Xian
Tel: 86-29-8833-7252
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
India - Bangalore
Tel: 91-80-3090-4444
India - New Delhi
Tel: 91-11-4160-8631
India - Pune
Tel: 91-20-4121-0141
Japan - Osaka
Tel: 81-6-6152-7160
Japan - Tokyo
Tel: 81-3-6880- 3770
Korea - Daegu
Tel: 82-53-744-4301
Korea - Seoul
Tel: 82-2-554-7200
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
Malaysia - Penang
Tel: 60-4-227-8870
Philippines - Manila
Tel: 63-2-634-9065
Singapore
Tel: 65-6334-8870
Taiwan - Hsin Chu
Tel: 886-3-577-8366
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Thailand - Bangkok
Tel: 66-2-694-1351
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Finland - Espoo
Tel: 358-9-4520-820
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-72400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-72884388
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
© 2019 Microchip Technology Inc. Datasheet DS20006224A-page 36