MB MCOIL™ Series Datasheet by Taiyo Yuden

Datasheet Feedback/Errors

Product Inlormallcm m mus cala‘og \s as a! wmp‘antab‘e medlea‘ devices ‘ TAIYD YUDEN 2021

▶ This catalog contains the typical speciﬁ cation only due to the limitation of space. When you consider the purchase of our products, please check our product speciﬁ cation sheets.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .

for General Electronic Equipment

REMINDERS

Notice for TAIYO YUDEN products

Please read this notice before using the TAIYO YUDEN products.

■Product Information in this Catalog

Product information in this catalog is as of October 2020. All of the

contents specified herein and production status of the products listed in

this catalog are subject to change without notice due to technical

improvement of our products, etc. Therefore, please check for the latest

information carefully before practical application or use of our products.

Please note that TAIYO YUDEN shall not be in any way responsible

for any damages and defects in products or equipment incorporating

our products, which are caused under the conditions other than those

specified in this catalog or individual product specification sheets.

■Approval of Product Specifications

Plea se contac t TAIYO YUDEN for fur the r details of p rodu ct

specifications as the individual product specification sheets are

available. When using our products, please be sure to approve our

product specifications or make a written agreement on the product

specification with TAIYO YUDEN in advance.

■Pre-Evaluation in the Actual Equipment and Conditions

Please conduct validation and verification of our products in actual

conditions of mounting and operating environment before using our

products.

■Limited Application

1. Equipment Intended for Use

The p roducts liste d in thi s cat alog are in te nde d for gene ral -

purpose and standard use in general electronic equipment (e.g.,

AV equipment, OA equipment, home electric appliances, office

equipment, information and communication equipment including,

without limitation, mobile phone, and PC) and other equipment

specified in this catalog or the individual product specification sheets.

TAIYO YUDEN has the line-up of the products intended for

use in automotive electronic equipment, telecommunications

infrastructure and industrial equipment, or medical devices

classified as GHTF Classes A to C (Japan Classes I to III).

Therefore, when using our p roducts for these e quipm ent,

please check available applications specified in this catalog

or the individual product specification sheets and use the

corresponding products.

2. Equipment Requiring Inquiry

Please be sure to contact TAIYO YUDEN for further information

before using the products listed in this catalog for the following

equipment (excluding intended equipment as specified in this

catalog or the individual product specification sheets) which may

cause loss of human life, bodily injury, serious property damage

and/or serious public impact due to a failure or defect of the

products and/or malfunction attributed thereto.

(1) Transportation equipment (automotive powertrain control

system, train control system, and ship control system, etc.)

(2) Traffic signal equipment

(3) Disaster prevention equipment, crime prevention equipment

(4) Medical devices classified as GHTF Class C (Japan Class III)

(5) Highly public information network equipment, data-

processing equipment (telephone exchange, and base

station, etc.)

(6) Any other equipment requiring high levels of quality and/or

reliability equal to the equipment listed above

3. Equipment Prohibited for Use

Please do not incorporate our products into the following

equipment requiring extremely high levels of safety and/or

reliability.

(1) Aerospace equipment (artificial satellite, rocket, etc.)

(2) Aviation equipment *1

(3) Medical devices classified as GHTF Class D (Japan Class IV),

implantable medical devices *

(4) Power generation control equipme nt (nuc lea r power,

hydroelectric power, thermal power plant control system, etc.)

(5) Undersea equipment (submarine repeating equipment,

underwater work equipment, etc.)

(6) Military equipment

(7) Any other equipment requiring extremely high levels of safety

and/or reliability equal to the equipment listed above

*Notes:

1. There is a possibility that our products can be used only

for aviation equipment that does not directly affect the safe

operation of aircraft (e.g., in-flight entertainment, cabin

light, electric seat, cooking equipment) if such use meets

requirements specified separately by TAIYO YUDEN. Please

be sure to contact TAIYO YUDEN for further information

before using our products for such aviation equipment.

2. Implantable medical devices contain not only internal unit

which is implanted in a body, but also external unit which is

connected to the internal unit.

4. Limitation of Liability

Please note that unless you obtain prior written consent of TAIYO

YUDEN, TAIYO YUDEN shall not be in any way responsible for

any damages incurred by you or third parties arising from use of

the products listed in this catalog for any equipment that is not

intended for use by TAIYO YUDEN, or any equipment requiring

inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN

as described above.

■Safety Design

When using our products for high safety and/or reliability-required

equipment or circuits, please fully perform safety and/or reliability

evaluation. In addition, please install (i) systems equipped with

a protection circuit and a protection device and/or (ii) systems

equipped with a redundant circuit or other system to prevent an

unsafe status in the event of a single fault for a failsafe design to

ensure safety.

■Intellectual Property Rights

Information contained in this catalog is intended to convey examples

of typical performances and/or applications of our products and is

not intended to make any warranty with respect to the intellectual

property rights or any other related rights of TAIYO YUDEN or any

third parties nor grant any license under such rights.

■Limited Warranty

Please note that the scope of warranty for our products is limited to

the delivered our products themselves and TAIYO YUDEN shall not

be in any way responsible for any damages resulting from a failure

or defect in our products. Notwithstanding the foregoing, if there is

a written agreement (e.g., supply and purchase agreement, quality

assurance agreement) signed by TAIYO YUDEN and your company,

TAIYO YUDEN will warrant our products in accordance with such

agreement.

■TAIYO YUDEN’s Official Sales Channel

The contents of this catalog are applicable to our products which are

purchased from our sales offices or authorized distributors (hereinafter

“TAIYO YUDEN’s official sales channel”). Please note that the contents

of this catalog are not applicable to our products purchased from any

seller other than TAIYO YUDEN’s official sales channel.

■Caution for Export

Some of our products listed in this catalog may require specific

procedures for export according to “U.S. Export Administration

Regulations”, “Foreign Exchange and Foreign Trade Control Law”

of Japan, and other applicable regulations. Should you have any

questions on this matter, please contact our sales staff.

January 2021. All of the

TAIYD YUDEN 2021

for General Electronic Equipment

▶Thiscatalogcontainsthetypicalspecificationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourproductspecificationsheets.

 Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourwebsite(http://www.ty-top.com/).

METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM MB SERIES）

i_wound_MB_e-E08R01.doc

METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOIL

MB SERIES）

REFLOW

■PARTS NUMBER * Operating Temp.：-40～+105℃（Including self-generated heat）

△

△＝Blank space

①

②

③

④

⑤

⑥

⑦

①Series name

Code Series name

MB Metal Wire-Wound chip power inductor

②Dimensions（T）

Code Dimensions（T）［mm］

KK 1.0

MK 1.2

③Dimensions（L×W）

Code Type（inch） Dimensions

（L×W）［mm］

1608 1608（0603） 1.6×0.8

2012 2012（0805） 2.0×1.25

2520 2520（1008） 2.5×2.0

④Packaging

Code Packaging

T Taping

⑤Nominal inductance

Code

（example） Nominal inductance［μH］

R24 0.24

1R0 1.0

4R7 4.7

※R＝Decimal point

⑥Inductance tolerance

Code Inductance tolerance

M ±20％

N ±30％

⑦Internal code

■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY

Recommended Land Patterns

Surface Mounting

・Mounting and soldering conditions should be checked beforehand.

・Applicable soldering process to these products is reflow soldering only.

Type A B C

1608 0.55 0.70 1.00

2012 0.60 1.00 1.45

2520 0.60 1.50 2.00

Unit：mm

Type L W T e Standard quantity［pcs］

Paper tape Embossed tape

MBKK1608 1.6±0.2

（0.063±0.008）

0.8±0.2

（0.031±0.008）

1.0 max

（0.040 max）

0.45±0.15

（0.016±0.006）－ 3000

MBKK2012 2.0±0.2

（0.079±0.008）

1.25±0.2

（0.049±0.008）

1.0 max

（0.040 max）

0.5±0.2

（0.020±0.008）－ 3000

MBMK2520 2.5±0.2

（0.098±0.008）

2.0±0.2

（0.079±0.008）

1.2 max

（0.047 max）

0.5±0.2

（0.020±0.008）－ 3000

Unit：mm（inch）

POWER INDUCTORS

INDUCTORS

TAIYD YUDEN 2021

 Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourwebsite(http://www.ty-top.com/).

for General Electronic Equipment

■PARTS NUMBER

●MBKK1608（0603） type 【Thickness：1.0mm max.】

Saturation current

Idc1

Temperature rise current

Idc2

MBKK1608TR24N RoHS 0.24 ±30％ - 0.049 1,650 2,300 1.0

MBKK1608TR47N RoHS 0.47 ±30％ - 0.104 1,100 1,400 1.0

MBKK1608TR68N RoHS 0.68 ±30％ - 0.120 950 1,200 1.0

MBKK1608T1R0M RoHS 1.0 ±20％ - 0.150 800 1,150 1.0

MBKK1608T1R5M RoHS 1.5 ±20％ - 0.200 650 1,000 1.0

MBKK1608T2R2M RoHS 2.2 ±20％ - 0.345 520 750 1.0

MBKK1608T3R3M RoHS 3.3 ±20％ - 0.512 450 600 1.0

MBKK1608T4R7M RoHS 4.7 ±20％ - 0.730 370 500 1.0

●MBKK2012（0805） type 【Thickness：1.0mm max.】

Saturation current

Idc1

Temperature rise current

Idc2

MBKK2012TR24N RoHS 0.24 ±30％ - 0.041 3,000 2,400 1.0

MBKK2012TR47N RoHS 0.47 ±30％ - 0.078 2,000 1,650 1.0

MBKK2012TR68N RoHS 0.68 ±30％ - 0.090 1,800 1,500 1.0

MBKK2012T1R0M RoHS 1.0 ±20％ - 0.106 1,500 1,450 1.0

MBKK2012T1R5M RoHS 1.5 ±20％ - 0.173 1,200 1,100 1.0

MBKK2012T2R2M RoHS 2.2 ±20％ - 0.290 900 850 1.0

MBKK2012T3R3M RoHS 3.3 ±20％ - 0.500 700 650 1.0

MBKK2012T4R7M RoHS 4.7 ±20％ - 0.615 600 600 1.0

●MBMK2520（1008） type 【Thickness：1.2mm max.】

Saturation current

Idc1

Temperature rise current

Idc2

MBMK2520TR24N RoHS 0.24 ±30％ - 0.026 4,750 3,500 1.0

MBMK2520TR47N RoHS 0.47 ±30％ - 0.042 3,900 2,600 1.0

MBMK2520TR68N RoHS 0.68 ±30％ - 0.058 3,150 2,150 1.0

MBMK2520T1R0M RoHS 1.0 ±20％ - 0.072 2,350 1,850 1.0

MBMK2520T1R5M RoHS 1.5 ±20％ - 0.106 2,050 1,500 1.0

MBMK2520T2R2M RoHS 2.2 ±20％ - 0.159 1,800 1,250 1.0

MBMK2520T3R3M RoHS 3.3 ±20％ - 0.260 1,400 970 1.0

MBMK2520T4R7M RoHS 4.7 ±20％ - 0.380 1,150 800 1.0

※）The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)

※）The temperature rise current value (Idc2) is the DC current value having temperature increase by 40℃. (at 20℃)

※）The rated current value is following either Idc1 or Idc2, which is the lower one.

Rated current　※）　［ｍA］（max.） Measuring

frequency［MHz］

Parts number EHS Nominal inductance

［μH］ Inductance tolerance

Self-resonant

frequency

［MHｚ］（min.）

DC Resistance

［Ω］（max.）

Self-resonant

frequency

［MHｚ］（min.）

DC Resistance

［Ω］（max.）

Rated current　※）　［ｍA］（max.） Measuring

frequency［MHz］

Parts number EHS Nominal inductance

［μH］ Inductance tolerance

Self-resonant

frequency

［MHｚ］（min.）

DC Resistance

［Ω］（max.）

Rated current　※）　［ｍA］（max.） Measuring

frequency［MHz］

Parts number EHS Nominal inductance

［μH］ Inductance tolerance

i_wound_MB_e-E08R01.xls

POWER INDUCTORS

INDUCTORS

F m“ Sprocket hole W E m a E \ Base tape Chip cavity m OOOOOO Blank porlions Chip cavity Blank portions Leader 000000 CO DEN] ..... DI. ........ ID... "DEC ‘60 10 320mm 150 to 200 mm (6 31012 6 inch) (6 3 m 7,9 inch) 40010 560 mm Direction of tape feed :15 7 ‘0 22-0 Inch) TAIYD YUDEN

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

i_wound_MB_pack_e-E06R01

METAL WIRE-WOUND CHIP POWER INDUCTORS

(MCOILTM MB SERIES／MCOILTM MB-H SERIES)

■PACKAGING

①Minimum Quantity

Type Standard Quantity [pcs]

Tape ＆ Reel

MBKK1608／MBKK1608H 3000

MBKK2012 3000

MBMK2520／MBMK2520H 3000

②Tape Material

●Embossed Tape

Top tape

Base tape

Sprocket hole

Chip cavity

Chip

Chip Filled

③Taping dimensions

●Embossed tape 8mm wide (0.315 inches wide)

2.0±0.05

(0.079±0.002)

4.0±0.1

(0.157±0.004)

1.75±0.1

(0.069±0.004）

3.5±0.1

(0.138±0.004)

8.0±0.2

(0.315±0.008)

φ1.5＋0.1/－0

(φ0.059＋0.004/-0)

Sprocket hole

Electrode（bottom view）

Type Chip cavity Insertion pitch Tape thickness

A B F T K

MBKK1608／MBKK1608H 1.1

(0.043)

1.9

(0.075)

4.0±0.1

(0.157±0.004)

0.25±0.05

(0.010±0.002)

1.2 max

(0.047 max)

MBKK2012 1.45

(0.057)

2.2

(0.087)

4.0±0.1

(0.157±0.004)

0.25±0.05

(0.010±0.002)

1.2 max

(0.047 max)

MBMK2520／MBMK2520H 2.3

(0.091)

2.8

(0.110)

4.0±0.1

(0.157±0.004)

0.3±0.05

(0.012±0.002)

1.45 max

(0.057 max)

Unit：mm（inch）

④Leader and Blank portion

‘0 D _ I > e e ; 2-5 or Iess m'nwmhes ‘ > ._or less) 165n~130v _F‘"'f’ire_c1k31‘ Too tape / \ﬂrI-ﬁ, —% BEE ‘aDe TAIYO YUDEN

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

i_wound_MB_pack_e-E06R01

⑤Reel size

Type Reel size (Reference values)

φD φd W

MBKK1608／MBKK1608H 180+0/-3

（7.087+0/-0.118）

60+1/-0

（2.36+0.039/0）

10.0±1.5

（0.394±0.059）

MBKK2012

MBMK2520／MBMK2520H

Unit：mm（inch）

⑥Top Tape Strength

The top The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below.

TAIYO YUDEN

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

i_wound_MB_reli_e-E06R01

METAL WIRE-WOUND CHIP POWER INDUCTORS

(MCOIL

TM MB SERIES／MCOILTM MB-H SERIES)

■RELIABILITY DATA

1. Operating Temperature Range

Specified Value MB series －40～＋105℃

MB-H series －40～＋125℃

Test Methods and

Remarks Including self-generated heat

2. Storage Temperature Range

Specified Value MB series －40～＋85℃

MB-H series

Test Methods and

Remarks 0 to 40℃ for the product with taping.

3. Rated current

Specified Value MB series Within the specified tolerance

MB-H series

4. Inductance

Specified Value MB series Within the specified tolerance

MB-H series

Test Methods and

Remarks

Measuring equipment : LCR Meter （HP 4285A or equivalent）

Measuring frequency : 1MHz、1V

5. DC Resistance

Specified Value MB series Within the specified tolerance

MB-H series

Test Methods and

Remarks Measuring equipment : DC ohmmeter （HIOKI 3227 or equivalent）

6. Self resonance frequency

Specified Value MB series －

MB-H series

7. Temperature characteristic

Specified Value MB series Inductance change : Within ±15%

MB-H series

Test Methods and

Remarks

MB series :

Measurement of inductance shall be taken at temperature range within －40℃～＋105℃.

With reference to inductance value at ＋20℃., change rate shall be calculated.

MB-H series :

Measurement of inductance shall be taken at temperature range within －40℃～＋125℃.

With reference to inductance value at ＋20℃., change rate shall be calculated.

Farce Rod } am ‘ W—m—v Veslsamma ‘ hymn." 45+2mm 4—» R5 TAIYO YUDEN

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

i_wound_MB_reli_e-E06R01

8. Resistance to flexure of substrate

Specified Value MB series No damage

MB-H series

Test Methods and

Remarks

The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating

until deflection of the test board reaches to 2 mm.

Test board size : 100×40×1.0 mm (1608：0.8mm)

Test board material : Glass epoxy-resin

Solder cream thickness : 0.1 mm

9. Insulation resistance : between wires

Specified Value MB series －

MB-H series

10. Insulation resistance : between wire and core

Specified Value MB series DC25V 100kΩ min

MB-H series DC50V 100kΩ min

11. Withstanding voltage : between wire and core

Specified Value MB series －

MB-H series

12. Adhesion of terminal electrode

Specified Value MB series No abnormality.

MB-H series

Test Methods and

Remarks

The test samples shall be soldered to the test board by the reflow.

Applied force : 10N (1608：5N) to X and Y directions.

Duration : 5s.

Solder cream thickness : 0.1mm.

13. Resistance to vibration

Specified Value MB series Inductance change : Within ±10%

No significant abnormality in appearance.

MB-H series

Test Methods and

Remarks

The test samples shall be soldered to the test board by the reflow.

Then it shall be submitted to below test conditions.

Frequency Range 10～55Hz

Total Amplitude 1.5mm (May not exceed acceleration 196m/s2)

Sweeping Method 10Hz to 55Hz to 10Hz for 1min.

Time

For 2 hours on each X, Y, and Z axis. Y

Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.

14. Solderability

Specified Value MB series At least 90％ of surface of terminal electrode is covered by new solder.

MB-H series

Test Methods and

Remarks

The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.

Flux : Methanol solution containing rosin 25%.

Solder Temperature 245±5℃

Immersing speed 25mm/s

Time 5±0.5 sec.

※Immersion depth : All sides of mounting terminal shall be immersed.

TAIYO YUDEN

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

i_wound_MB_reli_e-E06R01

15. Resistance to soldering heat

Specified Value MB series Inductance change : Within ±10%

No significant abnormality in appearance.

MB-H series

Test Methods and

Remarks

The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 3 times.

Test board material : Glass epoxy-resin

Test board thickness : 1.0mm

Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.

16. Thermal shock

Specified Value MB series Inductance change : Within ±10%

No significant abnormality in appearance.

MB-H series

Test Methods and

Remarks

MB series:

The test samples shall be soldered to the test board by the reflow.

The test samples shall be placed at specified temperature for

specified time by step 1 to step 4 as shown in below table in

sequence. The temperature cycle shall be repeated 100 cycles.

Conditions of 1 cycle

Step Temperature (℃) Duration (min)

1 －40±3 30±3

2 Room temperature Within 3

3 ＋85±2 30±3

4 Room temperature Within 3

Recovery : At least 2hrs of recovery under the standard condition

after the test, followed by the measurement within 48hrs.

MB-H series:

The test samples shall be soldered to the test board by the reflow.

The test samples shall be placed at specified temperature for

specified time by step 1 to step 4 as shown in below table in

sequence. The temperature cycle shall be repeated 100 cycles.

Conditions of 1 cycle

Step Temperature (℃) Duration (min)

1 －40±3 30±3

2 Room temperature Within 3

3 ＋125±2 30±3

4 Room temperature Within 3

Recovery : At least 2hrs of recovery under the standard condition

after the test, followed by the measurement within 48hrs.

17. Damp heat

Specified Value MB series Inductance change : Within ±10%

No significant abnormality in appearance.

MB-H series

Test Methods and

Remarks

MB series:

The test samples shall be soldered to the test board by the reflow.

The test samples shall be placed in thermostatic oven set at

specified temperature and humidity as shown in below table.

Temperature 60±2℃

Humidity 90～95%RH

Time 1000＋24/－0 hour

Recovery : At least 2hrs of recovery under the standard condition

after the test, followed by the measurement within 48hrs.

MB-H series:

The test samples shall be soldered to the test board by the reflow.

The test samples shall be placed in thermostatic oven set at

specified temperature and humidity as shown in below table.

Temperature 85±2℃

Humidity 85%RH

Time 1000＋24/－0 hour

Recovery : At least 2hrs of recovery under the standard condition

after the test, followed by the measurement within 48hrs.

18. Loading under damp heat

Specified Value MB series Inductance change : Within ±10%

No significant abnormality in appearance.

MB-H series

Test Methods and

Remarks

MB series:

The test samples shall be soldered to the test board by the reflow.

The test samples shall be placed in thermostatic oven set at

specified temperature and humidity and applied the rated current

continuously as shown in below table.

Temperature 60±2℃

Humidity 90～95％RH

Applied current Rated current

Time 1000＋24/－0 hour

Recovery : At least 2hrs of recovery under the standard condition

after the test, followed by the measurement within 48hrs.

MB-H series:

The test samples shall be soldered to the test board by the reflow.

The test samples shall be placed in thermostatic oven set at

specified temperature and humidity and applied the rated current

continuously as shown in below table.

Temperature 85±2℃

Humidity 85％RH

Applied current Rated current

Time 1000＋24/－0 hour

Recovery : At least 2hrs of recovery under the standard condition

after the test, followed by the measurement within 48hrs.

19. Low temperature life test

Specified Value MB series Inductance change : Within ±10%

No significant abnormality in appearance.

MB-H series

Test Methods and

Remarks

The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown

in below table.

Temperature －40±2℃

Time 1000＋24/－0 hour

Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.

TAIYO YUDEN

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

i_wound_MB_reli_e-E06R01

20. High temperature life test

Specified Value MB series Inductance change : Within ±10%

No significant abnormality in appearance.

MB-H series

Test Methods and

Remarks

The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown

in below table.

Temperature 85±2℃

Time 1000＋24/－0 hour

Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.

21. Loading at high temperature life test

Specified Value MB series －

MB-H series

22. Standard condition

Specified Value

MB series Standard test condition :

Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.

When there is any question concerning measurement result: In order to provide correlation

data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.

Inductance is in accordance with our measured value.

MB-H series

TAIYO YUDEN

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

i_wound_MB_prec_e-E06R01

METAL WIRE-WOUND CHIP POWER INDUCTORS

(MCOIL

TM MB SERIES／MCOILTM MB-H SERIES)

■PRECAUTIONS

1. Circuit Design

Precautions

◆Operating environment

1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,

telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical

equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear

control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or

damage. For such uses, contact TAIYO YUDEN Sales Department in advance.

2. PCB Design

Precautions ◆Land pattern design

1. Please refer to a recommended land pattern.

Technical

considerations

◆Land pattern design

Surface Mounting

・ Mounting and soldering conditions should be checked beforehand.

・ Applicable soldering process to this products is reflow soldering only.

3. Considerations for automatic placement

Precautions

◆Adjustment of mounting machine

1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.

2. Mounting and soldering conditions should be checked beforehand.

Technical

considerations

◆Adjustment of mounting machine

1. When installing products, care should be taken not to apply distortion stress as it may deform the products.

4. Soldering

Precautions

◆Reflow soldering

1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.

2. The product shall be used reflow soldering only.

3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.

◆Lead free soldering

1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering

heat, soldering etc sufficiently.

Technical

considerations

◆Reflow soldering

1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently

degrade the reliability of the products.

Recommended reflow condition (Pb free solder)

5sec max

40sec max

230℃ min

90±30sec

Peak：260+0/-5℃

150～180

Heating Time［sec］

300

200

100

Temperature［℃］

5. Cleaning

Precautions ◆Cleaning conditions

1. Washing by supersonic waves shall be avoided.

Technical

considerations

◆Cleaning conditions

1. If washed by supersonic waves, the products might be broken.

TAIYO YUDEN

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

i_wound_MB_prec_e-E06R01

6. Handling

Precautions

◆Handling

1. Keep the product away from all magnets and magnetic objects.

◆Breakaway PC boards (splitting along perforations)

1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.

2. Board separation should not be done manually, but by using the appropriate devices.

◆Mechanical considerations

1. Please do not give the product any excessive mechanical shocks.

2. Please do not add any shock and power to a product in transportation.

◆Pick-up pressure

1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.

◆Packing

1. Please avoid accumulation of a packing box as much as possible.

Technical

considerations

◆Handling

1. There is a case that a characteristic varies with magnetic influence.

◆Breakaway PC boards (splitting along perforations)

1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.

◆Mechanical considerations

1. There is a case to be damaged by a mechanical shock.

2. There is a case to be broken by the handling in transportation.

◆Pick-up pressure

1. Damage and a characteristic can vary with an excessive shock or stress.

◆Packing

1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.

7. Storage conditions

Precautions

◆Storage

1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the

storage area should be controlled.

・ Recommended conditions

Ambient temperature : 0～40℃

Humidity : Below 70% RH

・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may

decrease as time passes.

For this reason, product should be used within 6 months from the time of delivery.

In case of storage over 6 months, solderability shall be checked before actual usage.

Technical

considerations

◆Storage

1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes

and deterioration of taping/packaging materials may take place.

MB MCOIL™ Series Datasheet by Taiyo Yuden

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