WP3A10YD Datasheet by Kingbright

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© 2021 Kingbright. All Rights Reserved. Spec No: DSAL0494 / 1101029027 Rev No: V.9B Date: 04/21/2021
Page 1 / 5
DESCRIPTION
The Yellow source color devices are made with
Gallium Arsenide Phosphide on Gallium Phosphide
Yellow Light Emitting Diode
FEATURES
Low power consumption
Popular T-1 diameter package
General purpose leads
Reliable and rugged
Long life - solid state reliability
Available on tape and reel
RoHS compliant
APPLICATIONS
Status indicator
Illuminator
Signage applications
Decorative and entertainment lighting
Commercial and residential architectural lighting
PACKAGE DIMENSIONS
WP3A10YD
T-1 (3mm) Solid State Lamp
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the leads emerge from the package.
4. The specifications, characteristics and technical data described in the datasheet are subject to change
without prior notice.
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
3. Luminous intensity value is traceable to CIE127-2007 standards.
SELECTION GUIDE
Part Number
Emitting Color
(Material)
Lens Type
Iv (mcd) @ 10mA
[2]
Viewing Angle
[1]
Min. Typ. 2θ1/2
WP3A10YD
Yellow (GaAsP/GaP) Yellow Diffused 8 15 60°
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© 2021 Kingbright. All Rights Reserved. Spec No: DSAL0494 / 1101029027 Rev No: V.9B Date: 04/21/2021
Page 2 / 5
ABSOLUTE MAXIMUM RATINGS at T
A
=25°C
ELECTRICAL / OPTICAL CHARACTERISTICS at T
A
=25°C
WP3A10YD
Parameter Symbol Emitting Color
Value
Unit
Typ. Max.
Wavelength at Peak Emission I
F
= 10mA λ
peak
Yellow 590 - nm
Dominant Wavelength I
F
= 10mA λ
dom
[1]
Yellow 588 - nm
Spectral Bandwidth at 50% Φ
REL MAX
I
F
= 10mA ∆λ
Yellow 35 - nm
Capacitance C Yellow 20 - pF
Forward Voltage I
F
= 10mA V
F
[2]
Yellow 1.95 2.4 V
Reverse Current (V
R
= 5V) I
R
Yellow - 10 µA
Temperature Coefficient of λ
peak
I
F
= 10mA, -10°C T 85°C TC
λpeak
Yellow 0.12 - nm/°C
Temperature Coefficient of λ
dom
I
F
= 10mA, -10°C T 85°C TC
λdom
Yellow 0.07 - nm/°C
Temperature Coefficient of V
F
I
F
= 10mA, -10°C T 85°C TC
V
Yellow -2 - mV/°C
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
Parameter
Symbol
Value
Unit
Power Dissipation P
D
75 mW
Reverse Voltage V
R
5 V
Junction Temperature
T
j
110 °C
Operating Temperature T
op
-40 To +85 °C
Storage Temperature T
stg
-40 To +85 °C
DC Forward Current I
F
30 mA
Peak Forward Current I
FM
[1]
140 mA
Electrostatic Discharge Threshold (HBM)
-
8000 V
Lead Solder Temperature
[3]
260°C For 3 Seconds
Lead Solder Temperature
[4]
260°C For 5 Seconds
Thermal Resistance (Junction / Ambient) R
th
JA
[2]
640 °C/W
Thermal Resistance (Junction / Solder point) R
th
JS
[2]
400 °C/W
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. R
t h
JA
,R
t h
JS
Results from mounting on PC board FR4 (pad size 16 mm
2
per pad).
3. 2mm below package base.
4. 5mm below package base.
5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
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© 2021 Kingbright. All Rights Reserved. Spec No: DSAL0494 / 1101029027 Rev No: V.9B Date: 04/21/2021
Page 3 / 5
0%
20%
40%
60%
80%
100%
350 400 450 500 550 600 650 700 750 800
T
a
= 25 °C
Yellow
Wavelength (nm)
Relative Intensity (a. u.)
TECHNICAL DATA
RELATIVE INTENSITY vs. WAVELENGTH
YELLOW
WP3A10YD
RECOMMENDED WAVE SOLDERING PROFILE
Notes:
1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple
attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath
temperature of 260°C
2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max).
3. Do not apply stress to the epoxy resin while the temperature is above 85°C.
4. Fixtures should not incur stress on the component when mounting and during soldering process.
5. SAC 305 solder alloy is recommended.
6. No more than one wave soldering pass.
PACKING & LABEL SPECIFICATIONS
0
4
8
12
16
20
1.5 1.7 1.9 2.1 2.3 2.5
T
a
= 25 °C
Forward voltage (V)
Forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
0 4 8 12 16 20
T
a
= 25 °C
Forward current (mA)
Luminous intensity normalised
at 10mA
0
10
20
30
40
50
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
Permissible forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
Luminous intensity normalised
at Ta = 25 °C
Forward Current vs.
Forward Voltage
Luminous Intensity vs.
Forward Current
Forward Current Derating Curve
Luminous Intensity vs.
Ambient Temperature
0.5 0.50.0
-90°
-75°
-60°
-45°
-30°
-15°
75°
60°
45°
30°
15°
90°
1.0 1.0
T
a
= 25 °C
SPATIAL DISTRIBUTION
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© 2021 Kingbright. All Rights Reserved. Spec No: DSAL0494 / 1101029027 Rev No: V.9B Date: 04/21/2021
Page 4 / 5
WP3A10YD
PRECAUTIONS
Storage conditions
1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient
temperature.
2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%.
3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.
Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.
2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.
Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the
internal structures and cause failure.
3. Use stand-offs
(Fig.1)
or spacers
(Fig.2)
to securely position the LED above the PCB.
4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead
bend
(Fig. 3 ,Fig. 4)
.
5. During lead forming, use tools or jigs to hold the leads securely so that the bending force
will not be transmitted to the LED lens and its internal structures. Do not perform lead
forming once the component has been mounted onto the PCB.
(Fig. 5 )
LED Mounting Method
1. The lead pitch of the LED must match the
pitch of the mounting holes on the PCB
during component placement.
Lead-forming may be required to insure
the lead pitch matches the hole pitch.
Refer to the figure below for proper lead
forming procedures.
Note 1-3: Do not route PCB trace in the contact area between the
leadframe and the PCB to prevent short-circuits.
"
"
Correct mounting method
" x "
Incorrect mounting method
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© 2021 Kingbright. All Rights Reserved. Spec No: DSAL0494 / 1101029027 Rev No: V.9B Date: 04/21/2021
Page 5 / 5
WP3A10YD
Lead Forming Procedures
1. Do not bend the leads more than twice.
(Fig. 6 )
2. During soldering, component covers and holders should leave
clearance to avoid placing damaging stress on the LED during
soldering.
(Fig. 7)
3. The tip of the soldering iron should never touch the lens epoxy.
4. Through-hole LEDs are incompatible with reflow soldering.
5. If the LED will undergo multiple soldering passes or face other
processes where the part may be subjected to intense heat,
please check with Kingbright for compatibility.
PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes