XLamp® XM Family LED Binning, Labeling Datasheet by CreeLED, Inc.

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SOLDERING & HANDLING
Copyright © 2010-2021 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo,
XLamp® and XM-L® are registered trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a
specification. For product specifications, please see the data sheets available at www.cree-led.com. For warranty information, please contact Cree
Sales at sales@cree.com. Other trademarks, product and company names are the property of their respective owners and do not imply specific product
and/or vendor endorsement, sponsorship or association.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
WWW.CREE.COM/XLAMP
CLD-AP54 REV 13
Cree® XLamp® XM Family LED
INTRODUCTION
This application note applies to XLamp® XM Family LEDs, which
have order codes in the following format:
XMxxxx-xx-xxxx-xxxxxxxxx
This application note explains how XLamp XM Family LEDs and
assemblies containing these LEDs should be handled during
manufacturing. Please read the entire document to understand
how to properly handle XLamp XM Family LEDs.
TABLE OF CONTENTS
Handling XLamp® XM Family LEDs ............................................. 2
Circuit Board Preparation & Layouts ........................................... 4
Case Temperature (Ts) Measurement Point ............................... 6
Notes on Soldering XLamp® XM Family LEDs ........................... 6
Moisture Sensitivity ..................................................................... 8
Low Temperature Operation ........................................................ 8
XLamp® XM Family LED Reflow Soldering Characteristics ....... 9
Chemicals & Conformal Coatings ............................................. 10
Assembly Storage & Handling ................................................... 11
Tape and Reel ............................................................................. 12
Packaging & Labels ................................................................... 13
Copyright © 2010-2021 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and XM-L® are registered trademarks of Cree, Inc. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree-led.com. For warranty information,
please contact Cree Sales at sales@cree.com. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement,
sponsorship or association. 2
XLAMP® XM FAMILY LED SOLDERING & HANDLING
22
HANDLING XLAMP® XM FAMILY LEDS
Manual Handling
Use tweezers to grab XLamp XM Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers. Do
not push on the lens.
Cree recommends the following at all times when handling XLamp XM Family LEDs or assemblies containing these LEDs:
Avoid putting mechanical stress on the LED lens.
Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect
the optical performance of the LED.
Cree recommends always handling XM family LEDs with appropriate ESD grounding.
Cree recommends handling XM family LEDs wearing clean, lint-free gloves.
Whenever possible, Cree recommends the use of a pick & place tool to remove XLamp XM Family LEDs from the factory tape and reel
packaging.
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CORRECT
— Jam Mean
Copyright © 2010-2021 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and XM-L® are registered trademarks of Cree, Inc. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree-led.com. For warranty information,
please contact Cree Sales at sales@cree.com. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement,
sponsorship or association. 3
XLAMP® XM FAMILY LED SOLDERING & HANDLING
33
HANDLING XLAMP® XM FAMILY LEDS (CONTINUED)
Pick & Place Nozzle
The following diagram shows an example of a pick & place tool to remove XM family LEDs from the factory tape and reel packaging.
For pick and place nozzles coming into contact with silicone-covered LED components, Cree recommends nozzles be constructed of
non-metallic materials.
All dimensions in mm
Tolerance: + 0.01 mm
if? Paw la 2% m f“ 50 m ”a ;4 T\ B flg“ L25
Copyright © 2010-2021 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and XM-L® are registered trademarks of Cree, Inc. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree-led.com. For warranty information,
please contact Cree Sales at sales@cree.com. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement,
sponsorship or association. 4
XLAMP® XM FAMILY LED SOLDERING & HANDLING
44
CIRCUIT BOARD PREPARATION & LAYOUTS
Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or
soldering XLamp XM Family LEDs onto the PCB. The diagrams below show the recommended PCB solder pad layout for XLamp XM
Family LEDs.
All dimensions in mm
Tolerance: + 0.13 mm
XM-L2, XM-L2 EZW
XM-L® Color
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone (919) 313-5300
Fax (919) 313-5558
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT
THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °
.XXX ± .25
.XX ± .75
.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125
X° ± .5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
1.6
5.00
5.00
R2.26
3.02
0.73
.50
3.78
2.78
4.78
4.78
.50
4.78
.80
.50
.25
.80
.25
.97
4.78
.50
.50
2.78
4.78
4.78
1/116.000
B
2610-00032
OUTLINE DRAWING, 5050 XMLB
--
--
----
----
11/14/12D. CRONIN
REVISONS
REV DESCRIPTION BY DATE APP'D
RECOMMENDED PCB SOLDER PAD
RECOMMENDED STENCIL PATTERN
(HATCHED AREA IS OPENING)
ALL DIMENSIONS ARE ± .13MM UNLESS OTHERWISE NOTED
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone (919) 313-5300
Fax (919) 313-5558
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT
THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °
.XXX ± .25
.XX ± .75
.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125
X° ± .5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
1.6
5.00
5.00
R2.26
3.02
0.73
.50
3.78
2.78
4.78
4.78
.50
4.78
.80
.50
.25
.80
.25
.97
4.78
.50
.50
2.78
4.78
4.78
1/116.000
B
2610-00032
OUTLINE DRAWING, 5050 XMLB
--
--
----
----
11/14/12D. CRONIN
REVISONS
REV DESCRIPTION BY DATE APP'D
RECOMMENDED PCB SOLDER PAD
RECOMMENDED STENCIL PATTERN
(HATCHED AREA IS OPENING)
ALL DIMENSIONS ARE ± .13MM UNLESS OTHERWISE NOTED
Recommended PCB Solder Pad Recommended Stencil Pattern
(Shaded Area Is Open)
Recommended PCB Solder Pad Recommended Stencil Pattern
(Shaded Area Is Open)
fl W m jumuni fllfi munhfl T m;
Copyright © 2010-2021 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and XM-L® are registered trademarks of Cree, Inc. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree-led.com. For warranty information,
please contact Cree Sales at sales@cree.com. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement,
sponsorship or association. 5
XLAMP® XM FAMILY LED SOLDERING & HANDLING
CIRCUIT BOARD PREPARATION & LAYOUTS - CONTINUED
XM-L3
Recommended Copper Layout Recommended Solder Pad
(Solder Mask Pattern)
Recommended Stencil Openings* Optional Stencil Openings*
Notes:
Cree recommends using thermal pad kickouts to maximize component thermal performance.
Cree recommends using white solder mask material to minimize system optical loss.
* This stencil has been tested and optimized for the avoidance of voiding when using ALPHA® LUMET® P30 Maxrel solder paste. For
other solder pastes, a “window pane” design for the thermal pad stencil may result in a lower voiding percentage. Contact your local
Cree Field Applications Engineer for consultation regarding your specific application.
Copyright © 2010-2021 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and XM-L® are registered trademarks of Cree, Inc. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree-led.com. For warranty information,
please contact Cree Sales at sales@cree.com. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement,
sponsorship or association. 6
XLAMP® XM FAMILY LED SOLDERING & HANDLING
66
CASE TEMPERATURE (TS) MEASUREMENT POINT
XLamp XM Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This
measurement point is shown in the picture below.
XM-L2, XM-L2 EZW XM-L Color XM-L3
It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XM Family LED itself. In testing, Cree has found
such a solder pad to have insignificant impact on the resulting Ts measurement.
NOTES ON SOLDERING XLAMP® XM FAMILY LEDS
XLamp XM Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the
PCB on a hotplate and following the reflow soldering profile listed on page 9.
Do not wave solder XLamp XM Family LEDs. Do not hand solder XLamp XM Family LEDs.
P
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Notes on Soldering XLamp XP Family LEDs
XLamp XP Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or
by placing the PCB on a hotplate and following the reflow soldering profile listed on the previous page.
Do not wave solder XLamp XP Family LEDs. Do not hand solder XLamp XP Family LEDs.
Solder Paste Type
Cree strongly recommends using “no clean” solder paste with XLamp XP Family LEDs so that cleaning the PCB after
reflow soldering is not required. Cree uses the following solder paste internally:
Indium Corporation of America® Part number 82676
Sn62/Pb36/Ag2 composition
Flux: NC-SMQ92J
Cree recommends the following solder paste compositions: SnPbAg, SnAgCu and SnAg.
Solder Paste Thickness
The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results,
an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder
thickness that results in a 3-mil (75-μm) bond line.
X
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P
CORRECT
P
CORRECT
X
WRONG
P
CORRECT
This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the
data sheets available at www.cree.com. For warranty information, please contact Cree Sales at sales@cree.com.
Copyright © 2008-2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo
and XLamp are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners
and do not imply specific product and/or vendor endorsement, sponsorship or association.
4CLD-AP25 Rev 3
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com/xlamp
X
WRONG
Copyright © 2010-2021 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and XM-L® are registered trademarks of Cree, Inc. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree-led.com. For warranty information,
please contact Cree Sales at sales@cree.com. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement,
sponsorship or association. 7
XLAMP® XM FAMILY LED SOLDERING & HANDLING
Solder Paste Type
Cree strongly recommends using “no clean” solder paste with XLamp XM Family LEDs so that cleaning the PCB after reflow soldering is
not required. Cree uses Kester® R276 solder paste internally.
Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).
Solder Paste Thickness
The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated
dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil
(102-μm) bond line, i.e., the solder joint thickness after reflow soldering.
After Soldering
After soldering, allow XLamp XM Family LEDs to return to room temperature before subsequent handling. Premature handling of the
device, especially around the lens, could result in damage to the LED.
Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. After
shearing selected devices from the circuit board the solder should appear completely re-flowed (no solder grains evident). The solder
areas should show minimum evidence of voids on the backside of the package and the PCB.
Cleaning PCBs After Soldering
Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary,
Cree recommends the use of isopropyl alcohol (IPA).
Do not use ultrasonic cleaning.
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NOTES ON SOLDERING XLAMP® XM FAMILY LEDS (CONTINUED)
Copyright © 2010-2021 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and XM-L® are registered trademarks of Cree, Inc. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree-led.com. For warranty information,
please contact Cree Sales at sales@cree.com. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement,
sponsorship or association. 8
XLAMP® XM FAMILY LED SOLDERING & HANDLING
MOISTURE SENSITIVITY
Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.
Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp XM Family LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life
in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of the storage condition, Cree recommends sealing any unsoldered LEDs
in the original MBP.
LOW TEMPERATURE OPERATION
The minimum operating temperature of these XLamp LED components is -40 °C. To maximize lifetime, Cree recommends avoiding
applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0°C.
IPC/J EDEC J-STD-OZOC
Copyright © 2010-2021 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and XM-L® are registered trademarks of Cree, Inc. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree-led.com. For warranty information,
please contact Cree Sales at sales@cree.com. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement,
sponsorship or association. 9
XLAMP® XM FAMILY LED SOLDERING & HANDLING
XLAMP® XM FAMILY LED REFLOW SOLDERING CHARACTERISTICS
In testing, Cree has found XLamp XM Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a
general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder
paste used, and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
Profile Feature Lead-Free Solder
Average Ramp-Up Rate (Tsmax to Tp)1.2°C/second
Preheat: Temperature Min (Tsmin) 120 °C
Preheat: Temperature Max (Tsmax)170 °C
Preheat: Time (tsmin to tsmax) 65-150 seconds
Time Maintained Above: Temperature (TL)217 °C
Time Maintained Above: Time (tL) 45-90 seconds
Peak/Classification Temperature (Tp) 235 - 245 °C
Time Within 5°C of Actual Peak Temperature (tp) 20-40 seconds
Ramp-Down Rate 1 - 6 °C/second
Time 25°C to Peak Temperature 4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Note: While the high reflow temperatures (above) have been approved, Crees best practice guideline for reflow is to use as low a
temperature as possible during the reflow soldering process for these LEDs.
TP
TL
Temperature
Time
t 25˚C to Peak
Preheat
ts
tS
tP
25
Ramp-down
Ramp-up
Critical Zone
TL to TP
Tsmax
Tsmin
Copyright © 2010-2021 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and XM-L® are registered trademarks of Cree, Inc. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree-led.com. For warranty information,
please contact Cree Sales at sales@cree.com. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement,
sponsorship or association. 10
XLAMP® XM FAMILY LED SOLDERING & HANDLING
CHEMICALS & CONFORMAL COATINGS
Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and
current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application
Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of
chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer.
Recommended Cleaning Solutions
Cree has found the following chemicals to be safe to use with XLamp XM Family LEDs.
Water
Isopropyl alcohol (IPA)
Chemicals Tested as Harmful
In general, subject to the specifics in Crees Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to
XLamp XM Family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp XM Family LEDs.
The fumes from even small amounts of the chemicals may damage the LEDs.
Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)
Methyl acetate or ethyl acetate (i.e., nail polish remover)
Cyanoacrylates (i.e., “Superglue”)
Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether)
Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive)
Hermetically Sealing Luminaires
For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment
that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically
sealing LEDs in an enclosed space is not recommended.
Copyright © 2010-2021 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and XM-L® are registered trademarks of Cree, Inc. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree-led.com. For warranty information,
please contact Cree Sales at sales@cree.com. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement,
sponsorship or association. 11
XLAMP® XM FAMILY LED SOLDERING & HANDLING
ASSEMBLY STORAGE & HANDLING
Do not stack PCBs or assemblies containing XLamp XM Family LEDs so that anything rests on the LED lens. Force applied to the LED lens
may result in the lens being knocked off. PCBs or assemblies containing XLamp XM Family LEDs should be stacked in a way to allow at
least 1-cm clearance above the LED lens.
Do not use bubble wrap directly on top of XLamp XM Family LEDs. Force from the bubble wrap can potentially damage the LED.
P
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Copyright © 2010-2021 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and XM-L® are registered trademarks of Cree, Inc. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree-led.com. For warranty information,
please contact Cree Sales at sales@cree.com. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement,
sponsorship or association. 12
XLAMP® XM FAMILY LED SOLDERING & HANDLING
TAPE AND REEL
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
Except as noted, all dimensions in mm.
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
± .5 °
.XXX ± .010
.XX ± .03
.X ± .06
FOR SHEET METAL PARTS ONLY
.XX ± .01
.XXX ± .005
± .5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone (919) 313-5300
Fax (919) 313-5558
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTANED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
SURFACE FINISH:
63
330
+.25
-.75
12.4
+1.0
-.5
MEASURED AT EDGE
16.4
+0.2
.0
MEASURED AT HUB
12.4
+.2
.0
MEASURED AT HUB
±.213.1
1.9±.4
±.421
60° 60°
1/10.500
A
2400-00009
REEL, 13" X 12MM, 3 PIECE SNAP
-
ANTI-STATIC HIPS
----
----
09/29/09D. CRONIN
2400-00009
INDEX QTY ITEM COMMENTS
1 1 2400-00009-CORE
2 2 2400-00009-REEL
REVISONS
REV DESCRIPTION BY DATE APP'D
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone (919) 313-5300
Fax (919) 313-5558
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT
THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
± .5 °
.XXX ± .25
.XX ± .75
.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125
± .5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
1.6
Trailer
160mm (min) of
empty pockets
sealed with tape
(15 pockets min.)
Loaded Pockets
(1000 Lamps)
Leader
400mm (min.) of
empty pockets with
at least 100mm
sealed by tape
(40 empty pockets min.)
12
1.75
4
83.35
1/13.000
B
2402-00012
XM LOADING SPEC
--
--
----
----
06/08/10D. CRONIN
REVISONS
REV DESCRIPTION BY DATE APP'D
A Loaded pocket count was 750 DDS 11/8/10 BS
B MADE CATHODE AND ANODE NOTE LARGER DC 2/26/12
END START
User Feed Direction
CATHODE SIDE
ANODE SIDE
1
234
6 5
D
C
B
A
APP'DDATEBY
REVISIONS
REV DESCRIPTION
SIZE
TITLE
OF
REV.
SHEET
A
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
1
23456
4600 Silicon Drive
Fax (919) 313-5558
Durham, N.C 27703
Phone (919) 313-5300
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
± .5 °
.XXX ± .010
.XX ± .03
.X ± .06
FOR SHEET METAL PARTS ONLY
.XX ± .01
.XXX ± .005
± .5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
63
1/1DRAWING SCALE
A
2402-00011
XM 5050 CARRIER TAPE
4/23/10 D. CRONIN
CREE REFERENCE DRAWING FOR TEK-PAK DRAWING 018275
.36[.014]
T
5.40[.213]
Ao
3.35[.132]
Ko
3.0°
5.40[.213]
Bo
2.00[.079]
P2
4.00[.157]
Po
Do1.50 +.10
-.00 .0591 +.0039
-.0000 [ ]
10.25
[.404]
E2
7.0°
12.00[.472]
NOMINAL
12.30 [.484]
MAX
W
1.75[.069]
E1
5.50[.217]F
1.50[.059]
D1
8.00[.315]
P
POCKET SIZE
Ao - 5.40mm [.213"]
Bo - 5.40mm [.213"]
Ko - 3.35mm [.132"]
1
234
6 5
D
C
B
A
APP'DDATEBY
REVISIONS
REV DESCRIPTION
SIZE
TITLE
OF
REV.
SHEET
A
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
1
23456
4600 Silicon Drive
Fax (919) 313-5558
Durham, N.C 27703
Phone (919) 313-5300
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
± .5 °
.XXX ± .010
.XX ± .03
.X ± .06
FOR SHEET METAL PARTS ONLY
.XX ± .01
.XXX ± .005
± .5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
63
1/1DRAWING SCALE
A
2402-00011
XM 5050 CARRIER TAPE
4/23/10 D. CRONIN
CREE REFERENCE DRAWING FOR TEK-PAK DRAWING 018275
.36[.014]
T
5.40[.213]
Ao
3.35[.132]
Ko
3.0°
5.40[.213]
Bo
2.00[.079]
P2
4.00[.157]
Po
Do1.50 +.10
-.00 .0591 +.0039
-.0000 [ ]
10.25
[.404]
E2
7.0°
12.00[.472]
NOMINAL
12.30 [.484]
MAX
W
1.75[.069]
E1
5.50[.217]F
1.50[.059]
D1
8.00[.315]
P
POCKET SIZE
Ao - 5.40mm [.213"]
Bo - 5.40mm [.213"]
Ko - 3.35mm [.132"]
1
234
6 5
D
C
B
A
APP'DDATEBY
REVISIONS
REV DESCRIPTION
SIZE
TITLE
OF
REV.
SHEET
A
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
1
23456
4600 Silicon Drive
Fax (919) 313-5558
Durham, N.C 27703
Phone (919) 313-5300
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
± .5 °
.XXX ± .010
.XX ± .03
.X ± .06
FOR SHEET METAL PARTS ONLY
.XX ± .01
.XXX ± .005
± .5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
63
1/1DRAWING SCALE
A
2402-00011
XM 5050 CARRIER TAPE
4/23/10 D. CRONIN
CREE REFERENCE DRAWING FOR TEK-PAK DRAWING 018275
.36[.014]
T
5.40[.213]
Ao
3.35[.132]
Ko
3.0°
5.40[.213]
Bo
2.00[.079]
P2
4.00[.157]
Po
Do1.50 +.10
-.00 .0591 +.0039
-.0000 [ ]
10.25
[.404]
E2
7.0°
12.00[.472]
NOMINAL
12.30 [.484]
MAX
W
1.75[.069]
E1
5.50[.217]F
1.50[.059]
D1
8.00[.315]
P
POCKET SIZE
Ao - 5.40mm [.213"]
Bo - 5.40mm [.213"]
Ko - 3.35mm [.132"]
Copyright © 2010-2021 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and XM-L® are registered trademarks of Cree, Inc. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree-led.com. For warranty information,
please contact Cree Sales at sales@cree.com. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement,
sponsorship or association. 13
XLAMP® XM FAMILY LED SOLDERING & HANDLING
PACKAGING & LABELS
The diagrams below show the packaging and labels Cree uses to ship XLamp XM Family LEDs. XLamp XM Family LEDs are shipped in
tape loaded on a reel. Each box contains only one reel in a moisture barrier bag.
Label with Cree Bin
Code, Qty, Lot # Label with Cree Bin
Code, Qty, Lot #
Vacuum-Sealed
Moisture Barrier Bag
Dessicant
(inside bag)
Humidity Indicator
Card (inside bag)
Patent Label
Label with Customer Order
Code, Qty, Reel ID, PO #
Patent Label
Label with Cree Bin Code,
Quantity, Reel ID
Label with Cree Bin Code,
Quantity, Reel ID
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Unpackaged Reel
Packaged Reel
Boxed Reel

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