NCP705 Datasheet by onsemi

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© Semiconductor Components Industries, LLC, 2014
September, 2019 Rev. 8
1Publication Order Number:
NCP705/D
NCP705
LDO Regulator - Ultra-Low
Quiescent Current, IQ 13 mA,
Ultra-Low Noise
500 mA
Noise sensitive RF applications such as Power Amplifiers in
satellite radios, infotainment equipment, and precision
instrumentation require very clean power supplies. The NCP705 is
500 mA LDO that provides the engineer with a very stable, accurate
voltage with ultra low noise and very high Power Supply Rejection
Ratio (PSRR) suitable for RF applications. The device doesn’t require
any additional noise bypass capacitor to achieve ultralow noise
performance. In order to optimize performance for battery operated
portable applications, the NCP705 employs dynamic Iq management
for ultralow quiescent current consumption at lightload conditions
and great dynamic performance.
Features
Operating Input Voltage Range: 2.5 V to 5.5 V
Available Fixed Voltage Option: 0.8 V to 3.5 V
Available Adjustable Voltage Option: 0.8 V to 5.5 VVDROP
Reference Voltage 0.8 V
UltraLow Quiescent Current of Typ. 13 mA
UltraLow Noise: 12 mVRMS from 100 Hz to 100 kHz
Very Low Dropout: 230 mV Typical at 500 mA
±2% Accuracy Over Load/Line/Temperature
High PSRR: 71 dB at 1 kHz
Internal SoftStart to Limit the TurnOn Inrush Current
Thermal Shutdown and Current Limit Protections
Stable with a 1 mF Ceramic Output Capacitor
Active Output Discharge for Fast TurnOff
These are PbFree Devices
Typical Applications
PDAs, Mobile Phones, GPS, Smartphones
Wireless Handsets, Wireless LAN, Bluetooth®, ZigBee®
Portable Medical Equipment
Other Battery Powered Applications
Figure 1. Typical Application Schematics
1 mF
NCP705
IN
EN
GND
OUT
1 mFOFF
ON
N/C
Fixed Voltage Version
CIN
VIN
COUT
VOUT
NCP705
IN
EN
GND
OUT
OFF
ON
ADJ
VIN VOUT
COUT
1 mF
C1
R1
R2
CIN
1 mF
Adjustable Voltage Version
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See detailed ordering, marking and shipping information on
page 19 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAM
WDFN6
CASE 511BR
PIN CONNECTIONS
1
2
3
GND
XX M
1
XX = Specific Device Code
M = Date Code
6
5
4
OUT
N/C
GND
IN
N/C
EN
WDFN6 2x2 mm
(Top View)
1
2
3
GND
6
5
4
OUT
ADJ
GND
IN
N/C
EN
Adjustable Version
(Top View)
NCP705
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Figure 2. Simplified Schematic Block Diagrams
IN
THERMAL
SHUTDOWN
UVLO
MOSFET
DRIVER WITH
CURRENT LIMIT
AUTO LOW
POWER MODE
INTEGRATED
SOFTSTART
ACTIVE
DISCHARGE
EN
BANDGAP
REFERENCE
ENABLE
LOGIC
EN
OUT
GND
IN
THERMAL
SHUTDOWN
UVLO
MOSFET
DRIVER WITH
CURRENT LIMIT
AUTO LOW
POWER MODE
INTEGRATED
SOFTSTART
ACTIVE
DISCHARGE
EN
BANDGAP
REFERENCE
ENABLE
LOGIC
EN
OUT
GND
ADJ
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Table 1. PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
Fixed
Pin Name
Adjustable Description
1 OUT OUT Regulated output voltage pin. A small 1 mF ceramic capacitor is needed from this pin to
ground to assure stability.
2 N/C ADJ Feedback pin for setup output voltage. Use resistor divider for voltage selection.
3 GND GND Power supply ground. Expose pad must be tied with GND pin. Soldered to the copper
plane allows for effective heat dissipation.
4 EN EN Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts
the regulator into shutdown mode.
5 N/C N/C Not connected. This pin can be tied to ground to improve thermal dissipation.
6 IN IN Input pin. A small capacitor is needed from this pin to ground to assure stability.
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (Note 1) VIN 0.3 V to 6 V V
Output Voltage VOUT 0.3 V to VIN + 0.3 V V
Enable Input VEN 0.3 V to VIN + 0.3 V V
Adjustable Input VADJ 0.3 V to VIN + 0.3 V V
Output Short Circuit Duration tSC Indefinite s
Maximum Junction Temperature TJ(MAX) 150 °C
Storage Temperature TSTG 55 to 150 °C
ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V
ESD Capability, Machine Model (Note 2) ESDMM 200 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AECQ100002 (EIA/JESD22A114)
ESD Machine Model tested per AECQ100003 (EIA/JESD22A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
Table 3. THERMAL CHARACTERISTICS (Note 3)
Rating Symbol Value Unit
Thermal Characteristics, WDFN6 2x2 mm
Thermal Resistance, JunctiontoAir
Thermal Resistance Parameter, JunctiontoBoard
qJA
YJB
116.5
30
°C/W
3. Single component mounted on 1 oz, FR 4 PCB with 645 mm2 Cu area.
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Table 4. ELECTRICAL CHARACTERISTICS
40°C TJ 125°C; VIN = VOUT(NOM) + 0.5 V or 2.5 V, whichever is greater; VEN = 0.9 V, IOUT = 10 mA, CIN = COUT = 1 mF unless
otherwise noted. Typical values are at TJ = +25°C. (Note 4)
Parameter Test Conditions Symbol Min Typ Max Unit
Operating Input Voltage VIN 2.5 5.5 V
Output Voltage Range (Adjustable) VOUT 0.8 5.5
VDO
V
Undervoltage Lockout VIN rising UVLO 1.2 1.6 1.9 V
Output Voltage Accuracy (Fixed) VOUT + 0.5 V VIN 5.5 V, IOUT = 0 500 mA VOUT 2 +2 %
Reference Voltage VREF 0.8 V
Reference Voltage Accuracy IOUT = 10 mA VREF 2 +2 %
Line Regulation VOUT + 0.5 V VIN 4.5 V, IOUT = 10 mA
VOUT + 0.5 V VIN 5.5 V, IOUT = 10 mA
RegLINE 550
750
mV/V
Load Regulation IOUT = 0 mA to 500 mA RegLOAD 12 mV/mA
Load Transient IOUT = 1 mA to 500 mA or 500 mA to 1 mA in
1 ms, COUT = 1 mF
TranLOAD ±120 mV
Dropout Voltage (Note 5) IOUT = 500 mA, VOUT(nom) = 2.8 V VDO 230 350 mV
Output Current Limit VOUT = 90% VOUT(nom) NCP705 ICL 510 750 950 mA
NCP705E
(0°C TJ 70°C)
600 750 950
Quiescent Current IOUT = 0 mA IQ13 25 mA
Ground Current IOUT = 500 mA IGND 260 mA
Shutdown Current VEN 0.4 V, TJ = +25°C IDIS 0.12 mA
VEN 0 V, VIN = 2.0 to 4.5 V, TJ = 40 to +85°C IDIS 0.55 2 mA
EN Pin Threshold Voltage
High Threshold
Low Threshold
VEN Voltage increasing
VEN Voltage decreasing
VEN_HI
VEN_LO
0.9
0.4
V
EN Pin Input Current VEN = 5.5 V IEN 100 500 nA
ADJ Pin Current VADJ = 0.8 V 1 nA
TurnOn Time COUT = 1.0 mF, from assertion EN pin to 98%
VOUT(nom)
tON 150 ms
Power Supply Rejection Ratio VIN = 3.8 V, VOUT = 2.8 V
(Fixed), IOUT = 500 mA
f = 100 Hz
f = 1 kHz
f = 10 kHz
PSRR 73
71
56
dB
Output Noise Voltage VOUT = 2.5 V (Fixed), VIN = 3.5 V, IOUT = 500 mA
f = 100 Hz to 100 kHz
VN12 mVrms
Thermal Shutdown Temperature Temperature increasing from TJ = +25°C TSD 160 °C
Thermal Shutdown Hysteresis Temperature falling from TSD TSDH 20 °C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TJ = TA
= 25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 0.5 V.
NCP705
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TYPICAL CHARACTERISTICS
Figure 3. Output Voltage Noise Spectral Density for VOUT = 0.8 V, COUT = 1 mF
FREQUENCY (kHz)
10001010.10.01
0.001
0.01
0.1
1
10
Figure 4. Output Voltage Noise Spectral Density for VOUT = 0.8 V, COUT = 10 mF
Figure 5. Output Voltage Noise Spectral Density for VOUT = 3.3 V, COUT = 1 mF
OUTPUT VOLTAGE NOISE (mV/rtHz)
VIN = 2.5 V
VOUT = 0.8 V
CIN = COUT = 1 mF
MLCC, X7R,
1206 size
IOUT = 10 mA
IOUT = 300 mA
IOUT = 500 mA
10 mA 19.06 18.21
100 mA 15.99 15.04
300 mA 14.42 13.39
10 Hz 100 kHz 100 Hz 100 kHz
RMS Output Noise (mV)
IOUT
FREQUENCY (kHz)
0.001
0.01
0.1
1
10
OUTPUT VOLTAGE NOISE (mV/rtHz)
FREQUENCY (kHz)
0.001
0.01
0.1
1
10
OUTPUT VOLTAGE NOISE (mV/rtHz)
VIN = 3.8 V
VOUT = 3.3 V
CIN = COUT = 1 mF
MLCC, X7R,
1206 size
500 mA 13.70 12.60
10 mA 16.17 15.28
100 mA 16.41 15.65
300 mA 14.94 14.10
10 Hz 100 kHz 100 Hz 100 kHz
RMS Output Noise (mV)
IOUT
500 mA 14.08 13.11
10 mA 18.12 15.39
100 mA 16.42 13.50
300 mA 16.35 12.47
10 Hz 100 kHz 100 Hz 100 kHz
RMS Output Noise (mV)
IOUT
500 mA 16.00 12.10
100
10001010.10.01 100
VIN = 2.5 V
VOUT = 0.8 V
CIN = 1 mF
COUT = 10 mF
MLCC, X7R,
1206 size
IOUT = 10 mA
IOUT = 300 mA
IOUT = 100 mA
IOUT = 500 mA
10001010.10.01 100
IOUT = 300 mA
IOUT = 500 mA
IOUT = 100 mA
IOUT = 10 mA
IOUT = 100 mA
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TYPICAL CHARACTERISTICS
Figure 6. Output Voltage Noise Spectral Density for VOUT = 3.3 V, COUT = 10 mF
FREQUENCY (kHz)
10001010.10.01
0.001
0.01
0.1
1
10
OUTPUT VOLTAGE NOISE (mV/rtHz)
VIN = 3.8 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 10 mF
MLCC, X7R,
1206 size
IOUT = 10 mA IOUT = 100 mA
IOUT = 500 mA
1 mA 17.35 14.07
100 mA 17.43 14.29
300 mA 16.55 13.33
10 Hz 100 kHz 100 Hz 100 kHz
RMS Output Noise (mV)
IOUT
500 mA 16.48 13.20
100
IOUT = 300 mA
Figure 7. Output Voltage Noise Spectral Density for Adjustable Version – Different Output Voltage
FREQUENCY (kHz)
10001010.10.01
0.001
0.01
0.1
1
10
OUTPUT VOLTAGE NOISE (mV/rtHz)
VIN = VOUT +1 V
CIN = 1 mF
COUT = 10 mF
IOUT = 10 mA
VOUT = 3.3 V, R1 = 25k,
R2 = 8.2k
1.5 V 31.40 30.33
3.3 V 49.14 44.30
10 Hz 100 kHz 100 Hz 100 kHz
RMS Output Noise (mV)
VOUT
100
VOUT = 1.5 V, R1 = 15k,
R2 = 13k
Figure 8. Output Voltage Noise Spectral Density for Adjustable Version for Various C1
FREQUENCY (kHz)
10001010.10.01
0.001
0.01
0.1
1
10
OUTPUT VOLTAGE NOISE (mV/rtHz)
none 50.17 43.85
100 pF 46.90 40.39
1 nF 36.92 27.99
10 Hz 100 kHz 100 Hz 100 kHz
RMS Output Noise (mV)
IOUT
10 nF 27.02 18.31
100
C1 = none
C1 = 100 pF
C1 = 1 nF
C1 = 10 nF
VIN = 4.3 V
VOUT = 3.3 V
R1 = 255k, R2 = 82k
CIN = COUT = 1 mF
IOUT = 10 mA
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TYPICAL CHARACTERISTICS
Figure 9. Ground Current vs. Output Current Figure 10. Ground Current vs. Output Current
from 0 mA to 2 mA
IOUT
, OUTPUT CURRENT (mA) IOUT
, OUTPUT CURRENT (mA)
500450200150100500
450
Figure 11. Ground Current vs. Output Current
at Temperatures
Figure 12. Ground Current vs. Output Current
0 mA to 2 mA at Temperature
IOUT
, OUTPUT CURRENT (mA) IOUT
, OUTPUT CURRENT (mA)
IGND, GROUND CURRENT (mA)
IGND, GROUND CURRENT (mA)
IGND, GROUND CURRENT (mA)
IGND, GROUND CURRENT (mA)
VIN = VOUT + 0.5 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
160
160
300
400
350
300
250
200
150
100
50
0
250 400350300
VOUT = 0.8 V
VOUT = 3.3 V
VOUT = 2.5 V
140
120
100
80
60
40
20
020 1.751.51.2510.750.50.25
VOUT = 2.5 V
VOUT = 3.3 V
VOUT = 0.8 V
VIN = VOUT + 0.5 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
250
200
150
100
50
0
500450200150100500 250 400350300
VIN = 3.8 V
VOUT = 3.3 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
TJ = 125°C
TJ = 40°C
TJ = 25°C
20 1.751.51.2510.750.50.25
TJ = 125°C
TJ = 25°C
TJ = 40°C
VIN = 3.8 V
VOUT = 3.3 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
140
120
100
80
60
40
20
0
Figure 13. Quiescent Current vs. Temperature Figure 14. Dropout Voltage vs. Output Current
at Temperature (2.5 V)
TJ, JUNCTION TEMPERATURE (°C) IOUT
, OUTPUT CURRENT (mA)
140120100806020 040
16
500350300250150100500
320
IQ, QUIESCENT CURRENT (mA)
VDROP
, DROPOUT VOLTAGE (mV)
200 400 450
TJ = 25°C
TJ = 40°C
TJ = 125°C
VIN = VOUT + 0.5 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
VOUT = 0.8 V
VOUT = 2.5 V
VOUT = 3.3 V
14
12
10
8
6
4
2
04020
VIN = VOUT + 0.5 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
280
240
200
160
120
80
40
0
m w : 1 u MLCC‘ X7R‘
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TYPICAL CHARACTERISTICS
Figure 15. Dropout Voltage vs. Output Current
at Temperatures (3.3 V)
Figure 16. Dropout Voltage vs. Temperature
(2.5 V)
IOUT
, OUTPUT CURRENT (mA) TJ, JUNCTION TEMPERATURE (°C)
400
Figure 17. Dropout Voltage vs. Temperature,
(3.3 V)
Figure 18. Input Voltage vs. Output Voltage
TJ, JUNCTION TEMPERATURE (°C) VIN, INPUT VOLTAGE (V)
54210
4
VDROP
, DROPOUT VOLTAGE (mV)
VDROP
, DROPOUT VOLTAGE (mV)
VDROP
, DROPOUT VOLTAGE (mV)
VOUT
, OUTPUT VOLTAGE (V)
TJ = 25°C
TJ = 40°C
TJ = 125°C
36
VIN = VOUT + 0.5 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
500350300250150100500 200 400 450
320
280
240
200
160
120
80
40
0
350
300
250
200
150
100
50
0140120100806020 040 4020
IOUT = 500 mA
IOUT = 300 mA
IOUT = 0 mA
VIN = VOUT + 0.5 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
140120100806020 040 4020
400
350
300
250
200
150
100
50
0
VIN = VOUT + 0.5 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size IOUT = 500 mA
IOUT = 300 mA
IOUT = 0 mA
3.5
3
2.5
2
1.5
1
0.5
0
IIN = 0 mA
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
VOUT = 0.8 V
VOUT = 2.5 V
VOUT = 3.3 V
Figure 19. Output Voltage vs. Temperature,
(0.8 V)
Figure 20. Output Voltage vs. Temperature,
(2.5 V)
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
12010080402002040
0.8014
VOUT
, OUTPUT VOLTAGE (V)
VOUT
, OUTPUT VOLTAGE (V)
60 140 12010080402002040 60 140
1.804
VIN = 2.5 V
VOUT = 0.8 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
0.8012
0.8010
0.8008
0.8006
0.8004
0.8002
0.8000
0.7998
0.7996
0.7994
0.7992
0.7990
1.803
1.802
1.801
1.800
1.799
1.798
1.797
1.796
1.795
1.794
1.793
1.792
VIN = 3 V
VOUT = 2.5 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
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TYPICAL CHARACTERISTICS
Figure 21. Output Voltage vs. Temperature,
(3.3 V)
Figure 22. Line Regulation vs. Temperature,
(1.8 V)
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
12010080402002040
3.305
Figure 23. Line Regulation vs. Temperature,
(3.3 V)
Figure 24. Load Regulation vs. Temperature,
(1.8 V)
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
VOUT
, OUTPUT VOLTAGE (V)
REGLOAD, LOAD REGULATION (mV/mA)
60 140 12010080402002040
700
REGLINE, LINE REGULATION (mV/V)
60 140
12010080402002040
1200
REGLINE, LINE REGULATION (mV/V)
60 140 12010080402002040
8
60 140
VIN = 3.8 V
VOUT = 3.3 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
3.304
3.303
3.302
3.301
3.300
3.299
3.298
3.297
3.296
3.295
3.294
3.293
680
660
640
620
600
580
560
540
520
500
VIN = 2.5 V
VOUT = 1.8 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
1150
1050
1000
950
900
850
800
750
700
VIN = 3.8 V
VOUT = 3.3 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
VIN = 2.5 V
VOUT = 1.8 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
7
6
5
4
3
2
1
0
Figure 25. Load Regulation vs. Temperature,
(3.3 V)
Figure 26. Disable Current vs. Temperature
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
12010060402002040
8
REGLOAD, LOAD REGULATION (mV/mA)
80 140 12010060402002040
0.3
IDIS, DISABLE CURRENT (mA)
80 140
VIN = 3.8 V
VOUT = 3.3 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
7
6
5
4
3
2
1
0
0.25
0.2
0.15
0.1
0.05
0
0.05
VEN 0.4 V
RL = 330 W
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
VIN = 4.5 V
VIN = 2.3 V
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TYPICAL CHARACTERISTICS
Figure 27. Enable Current vs. Temperature Figure 28. Current Limit vs. Temperature
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
12010080402002040
120
Figure 29. ShortCircuit vs. Temperature Figure 30. ShortCircuit Current vs.
Temperature
TJ, JUNCTION TEMPERATURE (°C) VIN, INPUT VOLTAGE (V)
IEN, CURRENT TO ENABLE PIN (nA)ISC, SHORTCIRCUIT CURRENT (mA)
ISC, SHORTCIRCUIT CURRENT (mA)
60 140 12010080402002040
750
ICL, CURRENT LIMIT (mA)
60 140
12010080402002040
800
60 140 2.5 3.00 5.50
100
80
60
40
20
0
VIN = 3.8 V
VOUT = 3.3 V
RL = 330 W
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
VEN = 5.5 V
VEN = 0.4 V
735
720
705
690
675
660
645
630
615
600
VIN = VOUT + 0.5 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
VOUT = 1.8 V
VOUT = 3.3 V
780
760
740
720
700
680
660
640
620
600
VIN = VOUT + 0.5 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
VOUT = 3.3 V
VOUT = 1.8 V
800
780
760
740
720
700
680
660
640
620
600
VOUT = 0.8 V
CIN = 1 mF
COUT = 1 mF
MLCC, X7R
1206 size
3.50 4.00 4.50 5.00
Figure 31. Enable Threshold (High) Figure 32. Enable Threshold (Low)
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
12010060402002040
1
VEN, ENABLE VOLTAGE (V)
80 140 12010060402002040
VEN, ENABLE VOLTAGE (V)
80 140
VIN = 3.8 V
VOUT = 3.3 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
VIN = 3.8 V
VOUT = 3.3 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
NCP705
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TYPICAL CHARACTERISTICS
IOUT = 10 mA
IOUT = 100 mA
IOUT = 300 mA
IOUT = 500 mA
Figure 33. Discharge Resistance vs.
Temperature
Figure 34. Startup Time vs. Temperature
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
12010080402002040
400
Figure 35. Power Supply Rejection Ratio,
VOUT = 1.8 V
Figure 36. Power Supply Rejection Ratio,
VOUT = 2.8 V
FREQUENCY (kHz) FREQUENCY (kHz)
RDIS, ACTIVE DISCHARGE RESISTANCE (Ω)
RR, RIPPLE REJECTION (dB)
RR, RIPPLE REJECTION (dB)
60 140 12010080402002040
250
tSTARTUP
, STARTUP TIME (ms)
60 140
0.01
80
10k
90
VIN = 3.8 V
VOUT = 3.3 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
390
380
370
360
350
340
330
320
310
300
VIN = 3.8 V
VOUT = 3.3 V
COUT = 1 mF
CIN = 1 mF
MLCC, X7R,
1206 size
240
230
220
210
200
190
180
170
160
150
0.1 1 10 100 1k
70
60
50
40
30
20
10
0
VIN = 2.8 V + 100 mVPP
VOUT = 1.8 V
COUT = 1 mF
CIN = none
MLCC, X7R,
1206 size
0.01 10k0.1 1 10 100 1k
80
70
60
50
40
30
20
10
0
VIN = 3.8 V + 100 mVPP
VOUT = 2.8 V
COUT = 1 mF
CIN = none
MLCC, X7R,
1206 size
IOUT = 10 mA
IOUT = 100 mA
IOUT = 300 mA
IOUT = 500 mA
IOUT = 10 mA
IOUT = 100 mA
IOUT = 300 mA
IOUT = 500 mA
Figure 37. Power Supply Rejection Ratio,
VOUT = 3.3 V
Figure 38. Power Supply Rejection Ratio,
VOUT = 3.3 V, IOUT = 10 mA Different COUT
FREQUENCY (kHz) FREQUENCY (kHz)
RR, RIPPLE REJECTION (dB)
RR, RIPPLE REJECTION (dB)
0.01
100
10k
90
0.1 1 10 100 1k
VIN = 4.3 V + 100 mVPP
VOUT = 3.3 V
COUT = 1 mF
CIN = none
MLCC, X7R,
1206 size
0.01 10k0.1 1 10 100 1k
80
70
60
50
40
30
20
10
0
VIN = 4.3 V + 100 mVPP
VOUT = 3.3 V
CIN = none
MLCC, X7R,
1206 size
COUT = 1 mF
COUT = 4.7 mF
COUT = 10 mF
90
80
70
60
50
40
30
20
10
0
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TYPICAL CHARACTERISTICS
Figure 39. Power Supply Rejection Ratio,
VOUT = 3.3 V, IOUT = 500 mA Different COUT
FREQUENCY (kHz)
RR, RIPPLE REJECTION (dB)
0.01
100
10k0.1 1 10 100 1k
90
80
70
60
50
40
30
20
10
0
VIN = 4.3 V + 100 mVPP
VOUT = 3.3 V
ILOAD = 500 mA
CIN = none
MLCC, X7R,
1206 size
COUT = 1 mF
COUT = 4.7 mF
COUT = 10 mF
Figure 40. Power Supply Rejection Ratio,
VOUT = 3.3 V, IOUT = 10 mA Different C1
FREQUENCY (kHz)
RR, RIPPLE REJECTION (dB)
0.01 10k0.1 1 10 100 1k
80
70
60
50
40
30
20
10
0
C1 = none
C1 = 100 pF
C1 = 1 nF
C1 = 10 nF
C1 = 100 nF
VIN = 4.3 V + 100 mVPP
VOUT = 3.3 V
R1 = 225k, R2 = 82k
ILOAD = 10 mA
COUT = 1 mF MLCC,
X7R, 1206 size
Figure 41. Output Capacitor ESR vs. Output
Current
IOUT
, OUTPUT CURRENT (mA)
ESR, EQUIVALENT SERIAL RESISTANCE (W)
100
10
1
0.1
0.01
0 50050 150 400100 450200 350300250
VOUT = 0.8 V
VOUT = 3.3 V
UNSTABLE REGION
STABLE REGION
Figure 42. Enable Turnon Response,
COUT = 1 mF, IOUT = 10 mA
Figure 43. Enable Turnon Response,
COUT = 1 mF, IOUT = 500 mA
VIN = 3.8 V
VOUT = 3.3 V
VEN = 1 V
COUT = 1 mF
CIN = 1 mF
IOUT = 500 mA
500 mV/div1 V/div
200 mA/div
IINRUSH
100 ms/div
VEN
VOUT
VIN = 3.8 V
VOUT = 3.3 V
VEN = 1 V
COUT = 1 mF
CIN = 1 mF
IOUT = 500 mA
200 mA/div
500 mV/div1 V/div
VEN
IINRUSH
VOUT
100 ms/div
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TYPICAL CHARACTERISTICS
Figure 44. Enable Turnon Response,
COUT = 10 mF, IOUT = 10 mA
500 mV/div1 V/div
200 mA/div
IINRUSH
100 ms/div
VEN
VOUT
VIN = 3.8 V
VOUT = 3.3 V
VEN = 1 V
COUT = 10 mF
CIN = 1 mF
IOUT = 500 mA
200 mA/div
500 mV/div1 V/div
VIN = 3.8 V
VOUT = 3.3 V
VEN = 1 V
COUT = 10 mF
CIN = 1 mF
IOUT = 500 mA
Figure 45. Enable Turnon Response,
COUT = 10 mF, IOUT = 500 mA
100 ms/div
IINRUSH
VEN
VOUT
500 mV/div20 mV/div
Figure 46. Line Transient Response Rising
Edge, VOUT = 0.8 V, IOUT = 10 mA
5 ms/div
VIN = 2.5 V
VOUT = 0.8 V
VEN = 1 V
IOUT = 10 mA
tRISE = 1 ms
COUT = 1 mF
COUT = 10 mF
VEN
VOUT
Figure 47. Line Transient Response Falling
Edge, VOUT = 0.8 V, IOUT = 10 mA
5 ms/div
500 mV/div20 mV/div
VIN = 2.5 V
VOUT = 0.8 V
VEN = 1 V
IOUT = 10 mA
COUT = 1 mF
COUT = 10 mF
tFALL = 1 ms
VEN
VOUT
500 mV/div20 mV/div
Figure 48. Line Transient Response Rising
Edge, VOUT = 3.3 V, IOUT = 10 mA
10 ms/div
COUT = 1 mF
COUT = 10 mF
tRISE = 1 msVEN
VOUT
VIN = 3.8 V
VOUT = 3.3 V
VEN = 1 V
IOUT = 10 mA
Figure 49. Line Transient Response Falling
Edge, VOUT = 3.3 V, IOUT = 10 mA
10 ms/div
500 mV/div20 mV/div
VIN = 3.8 V
VOUT = 3.3 V
VEN = 1 V
IOUT = 10 mA
tFALL = 1 ms
COUT = 10 mF
COUT = 1 mF
VOUT
VEN
NCP705
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TYPICAL CHARACTERISTICS
500 mV/div20 mV/div
Figure 50. Line Transient Response Rising
Edge, VOUT = 3.3 V, IOUT = 500 mA
5 ms/div
COUT = 1 mF
tRISE = 1 ms
VEN
VOUT
VIN = 3.8 V
VOUT = 3.3 V
VEN = 1 V
IOUT = 500 mA
COUT = 10 mF
Figure 51. Line Transient Response Falling
Edge, VOUT = 3.3 V, IOUT = 500 mA
10 ms/div
500 mV/div20 mV/div
VIN = 3.8 V
VOUT = 3.3 V
VEN = 1 V
IOUT = 500 mA
tFALL = 1 ms
COUT = 1 mF
COUT = 10 mF
VEN
VOUT
200 mA/div100 mV/div
Figure 52. Load Transient Response Rising
Edge, VOUT = 0.8 V, IOUT = 1 mA to 500 mA,
COUT = 1 mF, 10 mF
10 ms/div
COUT = 1 mF
COUT = 10 mF
tRISE = 1 ms
VOUT
IOUT
VIN = 2.5 V
VOUT = 0.8 V
CIN = 1 mF (MLCC)
COUT = 10 mF
COUT = 1 mF
tFALL = 1 ms
VIN = 2.5 V
VOUT = 0.8 V
CIN = 1 mF (MLCC)
Figure 53. Load Transient Response Falling
Edge, VOUT = 0.8 V, IOUT = 1 mA to 500 mA,
COUT = 1 mF, 10 mF
100 ms/div
VOUT
IOUT
200 mA/div50 mV/div
200 mA/div100 mV/div
Figure 54. Load Transient Response Rising
Edge, VOUT = 0.8 V, IOUT = 1 mA to 500 mA,
tRISE_IOUT = 1 ms, 10 ms
10 ms/div
tRISE_IOUT = 10 ms
tRISE_IOUT = 1 ms
VOUT
IOUT
VIN = 2.5 V
VOUT = 0.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
Figure 55. Load Transient Response Falling
Edge, VOUT = 0.8 V, IOUT = 1 mA to 500 mA,
tFALL_IOUT = 1 ms, 10 ms
10 ms/div
tFALL_IOUT = 1 ms
tFALL_IOUT = 10 ms
200 mA/div50 mV/div
VOUT
IOUT
VIN = 2.5 V
VOUT = 0.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
NCP705
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TYPICAL CHARACTERISTICS
200 mA/div100 mV/div
Figure 56. Load Transient Response Rising
Edge, VOUT = 3.3 V, IOUT = 1 mA to 500 mA,
COUT = 1 mF, 10 mF
5 ms/div
VIN = 3.8 V
VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF
COUT = 10 mF
VOUT
IOUT
Figure 57. Load Transient Response Falling
Edge, VOUT = 3.3 V, IOUT = 1 mA to 500 mA,
COUT = 1 mF, 10 mF
50 ms/div
200 mA/div50 mV/div
VOUT
IOUT
COUT = 10 mF
COUT = 1 mF
VIN = 3.8 V
VOUT = 3.3 V
CIN = 1 mF (MLCC)
200 mA/div50 mV/div
Figure 58. Load Transient Response Rising
Edge, VOUT = 3.3 V, IOUT = 1 mA to 500 mA,
tRISE_IOUT = 1 ms, 10 ms
10 ms/div
Figure 59. Load Transient Response Falling
Edge, VOUT = 3.3 V, IOUT = 1 mA to 500 mA,
tFALL_IOUT = 1 ms, 10 ms
50 ms/div
tRISE_IOUT = 10 ms
tRISE_IOUT = 1 ms
VOUT
IOUT
VIN = 3.8 V
VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VIN = 3.8 V
VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VOUT
IOUT
tFALL_IOUT = 10 ms
tFALL_IOUT = 1 ms
200 mA/div50 mV/div
VOUT
VIN
VIN = 3.3 V
IOUT = 1 mA
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
600 mV/div
Figure 60. Turnon/off, Slow Rising VIN
5 ms/div
Figure 61. ShortCircuit and Thermal
Shutdown
20 ms/div
1 V/div500 mA/div
IOUT
VOUT
ShortCircuit
Thermal Shutdown
VIN = 5.5 V
VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
NCP705
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TYPICAL CHARACTERISTICS
Figure 62. ShortCircuit Current Peak
50 ms/div
1 V/div500 mA/div
IOUT
VOUT
VIN = 5.5 V
VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
500 mA/div1 V/div
Figure 63. Enable Turnoff
5 ms/div
VIN = 5.5 V
VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
COUT = 1 mF
COUT = 10 mF
VEN
VOUT
FT OUT 0.8
NCP705
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APPLICATIONS INFORMATION
General
The NCP705 is a high performance 500 mA Low Dropout
Linear Regulator. This device delivers excellent noise and
dynamic performance. Thanks to its adaptive ground current
feature the device consumes only 13 mA of quiescent current
at noload condition. The regulator features ultra*low
noise of 12 mVRMS, PSRR of 71 dB at 1 kHz and very good
load/line transient performance. Such excellent dynamic
parameters and small package size make the device an ideal
choice for powering the precision analog and noise sensitive
circuitry in portable applications. The LDO achieves this
ultra low noise level output without the need for a noise
bypass capacitor. A logic EN input provides ON/OFF
control of the output voltage. When the EN is low the device
consumes as low as typ. 10 nA from the IN pin. The device is
fully protected in case of output overload, output short circuit
condition and overheating, assuring a very robust design.
Input Capacitor Selection (CIN)
It is recommended to connect a minimum of 1 mF Ceramic
X5R or X7R capacitor close to the IN pin of the device. This
capacitor will provide a low impedance path for unwanted
AC signals or noise modulated onto constant input voltage.
There is no requirement for the min. /max. ESR of the input
capacitor but it is recommended to use ceramic capacitors
for their low ESR and ESL. A good input capacitor will limit
the influence of input trace inductance and source resistance
during sudden load current changes. Larger input capacitor
may be necessary if fast and large load transients are
encountered in the application.
Output Decoupling (COUT)
The NCP705 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
minimal capacitor value is 1 mF and X7R or X5R dielectric
due to its low capacitance variations over the specified
temperature range. The NCP705 is designed to remain stable
with minimum effective capacitance of 1 mF to account for
changes with temperature, DC bias and package size.
Especially for small package size capacitors such as 0402
the effective capacitance drops rapidly with the applied DC
bias. Refer to the Figure 64, for the capacitance vs. package
size and DC bias voltage dependence.
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the COUT but the
maximum value of ESR should be less than 900 mW. Larger
output capacitors and lower ESR could improve the load
transient response or high frequency PSRR as shown in
typical characteristics. It is not recommended to use
tantalum capacitors on the output due to their large ESR. The
equivalent series resistance of tantalum capacitors is also
strongly dependent on the temperature, increasing at low
temperature. The tantalum capacitors are generally more
costly than ceramic capacitors.
Figure 64. Capacitance Change vs. DC Bias
1206
0805
0603
0402
DC BIAS (V)
CAPACITY CHANGE (%)
010198762345
10
0
10
20
30
40
50
60
70
80
Package Size
Noload Operation
The regulator remains stable and regulates the output
voltage properly within the ±2% tolerance limits even with
no external load applied to the output.
Adjustable Operation
The output voltage range can be set from 0.8 V to
5.5 VVDO by resistor divider network. Use Equations 1
and 2 to calculate appropriate values of resistors and output
voltage. Typical current to ADJ pin is 1 nA. For output
voltage 0.8 V ADJ pin can be tied directly to Vout pin.
VOUT +0.8 @ǒ1)R1
R2Ǔ)R1@IADJ (eq. 1)
R2^R1@1
VOUT
0.8 *1
(eq. 2)
The resistor divider should be designed carefully to
achieve the best performance. Recommended current
through divider is 10 mA and more. Too high values of
resistors (MW) cause increasing noise and longer startup
time. The suggested values of the resistors are in Table 5. To
improve dynamic performance capacitor C1 should be at
least 1 nF. Recommended range of capacity is between
10 nF and 100 nF. Higher value of capacitor C1 increasing
startup time.
Table 5. Proposal Resistor Values for Variuos VOUT
VOUT R1 R2
1.5 V 130k 150k
3.3 V 256k 82k
5.0 V 430k 82k
C i F i Figure 65. NCP705 Adjustable wilh Noise Improvement Capacitor ch Ly l / //vX www.cnsemi.com 1B
NCP705
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18
Figure 65. NCP705 Adjustable with Noise
Improvement Capacitor
NCP705
IN
EN
GND
OUT
OFF
ON
ADJ
VIN VOUT
COUT
1 mF
C1
R1
R2
CIN
1 mF
Enable Operation
The NCP705 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function.
If the EN pin voltage >0.9 V the device is guaranteed to
be enabled. The NCP705 regulates the output voltage and
the active discharge transistor is turnedoff.
The EN pin has internal pulldown current source with
typ. value of 110 nA which assures that the device is
turnedoff when the EN pin is not connected. Build in 2 mV
hysteresis into the EN prevents from periodic on/off
oscillations that can occur due to noise.
In the case where the EN function isn’t required the EN
should be tied directly to IN.
Undervoltage Lockout
The internal UVLO circuitry assures that the device
becomes disabled when the VIN falls below typ. 1.5 V. When the
VIN voltage rampsup the NCP705 becomes enabled, if VIN
rises above typ. 1.6 V. The 100 mV hysteresis prevents from
on/off oscillations that can occur due to noise on VIN line.
Output Current Limit
Output Current is internally limited within the IC to a
typical 750 mA. The NCP705 will source this amount of
current measured with a voltage drops on the 90% of the
nominal VOUT. If the Output Voltage is directly shorted to
ground (VOUT = 0 V), the short circuit protection will limit
the output current to 800 mA (typ). The current limit and
short circuit protection will work properly up to
VIN = 5.5 V at TA = 125°C. There is no limitation for the
short circuit duration.
Internal SoftStart Circuit
NCP705 contains an internal softstart circuitry to protect
against large inrush currents which could otherwise flow
during the startup of the regulator. Softstart feature
protects against power bus disturbances and assures a
controlled and monotonic rise of the output voltage.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD * 160°C typical), Thermal Shutdown event
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (TSDU * 140°C
typical). Once the IC temperature falls below the 140°C the
LDO is enabled again. The thermal shutdown feature
provides the protection from a catastrophic device failure
due to accidental overheating. This protection is not
intended to be used as a substitute for proper heat sinking.
For reliable operation junction temperature should be
limited to +125°C maximum.
Power Dissipation
As power dissipated in the NCP705 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part.
The maximum power dissipation the NCP705 can handle
is given by:
PD(MAX) +ƪ)125oC*TAƫ
qJA
(eq. 3)
The power dissipated by the NCP705 for given
application conditions can be calculated from the following
equations:
PD[VINǒIGND@IOUTǓ)IOUTǒVIN *VOUTǓ(eq. 4)
Figure 66. qJA and PD(MAX) vs. Copper Area (WDFN6)
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
80
100
120
140
160
180
200
220
0 100 200 300 400 500 600 700
COPPER HEAT SPREADER AREA (mm2)
qJA, JUNCTIONTOAMBIENT
THERMAL RESISTANCE (°C/W)
PD(MAX), TA = 25°C, 2 oz Cu
PD(MAX), MAXIMUM POWER
DISSIPATION (W)
PD(MAX), TA = 25°C, 1 oz Cu
qJA, 1 oz Cu
qJA, 2 oz Cu
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Reverse Current
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that VOUT > VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
Load Regulation
The NCP705 features very good load regulation of
maximum 2 mV in 0 mA to 500 mA range. In order to
achieve this very good load regulation a special attention to
PCB design is necessary. The trace resistance from the OUT
pin to the point of load can easily approach 100 mW which
will cause 50 mV voltage drop at full load current,
deteriorating the excellent load regulation.
Line Regulation
The IC features very good line regulation of 0.75 mV/V
measured from VIN = VOUT + 0.5 V to 5.5 V. For battery
operated applications it may be important that the line
regulation from VIN = VOUT + 0.5 V up to 4.5 V is only
0.55 mV/V.
Power Supply Rejection Ratio
The NCP705 features very good Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
100 kHz – 10 MHz can be tuned by the selection of COUT
capacitor and proper PCB layout.
Output Noise
The IC is designed for ultralow noise output voltage
without external noise filter capacitor (Cnr). Figures 3 6
shows NCP705 noise performance. Generally the noise
performance in the indicated frequency range improves with
increasing output current.
TurnOn Time
The turnon time is defined as the time period from EN
assertion to the point in which VOUT will reach 98% of its
nominal value. This time is dependent on various
application conditions such as VOUT(NOM), COUT, TA.
PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 capacitors. Larger
copper area connected to the pins will also improve the
device thermal resistance. The actual power dissipation can
be calculated from the equation above (Equation 4).
ORDERING INFORMATION
Device Voltage Option Marking Package Shipping
NCP705MT09TCG 0.9 V 5G
WDFN6
(PbFree) 3000 / Tape & Reel
NCP705MT18TCG 1.8 V 5A
NCP705MT28TCG 2.8 V 5C
NCP705MT30TCG 3.0 V 5D
NCP705MT33TCG 3.3 V 5E
NCP705EMT33TCG 3.3 V 3A
NCP705MTADJTCG Adjustable 5J
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Bluetooth is a registered trademark fo Bluetooth SIG.
ZigBee is a registered trademark of ZigBee Alliance.
0N Semiwndudw" m SCALE4:1 50% / \ SEW" E L@ “Q ‘ nxr pm: ‘ ,7 W, E Q 0.10 C A l ‘ Ui if 3 5' TOPVIEW nEmLa A3, // nus 0 ¢ ama- . O \ \ BOTTOMVIEW 0 L4 F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM
THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS
WELL AS THE TERMINALS.
5. FOR DEVICES CONTAINING WETTABLE FLANK
OPTION, DETAIL A ALTERNATE CONSTRUCTION
A-2 AND DETAIL B ALTERNATE CONSTRUCTION
B-2 ARE NOT APPLICABLE.
SEATING
PLANE
D
E
0.10 C
A3
A
A1
0.10 C
WDFN6 2x2, 0.65P
CASE 511BR
ISSUE B
DATE 19 JAN 2016
SCALE 4:1
DIM
A
MIN MAX
MILLIMETERS
0.70 0.80
A1 0.00 0.05
A3 0.20 REF
b0.25 0.35
D2.00 BSC
D2 1.50 1.70
0.90 1.10
E2.00 BSC
E2
e0.65 BSC
0.20 0.40
L
PIN ONE
REFERENCE
0.05 C
0.05 C
NOTE 4
A0.10 C
NOTE 3
L
e
D2
E2
b
B
3
6
6X
1
4
0.05 C MOUNTING FOOTPRINT
GENERIC
MARKING DIAGRAM*
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “ G”,
may or may not be present.
XX = Specific Device Code
M = Date Code
XX M
1
BOTTOM VIEW
RECOMMENDED
DIMENSIONS: MILLIMETERS
L1
DETAIL A
L
ALTERNATE
CONSTRUCTIONS
L
DETAIL A
DETAIL B
A
B
TOP VIEW
C
SIDE VIEW
--- 0.15
L1
6X
0.45
2.30
1.12
1.72
0.65
PITCH
6X 0.40
1
PACKAGE
OUTLINE
6X
M
M
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
A1
A3
ALTERNATE B2ALTERNATE B1
ALTERNATE A2ALTERNATE A1
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON55829E
DOCUMENT NUMBER:
DESCRIPTION:
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