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MTCH6301 Datasheet by Microchip Technology

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6‘ MICRDCHIP
2012-2014 Microchip Technology Inc. DS40001663B-page 1
Description:
MTCH6301 is a turnkey projected capacitive controller
that allows easy integration of multi-touch and gestures
to create a rich user interface in your design. Through
a sophisticated combination of Self and Mutual
Capacitive scanning for both XY screens and touch
pads, the MTCH6301 allows designers to quickly and
easily integrate projected capacitive touch into their
application.
Applications:
Human-Machine Interfaces with Configurable
Button, Keypad or Scrolling Functions
Single-Finger Gesture-Based Interfaces to Swipe,
Scroll or Doubletap Controls
Home Automation Control Panels
Security Control Keypads
Automotive Center Stack Controls
Gaming Devices
Remote Control Touch Pads
Touch Sensor Support:
Up to 13RX x 18TX Channels
Individual Channel Tuning for Optimal Sensitivity
Works with Printed Circuit Board (PCB) Sensors,
Film, Glass and Flexible Printed Circuit (FPC)
Sensors
Cover Layer Support:
- Plastic: up to 3 mm
- Glass: up to 5 mm
Touch Performance:
> 100 Reports per Second Single Touch
> 60 Reports per Second Dual Touch
Up to 12-Bit Resolution Coordinate Reporting
Touch Features:
Multi-touch (up to ten touches)
Gesture Detection and Reporting
Single and Dual Touch Drawing
Self and Mutual Signal Acquisition
Built-in Noise Detection and Filtering
Power Management:
Configurable Sleep mode
Integrated Power-on Reset and Brown-out Reset
200 µA Sleep Current (typical)
Communication Interface:
•I
2C™ (up to 400 kbps)
Operating Conditions:
2.4V to 3.6V, -40ºC to +105ºC
Package Types:
44-Lead TQFP
44-Lead QFN
MTCH6301
MTCH6301 Projected Capacitive Touch Controller
MTCH6301
DS40001663B-page 2 2012-2014 Microchip Technology Inc.
Table of Contents
1.0 System Block Diagram ................................................................................................................................................................. 3
2.0 Configuration and Setup............................................................................................................................................................... 3
3.0 Pin Diagram.................................................................................................................................................................................. 4
4.0 Pinout I/O Descriptions................................................................................................................................................................. 5
5.0 Layout........................................................................................................................................................................................... 6
6.0 Communication Protocol ............................................................................................................................................................ 12
7.0 Memory Map .............................................................................................................................................................................. 21
8.0 Special Features ........................................................................................................................................................................ 23
9.0 Electrical Characteristics ............................................................................................................................................................ 26
10.0 Ordering Information .................................................................................................................................................................. 30
11.0 Packaging Information................................................................................................................................................................ 31
The Microchip Web Site........................................................................................................................................................................ 38
Customer Change Notification Service................................................................................................................................................. 38
Customer Support................................................................................................................................................................................ 38
Worldwide Sales and Service............................................................................................................................................................... 40
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MICROCHIP Ana‘ zer PleItW Sena‘ Touch Data
2012-2014 Microchip Technology Inc. DS40001663B-page 3
MTCH6301
1.0 SYSTEM BLOCK DIAGRAM
FIGURE 1-1: SYSTEM BLOCK DIAGRAM
2.0 CONFIGURATION AND SETUP
The MTCH6301 is preconfigured for a
12 Receiver (RX)/9 Transmitter (TX) touch sensor,
mapped as shown in Section 5.1 “Typical
Application Circuit”. While the device will work
out-of-the-box using this specific sensor configuration,
most applications will require additional configuration
and sensor tuning to determine the correct set of
parameters to be used in the final application.
Microchip provides a PC-based configuration tool for
this purpose, available in the mTouch™ Sensing
Solution Design Center (www.microchip.com/mtouch).
Use of this tool requires a PICkit™ Serial Analyzer
(updated with MTCH6301 support), as well as access
to the I2C communications bus of the MTCH6301
device.
Once the development process is complete, this
modified parameter set must either be written
permanently to the controller via NVRAM (see
Section 8.3 “Nonvolatile RAM (NVRAM)”), or
alternatively, it can be sent every time the system is
powered on. Both the PICkit Serial Analyzer and the
master I2C controller can be used for this purpose.
Touch Sensor
TX0..17
RX0..12
User Configuration Data
Noise Reduction / Filtering Engine
Gesture Engine
MultiTouch
Decode
I2CTM
Module
Signal Acquisition Controller
TX Drive
RX
Sense
ADC
MTCH6301
Communications Engine
[Master Controller]
Touch Data
MICROCHIP
PICkitTM Serial
Analyzer
USB
Connection only for initial tuning or configuration
MTCH6301
DS40001663B-page 4 2012-2014 Microchip Technology Inc.
3.0 PIN DIAGRAM
FIGURE 3-1: 44-PIN TQFP, QFN(1,2)
Note 1: All RX/TX are remappable. Refer to Section 5.6 “Sensor Layout Configuration” for further
information.
2: The metal plate at the bottom of the device is not connected to any pins and it is recommended to
be connected to VSS externally.
MTCH6301
SDA
TX17
TX16
TX15
TX14
VSS
VCAP
INT
N/C
RX12
RX11
SCL
TX11
TX10
TX9
VDD
VSS
TX5
TX6
TX7
TX8
TX4
TX0
TX1
TX2
TX3
VSS
VDD
RX0
RX1
RX2
RX3
RX4
TX13
TX12
RX10
RX9
VSS
VDD
RESET
RX8
RX7
RX6
RX5
MTCH6301
44
43
42
41
40
39
38
37
36
35
34
12
13
14
15
16
17
18
19
20
21
22
1
2
3
4
5
6
7
8
9
10
11
33
32
31
30
29
28
27
26
25
24
23
RESET
2012-2014 Microchip Technology Inc. DS40001663B-page 5
MTCH6301
4.0 PINOUT I/O DESCRIPTIONS
TABLE 4-1: PINOUT I/O DESCRIPTIONS
Pin Name Pin Number Pin Type Description
RESET 18 I/P Reset Device (active-low)
SCL 44 I Synchronous Serial Clock Input/Output for I2C™
SDA 1 I/O Synchronous Serial Data Input/Output for I2C™
INT 8 O Interrupt (from MTCH6301 to master) for I2C™
RX0 27* I/O
RX Sense (or TX Drive)
(*RX0/RX12 cannot be used for TX Drive)
RX1 26 I/O
RX2 25 I/O
RX3 24 I/O
RX4 23 I/O
RX5 22 I/O
RX6 21 I/O
RX7 20 I/O
RX8 19 I/O
RX9 15 I/O
RX10 14 I/O
RX11 11 I/O
RX12 10* I/O
TX0 33 O
TX Drive
TX1 32 O
TX2 31 O
TX3 30 O
TX4 34 O
TX5 38 O
TX6 37 O
TX7 36 O
TX8 35 O
TX9 41 O
TX10 42 O
TX11 43 O
TX12 13 O
TX13 12 O
TX14 5 O
TX15 4 O
TX16 3 O
TX17 2 O
N/C 9 N/C No Connect
VCAP 7 P CPU Logic Filter Capacitor Connection
VDD 17, 28, 40 P Positive Supply for Peripheral Logic and I/O Pins
VSS 6, 16, 29, 39 P Ground Reference for Logic and I/O Pins;
This pin must be connected at all times.
Q ITTT Rx ‘ m 114}
MTCH6301
DS40001663B-page 6 2012-2014 Microchip Technology Inc.
5.0 LAYOUT
5.1 Typical Application Circuit
The following schematic portrays a typical application
circuit, based on a 12RX/ 9TX touch sensor.
FIGURE 5-1: TYPICAL APPLICATION CIRCUIT
5.2 Decoupling Capacitors
The use of decoupling capacitors on power supply
pins, such as VDD and VSS, is required (see
Figure 5-1). Consider the following criteria when using
decoupling capacitors:
1. Value and type of capacitor:
A value of 0.1 µF (100 nF), 10-20V is recommended.
The capacitor should be a low Equivalent Series
Resistance (low ESR) capacitor and have resonance
frequency in the range of 20 MHz and higher. It is
further recommended that ceramic capacitors be used.
2. Placement on the Printed Circuit Board:
The decoupling capacitors should be placed as close to
the pins as possible. It is recommended that the
capacitors be placed on the same side of the board as
the device. If layout space is constrained, the capacitor
can be placed on another layer on the PCB and
connected using a via. Please ensure that the trace
length from the pin to the capacitor is less than
one-quarter inch (6 mm) in length.
3. Handling high-frequency noise:
If the board is experiencing high-frequency noise,
upward of tens of MHz, add a second ceramic-type
capacitor in parallel to the above-described decoupling
capacitor. The value of the second capacitor can be in
the range of 0.01 µF to 0.001 µF. Place this second
capacitor next to the primary decoupling capacitor. In
high-speed circuit designs, consider implementing a
decade pair of capacitances as close to the power and
ground pins as possible (for example, 0.1 µF in parallel
with 0.001 µF).
4. Maximizing performance:
On the board layout from the power supply circuit, run
the power and return traces to the decoupling
capacitors first, and then to the device pins. This
ensures that the decoupling capacitors are first in the
power chain. It is equally important to keep the trace
length between the capacitor and the power pins to a
minimum, thereby reducing PCB track inductance.
Master I2CTM
Controller
MTCH6301
TX3
TX2
TX1
TX0
VSS
VDD
RX0
RX1
RX2
RX3
RX4
30
31
32
33
29
28
27
26
25
24
23
4
3
2
1
5
6
7
8
9
10
11
TX15
TX16
TX17
SDA
TX14
VSS
VCAP
INT
N/C
RX12
RX11
TX9
TX10
TX11
SCL
VDD
VSS
TX5
TX6
TX7
TX8
TX4
41
42
43
44
40
39
38
37
36
35
34
RX9
RX10
TX12
TX13
VSS
VDD
RESET
RX8
RX7
RX6
RX5
15
14
13
12
16
17
18
19
20
21
22
10 µF
20k O
0.1 µF
0.1 µF
0.1 µF
RX0 RX11
TX0 TX8
GPIO/INT
SCL
SDA
MICROCHIP
PICkitTM Serial
Analyzer
VDD
VDD
VDD
2012-2014 Microchip Technology Inc. DS40001663B-page 7
MTCH6301
5.3 Bulk Capacitors
The use of a bulk capacitor is recommended to improve
power supply stability. Typical values range from 4.7 µF
to 47 µF. This capacitor should be located as close to
the device as possible.
5.4 Capacitor on Internal Voltage
Regulator (VCAP)
A low ESR (1 ohm) capacitor is required on the VCAP
pin, which is used to stabilize the internal voltage
regulator output. The VCAP pin must not be connected
to VDD and must have a CEFC capacitor with at least a
6V rating, connected to ground. The type can be
ceramic or tantalum.
5.5 Touch Sensor Design
Considerations
5.5.1 SENSOR PATTERNS AND PCB
LAYOUT
With regard to touch sensor patterns, please refer to
the mTouch Design Center (www.micro-
chip.com/mtouch) for additional information on design-
ing and laying out a touch sensor pattern, as well as
using the correct techniques for PCB trace routing.
5.5.2 PROTOTYPING DESIGNS
Due to their complexity, touch sensor designs typically
require a thorough debugging phase to ensure a
reliable product. If possible, it is suggested that flexible
prototyping hardware be created with this in mind. A
common example is providing external access to the
communication lines for quick test and tuning while
in-circuit. Microchip’s Projected Capacitive
Configuration Utility (PCU) and a configured PICkit
Serial Analyzer can assist with early prototype
development. See the online Microchip MTCH6301
device page for these and other support materials.
5.5.3 SENSOR OVERLAY MATERIAL
To prevent saturation of sensor levels, a minimum
0.5 mm plastic or glass overlay is required for proper
operation of the device, even during a prototyping
phase, even if this value is different than the final
design.
5.5.4 OPERATION WITH AN LCD
MTCH6301 has integrated algorithms to detect and
minimize the effects of noise, but proper care should
always be taken in selecting an LCD and support
components with a focus on reducing noise as much as
possible. Since the interaction between the touch
sensor and display is highly dependent upon the
physical arrangement of the components, proper
testing should always be executed with a fully
integrated device. Please reference your projected
capacitive touch screen manufacturer’s integration
guide for additional design considerations.
5.6 Sensor Layout Configuration
To properly configure a sensor from a physical layout
standpoint, the following registers must be correctly
set:
RX Pin Map/TX Pin Map
RX Scaling Coefficient/TX Scaling Coefficient
Flip State
5.6.1 RX/TX PIN MAP
By default, the RX and TX pins are set as shown in the
Typical Application Circuit (see Section 5.1 “Typical
Application Circuit”). It is recommended to keep this
layout if possible. If a different layout or a different
amount of sensor channels is required, the RX and TX
pins are configured via the Pin Map register arrays. To
access these arrays, please reference Section 6.0
“Communication Protocol” and Section 7.0
“Memory Map”.
The RX and TX lines are configurable for the purpose
of making trace routing and board layout more
convenient. Please note that while RX pins can be
used as TX pins instead, a single pin cannot be used
as both an RX and a TX channel concurrently. The pin
maps are comprised of Pin Map ID numbers, which are
shown in Tab l e 5 -1.
Note: At no time should the device be expected
to respond correctly to a user touching a
bare PCB sensor.
MTCH6301
DS40001663B-page 8 2012-2014 Microchip Technology Inc.
5.6.2 RX/ TX SCALING COEFFICIENT
Scaling coefficient registers exist in RAM for each axis
(RX/TX) and must be modified in accordance with the
number of channels that are in use (see Table 5- 2).
See Section 7.0 “Memory Map” for the location of
these parameters.
TABLE 5-1: PIN MAP ID CHART
Pin Map ID
(RX)
Map ID
(TX)
RX0 8
RX1 7 26
RX2 6 25
RX3 5 12
RX4 4 11
RX5 3 10
RX6 2 9
RX7 1 1
RX8 0 0
RX9 9 24
RX10 10 23
RX11 11 22
RX12 12
TX0 —13
TX1 —6
TX2 —3
TX3 —2
TX4 —4
TX5 —30
TX6 —29
TX7 —28
TX8 —7
TX9 —14
TX10 —15
TX11 —16
TX12 —5
TX13 —8
TX14 —34
TX15 —33
TX16 —32
TX17 —31
TABLE 5-2: RX/TX SCALING
COEFFICIENTS
Number of
Channels RX/TX Scaling Coefficient
(Base 10) (Base 16)
3 21845 0x5555
4 16384 0x4000
5 13107 0x3333
6 10922 0x2AAA
7 9362 0x2492
8 8192 0x2000
9 7281 0x1C71
10 6553 0x1999
11 5957 0x1745
12 5461 0x1555
13 5041 0x13B1
14 4681 0x1249
15 4369 0x1111
16 4096 0x1000
17 3855 0x0F0F
18 3640 0x0E38
2012-2014 Microchip Technology Inc. DS40001663B-page 9
MTCH6301
5.6.3 SENSOR ORIENTATION (FLIP
STATE)
Once the sensor layout is complete, the final output
orientation is configured using the Flip State register, as
shown in Register 5-1. The Flip State register can be
adjusted during operation to support applications
where rotation occurs during use. Possible flip state
configurations are detailed in Figure 5-2.
Figure 5-2 shows the flip state values for all possible
sensor orientations.
REGISTER 5-1: FLIP STATE REGISTER
U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-1
SWAP TXFLIP RXFLIP
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-3 Unimplemented: Read as ‘0
bit 2 SWAP:
1 = RX axis horizontal; TX axis vertical
0 = RX axis vertical; TX axis horizontal
bit 1 TXFLIP:
1 = Invert the TX axis
0 = Do not invert the TX axis
bit 0 RXFLIP:
1 = Invert the RX axis
0 = Do not invert the RX axis
MTCH6301
DS40001663B-page 10 2012-2014 Microchip Technology Inc.
FIGURE 5-2: SENSOR ORIENTATION CHART
5.6.4 UNUSED RX/TX PINS
Unused RX/TX pins are driven to VSS automatically
and should be left as no connects.
SENSOR
RX0 RXn
TX0
TXn
SENSOR
RXn RX0
TX0
TXn
SENSOR
RX0 RXn
TXn
TX0
SENSOR
RXn RX0
TXn
TX0
SENSOR
SENSOR
SENSOR
TX0 TXn
SENSOR
TXn TX0
0, 0 4096, 0
4096, 40960, 4096
0, 0 4096, 0
4096, 40960, 4096
0, 0 4096, 0
4096, 40960, 4096
0, 0 4096, 0
4096, 40960, 4096
0, 0 4096, 0
4096, 40960, 4096
0, 0 4096, 0
4096, 40960, 4096
0, 0 4096, 0
4096, 40960, 4096
0, 0 4096, 0
4096, 40960, 4096
RX0
RXn
RX0
RXn
RX0
RXn
RX0
RXn
TX0 TXn
TXn TX0
SWAP
TXFLIP
RXFLIP
0
0
1
SWAP
TXFLIP
RXFLIP
0
0
0
SWAP
TXFLIP
RXFLIP
0
1
1
SWAP
TXFLIP
RXFLIP
0
1
0
SWAP
TXFLIP
RXFLIP
1
0
1
SWAP
TXFLIP
RXFLIP
1
0
0
SWAP
TXFLIP
RXFLIP
1
1
1
SWAP
TXFLIP
RXFLIP
1
1
0
Default Configuration
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2012-2014 Microchip Technology Inc. DS40001663B-page 11
MTCH6301
5.7 Example Custom Application
Layout
An example 4RX/11TX sensor is shown in Figure 5-3.
In addition to using a completely modified pin layout,
this example differs from the default configuration by
also having the TX axis along the bottom (X) and RX
axis along the side (Y). Note that some RX pins are
also used as TX lines in this example.
FIGURE 5-3: CUSTOM APPLICATION LAYOUT
The resulting scaling coefficient for the custom
application example is shown in Tab le 5-3 . The scaling
coefficients were derived using Ta bl e 5 - 2 .
Using Figure 5-2, the Flip State register should be set
to ‘0b110’ or 0x6.
Sensor Line MTCH6301 Pin Map ID
TX
0TX10 15
1TX11 16
2TX17 31
3TX16 32
4TX15 33
5TX14 34
6RX11 22
7TX13 8
8TX12 5
9RX10 23
10 RX9 24
RX
0RX5 3
1RX6 2
2RX7 1
3RX8 0
The Pin Map register array for this particular setup is set
as follows:
RX Pin Map: {3,2,1,0}
TX Pin Map: {15,16,31,32,33,34,22,8,5,23,24}
MTCH6301
TX3
TX2
TX1
TX0
VSS
VDD
RX0
RX1
RX2
RX3
RX4
TX15
TX16
TX17
SDA
TX14
VSS
VCAP
INT
N/C
RX12
RX11
TX9
TX10
TX11
SCL
VDD
VSS
TX5
TX6
TX7
TX8
TX4
RX9
RX10
TX12
TX13
VSS
VDD
RESET
RX8
RX7
RX6
RX5
RX0 RX3
TX0 TX10
SENSOR
TABLE 5-3: CUSTOM APPLICATION
SCALING VALUES
Axis Channels Scaling Coefficient
RX 4 16384
TX 11 5957
MTCH6301
DS40001663B-page 12 2012-2014 Microchip Technology Inc.
6.0 COMMUNICATION PROTOCOL
6.1 Overview
The MTCH6301 I2C protocol follows a serial streaming
format, not a register-based protocol. To achieve this,
the device will assert the INT pin whenever a new
packet of data is ready to be transmitted to the host.
This will happen under two conditions:
1. New touch or gesture data is available.
2. A command has been sent to the controller and
the response to this command is ready.
6.2 I2C™ Pin Specification
6.2.1 SERIAL DATA (SDA)
The Serial Data (SDA) signal is the data signal of the
device. The value on this pin is latched on the rising
edge of the SCL signal when the signal is an input. With
the exception of the Start (Restart) and Stop conditions,
the high or low state of the SDA pin can only change
when the clock signal on the SCL pin is low. During the
high period of the clock, the SDA pin’s value (high or
low) must be stable. Changes in the SDA pin’s value
while the SCL pin is HIGH will be interpreted as a Start
or a Stop condition.
6.2.2 SERIAL CLOCK (SCL)
The Serial Clock (SCL) signal is the clock input signal
of the device, generated by the host. The rising edge of
the SCL signal latches the value on the SDA pin.
MTCH6301 employs clock stretching and this should
be taken into account by the master controller. The
maximum speed at which MTCH6301 can operate is
400 kbps.
6.2.3 INTERRUPT (INT)
This pin is utilized by MTCH6301 to signal that data is
available and that the master controller should invoke
a master read. INT is an active-high pin and is held low
during all other activities.
6.2.4 DEVICE ADDRESSING
The MTCH6301 7-bit base address is 0x25 and is not
configurable by the user. Every transmission must be
prefixed with this address, as well as a bit signifying
whether the transmission is a master write (‘0’) or
master read (‘1’). After appending this Read/Write bit to
the base address, this first byte becomes either 0x4A
(write) or 0x4B (read).
Note: Note that initiating a read from the device
when INT is in a logic ‘0’ state will result in
an unpredictable response.
Note: If the device is not read within 25 ms of
asserting the INT pin, a timeout will occur
and data will no longer be available.
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2012-2014 Microchip Technology Inc. DS40001663B-page 13
MTCH6301
6.3 Generic Read/Write Protocol
6.3.1 MASTER READ WAVEFORM
FIGURE 6-1: MASTER READ WAVEFORM
6.3.2 MASTER WRITE WAVEFORM
FIGURE 6-2: MASTER WRITE WAVEFORM
Note 1: The first byte read from the device denotes the number of bytes to follow.
2: The last byte read from the device must be followed by a nACK (‘1’) from the host controller. All other bytes
should be followed with ACK (‘0’).
3: INT will be set low within 10 uS of a correct I2C™ address match.
4: All data (DATA0 – DATAn) must be read at once within a single I2C™ transaction, and Restart conditions
are not supported.
ACK PS ACK NACK
ACK
R
Stop
D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
0x25 1[NUM_BYTES] [DATA0] [DATAn]
Start
INT
SCL
SDA
(DATA)
2
1
34
Note 1: If the device is sleeping, it will ACK the address byte, but will not ACK the first byte of the transmission
until it is awake. See Section 9. “Send Enable Touch command (0x00).” for details.
2: The first byte written to the controller denotes the number of bytes to follow.
3: Although it is not required all data be written in a single I2C™ transaction, it is recommended to reduce
the chance of a timeout occurring.
MTCH6301
DS40001663B-page 14 2012-2014 Microchip Technology Inc.
6.3.3 TOUCH PACKET PROTOCOL
Fully-processed touch coordinates will be sent out as
they are processed by MTCH6301. Since it is a slave
device, the INT pin will be asserted whenever one of
these packets is ready for transmission, requiring the
master to initiate a Read command. In other words, no
Write command is necessary before reading one of
these packets.
FIGURE 6-3: EXAMPLE TOUCH PACKET WAVEFORM
Byte Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
D0 1TOUCHID<3:0> TCH (0)0PEN
D1 0X<6:0>
D2 000 X<11:7>
D3 0Y<6:0>
D4 000 Y<11:7>
TOUCHID: Touch ID (0-9)
PEN: Pen State
0 = Pen Up
1 = Pen Down
X: X Coordinate of touch
Y: Y Coordinate of touch
TCH: Always ‘0’; it denotes a touch packet (vs. gesture)
SCL
Start Stop
INT
DATA 0x050x4B 0x81 0x7D 0x05 0x010x6A
Touch ID0, Pen
Down
X: 765 Y: 234
0x4B 0x05 [D0] [D1] [D2] [D3] [D4]
2012-2014 Microchip Technology Inc. DS40001663B-page 15
MTCH6301
6.4 Gesture Protocol
Similar to touch packets, the following packet is
transmitted whenever a gesture is performed on the
sensor. This feature can be enabled via the Comm
Packet CFG register (see Section 7.0 “Memory
Map”).
FIGURE 6-4: GESTURE PACKET WAVEFORM
Note 1: Gestures are not enabled by default.
2: For any hold gestures, packets are
continuously sent until the gesture is no
longer being held.
Byte Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
D0 1TOUCHID<3:0> GEST -10 0
D1 0GESTURE<6:0>
TOUCHID: Touch ID (0-9)
GESTURE: Gesture ID
0x10 Single Tap 0x11 Single Tap (hold)
0x20 Double Tap
0x31 Up Swipe 0x32 Up Swipe (hold)
0x41 Right Swipe 0x42 Right Swipe (hold)
0x51 Down Swipe 0x52 Down Swipe (hold)
0x61 Left Swipe 0x62 Left Swipe (hold)
GEST: Always ‘1’; it denotes a gesture packet (vs. touch)
0x4B 0x02 [D0] [D1]
SCL
Start Stop
INT
DATA 0x020x4B 0x84 0x61
Gesture from
ID1
Swipe Left
MTCH6301
DS40001663B-page 16 2012-2014 Microchip Technology Inc.
6.5 Command Protocol
Bidirectional communication protocol (for
reading/writing configuration data) is shown in
Figure 6-5.
FIGURE 6-5: COMMAND PROTOCOL
6.6 Full Command Set
A complete listing of MTCH6301 commands is shown
in Ta b l e 6 - 1 . Any commands which contain additional
data bytes, either sent or received, are shown
alongside an example data stream in the following
sections.
6.6.1 OVERVIEW
0x4A
0x4B NUM0
0x55 NUM CMD [D0] [Dn]...
0x55 NUM1RES [D0] [Dn]...CMD
I2CTM Data
I2CTM Data
INT
INT
Command
(I2CTM Write)
Response
(I2CTM Read)
NUM: Number of bytes to follow (true for NUM, NUM0, NUM1).
CMD: Command sent/ responded to
RES: Status result of command:
0x00 = Success
0x80 = Parameter out of range
0xFE = Timeout (not enough bytes received)
0xFF = Unrecognized command
0xFD = Invalid parameter
0xFC = Missing or extra parameter
D0 - Dn:Data associated with command
TABLE 6-1: COMMAND SET
CMD ID Name Description
0x00 Enable Touch Enable Touch functionality
0x01 Disable Touch Disable Touch functionality
0x14 Scan Baseline Instruct controller to scan for new sensor baseline immediately
0x15 Write Register Write data to specified register
0x16 Read Register Read data from specified register
0x17 Write NVRAM Write all current register values to NVRAM
0x18 Software Sleep Instruct controller to enter Sleep mode
0x19 Erase NVRAM Erase the contents of the nonvolatile RAM section
0x1A Manufacturing Test Perform manufacturing tests on all sensor I/O channels
0x83 Device ID Retrieve device ID/version
2012-2014 Microchip Technology Inc. DS40001663B-page 17
MTCH6301
6.6.2 WRITE REGISTER/ READ
REGISTER
It writes or reads to a single register. Please note that
all registers are volatile, and any modified data will be
lost on power-down. To store the current register
configuration permanently, the Write NVRAM
command should be used.
FIGURE 6-6: WRITE REGISTER COMMAND
FIGURE 6-7: READ REGISTER COMMAND
0x4A
0x4B 0x04
0x55 0x04 0x15 [D0] [D2][D1]
0x55 0x02 0x00 0x15
INT
INT
Command
(I2CTM Write)
Response
(I2CTM Read)
D0 = Index Location
D1 = Offset Location
D2 = Value to Write to Specified Register
0x4A
0x4B 0x05
0x55 0x03 0x15 [D0] [D1]
0x55 0x03 0x16 [D2]
INT
INT
Command
(I2CTM Write)
Response
(I2CTM Read)
0x00
D0 = Index Location
D1 = Offset Location
D2 = Read Value at Specified Register
MTCH6301
DS40001663B-page 18 2012-2014 Microchip Technology Inc.
6.6.3 MANUFACTURING TEST
This test performs the following checks on all mapped
sensor pins:
1. Short to VDD
2. Short to GND
3. Pin-to-pin short.
If an I/O error is discovered, bits for the pins in question
will be set in the TX Short Status and RX Short Status
registers.
Please note that:
1. The RX7/RX8 pins will always report an error.
2. If the sensor has more than 16 TX channels,
then channels 17 and 18 will never report an
error.
FIGURE 6-8: MANUFACTURING TEST
6.6.4 DEVICE ID
It allows the host to read the device ID.
FIGURE 6-9: DEVICE ID
0x4A
0x4B 0x05
0x55 0x01 0x1A
0x55 0x03 0x1A [D0]
INT
INT
Command
(I2CTM Write)
Response
(I2CTM Read)
0x00
D0 = Result; 0 = success, 1 = I/O error
0X050X00 0X10 0X02
0x4A
0x4B 0x05
0x55 0x01 0x83
0x55 0x03 0x83
INT
INT
Response
(I2CTM Read)
0x00
Command
(I2CTM Write)
RESET RESET
2012-2014 Microchip Technology Inc. DS40001663B-page 19
MTCH6301
6.6.5 TYPICAL I2C COMMAND
TRANSMISSION
Figure 6-10 depicts the master controller reading from
RAM location 0x01, to determine the number of RX
channels the controller is configured to use (0x0C or
12).
FIGURE 6-10: I2C™ COMMAND READ AND WRITE
6.7 Wake on I2C
The MTCH6301 is capable of waking up upon receiving
an I2C command from the host. Please note that since
wake-up time can take up to 350 µs, the controller must
resend any I2C bytes that were not acknowledged
(ACK) before continuing the transmission.
Since the controller will wake up upon a correct I2C
address match, it does not matter which command is
sent. For simplicity, the Enable Touch command is
recommended.
6.8 RESET Pin Behavior
The MTCH6301 can be reset by driving the RESET pin
low. When released, the device will assert the INT pin
until it has finished initialization routines. During this
time, any communication to the I2C address (0x25) will
result in a nACK.
FIGURE 6-11: INT BEHAVIOR AFTER
RESET
SDA
SCL
Start Stop
INT
DATA 554A 03 16 00 01
SDA
SCL
Start Stop
INT
DATA 054B 55 03 00 0C16
Master Write
Master Read
(Controller Response)
INT
RESET
tRST
80 ms < tRST < 100 ms
RESET RESET RESET RESET
MTCH6301
DS40001663B-page 20 2012-2014 Microchip Technology Inc.
6.9 Recommended Start-up Sequence
For ease of use, it is recommended that all custom
parameters be stored in NVRAM at the time of
production (or on first power-on) for the lifetime of the
chip. Once this has been completed, the start-up
procedure for the rest of the product’s life should be as
follows:
1. Prepare I2C master/host controller; initialize any
components of the system that depend upon the
MTCH6301 output.
2. Set RESET low for > 5 µs.
3. Set RESET high.
4. Wait for low state on INT.
5. If desired, check for correct device operation by
using the Device ID command.
If the application is such that using the NVRAM to store
custom parameters isn’t possible, the following start-up
procedure is recommended:
1. Prepare I2C master/host controller; initialize any
components of the system that depend upon the
MTCH6301 output.
2. Set RESET low for > 5 µs.
3. Set RESET high.
4. Wait for low state on INT.
5. If desired, check for correct device operation by
using the Device ID command.
6. Send Disable Touch command (0x01).
7. Write all desired parameters to the device.
8. Send Scan Baseline command (0x14).
9. Send Enable Touch command (0x00).
Note: If the application is designed to use the
default parameters, the above start-up
procedure should be used.
2012-2014 Microchip Technology Inc. DS40001663B-page 21
MTCH6301
7.0 MEMORY MAP
TABLE 7-1: MTCH6301 MEMORY MAP
Group Index
Byte
Offset
Byte Register Name Size
(Bytes) Description Data Range Default Value
General 0x00 0x01 RX Channels 1 Number of RX Sensor Channels 3-13 12
0x02 TX Channels 1 Number of TX Sensor Channels 3-18 9
0x04 RX Scaling <7:0> 2 RX Scaling Coefficient 3640-21845 5461
0x05 RX Scaling <15:8>
0x06 TX Scaling <7:0> 2 TX Scaling Coefficient 3640-21845 7281
0x07 TX Scaling <15:8>
Sensor Map 0x01 0x00-0x0C RX Pin Map 13 RX Pin Map Array 0-12 Section 5.6.1
“RX/TX Pin
Map”
0x02 0x00-0x12 TX Pin Map 18 TX Pin Map Array 0-34 Section 5.6.1
“RX/TX Pin
Map”
Self 0x10 0x00 Self Scan Time 1 Number of self readings to sum per electrode 1-30 5
0x01 Self Threshold 1 Threshold at which a touch may be present 10-150 40
Mutual 0x20 0x00 Mutual Scan Time 1 Number of mutual readings to sum per node 1-30 9
0x01 Mutual Threshold 1 Threshold at which a touch may be present 10-150 40
Decoding 0x30 0x00 Flip State 1 This determines the orientation of the sensor with respect to the
coordinate output
0b000-0b111 0b001
0x01 Number of Averages 1 Number of previous touch coordinates to average with current position
coordinate (smoothing filter)
1-16 8
0x04 Minimum Touch Distance 1 Minimum distance (interpolated coordinates) allowed between two touch
locations before suppressing the weaker touch.
0-255 150
0x05 Pen Down Timer 1 Number of successive sensor scans identifying a touch required prior to
transmitting touch data
0-10 3
0x06 Pen Up Timer 1 Number of successive sensor scans without detecting a touch prior to a
touch up packet being sent
0-10 3
0x07 Touch Suppression Value 1 The maximum number of touch points to transmit. Note that ten touch IDs
are still analyzed and tracked, just not reported; 0 = Disabled
0-10 0
MTCH6301
DS40001663B-page 22 2012-2014 Microchip Technology Inc.
Gestures 0x50 0x00 RX Swipe Length 1 Minimum swipe distance in the RX direction before gesture is recognized 10-255 160
0x01 TX Swipe Length 1 Minimum swipe distance in the TX direction before gesture is recognized 10-255 150
0x02 Swipe Boundary 1 The distance (in interpolated positions) a swipe can move, in the direction
opposite to the direction being swiped, before the gesture is canceled.
0-255 150
0x03 Swipe Hold Threshold 1 The maximum distance (in interpolated positions) a swipe-and-hold
gesture can move before the gesture is canceled
0-255 70
0x04 Swipe Time <7:0> 2 The maximum amount of time (in ms) the user has to perform a swipe
after initial pen down
0-65535 200
0x05 Swipe Time <15:8>
0x06 Tap Time <7:0> 2 The maximum amount of time (in ms) the user has to perform a click after
initial pen down
0-65535 500
0x07 Tap Time <15:8>
0x08 Tap Threshold 1 The maximum distance (in interpolated positions) a tap gesture can move
before it is no longer recognized as a tap
1-255 120
0x09 Minimum Swipe Velocity 1 The minimum velocity a swipe must maintain to be a swipe gesture.
Values below this will either cancel the gesture (if touch removed) or
move to the swipe-and-hold state (if touch is still present)
1-50 3
0x0A Double Tap Time <7:0> 2 The maximum amount of time allowed between the two taps of a double
tap (in ms)
50-1000 350
0x0B Double Tap Time <15:8>
0x0C Gesture Edge Keep-out 1 This value determines the width of a keep-out barrier around the edge of
the active touch area. This helps remove edge-effect issues.
0-255 128
Configuration 0xF0 0x00 SLP <7:0> 4 Duration (in ms) without touch activity before the controller enters Sleep
state
0-4,294,967,295 8000
0x01 SLP <15:8>
0x02 SLP <23:16>
0x03 SLP <31:24>
0x07 Touch Packet CFG 1 Touch Packet Configuration – Enabled: 0x81, Disabled: 0x01 0x81, 0x01 0x81
0x09 Gesture Packet CFG 1 Gesture Packet Configuration – Enabled: 0x81, Disabled: 0x01 0x81, 0x01 0x01
0x0A Status Packet CFG 1 Status Packet Configuration – Enabled: 0x81, Disabled: 0x01 0x81, 0x01 0x01
I/O Status 0xF1 0x02 TX Short Status <7:0> 2 Identifies which TX pins are shorted after using Manufacturing Test
command - read only
0x00-0xFF 0x00
0x03 TX Short Status <15:8>
0x06 RX Short Status <7:0> 2 Identifies which RX pins are shorted after using Manufacturing Test
command - read only
0x00-0xFF 0x00
0x07 RX Short Status <15:8>
TABLE 7-1: MTCH6301 MEMORY MAP (CONTINUED)
Group Index
Byte
Offset
Byte Register Name Size
(Bytes) Description Data Range Default Value
won. W @fi»$
2012-2014 Microchip Technology Inc. DS40001663B-page 23
MTCH6301
8.0 SPECIAL FEATURES
8.1 Gestures
Single-finger gestures are a fast and intuitive way to
navigate a feature-rich human-machine interface.
MTCH6301 supports 11 single finger gestures natively,
without requiring interaction from the master processor.
Tuning may be required depending on the layout of the
sensor, the time duration and length of activation
required for your gesture-supported application. The
most common defaults are already preloaded and
should serve most applications. These parameters and
their descriptions are available in the “Gestures”
section of the memory map (see Section 7.0 “Memory
Map”).
If your application requires only gesture functionality,
and does not require touch coordinates, the touch
packet configuration byte (see Section 7.0 “Memory
Map”) can be used to turn off all touch coordinate data.
Note: Gestures are not enabled by default, and
must be enabled via the gesture packet
configuration byte in RAM (see
Section 7.0 “Memory Map”).
TABLE 8-1: GESTURE TYPES
Icon Gesture Type Icon Gesture Type
Tap (Click) Tap and Hold
Double Tap (Double Click)
Swipe Down Swipe Down and Hold
Swipe Up Swipe Up and Hold
Swipe Right Swipe Right and Hold
Swipe Left Swipe Left and Hold
MTCH6301
DS40001663B-page 24 2012-2014 Microchip Technology Inc.
8.2 Sleep
Sleep functionality is enabled by default, and follows
the behavior shown in Figure 8-1. This functionality can
be modified via the SLP register (see Section 7.0
“Memory Map”).
The SLP register is the time (in ms) without touch
activity before controller enters Sleep mode.
FIGURE 8-1: SLEEP FUNCTIONALITY
8.3 Nonvolatile RAM (NVRAM)
Permanent storage of parameters that have been
modified can be achieved using the internal NVRAM.
This NVRAM is not meant for continuous writing, as it
has a low write-cycle limit of 20,000.
Upon start-up, the NVRAM’s data (if present) is loaded
into the controller. If no data is available in the NVRAM,
the device defaults are loaded instead.
Please note that RAM parameters cannot be
individually written to the NVRAM. They are all written
with only one command. See the applicable command
within the command set for more details. (Section 6.6
“Full Command Set”)
No touch for
[SLP] ms?
[Normal Full Decode
of Sensor]
Transmit
Touch
Sleep for
 ms
Wake up;
Touch exists? Yes
No
Yes
Touch?
No
No
Yes
2012-2014 Microchip Technology Inc. DS40001663B-page 25
MTCH6301
8.4 Touch Performance
Using default acquisition parameters, Figure 8-2
shows the relationship of single-touch report rate with
regard to sensor size.
FIGURE 8-2: REPORT RATE VS SENSOR SIZE
0
100
200
300
400
2x2
4x4
6x6
8x8
12x9
13x15
Report Rate (PPS) vs Sensor Size (Channels)
MTCH6301
DS40001663B-page 26 2012-2014 Microchip Technology Inc.
9.0 ELECTRICAL
CHARACTERISTICS
This section provides an overview of the MTCH6301
electrical characteristics. Additional information will be
provided in future revisions of this document as it
becomes available.
9.1 Absolute Maximum Ratings(†)
Ambient temperature under bias........................................................................................................ -40°C to +85°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on pins with respect to VSS
on VDD pin ................................................................................................................................. -0.3V to +4.0V
on all other pins ............................................................................................................... 0.3V to (VDD + 0.3V)
Maximum current
out of VSS pin .......................................................................................................................................300 mA
into VDD pin(s) .....................................................................................................................................300 mA
sunk by all ports ..................................................................................................................................200 mA
sourced by all ports .............................................................................................................................200 mA
Maximum output current
sunk by any I/O pin ................................................................................................................................15 mA
sourced by any I/O pin ..........................................................................................................................15 mA
9.2 Standard Operating Conditions
The standard operating conditions for any device are defined as:
Operating Voltage: VDDMIN VDD VDDMAX
Operating Temperature: TA_MIN TA TA_MAX
VDD — Operating Supply Voltage(1)
MTCH6301
VDDMIN .................................................................................................................................... +2.4V
VDDMAX .................................................................................................................................... +3.6V
TA — Operating Ambient Temperature Range
Industrial Temperature
TA_MIN ...................................................................................................................................... -40°C
T
A_MAX .................................................................................................................................. +105°C
Note: This device is sensitive to ESD damage and must be handled appropriately. Failure to properly handle and
protect the device in an application may cause partial to complete failure of the device.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
Note 1: Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be
limited by the device package power dissipation characterizations. See Tab l e 9 - 1 to calculate device
specifications.
2012-2014 Microchip Technology Inc. DS40001663B-page 27
MTCH6301
9.3 DC Characteristics
TABLE 9-1: THERMAL OPERATING CONDITIONS
Symbol Rating Min. Typ. Max. Units
TJOperating Junction Temperature Range -40 +125 C
TAOperating Ambient Temperature Range -40 +85 C
PD
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD-? IOH)
I/O Pin Power Dissipation:
PI/O = ? (({VDD - VOH} x IOH) + ? (VOLx IOL))
PINT + PI/OW
PDMAX Maximum Allowed Power Dissipation (TJ-TA)/θJA W
TABLE 9-2: THERMAL PACKAGING CHARACTERISTICS
Symbol Characteristics Typ. Max. Units
θJA Package Thermal Resistance, 44-pin QFN 32 C/W
θJA Package Thermal Resistance, 44-pin TQFP 45 C/W
TABLE 9-3: OPERATING VOLTAGE AND CURRENT
Symbol Characteristics Min. Typ. Max. Units Conditions
VDD Supply Voltage 2.3 3.6 V
VBOR BOR Event on VDD transition high-to-low 2.0 2.3 V
IDD Operating Current 19 25 mA Note 1
ISLP Sleep Current 200 245 µA Note 1, 2
Note 1: Parameter is characterized, but not tested.
2: Device configured with default parameters.
TABLE 9-4: PIN INPUT AND OUTPUT SPECIFICATIONS
Symbol Characteristic / Pins Min. Max. Units Conditions
VIL Input Low Voltage
RX, TX VSS 0.15 VDD V—
SDA, SCL VSS 0.3 VDD VNote 1
VIH Input High Voltage
RX, TX 0.65 VDD VDD VNote 1
SDA, SCL 0.65 VDD VDD VNote 1
VOL Output Low Voltage
INT, RX, TX VSS 0.4 V IOL 10 mA, VDD = 3.3V
SDA, SCL VSS 0.4 V IOL 10 mA, VDD = 3.3V(1,2)
VOH Output High Voltage
INT, RX, TX 2.4 VDD VIOH 10 mA, VDD = 3.3V
SDA, SCL V Note 2
VBOR Brown-out Event on VDD
Transition high-to-low
2.0 2.3 V Min. not tested
Note 1: Parameter is characterized, but not tested.
2: Open drain structure.
Condllion Condlfion
MTCH6301
DS40001663B-page 28 2012-2014 Microchip Technology Inc.
9.4 AC Characteristics and Timing Parameters
FIGURE 9-1: I2C™ BUS START/STOP BIT TIMING CHARACTERISTICS
FIGURE 9-2: I2C™ BUS DATA TIMING CHARACTERISTICS
TABLE 9-5: RESET TIMING
Symbol Characteristic Min. Typ. Max. Units Conditions
TPU Power-up Period 400 µs Notes 1, 2
TBOR Brown-out Pulse Width (Low) 1 µs Note 1
Note 1: Parameter is characterized, but not tested.
2: Power-up period is for core operation to begin and it does not reflect response time to a touch.
2012-2014 Microchip Technology Inc. DS40001663B-page 29
MTCH6301
TABLE 9-6: I2C™ BUS DATA TIMING REQUIREMENTS
Parameter
Number Symbol Characteristic Min. Max. Units Conditions
IS1 TLO:SCL Clock Low Time 100 kHz mode 4.7 µs
400 kHz mode 1.3 µs
IS2 THI:SCL Clock High Time 100 kHz mode 4.0 µs
400 kHz mode 0.6 µs
IS3 TF:SCL SDA and SCL
Fall Time
100 kHz mode 300 ns
400 kHz mode 20+0.1 CB300 ns
IS4 TR:SCL SDA and SCL
Rise Time
100 kHz mode 1000 ns
400 kHz mode 20+0.1 CB300 ns
IS5 TSU:DAT Data Input Setup
Time
100 kHz mode 250 ns
400 kHz mode 100 ns
IS6 THD:DAT Data Input Hold
Time
100 kHz mode 0 ns
400 kHz mode 0 0.9 µs
IS7 TSU:STA Start Condition
Setup Time
100 kHz mode 4700 ns Only relevant for repeated
Start condition
400 kHz mode 600 ns
IS8 THD:STA Start Condition
Hold Time
100 kHz mode 4000 ns After this period, the first
clock pulse is generated
400 kHz mode 600 ns
IS9 TSU:STO Stop Condition
Setup Time
100 kHz mode 4000 ns
400 kHz mode 600 ns
IS10 THD:STO Stop Condition
Hold Time
100 kHz mode 4000 ns
400 kHz mode 600 ns
IS11 T
AA:SCL Output Valid from
Clock
100 kHz mode 0 3500 ns
400 kHz mode 0 1000 ns
IS12 TBF:SDA Bus Free Time 100 kHz mode 4.7 µs Time bus must be free before
new transmission can start
400 kHz mode 1.3 µs
—C
BSCL, SDC Capacitive Loading 400 pF Note 1
Note 1: Parameter is characterized, but not tested.
MTCH6301
DS40001663B-page 30 2012-2014 Microchip Technology Inc.
10.0 ORDERING INFORMATION
TABLE 10-1: ORDERING INFORMATION
Part Number Pin Package Packing
MTCH6301-I/PT 44 TQFP 10x10x1mm Tray
MTCH6301-I/ML 44 QFN 8x8x0.9mm Tube
MTCH6301T-I/PT 44 TQFP 10x10x1mm T/R
MTCH6301T-I/ML 44 QFN 8x8x0.9mm T/R
33333333333 W 3 m 33333333333 ‘8‘ MICHDCHIP NNN
2012-2014 Microchip Technology Inc. DS40001663B-page 31
MTCH6301
11.0 PACKAGING INFORMATION
11.1 Package Marking Information
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
44-Lead QFN (8x8x0.9 mm) Example
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
XXXXXXXXXXX
PIN 1 PIN 1
44-Lead TQFP (10x10x1 mm) Example
XXXXXXXXXX
YYWWNNN
XXXXXXXXXX
XXXXXXXXXX
MTCH6301
-I/ML
1403017
3
e
MTCH6301
-I/PT
1403017
3
e
44-Lead Plainc Quad Flak, No Lead Package (ML) - 8x8 mm Body [QFN] Note: http'I/www microchIp com/packagmg For Ihe most currem package drawmgs please see the Microcmp Packaging SpeCIfication Iocated aI ~ 7/ ’ ‘////’ 2 W234 \ //////// //////- 7,4_z// ,4? ,,,,, (DATUM a) — ' (DATUM A) —\\l! E 0.20 . 2x E o 20 0 TOP VIEW I “m: , A1 same W ______ - PLANE J A3 008 c SIDE VIEW E I $-Ill3 e) o.1o® C A B NOTE’I 2 AIBI BOTTOM VIEW MIcrochIp Technology DrawIng ammo Sheet 1 012
MTCH6301
DS40001663B-page 32 2012-2014 Microchip Technology Inc.
11.2 Package Details
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN] Note: For the most current package drawmgs, please see the Microcmp Packaging Specmcation located at http-//www mtcrochtp com/packagmg Units MtLLIMETERs Dtmenston Lnntts MIN \ NOM | MAX Number at Pins N 44 Pttch e 0.55 580 Overatl Hetght A 0.60 0.90 1.00 Standott A1 0.00 0.02 0.05 Terminat Tmckness A3 0 20 REF Overau Wtdtn E a 00 950 Exposed Pad Wtdth E2 6 25 t 6 45 | 6 60 Overau Length D 8.00 ESQ Exposed Pad Length D2 6.25 6.45 6.50 Terminat Width 0 0.20 0.30 0.35 Terminat Length L o 30 0 40 o 50 Termmat-to-Expusea-Pau K o 20 - - Notes 1. Pm 1 visuat tncex teature may vary. but must be tccatea wttnin the hatched area 2 Package IS saw stngutated 3. Dtmenstoning and toteranctng perASMEY1A.5M BSC. Bastc Dtmensmn Theorehcal‘y exact vame Shawn wtmaul lulerances REF. Reference Dtmenston usuanv wtlhaut toteranee. tor informalion purposes onlv. Mtcmcntp Technology Drawtng coa-toac Sheet 2 on
2012-2014 Microchip Technology Inc. DS40001663B-page 33
MTCH6301
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN] Note: For the most current package drawmgs, please see the Microchip Packaging Specification located at http I/www.microchip.com/packaging Ct fl W2 n—.‘ N A m HBflDDDDDDDE$ rJEDDDDEDDDEQ- SiLK SCREEN DDDDDDDDDDEE, MAL RECOMMENDED LAND PATTERN Units MiLLIMETERS Dimension Limils MIN | NOM | MAX Contact Pitch E n 65 BSC Dptlonai Center Pad Width W2 6 60 Optionai Center Pad Length T2 6.60 Contact Fad Spacing Ci 0.00 Contad Pad Spacing 02 3.00 Contact Pad Width (x44) Xi 0 35 Contacl Pad Length (X44) Y1 D 55 Distance Between Pads G 0 25 Notes 1 Dimensioning and toleranclng perASME v14 SM 550 Basic Dimension ThenreticaHy exact value shown without tolerances. Micmcmp Tecnnciogy Drawing No 004-21035
MTCH6301
DS40001663B-page 34 2012-2014 Microchip Technology Inc.
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2012-2014 Microchip Technology Inc. DS40001663B-page 35
MTCH6301
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44-Lead Plastic Thin Quad F‘a‘pack (PT) 10X10><1 mm="" body,="" 2.00="" mm="" footprint="" [tqfp]="" '="" ddddddddddu—fi="" o="" 1="" ci="" |:|="" |:|="" |:|="" __="" |:|="" |:|="" 7i="" |:|="" |:|="" s="" —="" |:|="" |:|="" |:|="" |:|="" 02="" |:|="" |:|="" |:|="" |:|="" e="" silk="" screen="" e="" |:|="" |:|="" ’="" udduddddud="" e="" w="" r="" i,="" ,l="" l="" x1="" 4="" l="" e="" recommended="" land="" pattern="" umts="" m‘llimeters="" dwmenswon="" mes="" mn="" |="" nom="" \="" max="" conlacl="" push="" e="" o="" 80="" bsc="" cunlact="" pad="" spacing="" ci="" 11.40="" conlact="" pad="" spacing="" (:2="" 11.40="" contact="" pad="" wwdth="" (x44)="" x1="" 0="" 55="" contact="" pad="" length="" (x44)="" v1="" 1="" so="" sttance="" belween="" pads="" g="" u="" 25="" notes:="" 1.="" dimensiomng="" and="" to‘erancmg="" per="" asme="" y14.5m="" esc.="" eas‘c="" dlmenslun.="" theorehcal‘y="" exact="" vame="" shawn="" wunam="" mlerances="" chrocmp="" technmogy="" drawing="" no.="" 004720768="">
MTCH6301
DS40001663B-page 36 2012-2014 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2012-2014 Microchip Technology Inc. DS40001663B-page 37
MTCH6301
APPENDIX A: DATA SHEET
REVISION HISTORY
Revision A (2012)
Initial release of the document.
Revision B (03/2014)
Updated the Device Overview page; Added Chapter 4;
Updated Chapters 1 through 9 and Chapter 11; Other
minor corrections.
MTCH6301
DS40001663B-page 38 2012-2014 Microchip Technology Inc.
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
YSTEM
2012-2014 Microchip Technology Inc. DS40001663B-page 39
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2013, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-63276-011-1
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
6‘ MICROCHIP AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
DS40001663B-page 40 2012-2014 Microchip Technology Inc.
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
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Fax: 33-1-69-30-90-79
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Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Pforzheim
Tel: 49-7231-424750
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
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Tel: 31-416-690399
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Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
03/13/14

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