51338,55909 Series Spec Datasheet by Molex

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molex E 0.4 mm E“)? Efiifiifi 3*79
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TITLE: 0.4 BOARD TO BOARD CONNECTOR
(Hgt=1.5mm)
-LEAD FREE- CONFIDENTIAL 製品仕様書
F
REVISED
J2016-0650
2015/12/17
M.TAKASHIMA
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DESIGN CONTROL
J
STATUS
WRITTEN
BY:
N.AIDA
CHECKED
BY:
K.TOJO
APPROVED
BY:
M.SASAO
DATE : YR/MO/DAY
2004/04/09
DOCUMENT NUMBER
PS-51338-002
FILE NAME
PS-51338-002.docx
SHEET
1 OF 16
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
1.適用範囲 SCOPE
本仕様書は、 殿 に納入する 0.4 mm ッチ 基板対基板 ネクタ について規定する。
This specification covers the 0.4 mm PITCH BOARD TO BOARD CONNECTOR series.
2.製品名称及び型 PRODUCT NAME AND PART NUMBER
Product Name
Part Number
リセプタクル ハウジング アッセンブリ J-ベンド ール ネイル付
Receptacle Housing Assembly J-Bend Tail With Nail
無鉛
LEAD FREE
51338-***9
51338-***9 エンボス梱包品
Embossed Tape Package for 51338-***9
無鉛
LEAD FREE
51338-**74
プラグ アッセンブリ ネイル
Plug Assembly With Nail
無鉛
LEAD FREE
55909-**73
55909-**73 エンボス包品
Embossed Tape Package for 55909-**73
無鉛
LEAD FREE
55909-**74
* : 図面参照 Refer to the drawing.
molex
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
3.定 RATINGS
Item
Standard
最大許容電圧
Rated Voltage (MAX.)
50 V
[ AC (実効値 rms) / DC ]
最大許容電流
Rated Current (MAX.)
0.3 A
使用温度範囲*1
Ambient Temperature Range
-25°C ~ +85°C *2
保管条件
Storage Condition
温度
Temperature
-10°C +50°C
湿度
Humidity
85%R.H.以下(但し結露しないこと
85%R.H. MAX. (No Condensation)
期間
Terms
出荷後 6ヶ月(未開封の場合
For 6 months after shipping (unopened package)
*1 : 基板実装後の無通電状態は、使用温度範囲が適用されます
Non-operating connectors after reflow must follow the operating temperature range condition.
*2 : 通電による温度上昇分も含む。
This includes the terminal temperature rise generated by conducting electricity.
molex 4,1_ Eiflfifififi Electrical Performance 4,2 Mimm: Mechanical Performance
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
4.性 PERFORMANCE
4-1電気的性能 Electrical Performance
Item
Test Condition
Requirement
4-1-1
Contact
Resistance
コネクタを嵌合させ、開放電 20mV下、短絡電流
10mA にて測定する。
(JIS C5402 5.4)
Mate connectors and measured by dry circuit,
20mV MAX., 10mA.
(JIS C5402 5.4)
40 milliohm MAX.
4-1-2
Insulation
Resistance
コネクタを嵌合させ、隣接するターミナル間及び
タ-ミナル、ース間に、DC 250V を印加し測定する
(JIS C5402 5.2/MIL-STD-202 試験法 302)
Mate connectors and apply 250V DC between adjacent
terminal or ground.
(JIS C5402 5.2/MIL-STD-202 Method 302)
100 Megohm MIN.
4-1-3
Dielectric
Strength
コネクタを嵌合させ、隣接するターミナル間及び
タ-ミナル、アース間に、AC(rms) 250V (実効値)
1分間 印加する。
(JIS C5402 5.1/MIL-STD-202 試験法 301)
Mate connectors and apply 250V AC(rms) for 1 minute
between adjacent terminal or ground.
(JIS C5402 5.1/MIL-STD-202 Method 301)
異状なきこと
No Breakdown
4-2 機械的性能 Mechanical Performance
Item
Test Condition
Requirement
4-2-1
挿入力及び抜去
Insertion and
Withdrawal Force
毎分 25±3mm の速さで挿入、抜去を行う
Insert and withdraw connectors at the speed rate of
25±3 mm/minute.
6項参照
Refer to paragraph 6
4-2-2
ターミナル保持
Terminal / Housing
Retention Force
ハウジングに装着されたターミナルを
毎分 25±3mm の速さで引張る。
Apply axial pull out force at the speed rate of
25±3 mm/minute on the terminal assembled in the
housing.
0.49N {0.05 kgf} MIN.
molex 473. £7)th- Environmental Performance and Others
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
4-3その Environmental Performance and Others
Item
Test Condition
Requirement
4-3-1
繰返し挿抜
Repeated
Insertion /
Withdrawal
1分間 10 以下 の速さで挿入、抜去を
30 繰返す。
When mated up to 30 cycles repeatedly by the
rate of 10 cycles per minute.
Contact
Resistance
80 milliohm MAX.
4-3-2
Temperature
Rise
コネクタを嵌合させ、最大許容電流を
通電し、コネクタの温度上昇分を測定する。
(UL 498)
Carrying rated current load.
(UL 498)
Temperature
Rise
30 °C MAX.
4-3-3
Vibration
DC 1mA 通電状態にて、嵌合軸を含む互いに垂
直な 3方向 に掃引割合に
105510 Hz/分、全振幅 1.5mm 振動を
2時間 加える。
(MIL-STD-202 試験法 201)
Amplitude : 1.5mm P-P
Frequency : 10~55~10 Hz in 1 minute.
Duration : 2 hours in each X.Y.Z.axes.
(MIL-STD-202 Method 201)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm MAX.
Discontinuity
1.0 microsecond
MAX.
4-3-4
Mechanical
Shock
DC 1mA 通電状態にて、嵌合軸を含む互いに垂
直な 6方向 490m/s { 50G } の衝撃を 3
加える。
(JIS C60068-2-27/MIL-STD-202 験法 213)
490m/s { 50G } , 3 strokes in each X.Y.Z.
axes.
(JIS C60068-2-27/MIL-STD-202 Method 213)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm MAX.
Discontinuity
1.0 microsecond
MAX.
4-3-5
Heat Resistance
コネクタを嵌合させ、85±2°C の雰囲気中に
96時間 放置後取り出し1~2時間 室温に放置
する。
(JIS C60068-2-2/MIL-STD-202 試験法 108)
85±2°C, 96 hours
(JIS C60068-2-2/MIL-STD-202 Method 108)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm MAX.
4-3-6
Cold Resistance
コネクタを嵌合させ、25±3°C の雰囲気中
96時間 放置後取り出し1~2時間 室温に放置
する。
(JIS C60068-2-1)
25±3°C, 96 hours
(JIS C60068-2-1)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm MAX.
molex
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-7
湿
Humidity
コネクタを嵌合させ40±2°C 、相対湿度
90~95 の雰囲気中に 96時間 放置後
取り出し、1 ~2時間 室温に放置する。
(JIS C60068-2-3/MIL-STD-202 試験法 103)
Temperature : 40±2°C
Relative Humidity : 90~95%
Duration : 96 hours
(JIS C60068-2-3/MIL-STD-202 Method 103)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm MAX.
Dielectric
Strength
4-1-3項満足のこと
Must meet 4-1-3
Insulation
Resistance
50 Megohm MIN.
4-3-8
温度サイクル
Temperature
Cycling
コネクタを嵌合させ、 55°C 30分、+85°C
30 これを 1サイクル とし、
5サイクル 繰返す。但し、温度移行時間は
5分以内 する。試験後 1~2時間 室温に
放置する。
(JIS C0025)
5 cycles of :
a) 55°C 30 minutes
b) + 85°C 30 minutes
(JIS C0025)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm MAX.
4-3-9
Salt Spray
コネクタを嵌合させ、35±2°C にて 5±1%
重量比 の塩水を 48±4時間 噴霧し、試験後常
温で水洗いした後、室温で乾燥させる。
(JIS C60068-2-11/MIL-STD-202 験法101)
48±4 hours exposure to a salt spray from the
5±1% solution at 35±2°C.
(JIS C60068-2-11/MIL-STD-202 Method 101)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm MAX.
4-3-10
亜硫酸ガス
SO2 Gas
コネクタを嵌合させ、40±2 にて
50±5ppm の亜硫酸ガス中に 24時間
放置する。
24 hours exposure to 50±5ppm SO2 gas
at 40±2.
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm MAX.
4-3-11
半田付け性
Solderability
ターミナルまたはピンをフラックスに浸し、
245±3°C の半田に 3±0.5 浸す。
Soldering Time : 3±0.5 sec.
Solder Temperature : 245±3 °C
濡れ性
Solder
Wetting
浸漬面積の
95%以上
95% of immersed
area must show
no voids, pin
holes.
molex Reflow soldering method Soldering iron method
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-12
半田耐熱性
Resistance to
Soldering Heat
リフロー時
7項の条件にてリフローを2回実施する。
Reflow soldering method
Repeat paragraph 7, condition twice.
Appearance
端子ガタ、割れ
異状なきこと
No Damage
手半田時
端子先端より0.2mm具先端より0.2mm
位置まで350±10の半田ゴテにて最大5
加熱する。但し、ピンに異常な加圧がない
と。
Soldering iron method
Using a soldering iron (350±10 for 5
seconds MAX.) heat up the area 0.2mm from
the tip of the solder tails and fitting nails.
However, do not apply excessive pressure to
either the terminals or fitting nails.
( ) :参考規格 Reference Standard
{ } :参考単位 Reference Unit
5.外観形状、寸法及び材質 PRODUCT SHAPE, DIMENSIONS AND MATERIALS
図面参照 Refer to the drawing.
molex
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
6.挿入力及び抜去 INSERTION/WITHDRAWAL FORCE
No. of
CKT
単位
UNIT
挿入力(最大値
Insertion (MAX.)
抜去力(最小値
Withdrawal (MIN.)
初回
1st
6回目
6th
30回目
30th
初回
1st
6回目
6th
30回目
30th
12
N
{kgf}
14.2
{1.4}
14.2
{1.4}
14.2
{1.4}
2.31
{0.23}
2.31
{0.23}
2.31
{0.23}
20
N
{kgf}
23.6
{2.4}
23.6
{2.4}
23.6
{2.4}
3.92
{0.40}
3.92
{0.40}
3.92
{0.40}
22
N
{kgf}
25.9
{2.64}
25.9
{2.64}
25.9
{2.64}
4.31
{0.44}
4.31
{0.44}
4.31
{0.44}
24
N
{kgf}
28.3
{2.88}
28.3
{2.88}
28.3
{2.88}
4.70
{0.48}
4.70
{0.48}
4.70
{0.48}
26
N
{kgf}
30.6
{3.12}
30.6
{3.12}
30.6
{3.12}
5.09
{0.52}
5.09
{0.52}
5.09
{0.52}
30
N
{kgf}
35.3
{3.6}
35.3
{3.6}
35.3
{3.6}
5.88
{0.60}
5.88
{0.60}
5.88
{0.60}
34
N
{kgf}
40.0
{4.08}
40.0
{4.08}
40.0
{4.08}
6.66
{0.68}
6.66
{0.68}
6.66
{0.68}
40
N
{kgf}
47.1
{4.8}
47.1
{4.8}
47.1
{4.8}
7.84
{0.80}
7.84
{0.80}
7.84
{0.80}
50
N
{kgf}
58.8
{6.0}
58.8
{6.0}
58.8
{6.0}
9.80
{1.00}
9.80
{1.00}
9.80
{1.00}
60
N
{kgf}
70.6
{7.2}
70.6
{7.2}
70.6
{7.2}
11.7
{1.20}
11.7
{1.20}
11.7
{1.20}
70
N
{kgf}
82.4
{8.4}
82.4
{8.4}
82.4
{8.4}
13.7
{1.40}
13.7
{1.40}
13.7
{1.40}
80
N
{kgf}
94.1
{9.6}
94.1
{9.6}
94.1
{9.6}
15.6
{1.60}
15.6
{1.60}
15.6
{1.60}
90
N
{kgf}
105.9
{10.8}
105.9
{10.8}
105.9
{10.8}
17.6
{1.80}
17.6
{1.80}
17.6
{1.80}
100
N
{kgf}
117.6
{12.0}
117.6
{12.0}
117.6
{12.0}
19.6
{2.00}
19.6
{2.00}
19.6
{2.00}
120
N
{kgf}
141.2
{14.4}
141.2
{14.4}
141.2
{14.4}
23.5
{2.40}
23.5
{2.40}
23.5
{2.40}
{ } : 参考単位 Reference Unit
molex ififififi’ji 7 TEMPERATURE CONDITION GRAPH 20 20
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
7.赤外線リフロー条件 INFRARED REFLOW CONDITION
250+5
-0 (PEAK TEMP.)
2040 (230 以上)
2040 sec. (230 MIN.)
90120
90120 sec.
(予熱:150200)
(Pre-heat 150200)
温度条件グラフ
(温度は基板パターン面)
TEMPERATURE CONDITION GRAPH
(TEMPERATURE ON THE SURFACE OF P.C.BOARD PATTERN)
注記 NOTE
本リフロー条件に関しては、リフロー装置及び基板などにより条件が異なりますので、
事前にリフロー評価の確認をお願い致します。
また窒素雰囲気でリフロー(N2フロー)する場合にも、半田量や実装条件のご確認をお願いいたします
Please check the reflow soldering condition by your own devices beforehand, because the condition
changes by the soldering devices, PWB, and so on.
Also please check mount condition in case of Nitrogen atmosphere.
推奨ランド寸法 Recommended Pattern dimension
Sales Drawing をご参照下さい。Refer to the Sales Drawing.
参考メタルマスク厚さ Reference Thickness of metal mask
t = 0.12 mm
参考メタルマスク開口率 Reference Open aperture ratio of metal mask
100 ( 大気リフロー時 in Air atmosphere )
250+5
-0 (ピーク温度)
molex
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PRODUCT SPECIFICATION
8.取り扱い上の注意事項 INSTRUCTION UPON USAGE
[嵌合]
嵌合は極力嵌合軸に沿って平行に行って下さい。(図-1)
その際、リセハウジングとプラグの内壁同士を合せる様に位置決めした後に押し込み嵌合して下さい。
斜めの嵌合になる場合は10°以下の角度でリセハウジングとプラグの内壁同士を軽く当て、位置決めした
後に平行にしてから嵌合して下さい。(図-2)
尚、リセハウジングの外壁とプラグ外壁とを当てた(支点とした)状態で嵌合を行いますと、反支点側
リセハウジングとプラグの内壁同士が干渉し、ハウジングの破壊およびピン損傷の恐れが有りますので
このような嵌合はお避け下さい。(図-3)
Mate connectors parallel to the mating axis as much as possible. (Figure-1)
In doing so, priory determine the position with temporary fitting each inner wall of the Receptacle
and Plug housing, then mate those fully.
If angled mating is inevitable, determine the position priory with temporary fitting each inner wall of
the Receptacle and Plug housing softly within an angle less than 10 degree, and mate the
connector parallel. (Figure-2)
Avoid from mating connectors with fitting each outer wall of Receptacle and Plug housing as a
supporting point because the each inner wall on the opposite side could interfere each other and
cause housing or pin breakage. (Figure-3)
[抜去]
抜去は極力嵌合軸に沿って平行に行って下さい。(図-1)
または、左右に少しずつ振りながら行って下さい。(図-4)
(過度のこじり抜去には注意して下さい。ハウジングの破壊およびピン損傷の原因となります。)(図-5)
Withdraw the connector parallel to mating axis as much as possible (Figure-1),
Or do it with slightly swinging them right to left. (Figure-4)
(Please take care NOT to do excess twist extraction. It could cause the housing or pin breakage.)
(Figure-5)
molex O m—1 mrm W1 *- X R75 :w 2:.
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9.その他 注意事 OTHERS
・外観について
1.
本製品の樹脂部に黒点、多少の傷、微小な気泡等が生じることがありますが、性能上問題ありません。{また、
本製品のモールド材料LCP を使用しているため、ウェルドラインが目立つ場合がありますが、製品性能には
影響ないものです。}
Although this product may have a small black dot, a weld line or a scratch on the housing, it doesn't
impact the product’s performance. Also, although weld line may stand out due to LCP used to mold
material of this product, it doesn't impact the product’s performance.
2.
成形品の色相に多少の違いを生じる場合がありますが、製品性能には影響ありません。
Although there may be slight differences in the housing color tone, it doesn't impact the product’s
performance.
3.
本製品の錫めっきを使用しているため、外観に摺動痕がつく場合が御座いますが、製品性能に影響はありま
せん。
Although the surface of the product could have scratch marks by frictions because of the Tin plating, it
doesn't impact the product’s performance.
・実装について
4.
本リフロー条件に関しては、実装条件(大気/N2 リフロー、温度プロファイル、半田ペースト、メタルマスク板
厚・開口率、基板パターンレイアウト、実装基板種別などの種々の要素)により条件が異なりますので、必ずご
使用前に、顧客様のご使用環境で事前に実装評価(リフロー評価) を実施願います。実装条件によっては、接
点部への半田上がりやフラックス上りが発生するなど製品性能に影響を及ぼす場合があります。
Please make sure to do test run under the mounting condition (reflow soldering condition) on your own
devices before use because reflow condition may change due to the local condition (Air / N2 reflow /
temperature profile / solder paste, metal mask thickness / aperture rate / pattern layout of PWB / types
of PWB / and other factors ). Depending on the mounting condition, product's performance might be
influenced by occurrence of solder-wicking or flux wicking at contact area.
5.
本製品の一般性能確認はリジット基板にて実施しております。フレキシブル基板等の特殊な基板へ実装する
場合は、事前に実装確認等を行った上でご使用願います
The product performance was tested using rigid PWB. In case the product needs to be mounted onto
FPC, please conduct a reflow test on the FPC before use.
6.
フレキシブル基板に実装する場合は、基板の変形を防止するため、補強板をご使用願います。
In case of mounting the connector onto FPC, add a stiffener on the FPC in order to prevent the
deformation.
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PRODUCT SPECIFICATION
7.
弊社の推奨基板パターン寸法を変更して設計を行なう際は、致命的な不良の原因にもなりますので、あらかじ
めご相談ください。
In case of designing with changing our recommended board pattern size, please consult the contact
person in advance because it may cause a fatal defect.
8.
実装性能(平坦度)は、実装基板の反りの影響を含まないものと致します。基板の反りはコネクタ両端部を基
準とし、コネクタ中央部にて Max0.02mm として下さい。
The mounting specification for coplanarity does not include the influence of warpage of the PWB.
Warpage of the PWB should be 0.02mm at maximum at center of the connector based on the both
sides of connector.
9.
本製品は大気リフローでの実装を想定しています。N2 リフローで実装した場合、リフロー後、半田上がりを生
じる恐れがあります。N2 リフローでの実装をお考えの場合、別途評価が必要になります。
This product is designed to be mounted by air reflow. So, if this product is mounted by N2 reflow, solder
wicking may caused after reflow. Therefore if it is plan to adopt N2 reflow for this connector, an
evaluation is needed separately.
10.
弊社評価では本仕様書記載の推奨条件に基づき評価を実施しています。
Our evaluation is conducted based on Molex-recommended condition specified in this product
specification.
11.
本製品の平坦度については、実装前での保証のみであり、実装中および実装後での平坦度については、保
証の限りではありません
Only coplanarity before reflow is guaranteed. Coplanarity in and after reflow is not guaranteed.
12.
本製品は端子先端部に、カット面がある為に端子先端部の実装性(板への半田付け性)は、端子側面・後側
に比べて悪くなります。しかし、側面及び後側においてフィレットが形成されていれば、機能及び強度に問題は
ありません。
The solderability of the terminal tip, which is cut surface without plating, is worse than the sides/back of
the terminal with plating. However, it will not impact the product's function or the retention force if good
soldering fillet is formed at the sides/back of the terminal.
13.
半田実装部の未半田は、ターミナル脱落、ピン間ショート、ターミナル座屈、またコネクタの基板からの外れが
懸念されます。従って全てのターミナルテール部及び、ネイル部に半田付けを行って下さい。
If you leave any soldering area on this product open, it could occur terminal disengagement, short circuit
between pins, terminal buckling or connector disengagement from the PWB. Therefore, please solder
all of the soldering tails and fitting nails on the PWB.
14.
本製品は低背の為、端子コンタクト部以外の場所へフラックス上りが発生することがありますが、製品性能に
は影響ありません。
Since this product is low profile product, flux wicking could be occurred on the areas except for the
terminal contacts. However it does not impact on the product’s performance.
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15.
実装機によってコネクタに負荷が加わると変形、破損する場合がありますので事前にご確認下さい。
If accidental contact is added onto connectors in the reflow machine, connectors could be deformed or
damaged. Therefore review the reflow machine before use of the connectors.
16.
リフロー条件によっては、樹脂部の変色や端子めっき部にヨリが発生する場合がありますが、製品性能に影響
はございません。
Although color tone of housing or surface of terminal plating could be varied depending on reflow
conditions, it does not impact on the product’s performance.
17.
リフロー後、半田付け部に変色が見られることがありますが、製品性能に影響はありません。
Although some discoloration could be seen on the soldering tail after reflow, it does not impact on the
product’s performance.
・製品の仕様について
18.
本製品をご使用時には、1PIN 当りの定格以上の電流を複数の回路に分岐しての使用は避けて下さい。
When using this product, ensure that the specification for rated current per a circuit is followed. Do not
allow the sum of the current used on several circuits to exceed the maximum allowable current.
19.
本製品をご使用時に取り付けられた電線・プリント基板の共振や、機器の回転構造や可動部分の動作によりコ
ネクタ嵌合部(接点部)が常に動いてしまう状態での御使用は避けて下さい。接触部の摺動磨耗等による 接触
不良の原因となります 従って、機器内で電線・プリント基板を固定し、共振を抑える等の処置をお願い致しま
す。
Do not use the connector in a condition where the mating area (contact area) are constantly moved due
to sympathetic vibration of wires and PWB or constant movement of devices. It may cause contact failure
due to the worn out. Therefore fix wires and PWB on the chassis to reduces sympathetic vibration.
20.
コネクタに外力が加わらないようにクリアランスをあけた筐体構造にして下さい
Keep enough clearance between connector and chassis of your application in order to avoid pressure on
the connector.
21.
コネクタのみで基板を支えることは避け、コネクタ以外での基板固定対策を行ってください。
Avoid using a connector alone to mechanically support the PWB. Adopt separate fixture to support
PWB besides the connector in the chassis.
22.
活電状態の電気回路で、挿入、抜去ができることを前提に作られていません。スパーク等による危険の発生、
性能不良につながりますので、活電状態での挿入、抜去はしないで下さい
Do not mate and un-mate connectors while those are energized since this connector is not designed to
allow it. It may cause danger due to sparks and functional failure of the product.
molex
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ENGLISH
REVISE ON PC ONLY
TITLE: 0.4 BOARD TO BOARD CONNECTOR
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23.
活電状態の電気回路で、挿入、抜去ができることを前提に作られていません。スパーク等による危険の発生、
性能不良につながりますので、活電状態での挿入、抜去はしないで下さい
Do not mate and un-mate connectors while those are energized since this connector is not designed to
allow it. It may cause danger due to sparks and functional failure of the product.
24.
一枚の基板にコネクタを複数実装する場合は、嵌合相手側はそれぞれ個別の基板に実装してご使用を願いま
す。
When mounting several board to board connectors on a same PWB, ensure to mount the each mating
connector on a separate PWB.
25.
本製品及び加工工程品(仕掛品)や加工品(ハーネス品)の梱包及び輸送・保管時において、コネクタ間での絡
みや衝撃、積み重ね等による負荷が掛からないようにして下さい。変形・破損等による性能不良の原因となりま
す。
At packaging, transportation and storing, avoid applying loads to connectors by handling, interference of
connectors or piling-up packages. It could cause functional defect such as connector deformation or
breakage.
26.
推奨保管条件での保管をお願い致します。もし、梱包品の推奨保管条件を超えてしまった場合は外観、半田付
け性を確認の上ご使用ください。
Store the products under recommended storage condition. If the recommended storage conditions of the
packaging is exceeded, check the appearance of the products and solder-wettability before use.
27.
基板実装後に基板を直接積み重ねない様に注意してください。
Do not stack PWB directly after mounting the connector on it.
28.
コネクタの性能を損なう恐れがある為、コネクタの洗浄は、行わないで下さい。
Do not wash connector because it may impact the product’s function.
・製品操作について
29.
基板実装前後に端子、補強金具に触らないでください。
Do not touch the terminals and fitting nails of connectors before or after mounting onto the PWB.
30.
嵌合後、コネクタピッチ方向、スパン方向及び回転方向への負荷がかかるような動作またはセットはしないでく
ださい。コネクタ破壊やはんだクラックを引き起こします。Avoid move or assembly of connector which could
apply loads to the direction of the connector pitch, span or rotation. It may damage the connector and
crack the soldering.
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31.
嵌合の際、嵌合が不十分にならないようにご注意下さい。また、セットへの組み込み後も、振動、衝撃等で嵌合
の浮きが発生しないような状態にて使用してください。
Ensure to mate connectors fully. Also mount and assemble the connector in your application unit with
disengagement proof to avoid connector disengagement due to vibration or shocks.
・リペアについて
32.
実装後において半田こてによる手修正を行う際は、必ず仕様書掲載の条件以内で行って下さい。条件を超えて
実施した場合、端子の抜け、接点ギャップの変化、モールドの変形、溶融等、破損の原因になります
When conducting manual repairs using a soldering iron, follow the soldering conditions shown in the
product specification. If the conditions in the product specification are not followed, it may cause the
terminal disengagement, contact gap change, housing deformation, housing melting, and connector
damage.
33.
半田こてによる手修正を行なう際、過度の半田やフラックスを使用しないで下さい。半田上がりやフラックス上が
りにより接触、機能不良に至る場合があります。
When conducting manual repairs using a soldering iron, do not use excess solder and flux than needed.
It may cause solder wicking and flux wicking issues, and also eventually cause a contact defect and
functional issues.
molex
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SEE SHEET 1 OF 16
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REV.
REV. RECORD
DATE
ECN NO.
WRITTEN BY :
CHECKED BY :
A
新規作成 RELEASED
'04/04/09
J2004-3738
N.AIDA
K.TOJO
B
変更 REVISED
04/09/07
J2005-0696
R.UESAKA
S.MARUYAMA
C
変更 REVISED
05/12/07
J2006-1916
E.SUZUKI
K.TOYODA
D
変更 REVISED
07/03/06
J2007-2520
R.TSURUOKA
K.TOYODA
E
変更 REVISED
10/04/01
J2010-1973
T.OSHIMA
S.MARUYAMA
F
変更 REVISED
2015/12/17
J2016-0650
M.TAKASHIMA
T.ASAKAWA

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