SA40-19EWA Datasheet by Kingbright

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Kl'ngbrl'ghI RECOMMENDED PCB LAYOUT 122(4.805) ml .2(3.98A) 1070.213) mu, 5M\ by .57. o 7(0.276)io.5 ‘5 0.5% ( )3.E 7 \' fl ‘ 5 mo(o,394) 906.543) ‘ ‘ 508(01)‘ L 34.540 372)
SPEC NO: DSAN0149 REV NO: V.1A DATE: MAY/23/2013 PAGE: 1 OF 7
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: Y.Liu ERP: 1301000446
101.2mm (4.0INCH) SINGLE DIGIT NUMERIC
DISPLAY
Part Number: SA40-19EWA High Efficiency Red
Features
zLarge size.
z4.0 inch digit height.
zLow current operation.
zExcellent character appearance.
zHigh light output.
zEasy mounting on P.C. boards or sockets.
zMechanically rugged.
zStandard : gray face, white segment.
zRoHS compliant.
Description
The High Efficiency Red source color devices are made with
Gallium Arsenide Phosphide on Gallium Phosphide Orange
Light Emitting Diode.
Package Dimensions& Internal Circuit Diagram
Notes:
1. All dimensions are in millimeters (inches), Tolerance is ±0.25(0.01")unless otherwise noted.
2. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
Kl'ngbrl'ghI
SPEC NO: DSAN0149 REV NO: V.1A DATE: MAY/23/2013 PAGE: 2 OF 7
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: Y.Liu ERP: 1301000446
Selection Guide
Notes:
1. Luminous intensity/ luminous Flux: +/-15%.
*Luminous intensity value is traceable to the CIE127-2007 compliant national standards.
Absolute Maximum Ratings at TA=25°C
Electrical / Optical Characteristics at TA=25°C
Notes:
1.Wavelength: +/-1nm.
2. Forward Voltage: +/-0.1V.
3.Wavelength value is traceable to the CIE127-2007 compliant national standards.
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. 2mm below package base.
Part No. Dice Lens Type
Iv (ucd) [1]
@ 10mA Description
Min. Typ.
High Efficiency Red (GaAsP/GaP) White Diffused
14000 32000 Common Anode, Rt.
Hand Decimal.
*3600 *9000
SA40-19EWA
Symbol Parameter Device Typ. Max. Units Test Conditions
λpeak Peak Wavelength High Efficiency Red 627 nm IF=20mA
λD [1] Dominant Wavelength High Efficiency Red 617 nm IF=20mA
Δλ1/2 Spectral Line Half-width High Efficiency Red 45 nm IF=20mA
C Capacitance High Efficiency Red 15 pF VF=0V;f=1MHz
VF [2] Forward Voltage
(DP) High Efficiency Red 8.0
(4.0)
10.0
(5.0) V IF=20mA
IR Reverse Current
(Per chip) High Efficiency Red 20
(10) uA VR=5V
(VR=5V)
Parameter High Efficiency Red Units
Power dissipation
(DP)
600
(150) mW
DC Forward Current
(DP)
60
(30) mA
Peak Forward Current [1]
(DP)
320
(160) mA
Reverse Voltage
(Per chip)
5
(5) V
Operating / Storage Temperature -40°C To +85°C
Lead Solder Temperature[2] 260°C For 3-5 Seconds
Kl'ngbrlghl 2‘ g 1.0 — TA:25'C 5 E .E 1: 0.5 u m o .z 'E 3 a M 500 550 600 550 700 750 800 wavelengfh x (nm) RELATWE INTENSHY Vs. WAVELENGTH m“ E 10.5 A a E M E 5.“ a g; s w 7.3 m § 5: a Zn 5-; 1.0 “ 5% u A 7.5 7.9 8.0 8.! 5.2 3.3 0 2|} ‘0 5C] 80 100 chwnrd Vang=(V) |77Forwam Currsm (m) roawm cum," v. LuMINaus Immnv w. mawmu anrAGE roawmu cumm mu g 2.5 ? 2 5 no .: 2.0 ° E g m 3 m E .2 20 ALE 0 o D 20 ‘0 so 30 ‘un 7“} 720 D 20 AD 50 3090 Ambism Y-mplmmn TACC) FORWARD CURRENT mums CURVE Amhianl Tsmpummra n(‘c) Lumwous \NTENsmr Vs. AMB‘ENY TEMPERATURE
SPEC NO: DSAN0149 REV NO: V.1A DATE: MAY/23/2013 PAGE: 3 OF 7
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: Y.Liu ERP: 1301000446
High Efficiency Red SA40-19EWA
RED
Kl'ngbrlghl mwam CurranKmA) 50 Au 35 20 m u 3.3 3.9 w 4.1 4.2 4.3 Fnrwnrd Curranf(mA) Forward ValmgaC/j rmawmu cumm v; FORWARD VOLTAGE so 40 30 za m o a m 40 so an Inn AmeeM Tempsralure m-c) FORWARD swam" ngwma cunvg E E Ralnl‘wo Luminaus \mensfly >‘7 ”mm 2.5 2.0 1.5 nu 0.5 a 5,3 4.0 3.0 m 1.0 u 0 m m 30 m 50 IF-Forwurd oumm (m) LUMINOUS \NTENSITV Vs. FORWARD CURRENT \ 740 710 1: 2a m an Ambiem Tempernlur: nos) Lummus Imuswv Vs. AMB‘ENT TEMPERATURE an so
SPEC NO: DSAN0149 REV NO: V.1A DATE: MAY/23/2013 PAGE: 4 OF 7
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: Y.Liu ERP: 1301000446
Kl'ngbrl'ghI @W@ OUTSIDE LABEL <:| abfcs/box="" inswde="" label="" on="" hfbux="" ‘="" iyfe:="" smorwxxx="" aw:="" s="" vcs="" code»="" xx="" xxxxxxxxixxxx="" lot="" nov="" kinghrigh="" \="" rohs="" cumphani="" ouls'wde="" label="" on="" box="" spcs/w="" box="" fl="" awn="" box/w;="" box="" number="" of="" foc="" \="" hw‘hhhwhhw="" sx40—19xxx="" bin="" code="" number="" or="" ca="" 48="" pcs="" xx/iy="">< vdove="" xx="" xx="" xxy/="" \/="" \="" rohs="" compliurfl="" spec="" n0:dsan0149="" rev="" no:="" v.1a="" date:="" “ma/2mg="" approved:="" wvnec="" checked:="" joe="" lee="" drawn:="" v.liu="">
SPEC NO: DSAN0149 REV NO: V.1A DATE: MAY/23/2013 PAGE: 5 OF 7
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: Y.Liu ERP: 1301000446
PACKING & LABEL SPECIFICATIONS SA40-19EWA
Kl'ngbrl'ght THROUGH HOLE DISPLAY MOUNTING METHOD Lead Forming Do not bend the component leads by hand without proper tools. The leads should be bent by clinching the upper part of the lead firmly such that the bending force is not exerted on the plastic body. Clinch he had Mmlnal with in. banging ml Fflnndlnu atrial) 7‘ Human.“ m...) Nat Rlcnmmcndld Recommended Installation 1.The installation process should not apply stress to the lead terminals. 2.When inserting for assembly, ensure the terminal pitch matches the substrate board's hole pitch to prevent spreading or pinching the lead terminals. % g No! Ruommindm Racomm-ndnd 3.The component shall be placed at least 5mm from edge of PCEI to avoid damage caused excessive heat during wave soldering. ”5.1.1 Epmm l mu Rlcammlndld Recummund-d
SPEC NO: DSAN0149 REV NO: V.1A DATE: MAY/23/2013 PAGE: 6 OF 7
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: Y.Liu ERP: 1301000446
Kl'ngbrl'ght DISPLAY SOLDERING CONDITIONS Wave Soldering Profile For Leadrrree Throughrhule LED. Cc)3nu 275 25a , 25m: max/seem Temperatu re u an we iSD zuu 15D sun 350 A00 (sac) NOTES: LRecommena the wave temperature 145'C~150'Cd1he maximum lolaerlnq temperature should be In. than zau‘c, 2.De not apply ltrlu on Ipexy ruln: when lamp-ralura la our as'c. 3.1m soldering prom- apply to the lead lm sold-ring (Sn/Cu/Ag allay). 4.During wave solderlng . the PCB topisurface lempemim should be kapl below las'c 5.No more than om. Soldering General Notes: 1. Through—hole displays are incompatible with reflow soldering. 2. If components will undergo multiple soldering processes. or other processes where the components may be subjected to intense heat, please check with Kingbright for compatibility. CLEANING 1.Mild ”no—clean” fluxes are recommended for use in soldering. 2. If cleaning is required. Kingbright recommends to wash components with water only. Do not use harsh organic solvents for cleaning, because they may damage the plastic parts .And the devices should not be washed for more than one minute. CIRCUIT DESIGN NOTES LProtective current—limiting resistors may be necessary to operate the Displays. ZILEDs mounted in parallel should each be placed in series with its own current—limiting resistord invalid Set—up Recommended Sal—up VS "W vs GND hlt ://www.Kin bri hlUSA.com/A IicalionNoles
SPEC NO: DSAN0149 REV NO: V.1A DATE: MAY/23/2013 PAGE: 7 OF 7
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: Y.Liu ERP: 1301000446
All design applications should refer to Kingbright application notes available at
http://www.KingbrightUSA.com/ApplicationNotes

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