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NCV8509 Series
http://onsemi.com
18
PACKAGE DIMENSIONS
SOIC 16 LEAD WIDE BODY
EXPOSED PAD
PDW SUFFIX
CASE 751AG−01
ISSUE A
G
−W−
−U−
P
M
0.25 (0.010) W
−T−
SEATING
PLANE
K
D16 PL
C
M
0.25 (0.010) TUW
S S
M
F
DETAIL E
DETAIL E
R x 45_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL BE
0.13 (0.005) TOTAL IN EXCESS OF THE D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
6. 751R-01 OBSOLETE, NEW STANDARD 751R-02.
J
M
14 PL
PIN 1 I.D.
8
1
16 9
TOP SIDE
0.10 (0.004) T
16
EXPOSED PAD 18
BACK SIDE
L
H
DIM
A
MIN MAX MIN MAX
INCHES
10.15 10.45 0.400 0.411
MILLIMETERS
B7.40 7.60 0.292 0.299
C2.35 2.65 0.093 0.104
D0.35 0.49 0.014 0.019
F0.50 0.90 0.020 0.035
G1.27 BSC 0.050 BSC
H3.45 3.66 0.136 0.144
J0.25 0.32 0.010 0.012
K0.00 0.10 0.000 0.004
L4.72 4.93 0.186 0.194
M0 7 0 7
P10.05 10.55 0.395 0.415
R0.25 0.75 0.010 0.029
____
A
B
9
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.350
0.175
0.050
0.376
0.188
0.200
0.074
DIMENSIONS: INCHES
0.024 0.150
Exposed
Pad
C
L
C
L
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