NCP,NCV1117 Datasheet by onsemi

610 ON Semi condu ctr»Q www. o—nseml. co m a? L|“U
© Semiconductor Components Industries, LLC, 2017
February, 2021 Rev. 30
1Publication Order Number:
NCP1117/D
1.0 A Low-Dropout Positive
Fixed and Adjustable
Voltage Regulators
NCP1117, NCP1117I,
NCV1117
The NCP1117 series are low dropout positive voltage regulators that
are capable of providing an output current that is in excess of 1.0 A
with a maximum dropout voltage of 1.2 V at 800 mA over
temperature. This series contains nine fixed output voltages of 1.5 V,
1.8 V, 1.9 V, 2.0 V, 2.5 V, 2.85 V, 3.3 V, 5.0 V, and 12 V that have no
minimum load requirement to maintain regulation. Also included is an
adjustable output version that can be programmed from 1.25 V to
18.8 V with two external resistors. On chip trimming adjusts the
reference/output voltage to within ±1.0% accuracy. Internal protection
features consist of output current limiting, safe operating area
compensation, and thermal shutdown. The NCP1117 series can
operate with up to 20 V input. Devices are available in SOT223 and
DPAK packages.
Features
Output Current in Excess of 1.0 A
1.2 V Maximum Dropout Voltage at 800 mA Over Temperature
Fixed Output Voltages of 1.5 V, 1.8 V, 1.9 V, 2.0 V, 2.5 V, 2.85 V,
3.3 V, 5.0 V, and 12 V
Adjustable Output Voltage Option
No Minimum Load Requirement for Fixed Voltage Output Devices
Reference/Output Voltage Trimmed to ±1.0%
Current Limit, Safe Operating and Thermal Shutdown Protection
Operation to 20 V Input
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ100
Qualified and PPAP Capable
These are Pb-Free Devices
Applications
Consumer and Industrial Equipment Point of Regulation
Active SCSI Termination for 2.85 V Version
Switching Power Supply Post Regulation
Hard Drive Controllers
Battery Chargers
SOT223
ST SUFFIX
CASE 318H
DPAK
DT SUFFIX
CASE 369C
Pin: 1. Adjust/Ground
2. Output
3. Input
Heatsink tab is connected to Pin 2.
See detailed ordering and shipping information in the package
dimensions section on page 12 of this data sheet.
ORDERING INFORMATION
See general marking information in the device marking
section on page 14 of this data sheet.
DEVICE MARKING INFORMATION
123
123
Tab
Tab
PIN CONFIGURATION
SOT223
(Top View)
DPAK
(Top View)
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Figure 1. Fixed Output Regulator
NCP1117, NCP1117I, NCV1117
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2
10
mF
1
2Output
10
mF
3
Input NCP1117
XTXX
++
Figure 1. Fixed
Output Regulator
10
mF
1
2Output
10
mF
3
Input NCP1117
XTA
++
Figure 2. Adjustable
Output Regulator
22
mF
1
2
10
mF
3NCP1117
XT285
++
110 W
110 W
110 W
110 W
4.75 V
to
5.25 V
+
18 to 27
Lines
Figure 3. Active SCSI Bus Terminator
TYPICAL APPLICATIONS
MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (Note 1) Vin 20 V
Output Short Circuit Duration (Notes 2 and 3) Infinite
Power Dissipation and Thermal Characteristics
Case 318H (SOT223)
Power Dissipation (Note 2)
Thermal Resistance, JunctiontoAmbient, Minimum Size Pad
Thermal Resistance, JunctiontoCase
Case 369A (DPAK)
Power Dissipation (Note 2)
Thermal Resistance, JunctiontoAmbient, Minimum Size Pad
Thermal Resistance, JunctiontoCase
PD
RqJA
RqJC
PD
RqJA
RqJC
Internally Limited
160
15
Internally Limited
67
6.0
W
°C/W
°C/W
W
°C/W
°C/W
Maximum Die Junction Temperature Range TJ55 to 150 °C
Storage Temperature Range Tstg 65 to 150 °C
Operating Ambient Temperature Range
NCP1117
NCP1117I
NCV1117
TA0 to +125
40 to +125
40 to +125
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM), Class 2, 2000 V
Machine Model (MM), Class B, 200 V
Charge Device Model (CDM), Class IV, 2000 V.
2. Internal thermal shutdown protection limits the die temperature to approximately 175°C. Proper heatsinking is required to prevent activation.
The maximum package power dissipation is:
PD+TJ(max) *TA
RqJA
3. The regulator output current must not exceed 1.0 A with Vin greater than 12 V.
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ELECTRICAL CHARACTERISTICS
(Cin = 10 mF, Cout = 10 mF, for typical value TA = 25°C, for min and max values TA is the operating ambient temperature range that applies
unless otherwise noted.) (Note 4)
Characteristic Symbol Min Typ Max Unit
Reference Voltage, Adjustable Output Devices
(Vin–Vout = 2.0 V, Iout = 10 mA, TA = 25°C)
(Vin–Vout = 1.4 V to 10 V, Iout = 10 mA to 800 mA) (Note 4)
Vref
1.238
1.225
1.25
1.262
1.270
V
Output Voltage, Fixed Output Devices
1.5 V (Vin = 3.5 V, Iout = 10 mA, TA = 25 °C)
(Vin = 2.9 V to 11.5 V, Iout = 0 mA to 800 mA) (Note 4)
1.8 V (Vin = 3.8 V, Iout = 10 mA, TA = 25 °C)
(Vin = 3.2 V to 11.8 V, Iout = 0 mA to 800 mA) (Note 4)
1.9 V (Vin = 3.9 V, Iout = 10 mA, TA = 25 °C)
(Vin = 3.3 V to 11.9 V, Iout = 0 mA to 800 mA) (Note 4)
2.0 V (Vin = 4.0 V, Iout = 10 mA, TA = 25 °C)
(Vin = 3.4 V to 12 V, Iout = 0 mA to 800 mA) (Note 4)
2.5 V (Vin = 4.5 V, Iout = 10 mA, TA = 25 °C)
(Vin = 3.9 V to 10 V, Iout = 0 mA to 800 mA,) (Note 4)
2.85 V (Vin = 4.85 V, Iout = 10 mA, TA = 25 °C)
(Vin = 4.25 V to 10 V, Iout = 0 mA to 800 mA) (Note 4)
(Vin = 4.0 V, Iout = 0 mA to 500 mA) (Note 4)
3.3 V (Vin = 5.3 V, Iout = 10 mA, TA = 25 °C)
(Vin = 4.75 V to 10 V, Iout = 0 mA to 800 mA) (Note 4)
5.0 V (Vin = 7.0 V, Iout = 10 mA, TA = 25 °C)
(Vin = 6.5 V to 12 V, Iout = 0 mA to 800 mA) (Note 4)
12 V (Vin = 14 V, Iout = 10 mA, TA = 25 °C)
(Vin = 13.5 V to 20 V, Iout = 0 mA to 800 mA) (Note 4)
Vout
1.485
1.470
1.782
1.755
1.872
1.862
1.970
1.960
2.475
2.450
2.821
2.790
2.790
3.267
3.235
4.950
4.900
11.880
11.760
1.500
1.800
1.900
1.900
2.000
2.500
2.850
3.300
5.000
12.000
1.515
1.530
1.818
1.845
1.929
1.938
2.030
2.040
2.525
2.550
2.879
2.910
2.910
3.333
3.365
5.050
5.100
12.120
12.240
V
Line Regulation (Note 5) Adjustable (Vin = 2.75 V to 16.25 V, Iout = 10 mA) Regline 0.04 0.1 %
1.5 V (Vin = 2.9 V to 11.5 V, Iout = 0 mA)
1.8 V (Vin = 3.2 V to 11.8 V, Iout = 0 mA)
1.9 V (Vin = 3.3 V to 11.9 V, Iout = 0 mA)
2.0 V (Vin = 3.4 V to 12 V, Iout = 0 mA)
2.5 V (Vin = 3.9 V to 10 V, Iout = 0 mA)
2.85 V (Vin = 4.25 V to 10 V, Iout = 0 mA)
3.3 V (Vin = 4.75 V to 15 V, Iout = 0 mA)
5.0 V (Vin = 6.5 V to 15 V, Iout = 0 mA)
12 V (Vin = 13.5 V to 20 V, Iout = 0 mA)
0.3
0.4
0.5
0.5
0.5
0.8
0.8
0.9
1.0
1.0
1.0
2.5
2.5
2.5
3.0
4.5
6.0
7.5
mV
Load Regulation (Note 5) Adjustable (Iout = 10 mA to 800 mA, Vin = 4.25 V) Regline 0.2 0.4 %
1.5 V (Iout = 0 mA to 800 mA, Vin = 2.9 V)
1.8 V (Iout = 0 mA to 800 mA, Vin = 3.2 V)
1.9 V (Iout = 0 mA to 800 mA, Vin = 3.3 V)
2.0 V (Iout = 0 mA to 800 mA, Vin = 3.4 V)
2.5 V (Iout = 0 mA to 800 mA, Vin = 3.9 V)
2.85 V (Iout = 0 mA to 800 mA, Vin = 4.25 V)
3.3 V (Iout = 0 mA to 800 mA, Vin = 4.75 V)
5.0 V (Iout = 0 mA to 800 mA, Vin = 6.5 V)
12 V (Iout = 0 mA to 800 mA, Vin = 13.5 V)
2.3
2.6
2.7
3.0
3.3
3.8
4.3
6.7
16
5.5
6.0
6.0
6.0
7.5
8.0
10
15
28
mV
Dropout Voltage (Measured at Vout 100 mV)
(Iout = 100 mA)
(Iout = 500 mA)
(Iout = 800 mA)
VinVout
0.95
1.01
1.07
1.10
1.15
1.20
V
Output Current Limit (VinVout = 5.0 V, TA = 25°C, Note 6) Iout 1000 1500 2200 mA
Minimum Required Load Current for Regulation, Adjustable Output Devices
(Vin = 15 V)
IL(min) 0.8 5.0 mA
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ELECTRICAL CHARACTERISTICS (continued)
(Cin = 10 mF, Cout = 10 mF, for typical value TA = 25°C, for min and max values TA is the operating ambient temperature range that applies
unless otherwise noted.) (Note 4)
Characteristic UnitMaxTypMinSymbol
Quiescent Current
1.5 V (Vin = 11.5 V)
1.8 V (Vin = 11.8 V)
1.9 V (Vin = 11.9 V)
2.0 V (Vin = 12 V)
2.5 V (Vin = 10 V)
2.85 V (Vin = 10 V)
3.3 V (Vin = 15 V)
5.0 V (Vin = 15 V)
12 V (Vin = 20 V)
IQ
3.6
4.2
4.3
4.5
5.2
5.5
6.0
6.0
6.0
10
10
10
10
10
10
10
10
10
mA
Thermal Regulation (TA = 25°C, 30 ms Pulse) 0.01 0.1 %/W
Ripple Rejection (VinVout = 6.4 V, Iout = 500 mA, 10 Vpp 120 Hz Sinewave)
Adjustable
1.5 V
1.8 V
1.9 V
2.0 V
2.5 V
2.85 V
3.3 V
5.0 V
12 V
RR
67
66
66
66
64
62
62
60
57
50
73
72
70
72
70
68
68
64
61
54
dB
Adjustment Pin Current (Vin = 11.25 V, Iout = 800 mA) Iadj 52 120 mA
Adjust Pin Current Change
(VinVout = 1.4 V to 10 V, Iout = 10 mA to 800 mA)
DIadj 0.4 5.0 mA
Temperature Stability ST0.5 %
Long Term Stability (TA = 25°C, 1000 Hrs End Point Measurement) St0.3 %
RMS Output Noise (f = 10 Hz to 10 kHz) N0.003 %Vout
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. NCP1117: Tlow = 0°C, Thigh = 125°C
NCP1117I: Tlow = 40°C, Thigh = 125°C
NCV1117: Tlow = 40°C, Thigh = 125°C
5. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
6. The regulator output current must not exceed 1.0 A with Vin greater than 12 V.
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5
Vin Vout, DROPOUT VOLTAGE (V)
TA, AMBIENT TEMPERATURE (°C)
Iadj, ADJUST PIN CURRENT (mA)
Iout = 10 mA
0
20
40
60
80
100
Figure 4. Output Voltage Change
vs. Temperature
Figure 5. Dropout Voltage
vs. Output Current
Figure 6. Output Short Circuit Current
vs. Differential Voltage
Figure 7. Output Short Circuit Current
vs. Temperature
Figure 8. Adjust Pin Current
vs. Temperature
Figure 9. Quiescent Current Change
vs. Temperature
0
0.5
1.0
1.5
2.0
0 2 4 6 8 101214161820
Load pulsed at 1.0% duty cycle
Vin Vout, VOLTAGE DIFFERENTIAL (V)
Iout, OUTPUT CURRENT (A)
TJ = 25°C
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 200 400 600 800 100
0
Load pulsed at 1.0% duty cycle
Iout, OUTPUT CURRENT (mA)
TJ = 40°C
TJ = 25°C
TJ = 125°C
Vout, OUTPUT VOLTAGE CHANGE (%)
2.0
1.5
1.0
0.5
0
0.5
1.0
1.5
2.0
50 25 0 25 50 75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Vin = Vout + 3.0 V
Iout = 10 mA
Adj, 1.5 V,
1.8 V, 2.0 V,
2.5 V
2.85 V, 3.3 V,
5.0 V, 12.0 V
1.0
1.2
1.4
1.6
1.8
2.0
50 25 0 25 50 75 100 125 150
20
15
10
5.0
0
5.0
10
50 25 0 25 50 75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Iout, OUTPUT CURRENT (A)
Vin = 5.0 V
Load pulsed at 1.0% duty cycle
TA, AMBIENT TEMPERATURE (°C)
IQ, QUIESCENT CURRENT CHANGE (%)
50 25 0 25 50 75 100 125 150
‘v‘g‘l‘K/m‘; ‘31) x) Vm - Vnm 2 Vdmpnm Hegmn of \nsmbmly
NCP1117, NCP1117I, NCV1117
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6
0
20
40
60
80
100
10 100 1.0 k 10 k 100 k
0
20
40
60
80
100
0 200 400 600 800 1000
Iout, OUTPUT CURRENT (mA)
RR, RIPPLE REJECTION (dB)
fripple = 20 kHz
Vripple v 0.5 VPP
Vout = 5.0 V
Vin Vout = 3.0 V
Cout = 10 mF
Cadj = 25 mF
TA = 25°C
fripple, RIPPLE FREQUENCY (Hz)
RR, RIPPLE REJECTION (dB)
Vout = 5.0 V
Vin Vout = 3.0 V
Iout = 0.5 A
Cout = 10 mF
Cadj = 25 mF, f > 60 Hz
Vripple v 3.0 VPP Vripple v 0.5 VPP
Vin Vout w 3.0 V
Figure 10. NCP1117XTA Ripple Rejection
vs. Output Current
Figure 11. NCP1117XTA Ripple Rejection
vs. Frequency
Figure 12. Output Capacitance vs. ESR Figure 13. Typical ESR vs. Output Current
fripple = 120 Hz
Vripple v 3.0 VPP
Vin Vout w Vdropout
Cadj = 200 mF, f v 60 Hz
TA = 25°C
0.1
1
10
100
0.001 0.01 0.1 1 10
ESR, EQUIVALENT SERIES RESISTANCE (W)
OUTPUT CAPACITANCE (mF)
Vin = 3.0 V
Vout = 1.25 V
Iload = 5 mA 1 A
Cin = 10 mF MLCC
TJ = 25°C
Region of Instability
Region of Stability
0.01
0.1
1
10
0 100 500 900 1000
Iout, OUTPUT CURRENT (mA)
ESR, EQUIVALENT SERIES RESISTANCE (W)
Vin = 3.0 V
Vout = 1.25 V
Cin = 10 mF MLCC
Cout = 10 mF
TJ = 25°C
Region of Instability
Region of Stability
200 600300 700400 800
0
50E9
100E9
150E9
200E9
250E9
10 100 1.0 k 10 k 100 k
FREQUENCY (Hz)
V/sqrt (Hz)
Cin = 10 mF Tantalum
Cout = 10 mF Tantalum
Vin Vout = 3.0 V
Figure 14. Output Spectral Noise Density vs.
Frequency, Vout = 1V5
300E9
350E9
1 A
0.5 A
0.1 A
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t, TIME (ms)
20
0
7.5
6.5
0 40 80 120 160
OUTPUT VOLTAGE
DEVIATION (mV)
INPUT
VOLTAGE (V)
200
20
Figure 15. NCP1117XT285
Line Transient Response
Figure 16. NCP1117XT285
Load Transient Response
Figure 17. NCP1117XT50
Line Transient Response
Figure 18. NCP1117XT50
Load Transient Response
Cin = 10 mF
Cout = 10 mF
Vin = 6.5 V
Preload = 0.1 A
TA = 25°C
t, TIME (ms)
0
0.5
0
0.1
0.1
0 40 80 120 160
LOAD CURRENT
CHANGE (A)
OUTPUT VOLTAGE
DEVIATION (V)
20
0
Cin = 10 mF
Cout = 10 mF
Vin = 4.5 V
Preload = 0.1 A
TA = 25°C
t, TIME (ms)
0
0.5
0
0.1
0.1
0 40 80 120 160
LOAD CURRENT
CHANGE (A)
OUTPUT VOLTAGE
DEVIATION (V)
20
0
t, TIME (ms)
20
0
5.25
4.25
0 40 80 120 160
OUTPUT VOLTAGE
DEVIATION (mV)
INPUT
VOLTAGE (V)
200
Cin = 1.0 mF
Cout = 10 mF
Iout = 0.1 A
TA = 25°C
20
Cin = 1.0 mF
Cout = 10 mF
Iout = 0.1 A
TA = 25°C
Figure 19. NCP1117XT12 Line
Transient Response
Figure 20. NCP1117XT12 Load
Transient Response
t, TIME (ms)
Cin = 10 mF
Cout = 10 mF
Vin = 13.5 V
Preload = 0.1 A
TA = 25°C
0
0.5
0
0.1
0.1
0 40 80 120 160 200
LOAD CURRENT
CHANGE (A)
OUTPUT VOLTAGE
DEVIATION (V)
t, TIME (ms)
20
0
14.5
13.5
0 40 80 120 160
OUTPUT VOLTAGE
DEVIATION (mV)
INPUT
VOLTAGE (V)
200
20
Cin = 1.0 mF
Cout = 10 mF
Iout = 0.1 A
TA = 25°C
14‘ / F 73.. Z4. T‘KV \ T i 50%: for TA \/ m Size Pad www.cnsemi.com
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8
60
80
100
120
140
160
180
0.4
0.6
0.8
1.0
1.2
1.4
1.6
010203025155.0
L, LENGTH OF COPPER (mm)
PD(max) for TA = 50°C
40
50
60
70
80
90
100
010203025155.0
L, LENGTH OF COPPER (mm)
0.6
0.8
1.0
1.2
1.4
1.6
Figure 21. SOT223 Thermal Resistance and Maximum
Power Dissipation vs. P.C.B. Copper Length
RqJA, THERMAL RESISTANCE,
JUNCTIONTOAIR (°CW)
PD, MAXIMUM POWER DISSIPATION (W)
RqJA, THERMAL RESISTANCE,
JUNCTIONTOAIR (°CW)
0.4
Figure 22. DPAK Thermal Resistance and Maximum
Power Dissipation vs. P.C.B. Copper Length
Minimum
Size Pad
PD, MAXIMUM POWER DISSIPATION (W)
L
2.0 oz. Copper
RqJA
Minimum
Size Pad
PD(max) for TA = 50°C
L
RqJA
L
L
2.0 oz. Copper
NCP1117, NCP1117I, NCV1117 APPLICATIONS INFORMATION Introduction The NCP1117 features a significant reduction in dropout voltage along with enhanced output voltage accuracy and temperature stahihty when compared to o1der indus standard three—termina1 adju ble regu1ators. These devices contain output current lim ing, safe operating area compen-ation and therma1 shutdown protection making them de gner friend1y for powering numerous consumer and industria1 products. The NCP1117 series is pin compatible with the older LM317 and its derivative device types. Output Voltage The typica1 app1ication circuits for the fixed and adjustah1e output regu1ators are shown in Figures 23 and 24. The adjustable devi s are floating voltage regu1ators. They develop and main in the nomina1 1.25 v reference vo1tage between the output and adjust pins. The reference voltage is programmed to a constant current source by re. ' tor R1, and this current flows through R2 to ground to set the output vo1tage. The programmed current level is usua11y se1ected to be greater than the specified 5.0 mA minimum that is required for regulation. Since the adjust pin current, lad], is significantly lower and constant with respect to the programmed 1oad current, it generates a small output vo1tage error that can usuany be ignored. For the fixed output devices R1 and R2 are included within the device and the ground current Igna, ranges from 3.0 mA to 5.0 mA depending upon the output voltage. External Capacitors input bypass capacitor cm may be required for regu1ator stability if the device is located more than a few inches from the power source. This capacitor will reduce the Circuit's sensitivity when powered from a comp1ex source impedance and significantly enhance the output transient response. The input hypa. s capacitor shou1d be mounted with the shortest possible track 1ength directly across the regulator's input and ground terminals. A In itF ceramic or tantalum capacitor should be adequate for most applications. ”‘9‘“ a NCPllI7 2 0W“ 0 >< 6%="" .="" .="" a="" :="" '9“="i" figure="" 23.="" fixed="" output="" regulator="" frequency="" compensat="" capacitor="" c0...="" and="" its="" u="" stability.="" a="" minimum="" ca="" equivalent="" series="" re,="" n="" 33="" m9="" (typ)="" to="" 2.29="" is="" r="" capacitor="" type="" can="" be="" eiectro1ytic="" as="" 1ong="" a="" i="" value="" and="" esr="" limits="" o="" temperature="" range.="" high="" be="" used="" to="" enhance="" 1oop="" the="" additional="" benefit="" of="" 2t="" *5="" www.cnsemi.cam="" 9="" r2="" ri="" 21h="" r1="" l”—)="">
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APPLICATIONS INFORMATION
Introduction
The NCP1117 features a significant reduction in dropout
voltage along with enhanced output voltage accuracy and
temperature stability when compared to older industry
standard threeterminal adjustable regulators. These
devices contain output current limiting, safe operating area
compensation and thermal shutdown protection making
them designer friendly for powering numerous consumer
and industrial products. The NCP1117 series is pin
compatible with the older LM317 and its derivative device
types.
Output Voltage
The typical application circuits for the fixed and
adjustable output regulators are shown in Figures 23 and 24.
The adjustable devices are floating voltage regulators. They
develop and maintain the nominal 1.25 V reference voltage
between the output and adjust pins. The reference voltage is
programmed to a constant current source by resistor R1, and
this current flows through R2 to ground to set the output
voltage. The programmed current level is usually selected to
be greater than the specified 5.0 mA minimum that is
required for regulation. Since the adjust pin current, Iadj, is
significantly lower and constant with respect to the
programmed load current, it generates a small output
voltage error that can usually be ignored. For the fixed
output devices R1 and R2 are included within the device and
the ground current Ignd, ranges from 3.0 mA to 5.0 mA
depending upon the output voltage.
External Capacitors
Input bypass capacitor Cin may be required for regulator
stability if the device is located more than a few inches from
the power source. This capacitor will reduce the circuit’s
sensitivity when powered from a complex source impedance
and significantly enhance the output transient response. The
input bypass capacitor should be mounted with the shortest
possible track length directly across the regulators input
and ground terminals. A 10 mF ceramic or tantalum
capacitor should be adequate for most applications.
Figure 23. Fixed Output Regulator
1
2Output
3
Input NCP1117
XTXX
++
Cout
Cin
Ignd
Frequency compensation for the regulator is provided by
capacitor Cout and its use is mandatory to ensure output
stability. A minimum capacitance value of 4.7 mF with an
equivalent series resistance (ESR) that is within the limits of
33 mW (typ) to 2.2 W is required. See Figures 12 and 13. The
capacitor type can be ceramic, tantalum, or aluminum
electrolytic as long as it meets the minimum capacitance
value and ESR limits over the circuit’s entire operating
temperature range. Higher values of output capacitance can
be used to enhance loop stability and transient response with
the additional benefit of reducing output noise.
Figure 24. Adjustable Output Regulator
1
2Output
3
Input NCP1117
XTA
++
Cout
Cin
Iadj
R2
+Cadj
Vref R1
Vout +Vref ǒ1)R2
R1Ǔ)Iadj R2
The output ripple will increase linearly for fixed and
adjustable devices as the ratio of output voltage to the
reference voltage increases. For example, with a 12 V
regulator, the output ripple will increase by 12 V/1.25 V or
9.6 and the ripple rejection will decrease by 20 log of this
ratio or 19.6 dB. The loss of ripple rejection can be restored
to the values shown with the addition of bypass capacitor
Cadj, shown in Figure 24. The reactance of Cadj at the ripple
frequency must be less than the resistance of R1. The value
of R1 can be selected to provide the minimum required load
current to maintain regulation and is usually in the range of
100 W to 200 W.
Cadj u1
2pfripple R1
The minimum required capacitance can be calculated
from the above formula. When using the device in an
application that is powered from the AC line via a
transformer and a full wave bridge, the value for Cadj is:
fripple +120 Hz, R1 +120 W, then Cadj u11.1 mF
The value for Cadj is significantly reduced in applications
where the input ripple frequency is high. If used as a post
regulator in a switching converter under the following
conditions:
fripple +50 kHz, R1 +120 W, then Cadj u0.027 mF
Figures 10 and 11 shows the level of ripple rejection that
is obtainable with the adjust pin properly bypassed.
Cout 50 up, it becomes possible tor device damage to occur. Under these conditions, diode D1 is required to protect the device. The second path connects between CM and v0“, and it can withstand a peak surge current of about 150 mA. Protection diode D2 is required it the output is shorted or crowbarred to ground and cm- is greater than 1.” pp. Dt H 1N400| mg“ a NCPHW 2 0mm“ xTA D2 1' O C‘" I l m lNAnm I 0"“ 3R2 ’1 7 Cadl Figure 25. Protection Diode Placement A combination of protection diodes D1 and D2 may be required in the event that Vi" is shorted to ground and CM is greater than 50 piF. The peak current capability stated for the internal diodes are for a time of 100 as with ajunctiun temperature ot 25°C. These values may vary and are to be used as a general guide. Load Regulation The NCP1117 series is c« pable of providing excellent load regulation; but since the are three terminal devices, only partial remote load sensing is possible. There are two conditions that must be met to achieve the maximum available load regulation performance. The first is that the top side of programming r or R1 should be connected as close to the regulator case as practicable. This will minimize the voltage drop caused by wiring resi ance RW + from appearing in series with reference voltage that is across R1. 2 Out Cm ;— 1 Fit O—‘t‘r’vvv-l Figure 26. Load Sensing www.cnsemi.eam 10
NCP1117, NCP1117I, NCV1117
www.onsemi.com
10
Protection Diodes
The NCP1117 family has two internal low impedance
diode paths that normally do not require protection when
used in the typical regulator applications. The first path
connects between Vout and Vin, and it can withstand a peak
surge current of about 15 A. Normal cycling of Vin cannot
generate a current surge of this magnitude. Only when Vin
is shorted or crowbarred to ground and Cout is greater than
50 mF, it becomes possible for device damage to occur.
Under these conditions, diode D1 is required to protect the
device. The second path connects between Cadj and V
out, and
it can withstand a peak surge current of about 150 mA.
Protection diode D2 is required if the output is shorted or
crowbarred to ground and Cadj is greater than 1.0 mF.
Figure 25. Protection Diode Placement
1
2Output
3
Input NCP1117
XTA
++
Cout
Cin
R2
+Cadj
R1
1N4001
D1
D2
1N4001
A combination of protection diodes D1 and D2 may be
required in the event that Vin is shorted to ground and Cadj
is greater than 50 mF. The peak current capability stated for
the internal diodes are for a time of 100 ms with a junction
temperature of 25°C. These values may vary and are to be
used as a general guide.
Load Regulation
The NCP1117 series is capable of providing excellent
load regulation; but since these are three terminal devices,
only partial remote load sensing is possible. There are two
conditions that must be met to achieve the maximum
available load regulation performance. The first is that the
top side of programming resistor R1 should be connected as
close to the regulator case as practicable. This will minimize
the voltage drop caused by wiring resistance RW + from
appearing in series with reference voltage that is across R1.
The second condition is that the ground end of R2 should be
connected directly to the load. This allows true Kelvin
sensing where the regulator compensates for the voltage
drop caused by wiring resistance RW .
Figure 26. Load Sensing
1
2Output
3
Input NCP1117
XTA
+
+Cout
Cin R1
Remote
Load
RW+
RW
R2
Thermal Considerations
This series contains an internal thermal limiting circuit
that is designed to protect the regulator in the event that the
maximum junction temperature is exceeded. When
activated, typically at 175°C, the regulator output switches
off and then back on as the die cools. As a result, if the device
is continuously operated in an overheated condition, the
output will appear to be oscillating. This feature provides
protection from a catastrophic device failure due to
accidental overheating. It is not intended to be used as a
substitute for proper heatsinking. The maximum device
power dissipation can be calculated by:
PD+TJ(max) *TA
RqJA
The devices are available in surface mount SOT223 and
DPAK packages. Each package has an exposed metal tab
that is specifically designed to reduce the junction to air
thermal resistance, RqJA, by utilizing the printed circuit
board copper as a heat dissipater. Figures 21 and 22 show
typical RqJA values that can be obtained from a square
pattern using economical single sided 2.0 ounce copper
board material. The final product thermal limits should be
tested and quantified in order to insure acceptable
performance and reliability. The actual RqJA can vary
considerably from the graphs shown. This will be due to any
changes made in the copper aspect ratio of the final layout,
adjacent heat sources, and air flow.
NCP1117, NCP1117I, NCV1117 Constant Current Input Output Output OT “Sign 2 R 4’ to m I we. NCP‘ 1 I 7 2 0 t: I XTA L to t I rrF T ' e n23 v lout : % + tadJ Figure 27. Constant Current Regulator Figure 28. Slow TurnrOn Regulator or "‘3“ 3 Mama 2 0‘3”“ l XTA i 10 ‘ ‘20 ' ‘0 m: I t I rtF Output COMFOI 1.0 k 360 2N2222 RESIstol R2 sets the maximum output voltage. Each trahsrstor reduces the output voltage when turned on. Orr ottf mk Figure 29. Regulator with Shutdown Figure 30. Digitally Controlled Regulator oigbl—f %0 50 v Battery rtHL—t NCPH 1 7 XTSD The 50 :2 resrstor that rs rrr serres wrth the ground pm at the upper regutator lever shrrts rte output 300 mV hrgher than the tower regulator, Thrs keeps the tower regutator off mm the mpul source is removed. Figure 31. Battery BackedeUp Power Supply Figure 32. Adjusting Output of Fixed Voltage Regulators www.onsemi.com 11
NCP1117, NCP1117I, NCV1117
www.onsemi.com
11
Figure 27. Constant Current Regulator Figure 28. Slow TurnOn Regulator
Figure 29. Regulator with Shutdown Figure 30. Digitally Controlled Regulator
Figure 31. Battery BackedUp Power Supply Figure 32. Adjusting Output of Fixed
Voltage Regulators
The 50 W resistor that is in series with the ground pin of the
upper regulator level shifts its output 300 mV higher than the
lower regulator. This keeps the lower regulator off until the
input source is removed.
Resistor R2 sets the maximum output voltage. Each
transistor reduces the output voltage when turned on.
1
2
Constant Current
Output
3
Input NCP1117
XTA
++
10
mF
Iout +Vref
R)Iadj
10
mF
R
1
2Output
3
Input NCP1117
XTA
++
10
mF
10
mF
1N4001
R2
R1
10
mF
50 k
2N2907
1
2Output
3
Input NCP1117
XTA
++
10
mF
10
mF
120
2N2222
360
1.0 k
1.0 k
Output Control
On
Off
1
2Output
3
Input NCP1117
XTA
++
10
mF
10
mF
R1
2N2222
R2
1
50 W
2Output
3
Input NCP1117
XT50
++
10
mF
10
mF
+
RCHG
1
NCP1117
XT50
+
10
mF
6.6 V
5.3 V AC Line
5.0 V Battery
1
2Output
3
Input NCP1117
XT50
++
10
mF
+10
mF
10
mF
2.0 k
5.0 V to
12 V
Vout(Off) +Vref
Output Voltage Control
23
www onsem' com
NCP1117, NCP1117I, NCV1117
www.onsemi.com
12
ORDERING INFORMATION (NCP1117)
Device Nominal Output Voltage Package Shipping
NCP1117STAT3G Adjustable
SOT223
(PbFree) 4000 / Tape & Reel
NCP1117ST15T3G 1.5
NCP1117ST18T3G 1.8
NCP1117ST20T3G 2.0
NCP1117ST25T3G 2.5
NCP1117ST33T3G 3.3
NCP1117ST50T3G 5.0
NCP1117ST12T3G 12
NCP1117DTAG Adjustable
DPAK
(PbFree)
75 Units / Rail
NCP1117DTARKG Adjustable 2500 / Tape & Reel
NCP1117DTAT5G Adjustable 2500 / Tape & Reel
NCP1117DT15G 1.5 75 Units / Rail
NCP1117DT15RKG 1.5 2500 / Tape & Reel
NCP1117DT18G 1.8 75 Units / Rail
NCP1117DT18RKG 1.8 2500 / Tape & Reel
NCP1117DT18T5G 1.8 2500 / Tape & Reel
NCP1117DT19RKG 1.9 2500 / Tape & Reel
NCP1117DT20G 2.0 75 Units / Rail
NCP1117DT20RKG 2.0 2500 / Tape & Reel
NCP1117DT25G 2.5 75 Units / Rail
NCP1117DT25RKG 2.5 2500 / Tape & Reel
NCP1117DT25T5G 2.5 2500 / Tape & Reel
NCP1117DT285G 2.85 75 Units / Rail
NCP1117DT285RKG 2.85 2500 / Tape & Reel
NCP1117DT33G 3.3 75 Units / Rail
NCP1117DT33RKG 3.3 2500 / Tape & Reel
NCP1117DT33T5G 3.3 2500 / Tape & Reel
NCP1117DT50G 5.0 75 Units / Rail
NCP1117DT50RKG 5.0 2500 / Tape & Reel
NCP1117DT12G 12 75 Units / Rail
NCP1117DT12RKG 12 2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
ORDERING INFORMATION (NCP1117I)
Device Nominal Output Voltage Package Shipping
NCP1117ISTAT3G Adjustable
SOT223
(PbFree) 4000 / Tape & Reel
NCP1117IST18T3G 1.8
NCP1117IST33T3G 3.3
NCP1117IST50T3G 5.0
NCP1117IDTAT4G Adjustable
DPAK
(PbFree) 2500 / Tape & Reel
NCP1117IDT33T4G 3.3
NCP1117IDT50T4G 5.0
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NCP1117, NCP1117I, NCV1117
www.onsemi.com
13
ORDERING INFORMATION (NCV1117)
Device Nominal Output Voltage Package Shipping
NCV1117STAT3G* Adjustable
SOT223
(PbFree) 4000 / Tape & Reel
NCV1117ST15T3G* 1.5
NCV1117ST18T3G* 1.8
NCV1117ST20T3G* 2.0
NCV1117ST25T3G* 2.5
NCV1117ST33T3G* 3.3
NCV1117ST50T3G* 5.0
NCV1117ST12T3G* 12
NCV1117DTARKG* Adjustable
DPAK
(PbFree) 2500 / Tape & Reel
NCV1117DT15RKG* 1.5
NCV1117DT18RKG* 1.8
NCV1117DT18T5G* 1.8
NCV1117DT20RKG* 2.0
NCV1117DT25RKG* 2.5
NCV1117DT33T4G* 3.3
NCV1117DT33T5G* 3.3
NCV1117DT50RKG* 5.0
NCV1117DT12RKG* 12
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ100 Qualified and
PPAP Capable
| AYW 117— AVW 17-1 AYW 17-1 AYW 17-1 Avw 1 1 7— LIUU '_| UUU 1—1 LILIU l—l LILIU l—l AYW 17 2 AVW 17 a AYW 117- AYW 17 1 LILIU Mu um um HULI HUD U”U WU U”U WU WU WU WU www.cnsemi.com WU WU
NCP1117, NCP1117I, NCV1117
www.onsemi.com
14
117AJG
ALYWW
1715G
ALYWW
1718G
ALYWW
1172G
ALYWW
1725G
ALYWW
17285G
ALYWW
1733G
ALYWW
1175G
ALYWW
1712G
ALYWW
AYW
117AG
G
1
SOT223
ST SUFFIX
CASE 318H
A = Assembly Location
L = Wafer Lot
Y = Year
WW, W = Work Week
G or G = PbFree Package
MARKING DIAGRAMS NCP1117
DPAK
DT SUFFIX
CASE 369C
23
1
2
31
2
31
2
31
2
31
2
3
1
2
31
2
31
2
31
2
3
Adjustable 1.5 V 1.8 V 2.0 V
2.5 V 3.3 V 5.0 V 12 V
Adjustable 1.5 V 1.8 V 2.0 V 2.5 V
2.85 V 3.3 V 5.0 V 12 V
(Note: Microdot may be in either location)
AYW
1715 G
G
123
AYW
1718 G
G
123
AYW
1172G
G
123
AYW
1725 G
G
123
AYW
1733 G
G
123
AYW
1175G
G
123
AYW
1712 G
G
123
1.9 V
AYW
1719 G
G
123
1719G
ALYWW
1
2
3
1.9 V
AVW AVW AYW AYW Mu Mu LILIU LILIU U”U U”U www.cnsemi.com U”U
NCP1117, NCP1117I, NCV1117
www.onsemi.com
15
17AJTG
ALYWW
1733TG
ALYWW
1175TG
ALYWW
AYW
117ATG
G
1
SOT223
ST SUFFIX
CASE 318H
A = Assembly Location
L = Wafer Lot
Y = Year
WW, W = Work Week
G or G = PbFree Package
MARKING DIAGRAMS NCP1117I
DPAK
DT SUFFIX
CASE 369C
23
1
2
31
2
31
2
3
Adjustable 1.8 V 3.3 V
Adjustable 3.3 V 5.0 V
(Note: Microdot may be in either location)
AYW
1718TG
G
123
AYW
1733TG
G
123
5.0 V
AYW
1750TG
G
123
AYW AYW AYW AVW LILIU LILIU LILIU Mu AYW AYW AVW AYW LILIU UM Mu UM U”U U“U U”U U”U U“U U”U U”U U”U www.cnsemi.com
NCP1117, NCP1117I, NCV1117
www.onsemi.com
16
17AJVG
ALYWW
1715VG
ALYWW
1718VG
ALYWW
1172VG
ALYWW
1725VG
ALYWW
1733VG
ALYWW
1175VG
ALYWW
AYW
117AV G
G
1
SOT223
ST SUFFIX
CASE 318H
A = Assembly Location
L = Wafer Lot
Y = Year
WW, W = Work Week
G or G = PbFree Package
MARKING DIAGRAMS NCV1117
DPAK
DT SUFFIX
CASE 369C
23
1
2
31
2
31
2
31
2
3
1
2
31
2
31
2
3
Adjustable 1.5 V 2.0 V
2.5 V 3.3 V 5.0 V
Adjustable 1.5 V 1.8 V 2.0 V
2.5 V 3.3 V 5.0 V
(Note: Microdot may be in either location)
AYW
1715V G
G
123
AYW
1172V G
G
123
AYW
1725V G
G
123
AYW
1733V G
G
123
AYW
1750V G
G
123
1.8 V
AYW
1718V G
G
123
12 V
AYW
1712V G
G
123
1712VG
ALYWW
1
2
3
12 V
._HI 0 EHJ TDP VIEW SIDE VIEW L7 A1—F DETAIL A |_||_||_| 0N Semiwndudw" NEIYESI I DIMENSIDNING AND YDLERANCING PER ASHE HASH, 2W9 CEINTREILLING DIMENSIDNI MILLTMETERS DIMENSTDNS D 0 E1 ARE DETERMINED AT DATUM H. DIMENSIDNS DD NET [NELunE HEILD ELASH, PRDYEUSIDNS DR GATE BURRS SHALL NEIT EXCEED Dean-n FER SIDE. LEAD DIMENSIDNS E: AND m DD NEIT INCLDDE DAMBAR PRDTRUSIDN. ALLDUADLE DAMDDAR PREIYRUSIEIN IS Duann PER SIDE. DATUMS A AND D ARE DETERMINED AT DATUM H. AI IS DEFINED AS THE VERTICAL DISTANCE FREIM THE SEAHNG PLANE ID THE LEIVEST PEIINT Dr THE PACKAGE sum 2. 2. 7 PEISITIEINAL TDLEEANCE APPLIES Tl] DIMENSIDNS k1 AND bl. MILLIMETERS DIM MIN. NEIM. MAX. A see e" 1.80 A1 002 one 011 ~an 7 b 0.60 0.74 0.33 DL—WL A m 2.90 3.00 3.10 J c 0.24 s" 0.35 \ D 5.30 6.50 6.70 A E 5.70 7.00 7.30 I I .7 \J E1 330 23:53:: 3 0 END VIEW 9 ‘ L 0.25 ——— ——— L 0' s" 10' C a I l——-|—3.80 2.00 8.30 3X 2.00 3-30 3x 1.50 PITCH RECEIMMENDED MDUNTING FEIDTPRINT For oddmonm Inrernntien on our Pbsrree s‘ro‘egy and solaermg detofls, p|ensl demand the EIN Senwzunuucwr Squening and Mounting Yschanues REFEr‘Ence Munum, SDLDEERM/D. ON SemIcunduClm and ngms ev n|hers are uauemams ev SemICanduclur Campunenls lndusmes LLC dba ON SemICanduclar Dr Ils suhsIdIanes m Ine Dnneu sxaxes andJnI mhev cmm‘nes ON SemIcunduclar Iesewes me th‘ To make Changes wIlth Yunhev nenee To any prnduns hevem ON Semenduc‘m makes nu wavvamy represenlalmn m guarantee regardmg We sunewny av IL; manuals our eny pamcu‘av purpase nnv eees ON Semumnduclm assume any Mammy ansmg gum Ine apphcahan m use no any pmdudm mun enu seeemceuy dIscIaIms any and ex Mammy mCIudmg wnneuI hmma‘mn speeaI Cansequenha‘ m mueenuaI damages ON Sermmnduclar dues nn| Convey any hcense under ns pa|em thls Ivar Ine
SOT223
CASE 318H
ISSUE B
DATE 13 MAY 2020
SCALE 2:1
1
A = Assembly Location
Y = Year
W = Work Week
XXXXX = Specific Device Code
G= PbFree Package
GENERIC
MARKING DIAGRAM*
AYW
XXXXXG
G
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
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98ASH70634A
DOCUMENT NUMBER:
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PAGE 1 OF 1
SOT223
© Semiconductor Components Industries, LLC, 2018 www.onsemi.com
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DPAK (SINGLE GAUGE)
CASE 369C
ISSUE F
DATE 21 JUL 2015
SCALE 1:1
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
STYLE 2:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
STYLE 4:
PIN 1. CATHODE
2. ANODE
3. GATE
4. ANODE
STYLE 5:
PIN 1. GATE
2. ANODE
3. CATHODE
4. ANODE
STYLE 6:
PIN 1. MT1
2. MT2
3. GATE
4. MT2
STYLE 7:
PIN 1. GATE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
12
3
4
STYLE 8:
PIN 1. N/C
2. CATHODE
3. ANODE
4. CATHODE
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. RESISTOR ADJUST
4. CATHODE
STYLE 10:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. ANODE
b
D
E
b3
L3
L4
b2
M
0.005 (0.13) C
c2
A
c
C
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
D0.235 0.245 5.97 6.22
E0.250 0.265 6.35 6.73
A0.086 0.094 2.18 2.38
b0.025 0.035 0.63 0.89
c2 0.018 0.024 0.46 0.61
b2 0.028 0.045 0.72 1.14
c0.018 0.024 0.46 0.61
e0.090 BSC 2.29 BSC
b3 0.180 0.215 4.57 5.46
L4 −−− 0.040 −−− 1.01
L0.055 0.070 1.40 1.78
L3 0.035 0.050 0.89 1.27
Z0.155 −−− 3.93 −−−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
7. OPTIONAL MOLD FEATURE.
12 3
4
XXXXXX = Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
WW = Work Week
G = PbFree Package
AYWW
XXX
XXXXXG
XXXXXXG
ALYWW
DiscreteIC
5.80
0.228
2.58
0.102
1.60
0.063
6.20
0.244
3.00
0.118
6.17
0.243
ǒmm
inchesǓ
SCALE 3:1
GENERIC
MARKING DIAGRAM*
*This information is generic. Please refer
to device data sheet for actual part
marking.
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
H0.370 0.410 9.40 10.41
A1 0.000 0.005 0.00 0.13
L1 0.114 REF 2.90 REF
L2 0.020 BSC 0.51 BSC
A1
H
DETAIL A
SEATING
PLANE
A
B
C
L1
L
H
L2 GAUGE
PLANE
DETAIL A
ROTATED 90 CW5
e
BOTTOM VIEW
Z
BOTTOM VIEW
SIDE VIEW
TOP VIEW
ALTERNATE
CONSTRUCTIONS
NOTE 7
Z
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
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disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
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DOCUMENT NUMBER:
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