Spartan-6 FPGA Datasheet (DC and Switching Characteristics)

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Datasheet

DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 1
© 2009–2015 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Zynq, Artix, Kintex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United
States and other countries. All other trademarks are the property of their respective owners.
Spartan-6 FPGA Electrical Characteristics
Spartan®-6 LX and LXT FPGAs are available in various speed grades, with -3 having the highest performance. The DC and
AC electrical parameters of the Automotive XA Spartan-6 FPGAs and Defense-grade Spartan-6Q FPGAs devices are
equivalent to the commercial specifications except where noted. The timing characteristics of the commercial (XC) -2 speed
grade industrial device are the same as for a -2 speed grade commercial device. The -2Q and -3Q speed grades are
exclusively for the expanded (Q) temperature range. The timing characteristics are equivalent to those shown for the -2 and
-3 speed grades for the Automotive and Defense-grade devices.
Spartan-6 FPGA DC and AC characteristics are specified for commercial (C), industrial (I), and expanded (Q) temperature
ranges. Only selected speed grades and/or devices might be available in the industrial or expanded temperature ranges for
Automotive and Defense-grade devices. References to device names refer to all available variations of that part number (for
example, LX75 could denote XC6SLX75, XA6SLX75, or XQ6SLX75). The Spartan-6 FPGA -3N speed grade designates
devices that do not support MCB functionality.
All supply voltage and junction temperature specifications are representative of worst-case conditions. The parameters
included are common to popular designs and typical applications.
Available device and package combinations can be found at:
DS160: Spartan-6 Family Overview
DS170: Automotive XA Spartan-6 Family Overview
DS172: Defense-Grade Spartan-6Q Family Overview
This Spartan-6 FPGA data sheet, part of an overall set of documentation on the Spartan-6 family of FPGAs, is available on
the Xilinx website at http://www.xilinx.com/support/documentation/spartan-6.htm.
Spartan-6 FPGA DC Characteristics
89
Spartan-6 FPGA Data Sheet:
DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 Product Specification
Table 1: Absolute Maximum Ratings(1)
Symbol Description Units
VCCINT Internal supply voltage relative to GND –0.5 to 1.32 V
VCCAUX Auxiliary supply voltage relative to GND –0.5 to 3.75 V
VCCO Output drivers supply voltage relative to GND –0.5 to 3.75 V
VBATT Key memory battery backup supply (LX75, LX75T, LX100, LX100T, LX150, and LX150T only) –0.5 to 4.05 V
VFS External voltage supply for eFUSE programming (LX75, LX75T, LX100, LX100T, LX150, and
LX150T only)(2) –0.5 to 3.75 V
VREF Input reference voltage –0.5 to 3.75 V
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 2
VIN and VTS(3) I/O input voltage or voltage
applied to 3-state output,
relative to GND(4)
All user and dedicated
I/Os
Commercial
DC –0.60 to 4.10 V
20% overshoot duration –0.75 to 4.25 V
8% overshoot duration(5) –0.75 to 4.40 V
Industrial
DC –0.60 to 3.95 V
20% overshoot duration –0.75 to 4.15 V
4% overshoot duration(5) –0.75 to 4.40 V
Expanded (Q)
DC –0.60 to 3.95 V
20% overshoot duration –0.75 to 4.15 V
4% overshoot duration(5) –0.75 to 4.40 V
Restricted to
maximum of 100 user
I/Os
Commercial
20% overshoot duration –0.75 to 4.35 V
15% overshoot duration(5) –0.75 to 4.40 V
10% overshoot duration –0.75 to 4.45 V
Industrial
20% overshoot duration –0.75 to 4.25 V
10% overshoot duration –0.75 to 4.35 V
8% overshoot duration(5) –0.75 to 4.40 V
Expanded (Q)
20% overshoot duration –0.75 to 4.25 V
10% overshoot duration –0.75 to 4.35 V
8% overshoot duration(5) –0.75 to 4.40 V
TSTG Storage temperature (ambient) –65 to 150 °C
TSOL
Maximum soldering temperature(6)
(TQG144, CPG196, CSG225, CSG324, CSG484, and FTG256)
+260 °C
Maximum soldering temperature(6) (Pb-free packages: FGG484, FGG676, and FGG900) +250 °C
Maximum soldering temperature(6) (Pb packages: CS484, FT256, FG484, FG676, and FG900) +220 °C
TjMaximum junction temperature(6) +125 °C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2. When programming eFUSE, VFS VCCAUX. Requires up to 40 mA current. For read mode, VFS can be between GND and 3.45 V.
3. I/O absolute maximum limit applied to DC and AC signals. Overshoot duration is the percentage of a data period that the I/O is stressed
beyond 3.45V.
4. For I/O operation, refer to UG381: Spartan-6 FPGA SelectIO Resources User Guide.
5. Maximum percent overshoot duration to meet 4.40V maximum.
6. TSOL is the maximum soldering temperature for component bodies. For soldering guidelines and thermal considerations,
see UG385: Spartan-6 FPGA Packaging and Pinout Specification.
Table 1: Absolute Maximum Ratings(1) (Cont’d)
Symbol Description Units
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 3
Table 2: Recommended Operating Conditions(1)
Symbol Description Min Typ Max Units
VCCINT Internal supply voltage relative to GND
-3, -3N, -2 Standard performance(2) 1.14 1.2 1.26 V
-3, -2 Extended performance(2) 1.2 1.23 1.26 V
-1L Standard performance(2) 0.95 1.0 1.05 V
VCCAUX(3)(4) Auxiliary supply voltage relative to GND VCCAUX =2.5V
(5) 2.375 2.5 2.625 V
VCCAUX = 3.3V 3.15 3.3 3.45 V
VCCO(6)(7)(8) Output supply voltage relative to GND 1.1 3.45 V
VIN Input voltage relative to GND
All I/O
standards
(except PCI)
Commercial temperature (C) –0.5 4.0 V
Industrial temperature (I) –0.5 3.95 V
Expanded (Q) temperature –0.5 3.95 V
PCI I/O standard(9) –0.5 – VCCO +0.5 V
IIN(10)
Maximum current through pin using PCI I/O standard
when forward biasing the clamp diode.(9) Commercial (C) and
Industrial temperature (I) –– 10mA
Expanded (Q) temperature 7 mA
Maximum current through pin when forward biasing the ground clamp diode. 10 mA
VBATT(11) Battery voltage relative to GND, Tj=0°C to +85°C
(LX75, LX75T, LX100, LX100T, LX150, and LX150T only) 1.0 – 3.6 V
TjJunction temperature operating range
Commercial (C) range 0 85 °C
Industrial temperature (I) range –40 100 °C
Expanded (Q) temperature range –40 125 °C
Notes:
1. All voltages are relative to ground.
2. See Interface Performances for Memory Interfaces in Table 2 5 . The extended performance range is specified for designs not using the
standard VCCINT voltage range. The standard VCCINT voltage range is used for:
Designs that do not use an MCB
LX4 devices
Devices in the TQG144 or CPG196 packages
Devices with the -3N speed grade
3. Recommended maximum voltage droop for VCCAUX is 10 mV/ms.
4. During configuration, if VCCO_2 is 1.8V, then VCCAUX must be 2.5V.
5. The -1L devices require VCCAUX = 2.5V when using the LVDS_25, LVDS_33, BLVDS_25, LVPECL_25, RSDS_25, RSDS_33, PPDS_25,
and PPDS_33 I/O standards on inputs. LVPECL_33 is not supported in the -1L devices.
6. Configuration data is retained even if VCCO drops to 0V.
7. Includes VCCO of 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V.
8. For PCI systems, the transmitter and receiver should have common supplies for VCCO.
9. Devices with a -1L speed grade do not support Xilinx PCI IP.
10. Do not exceed a total of 100 mA per bank.
11. VBATT is required to maintain the battery backed RAM (BBR) AES key when VCCAUX is not applied. Once VCCAUX is applied, VBATT can be
unconnected. When BBR is not used, Xilinx recommends connecting to VCCAUX or GND. However, VBATT can be unconnected.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 4
Tabl e 3 : eFUSE Programming Conditions(1)
Symbol Description Min Typ Max Units
VFS(2) External voltage supply 3.2 3.3 3.4 V
IFS VFS supply current ––40mA
VCCAUX Auxiliary supply voltage relative to GND 3.2 3.3 3.45 V
RFUSE(3) External resistor from RFUSE pin to GND 1129 1140 1151 Ω
VCCINT Internal supply voltage relative to GND 1.14 1.2 1.26 V
tjTemperature range 15–85°C
Notes:
1. These specifications apply during programming of the eFUSE AES key. Programming is only supported through JTAG.The AES key is only
supported in the following devices: LX75, LX75T, LX100, LX100T, LX150, and LX150T.
2. When programming eFUSE, VFS must be less than or equal to VCCAUX. When not programming or when eFUSE is not used, Xilinx
recommends connecting VFS to GND. However, VFS can be between GND and 3.45 V.
3. An RFUSE resistor is required when programming the eFUSE AES key. When not programming or when eFUSE is not used, Xilinx
recommends connecting the RFUSE pin to VCCAUX or GND. However, RFUSE can be unconnected.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 5
Tabl e 4 : DC Characteristics Over Recommended Operating Conditions
Symbol Description Min Typ Max Units
VDRINT Data retention VCCINT voltage (below which configuration data might be lost) 0.8 V
VDRAUX Data retention VCCAUX voltage (below which configuration data might be lost) 2.0 V
IREF
VREF leakage current per pin for commercial (C) and industrial (I) devices –10 10 µA
VREF leakage current per pin for expanded (Q) devices –15 15 µA
IL
Input or output leakage current per pin (sample-tested) for commercial (C) and industrial
(I) devices
–10 10 µA
Input or output leakage current per pin (sample-tested) for expanded (Q) devices –15 15 µA
IHS Leakage current on pins during hot
socketing with FPGA unpowered
All pins except PROGRAM_B, DONE, and
JTAG pins when HSWAPEN = 1
–20 20 µA
PROGRAM_B, DONE, and JTAG pins, or other
pins when HSWAPEN = 0
IHS(HSWAPEN = 1) +
IRPU
µA
CIN(1) Die input capacitance at the pad 10 pF
IRPU
Pad pull-up (when selected) @ VIN =0V, V
CCO =3.3V or V
CCAUX = 3.3V 200 500 µA
Pad pull-up (when selected) @ VIN =0V, V
CCO =2.5V or V
CCAUX = 2.5V 120 350 µA
Pad pull-up (when selected) @ VIN =0V, V
CCO = 1.8V 60 200 µA
Pad pull-up (when selected) @ VIN =0V, V
CCO = 1.5V 40 150 µA
Pad pull-up (when selected) @ VIN =0V, V
CCO = 1.2V 12 100 µA
IRPD
Pad pull-down (when selected) @ VIN =V
CCO, VCCAUX = 3.3V 200 550 µA
Pad pull-down (when selected) @ VIN =V
CCO, VCCAUX = 2.5V 140 400 µA
IBATT(2) Battery supply current 150 nA
RDT(3) Resistance of optional input differential termination circuit, VCCAUX =3.3V – 100 – Ω
RIN_TERM(5)
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_25) for commercial (C) and industrial (I) devices
23 25 55 Ω
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_25) for expanded (Q) devices
20 25 55 Ω
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_50) for commercial (C) and industrial (I) devices
39 50 72 Ω
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_50) for expanded (Q) devices
32 50 74 Ω
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_75) for commercial (C) and industrial (I) devices
56 75 109 Ω
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_75) for expanded (Q) devices
47 75 115 Ω
ROUT_TERM
Thevenin equivalent resistance of programmable output termination (UNTUNED_25) 11 25 52 Ω
Thevenin equivalent resistance of programmable output termination (UNTUNED_50) 21 50 96 Ω
Thevenin equivalent resistance of programmable output termination (UNTUNED_75) 29 75 145 Ω
Notes:
1. The CIN measurement represents the die capacitance at the pad, not including the package.
2. Maximum value specified for worst case process at 25°C. LX75, LX75T, LX100, LX100T, LX150, and LX150T only.
3. Refer to IBIS models for RDT variation and for values at VCCAUX = 2.5V. IBIS values for RDT are valid for all temperature ranges.
4. VCCO2 is not required for data retention. The minimum VCCO2 for power-on reset and configuration is 1.65V.
5. Termination resistance to a VCCO/2 level.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 6
Quiescent Current
Typical values for quiescent supply current are specified at nominal voltage, 25°C junction temperatures (Tj). Quiescent
supply current is specified by speed grade for Spartan-6 devices. Xilinx recommends analyzing static power consumption
using the Xilinx Power Estimator (XPE) tool (download at http://www.xilinx.com/power) for conditions other than those
specified in Ta b l e 5 .
Tabl e 5 : Typical Quiescent Supply Current
Symbol Description Device Speed Grade Units
-3 -3N -2 -1L
ICCINTQ Quiescent VCCINT supply current LX4 4.0 4.0 4.0 2.4 mA
LX9 4.0 4.0 4.0 2.4 mA
LX16 6.0 6.0 6.0 4.0 mA
LX25 11.0 11.0 11.0 6.6 mA
LX25T 11.0 11.0 11.0 N/A mA
LX45 15.0 15.0 15.0 9.0 mA
LX45T 15.0 15.0 15.0 N/A mA
LX75 29.0 29.0 29.0 17.4 mA
LX75T 29.0 29.0 29.0 N/A mA
LX100 36.0 36.0 36.0 21.6 mA
LX100T 36.0 36.0 36.0 N/A mA
LX150 51.0 51.0 51.0 31.0 mA
LX150T 51.0 51.0 51.0 N/A mA
ICCOQ Quiescent VCCO supply current LX4 1.0 1.0 1.0 1.0 mA
LX9 1.0 1.0 1.0 1.0 mA
LX16 2.0 2.0 2.0 2.0 mA
LX25 2.0 2.0 2.0 2.0 mA
LX25T 2.0 2.0 2.0 N/A mA
LX45 3.0 3.0 3.0 3.0 mA
LX45T 3.0 3.0 3.0 N/A mA
LX75 4.0 4.0 4.0 4.0 mA
LX75T 4.0 4.0 4.0 N/A mA
LX100 5.0 5.0 5.0 5.0 mA
LX100T 5.0 5.0 5.0 N/A mA
LX150 7.0 7.0 7.0 7.0 mA
LX150T 7.0 7.0 7.0 N/A mA
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 7
ICCAUXQ Quiescent VCCAUX supply current LX4 2.5 2.5 2.5 2.5 mA
LX9 2.5 2.5 2.5 2.5 mA
LX16 3.0 3.0 3.0 3.0 mA
LX25 4.0 4.0 4.0 4.0 mA
LX25T 4.0 4.0 4.0 N/A mA
LX45 5.0 5.0 5.0 5.0 mA
LX45T 5.0 5.0 5.0 N/A mA
LX75 7.0 7.0 7.0 7.0 mA
LX75T 7.0 7.0 7.0 N/A mA
LX100 9.0 9.0 9.0 9.0 mA
LX100T 9.0 9.0 9.0 N/A mA
LX150 12.0 12.0 12.0 12.0 mA
LX150T 12.0 12.0 12.0 N/A mA
Notes:
1. Typical values are specified at nominal voltage, 25°C junction temperatures (Tj). Industrial (I) grade devices have the same typical values as
commercial (C) grade devices at 25°C, but higher values at 100°C. Use the XPE tool to calculate 100°C values. Nominal VCCINT is 1.20V;
use the XPE tool to calculate 1.23V values for the nominal VCCINT of the extended performance range.
2. Typical values are for blank configured devices with no output current loads, no active input pull-up resistors, all I/O pins are 3-state and
floating.
3. If differential signaling is used, more accurate quiescent current estimates can be obtained by using the Xilinx Power Estimator (XPE) or
Xilinx Power Analyzer (XPA) tools.
Tabl e 6 : Power Supply Ramp Time
Symbol Description Speed Grade Ramp Time Units
VCCINTR Internal supply voltage ramp time -3, -3N, -2 0.20 to 50.0 ms
-1L 0.20 to 40.0 ms
VCCO2(1) Output drivers bank 2 supply voltage ramp time All 0.20 to 50.0 ms
VCCAUXR Auxiliary supply voltage ramp time All 0.20 to 50.0 ms
Notes:
1. The minimum VCCO2 for power-on reset and configuration is 1.65V.
2. Spartan-6 FPGAs require a certain amount of supply current during power-on to insure proper device initialization. The actual current
consumed depends on the power-on ramp rate of the power supply. Use the Xilinx Power Estimator (XPE) or Xilinx Power Analyzer (XPA)
tools to estimate current drain on these supplies. Spartan-6 devices do not have a required power-on sequence.
Tabl e 5 : Typical Quiescent Supply Current (Cont’d)
Symbol Description Device Speed Grade Units
-3 -3N -2 -1L
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 8
SelectIO™ Interface DC Input and Output Levels
Tabl e 7 : Recommended Operating Conditions for User I/Os Using Single-Ended Standards
I/O Standard VCCO for Drivers(1) VREF for Inputs
V, Min V, Nom V, Max V, Min V, Nom V, Max
LVTTL 3.0 3.3 3.45
VREF is not used for these I/O standards
LVCMOS33 3.0 3.3 3.45
LVCMOS25 2.3 2.5 2.7
LVCMOS18 1.65 1.8 1.95
LVCMOS18_JEDEC 1.65 1.8 1.95
LVCMOS15 1.4 1.5 1.6
LVCMOS15_JEDEC 1.4 1.5 1.6
LVCMOS12 1.1 1.2 1.3
LVCMOS12_JEDEC 1.1 1.2 1.3
PCI33_3(2) 3.0 3.3 3.45
PCI66_3(2) 3.0 3.3 3.45
I2C 2.7 3.0 3.45
SMBUS 2.7 3.0 3.45
SDIO 3.0 3.3 3.45
MOBILE_DDR 1.7 1.8 1.9
HSTL_I 1.4 1.5 1.6 0.68 0.75 0.9
HSTL_II 1.4 1.5 1.6 0.68 0.75 0.9
HSTL_III 1.4 1.5 1.6 0.9
HSTL_I_18 1.7 1.8 1.9 0.8 0.9 1.1
HSTL_II_18 1.7 1.8 1.9 0.9
HSTL_III_18 1.7 1.8 1.9 1.1
SSTL3_I 3.0 3.3 3.45 1.3 1.5 1.7
SSTL3_II 3.0 3.3 3.45 1.3 1.5 1.7
SSTL2_I 2.3 2.5 2.7 1.13 1.25 1.38
SSTL2_II 2.3 2.5 2.7 1.13 1.25 1.38
SSTL18_I 1.7 1.8 1.9 0.833 0.9 0.969
SSTL18_II 1.7 1.8 1.9 0.833 0.9 0.969
SSTL15_II 1.425 1.5 1.575 0.69 0.75 0.81
Notes:
1. VCCO range required when using I/O standard for an output. Also required for MOBILE_DDR, PCI33_3, LVCMOS18_JEDEC,
LVCMOS15_JEDEC, and LVCMOS12_JEDEC inputs, and for LVCMOS25 inputs when VCCAUX =3.3V.
2. For PCI systems, the transmitter and receiver should have common supplies for VCCO.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 9
Tabl e 8 : Recommended Operating Conditions for User I/Os Using Differential Signal Standards
I/O Standard VCCO for Drivers
V, Min V, Nom V, Max
LVDS_33 3.0 3.3 3.45
LVDS_25 2.25 2.5 2.75
BLVDS_25 2.25 2.5 2.75
MINI_LVDS_33 3.0 3.3 3.45
MINI_LVDS_25 2.25 2.5 2.75
LVPECL_33(1) N/A–Inputs Only
LVPECL_25 N/A–Inputs Only
RSDS_33 3.0 3.3 3.45
RSDS_25 2.25 2.5 2.75
TMDS_33(1) 3.14 3.3 3.45
PPDS_33 3.0 3.3 3.45
PPDS_25 2.25 2.5 2.75
DISPLAY_PORT 2.3 2.5 2.7
DIFF_MOBILE_DDR 1.7 1.8 1.9
DIFF_HSTL_I 1.4 1.5 1.6
DIFF_HSTL_II 1.4 1.5 1.6
DIFF_HSTL_III 1.4 1.5 1.6
DIFF_HSTL_I_18 1.7 1.8 1.9
DIFF_HSTL_II_18 1.7 1.8 1.9
DIFF_HSTL_III_18 1.7 1.8 1.9
DIFF_SSTL3_I 3.0 3.3 3.45
DIFF_SSTL3_II 3.0 3.3 3.45
DIFF_SSTL2_I 2.3 2.5 2.7
DIFF_SSTL2_II 2.3 2.5 2.7
DIFF_SSTL18_I 1.7 1.8 1.9
DIFF_SSTL18_II 1.7 1.8 1.9
DIFF_SSTL15_II 1.425 1.5 1.575
Notes:
1. LVPECL_33 and TMDS_33 inputs require VCCAUX = 3.3V nominal.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 10
In Ta b l e 9 and Ta bl e 1 0 , values for VIL and VIH are recommended input voltages. Values for IOL and IOH are guaranteed over
the recommended operating conditions at the VOL and VOH test points. Only selected standards are tested. These are
chosen to ensure that all standards meet their specifications. The selected standards are tested at a minimum VCCO with the
respective VOL and VOH voltage levels shown. Other standards are sample tested.
Tabl e 9 : Single-Ended I/O Standard DC Input and Output Levels
I/O Standard VIL VIH VOL VOH IOL IOH
V, Min V, Max V, Min V, Max V, Max V, Min mA mA
LVTTL –0.5 0.8 2.0 4.1 0.4 2.4 Note 2 Note 2
LVCMOS33 –0.5 0.8 2.0 4.1 0.4 VCCO –0.4 Note 2 Note 2
LVCMOS25 –0.5 0.7 1.7 4.1 0.4 VCCO –0.4 Note 2 Note 2
LVCMOS18 –0.5 0.38 0.8 4.1 0.45 VCCO –0.45 Note 2 Note 2
LVCMOS18 (-1L) –0.5 0.33 0.71 4.1 0.45 VCCO –0.45 Note 2 Note 2
LVCMOS18_JEDEC –0.5 35% VCCO 65% VCCO 4.1 0.45 VCCO –0.45 Note 2 Note 2
LVCMOS15 –0.5 0.38 0.8 4.1 25% VCCO 75% VCCO Note 3 Note 3
LVCMOS15 (-1L) –0.5 0.33 0.71 4.1 25% VCCO 75% VCCO Note 3 Note 3
LVCMOS15_JEDEC –0.5 35% VCCO 65% VCCO 4.1 25% VCCO 75% VCCO Note 3 Note 3
LVCMOS12 –0.5 0.38 0.8 4.1 0.4 VCCO –0.4 Note 4 Note 4
LVCMOS12 (-1L) –0.5 0.33 0.71 4.1 0.4 VCCO –0.4 Note 4 Note 4
LVCMOS12_JEDEC –0.5 35% VCCO 65% VCCO 4.1 0.4 VCCO –0.4 Note 4 Note 4
PCI33_3 –0.5 30% VCCO 50% VCCO VCCO + 0.5 10% VCCO 90% VCCO 1.5 –0.5
PCI66_3 –0.5 30% VCCO 50% VCCO VCCO + 0.5 10% VCCO 90% VCCO 1.5 –0.5
I2C –0.5 25% VCCO 70% VCCO 4.1 20% VCCO –3
SMBUS –0.5 0.8 2.1 4.1 0.4 4 –
SDIO –0.5 12.5% VCCO 75% VCCO 4.1 12.5% VCCO 75% VCCO 0.1 –0.1
MOBILE_DDR –0.5 20% VCCO 80% VCCO 4.1 10% VCCO 90% VCCO 0.1 –0.1
HSTL_I –0.5 VREF –0.1 V
REF + 0.1 4.1 0.4 VCCO –0.4 8 8
HSTL_II –0.5 VREF –0.1 V
REF + 0.1 4.1 0.4 VCCO – 0.4 16 –16
HSTL_III –0.5 VREF –0.1 V
REF + 0.1 4.1 0.4 VCCO – 0.4 24 –8
HSTL_I_18 –0.5 VREF –0.1 V
REF + 0.1 4.1 0.4 VCCO – 0.4 11 –11
HSTL_II_18 –0.5 VREF –0.1 V
REF + 0.1 4.1 0.4 VCCO – 0.4 22 –22
HSTL_III_18 –0.5 VREF –0.1 V
REF + 0.1 4.1 0.4 VCCO – 0.4 30 –11
SSTL3_I –0.5 VREF –0.2 V
REF +0.2 4.1 V
TT –0.6 V
TT +0.6 8 8
SSTL3_II –0.5 VREF –0.2 V
REF +0.2 4.1 V
TT –0.8 V
TT + 0.8 16 –16
SSTL2_I –0.5 VREF –0.15 V
REF +0.15 4.1 V
TT –0.61 V
TT + 0.61 8.1 –8.1
SSTL2_II –0.5 VREF –0.15 V
REF +0.15 4.1 V
TT –0.81 V
TT + 0.81 16.2 –16.2
SSTL18_I –0.5 VREF – 0.125 VREF + 0.125 4.1 VTT –0.47 V
TT + 0.47 6.7 –6.7
SSTL18_II –0.5 VREF – 0.125 VREF + 0.125 4.1 VTT –0.60 V
TT + 0.60 13.4 –13.4
SSTL15_II –0.5 VREF –0.1 V
REF +0.1 4.1 V
TT –0.4 V
TT + 0.4 13.4 13.4
Notes:
1. Tested according to relevant specifications.
2. Using drive strengths of 2, 4, 6, 8, 12, 16, or 24 mA.
3. Using drive strengths of 2, 4, 6, 8, 12, or 16 mA.
4. Using drive strengths of 2, 4, 6, 8, or 12 mA.
5. For more information, refer to UG381: Spartan-6 FPGA SelectIO Resources User Guide.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 11
Tabl e 1 0 : Differential I/O Standard DC Input and Output Levels
I/O Standard
VID VICM VOD VOCM VOH VOL
mV,
Min
mV,
Max V, Min V, Max mV, Min mV,
Max V, Min V, Max V, Min V, Max
LVDS_33(2)(3) 100 600 0.3 2.35 247 454 1.125 1.375
LVDS_25(2)(3) 100 600 0.3 2.35 247 454 1.125 1.375
BLVDS_25(2)(3) 100 0.3 2.35 240 460 Typical 50% VCCO ––
MINI_LVDS_33 200 600 0.3 1.95 300 600 1.0 1.4
MINI_LVDS_25 200 600 0.3 1.95 300 600 1.0 1.4
LVPECL_33(2)(3) 100 1000 0.3 2.8(1) Inputs only
LVPECL_25(2)(3) 100 1000 0.3 1.95 Inputs only
RSDS_33(2)(3) 100 – 0.3 1.5 100 400 1.0 1.4
RSDS_25(2)(3) 100 – 0.3 1.5 100 400 1.0 1.4
TMDS_33 150 1200 2.7 3.23(1) 400 800 VCCO –0.405 V
CCO – 0.190
PPDS_33(2)(3) 100 400 0.2 2.3 100 400 0.5 1.4
PPDS_25(2)(3) 100 400 0.2 2.3 100 400 0.5 1.4
DISPLAY_PORT 190 1260 0.3 2.35 Typical 50% VCCO ––
DIFF_MOBILE_DDR 100 0.78 1.02 90% VCCO 10% VCCO
DIFF_HSTL_I 100 – 0.68 0.9 VCCO –0.4 0.4
DIFF_HSTL_II 100 – 0.68 0.9 VCCO –0.4 0.4
DIFF_HSTL_III 100 – 0.68 0.9 VCCO –0.4 0.4
DIFF_HSTL_I_18 100 – 0.8 1.1 VCCO –0.4 0.4
DIFF_HSTL_II_18 100 0.8 1.1 VCCO –0.4 0.4
DIFF_HSTL_III_18 100 0.8 1.1 VCCO –0.4 0.4
DIFF_SSTL3_I 100 – 1.0 1.9 VTT +0.6 V
TT –0.6
DIFF_SSTL3_II 100 – 1.0 1.9 VTT +0.8 V
TT –0.8
DIFF_SSTL2_I 100 – 1.0 1.5 VTT +0.61 V
TT –0.61
DIFF_SSTL2_II 100 – 1.0 1.5 VTT +0.81 V
TT –0.81
DIFF_SSTL18_I 100 – 0.7 1.1 VTT +0.47 V
TT –0.47
DIFF_SSTL18_II 100 – 0.7 1.1 VTT +0.6 V
TT –0.6
DIFF_SSTL15_II 100 0.55 0.95 VTT +0.4 V
TT –0.4
Notes:
1. LVPECL_33 and TMDS_33 maximum VICM is the lower of V (maximum) or VCCAUX –(V
ID/2)
2. When VCCAUX = 3.3V, the DCD can be higher than 5% for VICM < 0.7V when using these I/O standards: LVDS_25, LVDS_33, BLVDS_25,
LVPECL_25, LVPECL_33, RSDS_25, RSDS_33, PPDS_25, and PPDS_33.
3. The -1L devices require VCCAUX = 2.5V when using the LVDS_25, LVDS_33, BLVDS_25, LVPECL_25, RSDS_25, RSDS_33, PPDS_25,
and PPDS_33 I/O standards on inputs. LVPECL_33 is not supported in the -1L devices.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 12
eFUSE Read Endurance
Ta bl e 1 1 lists the minimum guaranteed number of read cycle operations for Device DNA and for the AES eFUSE key. For
more information, see UG380: Spartan-6 FPGA Configuration User Guide.
GTP Transceiver Specifications
GTP transceivers are available in the Spartan-6 LXT devices. See DS160: Spartan-6 Family Overview for more information.
GTP Transceiver DC Characteristics
Tabl e 1 1 : eFUSE Read Endurance
Symbol Description Speed Grade Units
(Min)
-3 -3N -2 -1L
DNA_CYCLES Number of DNA_PORT READ operations or JTAG ISC_DNA read
command operations. Unaffected by SHIFT operations. 30,000,000 Read
Cycles
AES_CYCLES Number of JTAG FUSE_KEY or FUSE_CNTL read command operations.
Unaffected by SHIFT operations.
30,000,000 Read
Cycles
Tabl e 1 2 : Absolute Maximum Ratings for GTP Transceivers(1)
Symbol Description MIn Max Units
MGTAVCC Analog supply voltage for the GTP transmitter and receiver circuits relative to
GND
–0.5 1.32 V
MGTAVTTTX Analog supply voltage for the GTP transmitter termination circuit relative to GND –0.5 1.32 V
MGTAVTTRX Analog supply voltage for the GTP receiver termination circuit relative to GND –0.5 1.32 V
MGTAVCCPLL Analog supply voltage for the GTP transmitter and receiver PLL circuits relative to
GND
–0.5 1.32 V
MGTAVTTRCAL Analog supply voltage for the resistor calibration circuit of the GTP transceiver
bank (top or bottom)
–0.5 1.32 V
VIN Receiver (RXP/RXN) and Transmitter (TXP/TXN) absolute input voltage –0.5 1.32 V
VMGTREFCLK Reference clock absolute input voltage –0.5 1.32 V
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to
Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
Tabl e 1 3 : Recommended Operating Conditions for GTP Transceivers(1)(2)(3)
Symbol Description Min Typ Max Units
MGTAVCC Analog supply voltage for the GTP transmitter and receiver circuits relative to GND 1.14 1.20 1.26 V
MGTAVTTTX Analog supply voltage for the GTP transmitter termination circuit relative to GND 1.14 1.20 1.26 V
MGTAVTTRX Analog supply voltage for the GTP receiver termination circuit relative to GND 1.14 1.20 1.26 V
MGTAVCCPLL Analog supply voltage for the GTP transmitter and receiver PLL circuits relative to
GND
1.14 1.20 1.26 V
MGTAVTTRCAL Analog supply voltage for the resistor calibration circuit of the GTP transceiver
bank (top or bottom)
1.14 1.20 1.26 V
Notes:
1. Each voltage listed requires the filter circuit described in UG386: Spartan-6 FPGA GTP Transceivers User Guide.
2. Voltages are specified for the temperature range of Tj = –40°C to +125°C.
3. The voltage level of MGTAVCCPLL must not exceed the voltage level of MGTAVCC +10mV. The voltage level of MGTAVCC must not exceed the
voltage level of MGTAVCCPLL.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 13
Tabl e 1 4 : GTP Transceiver Current Supply (per Lane)
Symbol Description Typ(1) Max Units
IMGTAVCC GTP transceiver internal analog supply current 40.4
Note 2
mA
IMGTAVTTTX GTP transmitter termination supply current 27.4 mA
IMGTAVTTRX GTP receiver termination supply current 13.6 mA
IMGTAVCCPLL GTP transmitter and receiver PLL supply current 28.7 mA
RMGTRREF Precision reference resistor for internal calibration termination 50.0 ± 1%
tolerance
Ω
Notes:
1. Typical values are specified at nominal voltage, 25°C, with a 2.5 Gb/s line rate, with a shared PLL use mode.
2. Values for currents of other transceiver configurations and conditions can be obtained by using the Xilinx Power Estimator (XPE) or Xilinx Power
Analyzer (XPA) tools.
Tabl e 1 5 : GTP Transceiver Quiescent Supply Current (per Lane)(1)(2)(3)(4)
Symbol Description Typ(5) Max Units
IMGTAVCCQ Quiescent MGTAVCC supply current 1.7
Note 2
mA
IMGTAVTTTXQ Quiescent MGTAVTTTX supply current 0.1 mA
IMGTAVTTRXQ Quiescent MGTAVTTRX supply current 1.2 mA
IMGTAVCCPLLQ Quiescent MGTAVCCPLL supply current 1.0 mA
Notes:
1. Device powered and unconfigured.
2. Currents for conditions other than values specified in this table can be obtained by using the Xilinx Power Estimator (XPE) or Xilinx Power Analyzer
(XPA) tools.
3. GTP transceiver quiescent supply current for an entire device can be calculated by multiplying the values in this table by the number of available GTP
transceivers.
4. Does not include power-up MGTAVTTRCAL supply current during device configuration.
5. Typical values are specified at nominal voltage, 25°C.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 14
GTP Transceiver DC Input and Output Levels
Ta bl e 1 6 summarizes the DC output specifications of the GTP transceivers in Spartan-6 FPGAs. Figure 1 shows the single-
ended output voltage swing. Figure 2 shows the peak-to-peak differential output voltage.
Consult UG386: Spartan-6 FPGA GTP Transceivers User Guide for further details.
Ta bl e 1 7 summarizes the DC specifications of the clock input of the GTP transceiver. Consult UG386: Spartan-6 FPGA GTP
Transceivers User Guide for further details.
Tabl e 1 6 : GTP Transceiver DC Specifications
Symbol DC Parameter Conditions Min Typ Max Units
DVPPIN Differential peak-to-peak input
voltage
External AC coupled 140 2000 mV
VIN Absolute input voltage DC coupled
MGTAVTTRX = 1.2V
–400 MGTAVTTRX mV
VCMIN Common mode input voltage DC coupled
MGTAVTTRX = 1.2V
–3/4
MGTAVTTRX
–mV
DVPPOUT Differential peak-to-peak output
voltage(1) Transmitter output swing is set
to maximum setting
1000 – mV
VSEOUT Single-ended output voltage swing(1) 500 mV
VCMOUTDC Common mode output voltage Equation based MGTAVTTTX – VSEOUT/2 mV
RIN Differential input resistance 80 100 130 Ω
ROUT Differential output resistance 80 100 130 Ω
TOSKEW Transmitter output skew 15 ps
CEXT Recommended external AC coupling capacitor(2) 75 100 200 nF
Notes:
1. The output swing and preemphasis levels are programmable using the attributes discussed in UG386: Spartan-6 FPGA GTP Transceivers User
Guide and can result in values lower than reported in this table. DVPPOUT is the minimum guaranteed value at the maximum setting. Refer to UG386:
Spartan-6 FPGA GTP Transceivers User Guide for nominal values.
2. Other values can be used as appropriate to conform to specific protocols and standards.
X-Ref Target - Figure 1
Figure 1: Single-Ended Peak-to-Peak Voltage
X-Ref Target - Figure 2
Figure 2: Differential Peak-to-Peak Voltage
0
+V P
N
Single-Ended
Voltage
ds162_01_112009
0
+V
–V
P–N
Differential
Voltage
ds162_02_112009
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 15
GTP Transceiver Switching Characteristics
Consult UG386: Spartan-6 FPGA GTP Transceivers User Guide for further information.
Tabl e 1 7 : GTP Transceiver Clock DC Input Level Specification
Symbol DC Parameter Min Typ Max Units
VIDIFF Differential peak-to-peak input voltage 200 800 2000 mV
RIN Differential input resistance 80 100 120 Ω
CEXT Required external AC coupling capacitor 100 nF
Tabl e 1 8 : GTP Transceiver Performance
Symbol Description Speed Grade Units
-3 -3N -2 -1L
FGTPMAX Maximum GTP transceiver data rate 3.2 3.2 2.7 N/A Gb/s
FGTPRANGE1 GTP transceiver data rate range when
PLL_TXDIVSEL_OUT = 1
1.88 to 3.2 1.88 to 3.2 1.88 to 2.7 N/A Gb/s
FGTPRANGE2 GTP transceiver data rate range when
PLL_TXDIVSEL_OUT = 2
0.94 to 1.62 0.94 to 1.62 0.94 to 1.62 N/A Gb/s
FGTPRANGE3 GTP transceiver data rate range when
PLL_TXDIVSEL_OUT = 4
0.6 to 0.81 0.6 to 0.81 0.6 to 0.81 N/A Gb/s
FGPLLMAX Maximum PLL frequency 1.62 1.62 1.62 N/A GHz
FGPLLMIN Minimum PLL frequency 0.94 0.94 0.94 N/A GHz
Tabl e 1 9 : GTP Transceiver Dynamic Reconfiguration Port (DRP) Switching Characteristics
Symbol Description Speed Grade Units
-3 -3N -2 -1L
FGTPDRPCLK GTP transceiver DCLK (DRP clock) maximum frequency 125 125 100 N/A MHz
Tabl e 2 0 : GTP Transceiver Reference Clock Switching Characteristics
Symbol Description Conditions All LXT Speed Grades Units
Min Typ Max
FGCLK Reference clock frequency range 60 160 MHz
TRCLK Reference clock rise time 20% – 80% 200 ps
TFCLK Reference clock fall time 80% – 20% 200 ps
TDCREF Reference clock duty cycle Transceiver PLL only 45 50 55 %
TLOCK Clock recovery frequency acquisition
time
Initial PLL lock 1 ms
TPHASE Clock recovery phase acquisition time Lock to data after PLL has locked to
the reference clock
––200µs
X-Ref Target - Figure 3
Figure 3: Reference Clock Timing Parameters
ds162_05_042109
80%
20%
T
FCLK
T
RCLK
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 16
Tabl e 2 1 : GTP Transceiver User Clock Switching Characteristics(1)
Symbol Description Conditions Speed Grade Units
-3 -3N -2 -1L
FTXOUT TXOUTCLK maximum frequency 320 320 270 N/A MHz
FRXREC RXRECCLK maximum frequency 320 320 270 N/A MHz
TRX RXUSRCLK maximum frequency 320 320 270 N/A MHz
TRX2 RXUSRCLK2 maximum frequency 1 byte interface 156.25 156.25 125 N/A MHz
2 byte interface 160 160 125 N/A MHz
4 byte interface 80 80 67.5 N/A MHz
TTX TXUSRCLK maximum frequency 320 320 270 N/A MHz
TTX2 TXUSRCLK2 maximum frequency 1 byte interface 156.25 156.25 125 N/A MHz
2 byte interface 160 160 125 N/A MHz
4 byte interface 80 80 67.5 N/A MHz
Notes:
1. Clocking must be implemented as described in UG386: Spartan-6 FPGA GTP Transceivers User Guide.
Tabl e 2 2 : GTP Transceiver Transmitter Switching Characteristics
Symbol Description Condition Min Typ Max Units
TRTX TX Rise time 20%–80% 140 – ps
TFTX TX Fall time 80%–20% 120 – ps
TLLSKEW TX lane-to-lane skew(1) 400 ps
VTXOOBVDPP Electrical idle amplitude 20 mV
TTXOOBTRANSITION Electrical idle transition time 50 ns
TJ3.125 Total Jitter(2) 3.125 Gb/s 0.35 UI
DJ3.125 Deterministic Jitter(2) 0.15 UI
TJ2.5 Total Jitter(2) 2.5 Gb/s 0.33 UI
DJ2.5 Deterministic Jitter(2) 0.15 UI
TJ1.62 Total Jitter(2) 1.62 Gb/s 0.20 UI
DJ1.62 Deterministic Jitter(2) 0.10 UI
TJ1.25 Total Jitter(2) 1.25 Gb/s 0.20 UI
DJ1.25 Deterministic Jitter(2) 0.10 UI
TJ614 Total Jitter(2) 614 Mb/s 0.10 UI
DJ614 Deterministic Jitter(2) 0.05 UI
Notes:
1. Using same REFCLK input with TXENPMAPHASEALIGN enabled for up to four consecutive GTP transceiver sites.
2. Using PLL_DIVSEL_FB = 2, INTDATAWIDTH = 1. These values are NOT intended for protocol specific compliance determinations.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 17
Endpoint Block for PCI Express Designs Switching Characteristics
The Endpoint block for PCI Express is available in the Spartan-6 LXT devices. Consult the Spartan-6 FPGA Integrated
Endpoint Block for PCI Express for further information.
Tabl e 2 3 : GTP Transceiver Receiver Switching Characteristics
Symbol Description Min Typ Max Units
TRXELECIDLE Time for RXELECIDLE to respond to loss or restoration of data 75 ns
RXOOBVDPP OOB detect threshold peak-to-peak 60 150 mV
RXSST Receiver spread-spectrum tracking(1) Modulated @ 33 KHz –5000 0 ppm
RXRL Run length (CID) Internal AC capacitor bypassed 150 UI
RXPPMTOL Data/REFCLK PPM offset
tolerance
CDR 2nd-order loop disabled –200 200 ppm
CDR 2nd-order
loop enabled
PLL_RXDIVSEL_OUT = 1 –2000 2000 ppm
PLL_RXDIVSEL_OUT = 2 –2000 2000 ppm
PLL_RXDIVSEL_OUT = 4 –1000 1000 ppm
SJ Jitter Tolerance(2)
JT_SJ3.125 Sinusoidal Jitter(3) 3.125 Gb/s 0.4 UI
JT_SJ2.5 Sinusoidal Jitter(3) 2.5 Gb/s 0.4 UI
JT_SJ1.62 Sinusoidal Jitter(3) 1.62 Gb/s 0.5 UI
JT_SJ1.25 Sinusoidal Jitter(3) 1.25 Gb/s 0.5 UI
JT_SJ614 Sinusoidal Jitter(3) 614 Mb/s 0.5 UI
SJ Jitter Tolerance with Stressed Eye(2)(5)
JT_TJSE3.125 Total Jitter with stressed eye(4) 3.125 Gb/s 0.65 UI
JT_SJSE3.125 Sinusoidal Jitter with stressed eye 3.125 Gb/s 0.1 UI
JT_TJSE2.7 Total Jitter with stressed eye(4) 2.7 Gb/s 0.65 UI
JT_SJSE2.7 Sinusoidal Jitter with stressed eye 2.7 Gb/s 0.1 UI
Notes:
1. Using PLL_RXDIVSEL_OUT = 1, 2, and 4.
2. All jitter values are based on a Bit Error Ratio of 1e–12.
3. Using 80 MHz sinusoidal jitter only in the absence of deterministic and random jitter.
4. Composed of 0.37 UI DJ in the form of ISI and 0.18 UI RJ.
5. Measured using PRBS7 data pattern.
Tabl e 2 4 : Maximum Performance for PCI Express Designs
Symbol Description Speed Grade Units
-3 -3N -2 -1L
FPCIEUSER User clock maximum frequency 62.5 62.5 62.5 N/A MHz
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 18
Performance Characteristics
This section provides the performance characteristics of some common functions and designs implemented in
Spartan-6 devices. The numbers reported here are worst-case values; they have all been fully characterized. These values
are subject to the same guidelines as the Switching Characteristics, page 19.
Tabl e 2 5 : Interface Performances
Description I/O Resource Clock
Buffer
Data
Width
Speed Grade Units
-3 -3N -2 -1L
Networking Applications(1)
SDR LVDS transmitter or receiver IOB SDR register BUFG 400 400 375 250 Mb/s
DDR LVDS transmitter or receiver ODDR2/IDDR2 register 2 BUFGs 800 800 750 500 Mb/s
SDR LVDS transmitter OSERDES2 BUFPLL
2 500 500 500 250 Mb/s
3 750 750 750 375 Mb/s
4-8 1080 1050 950 500 Mb/s
DDR LVDS transmitter OSERDES2 2 BUFIO2s
2 500 500 500 250 Mb/s
3 750 750 750 375 Mb/s
4-8 1080 1050 950 500 Mb/s
SDR LVDS receiver ISERDES2 in RETIMED mode BUFPLL
2 500 500 500 Mb/s
3 750 750 750 Mb/s
4-8 1080 1050 950 Mb/s
DDR LVDS receiver ISERDES2 in RETIMED mode 2 BUFIO2s
2 500 500 500 Mb/s
3 750 750 750 Mb/s
4-8 1080 1050 950 Mb/s
Memory Interfaces (Implemented using the Spartan-6 FPGA Memory Controller Block)(2)
Standard Performance (Standard VCCINT)
DDR 400 Note 4 400 350 Mb/s
DDR2 667 Note 4 625 400 Mb/s
DDR3 800 Note 4 667 — Mb/s
LPDDR (Mobile_DDR) 400 Note 4 400 350 Mb/s
Extended Performance (Requires Extended Performance VCCINT)(3)
DDR2 800 Note 4 667 — Mb/s
Notes:
1. Refer to XAPP1064, Source-Synchronous Serialization and Deserialization (up to 1050 Mb/s) and UG381, Spartan-6 FPGA SelectIO
Resources User Guide.
2. Refer to UG388, Spartan-6 FPGA Memory Controller User Guide.
3. Extended Memory Controller block performance for DDR2 can be achieved using the extended performance VCCINT range from Tab l e 2 .
4. The LX4 device, all devices in the TQG144 and CPG196 packages, and the -3N speed grade do not support a Memory Controller Block.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 19
Switching Characteristics
All values represented in this data sheet are based on these
speed specifications: v1.20 for -3, -3N, and -2; and v1.08 for
-1L. Switching characteristics are specified on a per-speed-
grade basis and can be designated as Advance,
Preliminary, or Production. Each designation is defined as
follows:
Advance
These specifications are based on simulations only and are
typically available soon after device design specifications
are frozen. Although speed grades with this designation are
considered relatively stable and conservative, some under-
reporting might still occur.
Preliminary
These specifications are based on complete ES
(engineering sample) silicon characterization. Devices and
speed grades with this designation are intended to give a
better indication of the expected performance of production
silicon. The probability of under-reporting delays is greatly
reduced as compared to Advance data.
Production
These specifications are released once enough production
silicon of a particular device family member has been
characterized to provide full correlation between
specifications and devices over numerous production lots.
There is no under-reporting of delays, and customers
receive formal notification of any subsequent changes.
Typically, the slowest speed grades transition to Production
before faster speed grades.
All specifications are always representative of worst-case
supply voltage and junction temperature conditions.
Since individual family members are produced at different
times, the migration from one category to another depends
completely on the status of the fabrication process for each
device.
The -1L speed grade refers to the lower-power Spartan-6
devices. The -3N speed grade refers to the Spartan-6
devices that do not support MCB functionality.
Ta bl e 2 6 correlates the current status of each Spartan-6
device on a per speed grade basis.
Testing of Switching Characteristics
All devices are 100% functionally tested. Internal timing parameters are derived from measuring internal test patterns. Listed
below are representative values.
For more specific, more precise, and worst-case guaranteed data, use the values reported by the static timing analyzer and
back-annotated to the simulation net list. Unless otherwise noted, values apply to all Spartan-6 devices.
Table 26: Spartan-6 Device Speed Grade Designations
Device Speed Grade Designations
Advance Preliminary Production
XC6SLX4(1) -3, -2, -1L
XC6SLX9 -3, -3N, -2, -1L
XC6SLX16 -3, -3N, -2, -1L
XC6SLX25 -3, -3N, -2, -1L
XC6SLX25T -3, -3N, -2
XC6SLX45 -3, -3N, -2, -1L
XC6SLX45T -3, -3N, -2
XC6SLX75 -3, -3N, -2, -1L
XC6SLX75T -3, -3N, -2
XC6SLX100 -3, -3N, -2, -1L
XC6SLX100T -3, -3N, -2
XC6SLX150 -3, -3N, -2, -1L
XC6SLX150T -3, -3N, -2
XA6SLX4 -3, -2
XA6SLX9 -3, -2
XA6SLX16 -3, -2
XA6SLX25 -3, -2
XA6SLX25T -3, -2
XA6SLX45 -3, -2
XA6SLX45T -3, -2
XA6SLX75 -3, -2
XA6SLX75T -3, -2
XA6SLX100 -2
XQ6SLX75 -2, -1L
XQ6SLX75T -3, -2
XQ6SLX150 -2, -1L
XQ6SLX150T -3, -2
Notes:
1. The XC6SLX4 is not available in the -3N speed grade.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 20
Production Silicon and ISE Software Status
In some cases, a particular family member (and speed grade) is released to production before a speed specification is
released with the correct label (Advance, Preliminary, Production). Any labeling discrepancies are corrected in subsequent
speed specification releases. Ta b l e 2 7 lists the production released Spartan-6 family member, speed grade, and the
minimum corresponding supported speed specification version and ISE® software revisions. The ISE software and speed
specifications listed are the minimum releases required for production. All subsequent releases of software and speed
specifications are valid.
Tabl e 2 7 : Spartan-6 Device Production Software and Speed Specification Release(1)
Device Speed Grade Designations(2)
-3(3) -3N -2(4) -1L
XC6SLX4 ISE 12.4 v1.15 N/A ISE 12.3 v1.12(5) ISE 13.2 v1.07
XC6SLX9 ISE 12.4 v1.15 ISE 13.1 Update v1.18(7) ISE 12.3 v1.12(5) ISE 13.2 v1.07
XC6SLX16 ISE 12.1 v1.08 ISE 13.1 Update v1.18(7) ISE 11.5 v1.06 ISE 13.2 v1.07
XC6SLX25 ISE 12.2 v1.11(6) ISE 13.1 Update v1.18(7) ISE 12.2 v1.11(6) ISE 13.2 v1.07
XC6SLX25T ISE 12.2 v1.11(6) ISE 13.1 Update v1.18(7) ISE 12.2 v1.11(6) N/A
XC6SLX45 ISE 12.1 v1.08 ISE 13.1 Update v1.18(7) ISE 11.5 v1.07 ISE 13.1 v1.06
XC6SLX45T ISE 12.1 v1.08 ISE 13.1 Update v1.18(7) ISE 12.1 v1.08 N/A
XC6SLX75 ISE 12.2 v1.11(6) ISE 13.1 Update v1.18(7) ISE 12.2 v1.11(6) ISE 13.2 v1.07
XC6SLX75T ISE 12.2 v1.11(6) ISE 13.1 Update v1.18(7) ISE 12.2 v1.11(6) N/A
XC6SLX100 ISE 12.2 v1.11(6) ISE 13.1 Update v1.18(7) ISE 12.2 v1.11(6) ISE 13.1 v1.06
XC6SLX100T ISE 12.2 v1.11(6) ISE 13.1 Update v1.18(7) ISE 12.2 v1.11(6) N/A
XC6SLX150 ISE 12.2 v1.11(6) ISE 13.1 Update v1.18(7) ISE 12.2 v1.11(6) ISE 13.1 v1.06
XC6SLX150T ISE 12.2 v1.11(6) ISE 13.1 Update v1.18(7) ISE 12.2 v1.11(6) N/A
XA6SLX4 ISE 13.2 v1.19 N/A ISE 13.2 v1.19 N/A
XA6SLX9 ISE 13.2 v1.19 N/A ISE 13.2 v1.19 N/A
XA6SLX16 ISE 13.2 v1.19 N/A ISE 13.2 v1.19 N/A
XA6SLX25 ISE 13.2 v1.19 N/A ISE 13.2 v1.19 N/A
XA6SLX25T ISE 13.2 v1.19 N/A ISE 13.2 v1.19 N/A
XA6SLX45 ISE 13.2 v1.19 N/A ISE 13.2 v1.19 N/A
XA6SLX45T ISE 13.2 v1.19 N/A ISE 13.2 v1.19 N/A
XA6SLX75 ISE 13.2 v1.19 N/A ISE 13.2 v1.19 N/A
XA6SLX75T ISE 13.2 v1.19 N/A ISE 13.2 v1.19 N/A
XA6SLX100 N/A N/A ISE 13.3 v1.20 N/A
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 21
IOB Pad Input/Output/3-State Switching Characteristics
Ta bl e 2 8 (for commercial (XC) Spartan-6 devices) and Ta bl e 2 9 (for Automotive XA Spartan-6 and Defense-grade
Spartan-6Q devices) summarizes the values of standard-specific data input delays, output delays terminating at pads
(based on standard), and 3-state delays.
•T
IOPI is described as the delay from IOB pad through the input buffer to the I-pin of an IOB pad. The delay varies
depending on the capability of the SelectIO input buffer.
•T
IOOP is described as the delay from the O pin to the IOB pad through the output buffer of an IOB pad. The delay varies
depending on the capability of the SelectIO output buffer.
•T
IOTP is described as the delay from the T pin to the IOB pad through the output buffer of an IOB pad, when 3-state is
disabled. The delay varies depending on the SelectIO capability of the output buffer.
See the TRACE report for further information on delays when using an I/O standard with UNTUNED termination on inputs
or outputs.
XQ6SLX75 N/A N/A ISE 13.2 v1.19 ISE 13.2 v1.07
XQ6SLX75T ISE 13.2 v1.19 N/A ISE 13.2 v1.19 N/A
XQ6SLX150 N/A N/A ISE 13.2 v1.19 ISE 13.2 v1.07
XQ6SLX150T ISE 13.2 v1.19 N/A ISE 13.2 v1.19 N/A
Notes:
1. ISE 13.3 software with v1.20 for -3, -3N, and -2; and v1.08 for -1L speed specification reflects the changes outlined in
XCN11028: Spartan-6 FPGA Speed File Changes.
2. As marked with an N/A, LXT devices and all XA devices are not available with a -1L speed grade; LX4 devices and all XA and XQ devices
are not available with a -3N speed grade.
3. Improved -3 specifications reflected in this data sheet require ISE 12.4 software with v1.15 speed specification.
4. Improved -2 specifications reflected in this data sheet require ISE 12.4 software and the 12.4 Speed Files Patch which contains the v1.17
speed specification available on the Xilinx Download Center.
5. ISE 12.3 software with v1.12 speed specification is available using ISE 12.3 software and the 12.3 Speed Files Patch available on the
Xilinx Download Center.
6. ISE 12.2 software with v1.11 speed specification is available using ISE 12.2 software and the 12.2 Speed Files Patch available on the
Xilinx Download Center.
7. ISE 13.1 software with v1.18 speed specification is available using ISE 13.1 software and the 13.1 Update available on the
Xilinx Download Center. See XCN11012: Speed File Change for -3N Devices.
Tabl e 2 8 : IOB Switching Characteristics for the Commercial (XC) Spartan-6 Devices
I/O Standard
TIOPI TIOOP TIOTP
UnitsSpeed Grade Speed Grade Speed Grade
-3 -3N -2 -1L(1) -3 -3N -2 -1L(1) -3 -3N -2 -1L(1)
LVDS_33 1.17 1.29 1.42 1.68 1.55 1.69 1.89 2.42 3000 3000 3000 3000 ns
LVDS_25 1.01 1.13 1.26 1.57 1.65 1.79 1.99 2.47 3000 3000 3000 3000 ns
BLVDS_25 1.02 1.14 1.27 1.57 1.72 1.86 2.06 2.68 1.72 1.86 2.06 2.68 ns
MINI_LVDS_33 1.17 1.29 1.42 1.68 1.57 1.71 1.91 2.41 3000 3000 3000 3000 ns
MINI_LVDS_25 1.01 1.13 1.26 1.57 1.65 1.79 1.99 2.47 3000 3000 3000 3000 ns
LVPECL_33 1.18 1.30 1.43 1.68 N/A N/A N/A N/A N/A N/A N/A N/A ns
LVPECL_25 1.02 1.14 1.27 1.57 N/A N/A N/A N/A N/A N/A N/A N/A ns
RSDS_33 (point to point) 1.17 1.29 1.42 1.68 1.57 1.71 1.91 2.42 3000 3000 3000 3000 ns
RSDS_25 (point to point) 1.01 1.13 1.26 1.56 1.65 1.79 1.99 2.47 3000 3000 3000 3000 ns
TMDS_33 1.21 1.33 1.46 1.71 1.54 1.68 1.88 2.50 3000 3000 3000 3000 ns
Tabl e 2 7 : Spartan-6 Device Production Software and Speed Specification Release(1) (Cont’d)
Device Speed Grade Designations(2)
-3(3) -3N -2(4) -1L
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 22
PPDS_33 1.17 1.29 1.42 1.68 1.57 1.71 1.91 2.43 3000 3000 3000 3000 ns
PPDS_25 1.01 1.13 1.26 1.56 1.68 1.82 2.02 2.47 3000 3000 3000 3000 ns
PCI33_3 1.07 1.19 1.32 1.57(2) 3.51 3.65 3.85 4.38(2) 3.51 3.65 3.85 4.38(1) ns
PCI66_3 1.07 1.19 1.32 1.57(2) 3.53 3.67 3.87 4.39(2) 3.53 3.67 3.87 4.39(1) ns
DISPLAY_PORT 1.02 1.14 1.27 1.56 3.15 3.29 3.49 4.08 3.15 3.29 3.49 4.08 ns
I2C 1.33 1.45 1.58 1.82 11.56 11.70 11.90 12.52 11.56 11.70 11.90 12.52 ns
SMBUS 1.33 1.45 1.58 1.82 11.56 11.70 11.90 12.52 11.56 11.70 11.90 12.52 ns
SDIO 1.36 1.48 1.61 1.84 2.64 2.78 2.98 3.60 2.64 2.78 2.98 3.60 ns
MOBILE_DDR 0.94 1.06 1.19 1.43 2.35 2.49 2.69 3.31 2.35 2.49 2.69 3.31 ns
HSTL_I 0.90 1.02 1.15 1.39 1.66 1.80 2.00 2.62 1.66 1.80 2.00 2.62 ns
HSTL_II 0.91 1.03 1.16 1.40 1.72 1.86 2.06 2.68 1.72 1.86 2.06 2.68 ns
HSTL_III 0.95 1.07 1.20 1.44 1.67 1.81 2.01 2.61 1.67 1.81 2.01 2.61 ns
HSTL_I _18 0.94 1.06 1.19 1.43 1.77 1.91 2.11 2.73 1.77 1.91 2.11 2.73 ns
HSTL_II _18 0.94 1.06 1.19 1.43 1.85 1.99 2.19 2.81 1.85 1.99 2.19 2.81 ns
HSTL_III _18 0.99 1.11 1.24 1.47 1.79 1.93 2.13 2.72 1.79 1.93 2.13 2.72 ns
SSTL3_I 1.58 1.70 1.83 2.16 1.83 1.97 2.17 2.72 1.83 1.97 2.17 2.72 ns
SSTL3_II 1.58 1.70 1.83 2.16 2.01 2.15 2.35 2.94 2.01 2.15 2.35 2.94 ns
SSTL2_I 1.30 1.42 1.55 1.87 1.77 1.91 2.11 2.69 1.77 1.91 2.11 2.69 ns
SSTL2_II 1.30 1.42 1.55 1.88 1.86 2.00 2.20 2.82 1.86 2.00 2.20 2.82 ns
SSTL18_I 0.92 1.04 1.17 1.41 1.63 1.77 1.97 2.59 1.63 1.77 1.97 2.59 ns
SSTL18_II 0.92 1.04 1.17 1.41 1.66 1.80 2.00 2.62 1.66 1.80 2.00 2.62 ns
SSTL15_II 0.92 1.04 1.17 1.41 1.67 1.81 2.01 2.63 1.67 1.81 2.01 2.63 ns
DIFF_HSTL_I 0.94 1.06 1.19 1.46 1.77 1.91 2.11 2.62 1.77 1.91 2.11 2.62 ns
DIFF_HSTL_II 0.93 1.05 1.18 1.45 1.72 1.86 2.06 2.54 1.72 1.86 2.06 2.54 ns
DIFF_HSTL_III 0.93 1.05 1.18 1.46 1.69 1.83 2.03 2.53 1.69 1.83 2.03 2.53 ns
DIFF_HSTL_I_18 0.97 1.09 1.22 1.50 1.79 1.93 2.13 2.63 1.79 1.93 2.13 2.63 ns
DIFF_HSTL_II_18 0.97 1.09 1.22 1.49 1.69 1.83 2.03 2.51 1.69 1.83 2.03 2.51 ns
DIFF_HSTL_III_18 0.97 1.09 1.22 1.50 1.69 1.83 2.03 2.53 1.69 1.83 2.03 2.53 ns
DIFF_SSTL3_I 1.18 1.30 1.43 1.68 1.81 1.95 2.15 2.64 1.81 1.95 2.15 2.64 ns
DIFF_SSTL3_II 1.19 1.31 1.44 1.68 1.80 1.94 2.14 2.63 1.80 1.94 2.14 2.63 ns
DIFF_SSTL2_I 1.02 1.14 1.27 1.57 1.80 1.94 2.14 2.62 1.80 1.94 2.14 2.62 ns
DIFF_SSTL2_II 1.02 1.14 1.27 1.57 1.76 1.90 2.10 2.57 1.76 1.90 2.10 2.57 ns
DIFF_SSTL18_I 0.97 1.09 1.22 1.51 1.72 1.86 2.06 2.56 1.72 1.86 2.06 2.56 ns
DIFF_SSTL18_II 0.98 1.10 1.23 1.50 1.68 1.82 2.02 2.52 1.68 1.82 2.02 2.52 ns
DIFF_SSTL15_II 0.94 1.06 1.19 1.46 1.67 1.81 2.01 2.50 1.67 1.81 2.01 2.50 ns
DIFF_MOBILE_DDR 0.97 1.09 1.22 1.51 1.75 1.89 2.09 2.57 1.75 1.89 2.09 2.57 ns
Tabl e 2 8 : IOB Switching Characteristics for the Commercial (XC) Spartan-6 Devices (Cont’d)
I/O Standard
TIOPI TIOOP TIOTP
UnitsSpeed Grade Speed Grade Speed Grade
-3 -3N -2 -1L(1) -3 -3N -2 -1L(1) -3 -3N -2 -1L(1)
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 23
LVTTL, QUIETIO, 2 mA 1.35 1.47 1.60 1.82 5.39 5.53 5.73 6.37 5.39 5.53 5.73 6.37 ns
LVTTL, QUIETIO, 4 mA 1.35 1.47 1.60 1.82 4.29 4.43 4.63 5.22 4.29 4.43 4.63 5.22 ns
LVTTL, QUIETIO, 6 mA 1.35 1.47 1.60 1.82 3.75 3.89 4.09 4.69 3.75 3.89 4.09 4.69 ns
LVTTL, QUIETIO, 8 mA 1.35 1.47 1.60 1.82 3.23 3.37 3.57 4.20 3.23 3.37 3.57 4.20 ns
LVTTL, QUIETIO, 12 mA 1.35 1.47 1.60 1.82 3.28 3.42 3.62 4.22 3.28 3.42 3.62 4.22 ns
LVTTL, QUIETIO, 16 mA 1.35 1.47 1.60 1.82 2.94 3.08 3.28 3.92 2.94 3.08 3.28 3.92 ns
LVTTL, QUIETIO, 24 mA 1.35 1.47 1.60 1.82 2.69 2.83 3.03 3.67 2.69 2.83 3.03 3.67 ns
LVTTL, Slow, 2 mA 1.35 1.47 1.60 1.82 4.36 4.50 4.70 5.30 4.36 4.50 4.70 5.30 ns
LVTTL, Slow, 4 mA 1.35 1.47 1.60 1.82 3.17 3.31 3.51 4.16 3.17 3.31 3.51 4.16 ns
LVTTL, Slow, 6 mA 1.35 1.47 1.60 1.82 2.76 2.90 3.10 3.75 2.76 2.90 3.10 3.75 ns
LVTTL, Slow, 8 mA 1.35 1.47 1.60 1.82 2.59 2.73 2.93 3.55 2.59 2.73 2.93 3.55 ns
LVTTL, Slow, 12 mA 1.35 1.47 1.60 1.82 2.58 2.72 2.92 3.54 2.58 2.72 2.92 3.54 ns
LVTTL, Slow, 16 mA 1.35 1.47 1.60 1.82 2.39 2.53 2.73 3.40 2.39 2.53 2.73 3.40 ns
LVTTL, Slow, 24 mA 1.35 1.47 1.60 1.82 2.28 2.42 2.62 3.24 2.28 2.42 2.62 3.24 ns
LVTTL, Fast, 2 mA 1.35 1.47 1.60 1.82 3.78 3.92 4.12 4.74 3.78 3.92 4.12 4.74 ns
LVTTL, Fast, 4 mA 1.35 1.47 1.60 1.82 2.49 2.63 2.83 3.45 2.49 2.63 2.83 3.45 ns
LVTTL, Fast, 6 mA 1.35 1.47 1.60 1.82 2.44 2.58 2.78 3.40 2.44 2.58 2.78 3.40 ns
LVTTL, Fast, 8 mA 1.35 1.47 1.60 1.82 2.32 2.46 2.66 3.28 2.32 2.46 2.66 3.28 ns
LVTTL, Fast, 12 mA 1.35 1.47 1.60 1.82 1.83 1.97 2.17 2.79 1.83 1.97 2.17 2.79 ns
LVTTL, Fast, 16 mA 1.35 1.47 1.60 1.82 1.83 1.97 2.17 2.79 1.83 1.97 2.17 2.79 ns
LVTTL, Fast, 24 mA 1.35 1.47 1.60 1.82 1.83 1.97 2.17 2.79 1.83 1.97 2.17 2.79 ns
LVCMOS33, QUIETIO, 2 mA 1.34 1.46 1.59 1.82 5.40 5.54 5.74 6.37 5.40 5.54 5.74 6.37 ns
LVCMOS33, QUIETIO, 4 mA 1.34 1.46 1.59 1.82 4.03 4.17 4.37 5.01 4.03 4.17 4.37 5.01 ns
LVCMOS33, QUIETIO, 6 mA 1.34 1.46 1.59 1.82 3.51 3.65 3.85 4.47 3.51 3.65 3.85 4.47 ns
LVCMOS33, QUIETIO, 8 mA 1.34 1.46 1.59 1.82 3.37 3.51 3.71 4.33 3.37 3.51 3.71 4.33 ns
LVCMOS33, QUIETIO, 12 mA 1.34 1.46 1.59 1.82 2.94 3.08 3.28 3.93 2.94 3.08 3.28 3.93 ns
LVCMOS33, QUIETIO, 16 mA 1.34 1.46 1.59 1.82 2.77 2.91 3.11 3.78 2.77 2.91 3.11 3.78 ns
LVCMOS33, QUIETIO, 24 mA 1.34 1.46 1.59 1.82 2.59 2.73 2.93 3.58 2.59 2.73 2.93 3.58 ns
LVCMOS33, Slow, 2 mA 1.34 1.46 1.59 1.82 4.37 4.51 4.71 5.28 4.37 4.51 4.71 5.28 ns
LVCMOS33, Slow, 4 mA 1.34 1.46 1.59 1.82 2.98 3.12 3.32 3.94 2.98 3.12 3.32 3.94 ns
LVCMOS33, Slow, 6 mA 1.34 1.46 1.59 1.82 2.58 2.72 2.92 3.61 2.58 2.72 2.92 3.61 ns
LVCMOS33, Slow, 8 mA 1.34 1.46 1.59 1.82 2.65 2.79 2.99 3.61 2.65 2.79 2.99 3.61 ns
LVCMOS33, Slow, 12 mA 1.34 1.46 1.59 1.82 2.39 2.53 2.73 3.31 2.39 2.53 2.73 3.31 ns
LVCMOS33, Slow, 16 mA 1.34 1.46 1.59 1.82 2.31 2.45 2.65 3.27 2.31 2.45 2.65 3.27 ns
LVCMOS33, Slow, 24 mA 1.34 1.46 1.59 1.82 2.28 2.42 2.62 3.24 2.28 2.42 2.62 3.24 ns
LVCMOS33, Fast, 2 mA 1.34 1.46 1.59 1.82 3.76 3.90 4.10 4.70 3.76 3.90 4.10 4.70 ns
LVCMOS33, Fast, 4 mA 1.34 1.46 1.59 1.82 2.48 2.62 2.82 3.44 2.48 2.62 2.82 3.44 ns
LVCMOS33, Fast, 6 mA 1.34 1.46 1.59 1.82 2.32 2.46 2.66 3.28 2.32 2.46 2.66 3.28 ns
Tabl e 2 8 : IOB Switching Characteristics for the Commercial (XC) Spartan-6 Devices (Cont’d)
I/O Standard
TIOPI TIOOP TIOTP
UnitsSpeed Grade Speed Grade Speed Grade
-3 -3N -2 -1L(1) -3 -3N -2 -1L(1) -3 -3N -2 -1L(1)
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 24
LVCMOS33, Fast, 8 mA 1.34 1.46 1.59 1.82 2.07 2.21 2.41 3.03 2.07 2.21 2.41 3.03 ns
LVCMOS33, Fast, 12 mA 1.34 1.46 1.59 1.82 1.65 1.79 1.99 2.62 1.65 1.79 1.99 2.62 ns
LVCMOS33, Fast, 16 mA 1.34 1.46 1.59 1.82 1.65 1.79 1.99 2.62 1.65 1.79 1.99 2.62 ns
LVCMOS33, Fast, 24 mA 1.34 1.46 1.59 1.82 1.65 1.79 1.99 2.62 1.65 1.79 1.99 2.62 ns
LVCMOS25, QUIETIO, 2 mA 0.82 0.94 1.07 1.31 4.81 4.95 5.15 5.79 4.81 4.95 5.15 5.79 ns
LVCMOS25, QUIETIO, 4 mA 0.82 0.94 1.07 1.31 3.70 3.84 4.04 4.66 3.70 3.84 4.04 4.66 ns
LVCMOS25, QUIETIO, 6 mA 0.82 0.94 1.07 1.31 3.46 3.60 3.80 4.38 3.46 3.60 3.80 4.38 ns
LVCMOS25, QUIETIO, 8 mA 0.82 0.94 1.07 1.31 3.20 3.34 3.54 4.12 3.20 3.34 3.54 4.12 ns
LVCMOS25, QUIETIO, 12 mA 0.82 0.94 1.07 1.31 2.83 2.97 3.17 3.75 2.83 2.97 3.17 3.75 ns
LVCMOS25, QUIETIO, 16 mA 0.82 0.94 1.07 1.31 2.64 2.78 2.98 3.64 2.64 2.78 2.98 3.64 ns
LVCMOS25, QUIETIO, 24 mA 0.82 0.94 1.07 1.31 2.45 2.59 2.79 3.42 2.45 2.59 2.79 3.42 ns
LVCMOS25, Slow, 2 mA 0.82 0.94 1.07 1.31 3.78 3.92 4.12 4.76 3.78 3.92 4.12 4.76 ns
LVCMOS25, Slow, 4 mA 0.82 0.94 1.07 1.31 2.79 2.93 3.13 3.73 2.79 2.93 3.13 3.73 ns
LVCMOS25, Slow, 6 mA 0.82 0.94 1.07 1.31 2.73 2.87 3.07 3.66 2.73 2.87 3.07 3.66 ns
LVCMOS25, Slow, 8 mA 0.82 0.94 1.07 1.31 2.48 2.62 2.82 3.42 2.48 2.62 2.82 3.42 ns
LVCMOS25, Slow, 12 mA 0.82 0.94 1.07 1.31 2.01 2.15 2.35 2.95 2.01 2.15 2.35 2.95 ns
LVCMOS25, Slow, 16 mA 0.82 0.94 1.07 1.31 2.01 2.15 2.35 2.95 2.01 2.15 2.35 2.95 ns
LVCMOS25, Slow, 24 mA 0.82 0.94 1.07 1.31 2.01 2.15 2.35 2.94 2.01 2.15 2.35 2.94 ns
LVCMOS25, Fast, 2 mA 0.82 0.94 1.07 1.31 3.35 3.49 3.69 4.31 3.35 3.49 3.69 4.31 ns
LVCMOS25, Fast, 4 mA 0.82 0.94 1.07 1.31 2.25 2.39 2.59 3.22 2.25 2.39 2.59 3.22 ns
LVCMOS25, Fast, 6 mA 0.82 0.94 1.07 1.31 2.09 2.23 2.43 3.05 2.09 2.23 2.43 3.05 ns
LVCMOS25, Fast, 8 mA 0.82 0.94 1.07 1.31 2.02 2.16 2.36 2.98 2.02 2.16 2.36 2.98 ns
LVCMOS25, Fast, 12 mA 0.82 0.94 1.07 1.31 1.56 1.70 1.90 2.52 1.56 1.70 1.90 2.52 ns
LVCMOS25, Fast, 16 mA 0.82 0.94 1.07 1.31 1.56 1.70 1.90 2.52 1.56 1.70 1.90 2.52 ns
LVCMOS25, Fast, 24 mA 0.82 0.94 1.07 1.31 1.56 1.70 1.90 2.52 1.56 1.70 1.90 2.52 ns
LVCMOS18, QUIETIO, 2 mA 1.18 1.30 1.43 2.04 5.92 6.06 6.26 6.80 5.92 6.06 6.26 6.80 ns
LVCMOS18, QUIETIO, 4 mA 1.18 1.30 1.43 2.04 4.74 4.88 5.08 5.63 4.74 4.88 5.08 5.63 ns
LVCMOS18, QUIETIO, 6 mA 1.18 1.30 1.43 2.04 4.05 4.19 4.39 4.96 4.05 4.19 4.39 4.96 ns
LVCMOS18, QUIETIO, 8 mA 1.18 1.30 1.43 2.04 3.71 3.85 4.05 4.63 3.71 3.85 4.05 4.63 ns
LVCMOS18, QUIETIO, 12 mA 1.18 1.30 1.43 2.04 3.35 3.49 3.69 4.27 3.35 3.49 3.69 4.27 ns
LVCMOS18, QUIETIO, 16 mA 1.18 1.30 1.43 2.04 3.20 3.34 3.54 4.14 3.20 3.34 3.54 4.14 ns
LVCMOS18, QUIETIO, 24 mA 1.18 1.30 1.43 2.04 2.96 3.10 3.30 3.98 2.96 3.10 3.30 3.98 ns
LVCMOS18, Slow, 2 mA 1.18 1.30 1.43 2.04 4.62 4.76 4.96 5.54 4.62 4.76 4.96 5.54 ns
LVCMOS18, Slow, 4 mA 1.18 1.30 1.43 2.04 3.69 3.83 4.03 4.60 3.69 3.83 4.03 4.60 ns
LVCMOS18, Slow, 6 mA 1.18 1.30 1.43 2.04 3.00 3.14 3.34 3.94 3.00 3.14 3.34 3.94 ns
LVCMOS18, Slow, 8 mA 1.18 1.30 1.43 2.04 2.19 2.33 2.53 3.17 2.19 2.33 2.53 3.17 ns
LVCMOS18, Slow, 12 mA 1.18 1.30 1.43 2.04 1.99 2.13 2.33 2.95 1.99 2.13 2.33 2.95 ns
LVCMOS18, Slow, 16 mA 1.18 1.30 1.43 2.04 1.99 2.13 2.33 2.95 1.99 2.13 2.33 2.95 ns
Tabl e 2 8 : IOB Switching Characteristics for the Commercial (XC) Spartan-6 Devices (Cont’d)
I/O Standard
TIOPI TIOOP TIOTP
UnitsSpeed Grade Speed Grade Speed Grade
-3 -3N -2 -1L(1) -3 -3N -2 -1L(1) -3 -3N -2 -1L(1)
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 25
LVCMOS18, Slow, 24 mA 1.18 1.30 1.43 2.04 1.99 2.13 2.33 2.95 1.99 2.13 2.33 2.95 ns
LVCMOS18, Fast, 2 mA 1.18 1.30 1.43 2.04 3.59 3.73 3.93 4.53 3.59 3.73 3.93 4.53 ns
LVCMOS18, Fast, 4 mA 1.18 1.30 1.43 2.04 2.39 2.53 2.73 3.35 2.39 2.53 2.73 3.35 ns
LVCMOS18, Fast, 6 mA 1.18 1.30 1.43 2.04 1.88 2.02 2.22 2.84 1.88 2.02 2.22 2.84 ns
LVCMOS18, Fast, 8 mA 1.18 1.30 1.43 2.04 1.81 1.95 2.15 2.77 1.81 1.95 2.15 2.77 ns
LVCMOS18, Fast, 12 mA 1.18 1.30 1.43 2.04 1.71 1.85 2.05 2.67 1.71 1.85 2.05 2.67 ns
LVCMOS18, Fast, 16 mA 1.18 1.30 1.43 2.04 1.71 1.85 2.05 2.67 1.71 1.85 2.05 2.67 ns
LVCMOS18, Fast, 24 mA 1.18 1.30 1.43 2.04 1.71 1.85 2.05 2.67 1.71 1.85 2.05 2.67 ns
LVCMOS18_JEDEC, QUIETIO, 2 mA 0.94 1.06 1.19 1.41 5.91 6.05 6.25 6.79 5.91 6.05 6.25 6.79 ns
LVCMOS18_JEDEC, QUIETIO, 4 mA 0.94 1.06 1.19 1.41 4.75 4.89 5.09 5.64 4.75 4.89 5.09 5.64 ns
LVCMOS18_JEDEC, QUIETIO, 6 mA 0.94 1.06 1.19 1.41 4.04 4.18 4.38 4.96 4.04 4.18 4.38 4.96 ns
LVCMOS18_JEDEC, QUIETIO, 8 mA 0.94 1.06 1.19 1.41 3.71 3.85 4.05 4.62 3.71 3.85 4.05 4.62 ns
LVCMOS18_JEDEC, QUIETIO, 12 mA 0.94 1.06 1.19 1.41 3.35 3.49 3.69 4.28 3.35 3.49 3.69 4.28 ns
LVCMOS18_JEDEC, QUIETIO, 16 mA 0.94 1.06 1.19 1.41 3.20 3.34 3.54 4.13 3.20 3.34 3.54 4.13 ns
LVCMOS18_JEDEC, QUIETIO, 24 mA 0.94 1.06 1.19 1.41 2.96 3.10 3.30 3.98 2.96 3.10 3.30 3.98 ns
LVCMOS18_JEDEC, Slow, 2 mA 0.94 1.06 1.19 1.41 4.59 4.73 4.93 5.54 4.59 4.73 4.93 5.54 ns
LVCMOS18_JEDEC, Slow, 4 mA 0.94 1.06 1.19 1.41 3.69 3.83 4.03 4.60 3.69 3.83 4.03 4.60 ns
LVCMOS18_JEDEC, Slow, 6 mA 0.94 1.06 1.19 1.41 3.00 3.14 3.34 3.94 3.00 3.14 3.34 3.94 ns
LVCMOS18_JEDEC, Slow, 8 mA 0.94 1.06 1.19 1.41 2.19 2.33 2.53 3.18 2.19 2.33 2.53 3.18 ns
LVCMOS18_JEDEC, Slow, 12 mA 0.94 1.06 1.19 1.41 1.99 2.13 2.33 2.95 1.99 2.13 2.33 2.95 ns
LVCMOS18_JEDEC, Slow, 16 mA 0.94 1.06 1.19 1.41 1.99 2.13 2.33 2.95 1.99 2.13 2.33 2.95 ns
LVCMOS18_JEDEC, Slow, 24 mA 0.94 1.06 1.19 1.41 1.99 2.13 2.33 2.95 1.99 2.13 2.33 2.95 ns
LVCMOS18_JEDEC, Fast, 2 mA 0.94 1.06 1.19 1.41 3.57 3.71 3.91 4.52 3.57 3.71 3.91 4.52 ns
LVCMOS18_JEDEC, Fast, 4 mA 0.94 1.06 1.19 1.41 2.39 2.53 2.73 3.35 2.39 2.53 2.73 3.35 ns
LVCMOS18_JEDEC, Fast, 6 mA 0.94 1.06 1.19 1.41 1.88 2.02 2.22 2.84 1.88 2.02 2.22 2.84 ns
LVCMOS18_JEDEC, Fast, 8 mA 0.94 1.06 1.19 1.41 1.80 1.94 2.14 2.76 1.80 1.94 2.14 2.76 ns
LVCMOS18_JEDEC, Fast, 12 mA 0.94 1.06 1.19 1.41 1.72 1.86 2.06 2.68 1.72 1.86 2.06 2.68 ns
LVCMOS18_JEDEC, Fast, 16 mA 0.94 1.06 1.19 1.41 1.72 1.86 2.06 2.68 1.72 1.86 2.06 2.68 ns
LVCMOS18_JEDEC, Fast, 24 mA 0.94 1.06 1.19 1.41 1.72 1.86 2.06 2.68 1.72 1.86 2.06 2.68 ns
LVCMOS15, QUIETIO, 2 mA 0.98 1.10 1.23 1.79 5.47 5.61 5.81 6.38 5.47 5.61 5.81 6.38 ns
LVCMOS15, QUIETIO, 4 mA 0.98 1.10 1.23 1.79 4.61 4.75 4.95 5.51 4.61 4.75 4.95 5.51 ns
LVCMOS15, QUIETIO, 6 mA 0.98 1.10 1.23 1.79 4.07 4.21 4.41 4.97 4.07 4.21 4.41 4.97 ns
LVCMOS15, QUIETIO, 8 mA 0.98 1.10 1.23 1.79 3.91 4.05 4.25 4.81 3.91 4.05 4.25 4.81 ns
LVCMOS15, QUIETIO, 12 mA 0.98 1.10 1.23 1.79 3.53 3.67 3.87 4.51 3.53 3.67 3.87 4.51 ns
LVCMOS15, QUIETIO, 16 mA 0.98 1.10 1.23 1.79 3.32 3.46 3.66 4.31 3.32 3.46 3.66 4.31 ns
LVCMOS15, Slow, 2 mA 0.98 1.10 1.23 1.79 4.18 4.32 4.52 5.11 4.18 4.32 4.52 5.11 ns
LVCMOS15, Slow, 4 mA 0.98 1.10 1.23 1.79 3.42 3.56 3.76 4.34 3.42 3.56 3.76 4.34 ns
LVCMOS15, Slow, 6 mA 0.98 1.10 1.23 1.79 2.29 2.43 2.63 3.24 2.29 2.43 2.63 3.24 ns
Tabl e 2 8 : IOB Switching Characteristics for the Commercial (XC) Spartan-6 Devices (Cont’d)
I/O Standard
TIOPI TIOOP TIOTP
UnitsSpeed Grade Speed Grade Speed Grade
-3 -3N -2 -1L(1) -3 -3N -2 -1L(1) -3 -3N -2 -1L(1)
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 26
LVCMOS15, Slow, 8 mA 0.98 1.10 1.23 1.79 2.30 2.44 2.64 3.25 2.30 2.44 2.64 3.25 ns
LVCMOS15, Slow, 12 mA 0.98 1.10 1.23 1.79 2.03 2.17 2.37 2.99 2.03 2.17 2.37 2.99 ns
LVCMOS15, Slow, 16 mA 0.98 1.10 1.23 1.79 2.01 2.15 2.35 2.97 2.01 2.15 2.35 2.97 ns
LVCMOS15, Fast, 2 mA 0.98 1.10 1.23 1.79 3.29 3.43 3.63 4.24 3.29 3.43 3.63 4.24 ns
LVCMOS15, Fast, 4 mA 0.98 1.10 1.23 1.79 2.27 2.41 2.61 3.22 2.27 2.41 2.61 3.22 ns
LVCMOS15, Fast, 6 mA 0.98 1.10 1.23 1.79 1.78 1.92 2.12 2.74 1.78 1.92 2.12 2.74 ns
LVCMOS15, Fast, 8 mA 0.98 1.10 1.23 1.79 1.73 1.87 2.07 2.69 1.73 1.87 2.07 2.69 ns
LVCMOS15, Fast, 12 mA 0.98 1.10 1.23 1.79 1.73 1.87 2.07 2.64 1.73 1.87 2.07 2.64 ns
LVCMOS15, Fast, 16 mA 0.98 1.10 1.23 1.79 1.73 1.87 2.07 2.64 1.73 1.87 2.07 2.64 ns
LVCMOS15_JEDEC, QUIETIO, 2 mA 1.03 1.15 1.28 1.49 5.49 5.63 5.83 6.37 5.49 5.63 5.83 6.37 ns
LVCMOS15_JEDEC, QUIETIO, 4 mA 1.03 1.15 1.28 1.49 4.61 4.75 4.95 5.51 4.61 4.75 4.95 5.51 ns
LVCMOS15_JEDEC, QUIETIO, 6 mA 1.03 1.15 1.28 1.49 4.07 4.21 4.41 4.97 4.07 4.21 4.41 4.97 ns
LVCMOS15_JEDEC, QUIETIO, 8 mA 1.03 1.15 1.28 1.49 3.92 4.06 4.26 4.81 3.92 4.06 4.26 4.81 ns
LVCMOS15_JEDEC, QUIETIO, 12 mA 1.03 1.15 1.28 1.49 3.54 3.68 3.88 4.51 3.54 3.68 3.88 4.51 ns
LVCMOS15_JEDEC, QUIETIO, 16 mA 1.03 1.15 1.28 1.49 3.33 3.47 3.67 4.31 3.33 3.47 3.67 4.31 ns
LVCMOS15_JEDEC, Slow, 2 mA 1.03 1.15 1.28 1.49 4.18 4.32 4.52 5.13 4.18 4.32 4.52 5.13 ns
LVCMOS15_JEDEC, Slow, 4 mA 1.03 1.15 1.28 1.49 3.42 3.56 3.76 4.35 3.42 3.56 3.76 4.35 ns
LVCMOS15_JEDEC, Slow, 6 mA 1.03 1.15 1.28 1.49 2.29 2.43 2.63 3.25 2.29 2.43 2.63 3.25 ns
LVCMOS15_JEDEC, Slow, 8 mA 1.03 1.15 1.28 1.49 2.30 2.44 2.64 3.26 2.30 2.44 2.64 3.26 ns
LVCMOS15_JEDEC, Slow, 12 mA 1.03 1.15 1.28 1.49 2.01 2.15 2.35 2.97 2.01 2.15 2.35 2.97 ns
LVCMOS15_JEDEC, Slow, 16 mA 1.03 1.15 1.28 1.49 2.01 2.15 2.35 2.97 2.01 2.15 2.35 2.97 ns
LVCMOS15_JEDEC, Fast, 2 mA 1.03 1.15 1.28 1.49 3.28 3.42 3.62 4.22 3.28 3.42 3.62 4.22 ns
LVCMOS15_JEDEC, Fast, 4 mA 1.03 1.15 1.28 1.49 2.27 2.41 2.61 3.23 2.27 2.41 2.61 3.23 ns
LVCMOS15_JEDEC, Fast, 6 mA 1.03 1.15 1.28 1.49 1.78 1.92 2.12 2.74 1.78 1.92 2.12 2.74 ns
LVCMOS15_JEDEC, Fast, 8 mA 1.03 1.15 1.28 1.49 1.73 1.87 2.07 2.69 1.73 1.87 2.07 2.69 ns
LVCMOS15_JEDEC, Fast, 12 mA 1.03 1.15 1.28 1.49 1.73 1.87 2.07 2.63 1.73 1.87 2.07 2.63 ns
LVCMOS15_JEDEC, Fast, 16 mA 1.03 1.15 1.28 1.49 1.73 1.87 2.07 2.63 1.73 1.87 2.07 2.63 ns
LVCMOS12, QUIETIO, 2 mA 0.91 1.03 1.16 1.51 6.40 6.54 6.74 7.30 6.40 6.54 6.74 7.30 ns
LVCMOS12, QUIETIO, 4 mA 0.91 1.03 1.16 1.51 4.98 5.12 5.32 5.90 4.98 5.12 5.32 5.90 ns
LVCMOS12, QUIETIO, 6 mA 0.91 1.03 1.16 1.51 4.65 4.79 4.99 5.55 4.65 4.79 4.99 5.55 ns
LVCMOS12, QUIETIO, 8 mA 0.91 1.03 1.16 1.51 4.23 4.37 4.57 5.21 4.23 4.37 4.57 5.21 ns
LVCMOS12, QUIETIO, 12 mA 0.91 1.03 1.16 1.51 3.98 4.12 4.32 4.94 3.98 4.12 4.32 4.94 ns
LVCMOS12, Slow, 2 mA 0.91 1.03 1.16 1.51 4.98 5.12 5.32 5.91 4.98 5.12 5.32 5.91 ns
LVCMOS12, Slow, 4 mA 0.91 1.03 1.16 1.51 2.84 2.98 3.18 3.81 2.84 2.98 3.18 3.81 ns
LVCMOS12, Slow, 6 mA 0.91 1.03 1.16 1.51 2.77 2.91 3.11 3.72 2.77 2.91 3.11 3.72 ns
LVCMOS12, Slow, 8 mA 0.91 1.03 1.16 1.51 2.34 2.48 2.68 3.31 2.34 2.48 2.68 3.31 ns
LVCMOS12, Slow, 12 mA 0.91 1.03 1.16 1.51 2.08 2.22 2.42 3.06 2.08 2.22 2.42 3.06 ns
Tabl e 2 8 : IOB Switching Characteristics for the Commercial (XC) Spartan-6 Devices (Cont’d)
I/O Standard
TIOPI TIOOP TIOTP
UnitsSpeed Grade Speed Grade Speed Grade
-3 -3N -2 -1L(1) -3 -3N -2 -1L(1) -3 -3N -2 -1L(1)
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 27
LVCMOS12, Fast, 2 mA 0.91 1.03 1.16 1.51 3.46 3.60 3.80 4.44 3.46 3.60 3.80 4.44 ns
LVCMOS12, Fast, 4 mA 0.91 1.03 1.16 1.51 2.35 2.49 2.69 3.30 2.35 2.49 2.69 3.30 ns
LVCMOS12, Fast, 6 mA 0.91 1.03 1.16 1.51 1.79 1.93 2.13 2.75 1.79 1.93 2.13 2.75 ns
LVCMOS12, Fast, 8 mA 0.91 1.03 1.16 1.51 1.68 1.82 2.02 2.64 1.68 1.82 2.02 2.64 ns
LVCMOS12, Fast, 12 mA 0.91 1.03 1.16 1.51 1.66 1.80 2.00 2.62 1.66 1.80 2.00 2.62 ns
LVCMOS12_JEDEC, QUIETIO, 2 mA 1.50 1.62 1.75 1.88 6.39 6.53 6.73 7.31 6.39 6.53 6.73 7.31 ns
LVCMOS12_JEDEC, QUIETIO, 4 mA 1.50 1.62 1.75 1.88 4.98 5.12 5.32 5.88 4.98 5.12 5.32 5.88 ns
LVCMOS12_JEDEC, QUIETIO, 6 mA 1.50 1.62 1.75 1.88 4.67 4.81 5.01 5.54 4.67 4.81 5.01 5.54 ns
LVCMOS12_JEDEC, QUIETIO, 8 mA 1.50 1.62 1.75 1.88 4.23 4.37 4.57 5.22 4.23 4.37 4.57 5.22 ns
LVCMOS12_JEDEC, QUIETIO, 12 mA 1.50 1.62 1.75 1.88 3.99 4.13 4.33 4.94 3.99 4.13 4.33 4.94 ns
LVCMOS12_JEDEC, Slow, 2 mA 1.50 1.62 1.75 1.88 5.00 5.14 5.34 5.90 5.00 5.14 5.34 5.90 ns
LVCMOS12_JEDEC, Slow, 4 mA 1.50 1.62 1.75 1.88 2.85 2.99 3.19 3.80 2.85 2.99 3.19 3.80 ns
LVCMOS12_JEDEC, Slow, 6 mA 1.50 1.62 1.75 1.88 2.76 2.90 3.10 3.72 2.76 2.90 3.10 3.72 ns
LVCMOS12_JEDEC, Slow, 8 mA 1.50 1.62 1.75 1.88 2.35 2.49 2.69 3.30 2.35 2.49 2.69 3.30 ns
LVCMOS12_JEDEC, Slow, 12 mA 1.50 1.62 1.75 1.88 2.09 2.23 2.43 3.05 2.09 2.23 2.43 3.05 ns
LVCMOS12_JEDEC, Fast, 2 mA 1.50 1.62 1.75 1.88 3.46 3.60 3.80 4.42 3.46 3.60 3.80 4.42 ns
LVCMOS12_JEDEC, Fast, 4 mA 1.50 1.62 1.75 1.88 2.35 2.49 2.69 3.31 2.35 2.49 2.69 3.31 ns
LVCMOS12_JEDEC, Fast, 6 mA 1.50 1.62 1.75 1.88 1.79 1.93 2.13 2.76 1.79 1.93 2.13 2.76 ns
LVCMOS12_JEDEC, Fast, 8 mA 1.50 1.62 1.75 1.88 1.69 1.83 2.03 2.65 1.69 1.83 2.03 2.65 ns
LVCMOS12_JEDEC, Fast, 12 mA 1.50 1.62 1.75 1.88 1.66 1.80 2.00 2.62 1.66 1.80 2.00 2.62 ns
Notes:
1. The -1L values listed in this table are also applicable to the Spartan-6Q devices.
2. Devices with a -1L speed grade do not support Xilinx PCI IP.
Tabl e 2 8 : IOB Switching Characteristics for the Commercial (XC) Spartan-6 Devices (Cont’d)
I/O Standard
TIOPI TIOOP TIOTP
UnitsSpeed Grade Speed Grade Speed Grade
-3 -3N -2 -1L(1) -3 -3N -2 -1L(1) -3 -3N -2 -1L(1)
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 28
Tabl e 2 9 : IOB Switching Characteristics for the Automotive XA Spartan-6 and the Spartan-6Q Devices(1)
I/O Standard
TIOPI TIOOP TIOTP
UnitsSpeed Grade Speed Grade Speed Grade
-3 -2 -3 -2 -3 -2
LVDS_33 1.24 1.42 1.69 1.89 3000 3000 ns
LVDS_25 1.08 1.26 1.79 1.99 3000 3000 ns
BLVDS_25 1.09 1.27 1.86 2.06 1.86 2.06 ns
MINI_LVDS_33 1.25 1.43 1.71 1.91 3000 3000 ns
MINI_LVDS_25 1.08 1.26 1.79 1.99 3000 3000 ns
LVPECL_33 1.25 1.43 N/A N/A N/A N/A ns
LVPECL_25 1.09 1.27 N/A N/A N/A N/A ns
RSDS_33 (point to point) 1.24 1.42 1.71 1.91 3000 3000 ns
RSDS_25 (point to point) 1.08 1.26 1.79 1.99 3000 3000 ns
TMDS_33 1.29 1.47 1.68 1.88 3000 3000 ns
PPDS_33 1.25 1.43 1.71 1.91 3000 3000 ns
PPDS_25 1.08 1.26 1.82 2.02 3000 3000 ns
PCI33_3 1.14 1.32 3.81 4.01 3.81 4.01 ns
PCI66_3 1.14 1.32 3.81 4.01 3.81 4.01 ns
DISPLAY_PORT 1.09 1.27 3.29 3.49 3.29 3.49 ns
I2C 1.40 1.58 11.70 11.90 11.70 11.90 ns
SMBUS 1.40 1.58 11.70 11.90 11.70 11.90 ns
SDIO 1.43 1.61 2.78 2.98 2.78 2.98 ns
MOBILE_DDR 1.01 1.19 2.50 2.70 2.50 2.70 ns
HSTL_I 1.01 1.19 1.80 2.00 1.80 2.00 ns
HSTL_II 1.01 1.19 1.86 2.06 1.86 2.06 ns
HSTL_III 1.07 1.25 1.81 2.01 1.81 2.01 ns
HSTL_I _18 1.05 1.23 1.91 2.11 1.91 2.11 ns
HSTL_II _18 1.05 1.23 1.99 2.19 1.99 2.19 ns
HSTL_III _18 1.13 1.31 1.93 2.13 1.93 2.13 ns
SSTL3_I 1.65 1.83 1.97 2.17 1.97 2.17 ns
SSTL3_II 1.65 1.83 2.15 2.35 2.15 2.35 ns
SSTL2_I 1.37 1.55 1.91 2.11 1.91 2.11 ns
SSTL2_II 1.37 1.55 2.00 2.20 2.00 2.20 ns
SSTL18_I 0.99 1.17 1.77 1.97 1.77 1.97 ns
SSTL18_II 1.00 1.18 1.80 2.00 1.80 2.00 ns
SSTL15_II 1.00 1.18 1.81 2.01 1.81 2.01 ns
DIFF_HSTL_I 1.01 1.19 1.91 2.11 1.91 2.11 ns
DIFF_HSTL_II 1.00 1.18 1.86 2.06 1.86 2.06 ns
DIFF_HSTL_III 1.00 1.18 1.83 2.03 1.83 2.03 ns
DIFF_HSTL_I_18 1.04 1.22 1.93 2.13 1.93 2.13 ns
DIFF_HSTL_II_18 1.04 1.22 1.83 2.03 1.83 2.03 ns
DIFF_HSTL_III_18 1.04 1.22 1.83 2.03 1.83 2.03 ns
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 29
DIFF_SSTL3_I 1.26 1.44 1.95 2.15 1.95 2.15 ns
DIFF_SSTL3_II 1.26 1.44 1.94 2.14 1.94 2.14 ns
DIFF_SSTL2_I 1.09 1.27 1.94 2.14 1.94 2.14 ns
DIFF_SSTL2_II 1.09 1.27 1.90 2.10 1.90 2.10 ns
DIFF_SSTL18_I 1.04 1.22 1.86 2.06 1.86 2.06 ns
DIFF_SSTL18_II 1.05 1.23 1.82 2.02 1.82 2.02 ns
DIFF_SSTL15_II 1.01 1.19 1.81 2.01 1.81 2.01 ns
DIFF_MOBILE_DDR 1.04 1.22 1.89 2.09 1.89 2.09 ns
LVTTL, QUIETIO, 2 mA 1.42 1.60 5.64 5.84 5.64 5.84 ns
LVTTL, QUIETIO, 4 mA 1.42 1.60 4.46 4.66 4.46 4.66 ns
LVTTL, QUIETIO, 6 mA 1.42 1.60 3.92 4.12 3.92 4.12 ns
LVTTL, QUIETIO, 8 mA 1.42 1.60 3.37 3.57 3.37 3.57 ns
LVTTL, QUIETIO, 12 mA 1.42 1.60 3.42 3.62 3.42 3.62 ns
LVTTL, QUIETIO, 16 mA 1.42 1.60 3.09 3.29 3.09 3.29 ns
LVTTL, QUIETIO, 24 mA 1.42 1.60 2.83 3.03 2.83 3.03 ns
LVTTL, Slow, 2 mA 1.42 1.60 4.58 4.78 4.58 4.78 ns
LVTTL, Slow, 4 mA 1.42 1.60 3.38 3.58 3.38 3.58 ns
LVTTL, Slow, 6 mA 1.42 1.60 2.95 3.15 2.95 3.15 ns
LVTTL, Slow, 8 mA 1.42 1.60 2.73 2.93 2.73 2.93 ns
LVTTL, Slow, 12 mA 1.42 1.60 2.72 2.92 2.72 2.92 ns
LVTTL, Slow, 16 mA 1.42 1.60 2.53 2.73 2.53 2.73 ns
LVTTL, Slow, 24 mA 1.42 1.60 2.42 2.62 2.42 2.62 ns
LVTTL, Fast, 2 mA 1.42 1.60 4.04 4.24 4.04 4.24 ns
LVTTL, Fast, 4 mA 1.42 1.60 2.66 2.86 2.66 2.86 ns
LVTTL, Fast, 6 mA 1.42 1.60 2.58 2.78 2.58 2.78 ns
LVTTL, Fast, 8 mA 1.42 1.60 2.46 2.66 2.46 2.66 ns
LVTTL, Fast, 12 mA 1.42 1.60 1.97 2.17 1.97 2.17 ns
LVTTL, Fast, 16 mA 1.42 1.60 1.97 2.17 1.97 2.17 ns
LVTTL, Fast, 24 mA 1.42 1.60 1.97 2.17 1.97 2.17 ns
LVCMOS33, QUIETIO, 2 mA 1.41 1.59 5.65 5.85 5.65 5.85 ns
LVCMOS33, QUIETIO, 4 mA 1.41 1.59 4.20 4.40 4.20 4.40 ns
LVCMOS33, QUIETIO, 6 mA 1.41 1.59 3.65 3.85 3.65 3.85 ns
LVCMOS33, QUIETIO, 8 mA 1.41 1.59 3.51 3.71 3.51 3.71 ns
LVCMOS33, QUIETIO, 12 mA 1.41 1.59 3.09 3.29 3.09 3.29 ns
LVCMOS33, QUIETIO, 16 mA 1.41 1.59 2.91 3.11 2.91 3.11 ns
LVCMOS33, QUIETIO, 24 mA 1.41 1.59 2.73 2.93 2.73 2.93 ns
LVCMOS33, Slow, 2 mA 1.41 1.59 4.59 4.79 4.59 4.79 ns
LVCMOS33, Slow, 4 mA 1.41 1.59 3.14 3.34 3.14 3.34 ns
Tabl e 2 9 : IOB Switching Characteristics for the Automotive XA Spartan-6 and the Spartan-6Q Devices(1) (Cont’d)
I/O Standard
TIOPI TIOOP TIOTP
UnitsSpeed Grade Speed Grade Speed Grade
-3 -2 -3 -2 -3 -2
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 30
LVCMOS33, Slow, 6 mA 1.41 1.59 2.79 2.99 2.79 2.99 ns
LVCMOS33, Slow, 8 mA 1.41 1.59 2.79 2.99 2.79 2.99 ns
LVCMOS33, Slow, 12 mA 1.41 1.59 2.53 2.73 2.53 2.73 ns
LVCMOS33, Slow, 16 mA 1.41 1.59 2.45 2.65 2.45 2.65 ns
LVCMOS33, Slow, 24 mA 1.41 1.59 2.42 2.62 2.42 2.62 ns
LVCMOS33, Fast, 2 mA 1.41 1.59 4.05 4.25 4.05 4.25 ns
LVCMOS33, Fast, 4 mA 1.41 1.59 2.66 2.86 2.66 2.86 ns
LVCMOS33, Fast, 6 mA 1.41 1.59 2.46 2.66 2.46 2.66 ns
LVCMOS33, Fast, 8 mA 1.41 1.59 2.21 2.41 2.21 2.41 ns
LVCMOS33, Fast, 12 mA 1.41 1.59 1.80 2.00 1.80 2.00 ns
LVCMOS33, Fast, 16 mA 1.41 1.59 1.80 2.00 1.80 2.00 ns
LVCMOS33, Fast, 24 mA 1.41 1.59 1.80 2.00 1.80 2.00 ns
LVCMOS25, QUIETIO, 2 mA 0.89 1.07 5.00 5.20 5.00 5.20 ns
LVCMOS25, QUIETIO, 4 mA 0.89 1.07 3.85 4.05 3.85 4.05 ns
LVCMOS25, QUIETIO, 6 mA 0.89 1.07 3.60 3.80 3.60 3.80 ns
LVCMOS25, QUIETIO, 8 mA 0.89 1.07 3.34 3.54 3.34 3.54 ns
LVCMOS25, QUIETIO, 12 mA 0.89 1.07 2.98 3.18 2.98 3.18 ns
LVCMOS25, QUIETIO, 16 mA 0.89 1.07 2.79 2.99 2.79 2.99 ns
LVCMOS25, QUIETIO, 24 mA 0.89 1.07 2.64 2.84 2.64 2.84 ns
LVCMOS25, Slow, 2 mA 0.89 1.07 3.96 4.16 3.96 4.16 ns
LVCMOS25, Slow, 4 mA 0.89 1.07 2.96 3.16 2.96 3.16 ns
LVCMOS25, Slow, 6 mA 0.89 1.07 2.88 3.08 2.88 3.08 ns
LVCMOS25, Slow, 8 mA 0.89 1.07 2.63 2.83 2.63 2.83 ns
LVCMOS25, Slow, 12 mA 0.89 1.07 2.15 2.35 2.15 2.35 ns
LVCMOS25, Slow, 16 mA 0.89 1.07 2.15 2.35 2.15 2.35 ns
LVCMOS25, Slow, 24 mA 0.89 1.07 2.15 2.35 2.15 2.35 ns
LVCMOS25, Fast, 2 mA 0.89 1.07 3.52 3.72 3.52 3.72 ns
LVCMOS25, Fast, 4 mA 0.89 1.07 2.43 2.63 2.43 2.63 ns
LVCMOS25, Fast, 6 mA 0.89 1.07 2.23 2.43 2.23 2.43 ns
LVCMOS25, Fast, 8 mA 0.89 1.07 2.16 2.36 2.16 2.36 ns
LVCMOS25, Fast, 12 mA 0.89 1.07 1.70 1.90 1.70 1.90 ns
LVCMOS25, Fast, 16 mA 0.89 1.07 1.70 1.90 1.70 1.90 ns
LVCMOS25, Fast, 24 mA 0.89 1.07 1.70 1.90 1.70 1.90 ns
LVCMOS18, QUIETIO, 2 mA 1.25 1.43 6.11 6.31 6.11 6.31 ns
LVCMOS18, QUIETIO, 4 mA 1.25 1.43 4.88 5.08 4.88 5.08 ns
LVCMOS18, QUIETIO, 6 mA 1.25 1.43 4.20 4.40 4.20 4.40 ns
LVCMOS18, QUIETIO, 8 mA 1.25 1.43 3.86 4.06 3.86 4.06 ns
LVCMOS18, QUIETIO, 12 mA 1.25 1.43 3.49 3.69 3.49 3.69 ns
Tabl e 2 9 : IOB Switching Characteristics for the Automotive XA Spartan-6 and the Spartan-6Q Devices(1) (Cont’d)
I/O Standard
TIOPI TIOOP TIOTP
UnitsSpeed Grade Speed Grade Speed Grade
-3 -2 -3 -2 -3 -2
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 31
LVCMOS18, QUIETIO, 16 mA 1.25 1.43 3.34 3.54 3.34 3.54 ns
LVCMOS18, QUIETIO, 24 mA 1.25 1.43 3.18 3.38 3.18 3.38 ns
LVCMOS18, Slow, 2 mA 1.25 1.43 4.79 4.99 4.79 4.99 ns
LVCMOS18, Slow, 4 mA 1.25 1.43 3.84 4.04 3.84 4.04 ns
LVCMOS18, Slow, 6 mA 1.25 1.43 3.17 3.37 3.17 3.37 ns
LVCMOS18, Slow, 8 mA 1.25 1.43 2.37 2.57 2.37 2.57 ns
LVCMOS18, Slow, 12 mA 1.25 1.43 2.13 2.33 2.13 2.33 ns
LVCMOS18, Slow, 16 mA 1.25 1.43 2.13 2.33 2.13 2.33 ns
LVCMOS18, Slow, 24 mA 1.25 1.43 2.13 2.33 2.13 2.33 ns
LVCMOS18, Fast, 2 mA 1.25 1.43 3.78 3.98 3.78 3.98 ns
LVCMOS18, Fast, 4 mA 1.25 1.43 2.54 2.74 2.54 2.74 ns
LVCMOS18, Fast, 6 mA 1.25 1.43 2.02 2.22 2.02 2.22 ns
LVCMOS18, Fast, 8 mA 1.25 1.43 1.95 2.15 1.95 2.15 ns
LVCMOS18, Fast, 12 mA 1.25 1.43 1.85 2.05 1.85 2.05 ns
LVCMOS18, Fast, 16 mA 1.25 1.43 1.85 2.05 1.85 2.05 ns
LVCMOS18, Fast, 24 mA 1.25 1.43 1.85 2.05 1.85 2.05 ns
LVCMOS18_JEDEC, QUIETIO, 2 mA 1.01 1.19 6.09 6.29 6.09 6.29 ns
LVCMOS18_JEDEC, QUIETIO, 4 mA 1.01 1.19 4.89 5.09 4.89 5.09 ns
LVCMOS18_JEDEC, QUIETIO, 6 mA 1.01 1.19 4.20 4.40 4.20 4.40 ns
LVCMOS18_JEDEC, QUIETIO, 8 mA 1.01 1.19 3.87 4.07 3.87 4.07 ns
LVCMOS18_JEDEC, QUIETIO, 12 mA 1.01 1.19 3.49 3.69 3.49 3.69 ns
LVCMOS18_JEDEC, QUIETIO, 16 mA 1.01 1.19 3.34 3.54 3.34 3.54 ns
LVCMOS18_JEDEC, QUIETIO, 24 mA 1.01 1.19 3.17 3.37 3.17 3.37 ns
LVCMOS18_JEDEC, Slow, 2 mA 1.01 1.19 4.79 4.99 4.79 4.99 ns
LVCMOS18_JEDEC, Slow, 4 mA 1.01 1.19 3.84 4.04 3.84 4.04 ns
LVCMOS18_JEDEC, Slow, 6 mA 1.01 1.19 3.18 3.38 3.18 3.38 ns
LVCMOS18_JEDEC, Slow, 8 mA 1.01 1.19 2.37 2.57 2.37 2.57 ns
LVCMOS18_JEDEC, Slow, 12 mA 1.01 1.19 2.13 2.33 2.13 2.33 ns
LVCMOS18_JEDEC, Slow, 16 mA 1.01 1.19 2.13 2.33 2.13 2.33 ns
LVCMOS18_JEDEC, Slow, 24 mA 1.01 1.19 2.13 2.33 2.13 2.33 ns
LVCMOS18_JEDEC, Fast, 2 mA 1.01 1.19 3.75 3.95 3.75 3.95 ns
LVCMOS18_JEDEC, Fast, 4 mA 1.01 1.19 2.54 2.74 2.54 2.74 ns
LVCMOS18_JEDEC, Fast, 6 mA 1.01 1.19 2.02 2.22 2.02 2.22 ns
LVCMOS18_JEDEC, Fast, 8 mA 1.01 1.19 1.94 2.14 1.94 2.14 ns
LVCMOS18_JEDEC, Fast, 12 mA 1.01 1.19 1.86 2.06 1.86 2.06 ns
LVCMOS18_JEDEC, Fast, 16 mA 1.01 1.19 1.86 2.06 1.86 2.06 ns
LVCMOS18_JEDEC, Fast, 24 mA 1.01 1.19 1.86 2.06 1.86 2.06 ns
Tabl e 2 9 : IOB Switching Characteristics for the Automotive XA Spartan-6 and the Spartan-6Q Devices(1) (Cont’d)
I/O Standard
TIOPI TIOOP TIOTP
UnitsSpeed Grade Speed Grade Speed Grade
-3 -2 -3 -2 -3 -2
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 32
LVCMOS15, QUIETIO, 2 mA 1.05 1.23 5.63 5.83 5.63 5.83 ns
LVCMOS15, QUIETIO, 4 mA 1.05 1.23 4.75 4.95 4.75 4.95 ns
LVCMOS15, QUIETIO, 6 mA 1.05 1.23 4.21 4.41 4.21 4.41 ns
LVCMOS15, QUIETIO, 8 mA 1.05 1.23 4.05 4.25 4.05 4.25 ns
LVCMOS15, QUIETIO, 12 mA 1.05 1.23 3.74 3.94 3.74 3.94 ns
LVCMOS15, QUIETIO, 16 mA 1.05 1.23 3.52 3.72 3.52 3.72 ns
LVCMOS15, Slow, 2 mA 1.05 1.23 4.32 4.52 4.32 4.52 ns
LVCMOS15, Slow, 4 mA 1.05 1.23 3.58 3.78 3.58 3.78 ns
LVCMOS15, Slow, 6 mA 1.05 1.23 2.45 2.65 2.45 2.65 ns
LVCMOS15, Slow, 8 mA 1.05 1.23 2.46 2.66 2.46 2.66 ns
LVCMOS15, Slow, 12 mA 1.05 1.23 2.17 2.37 2.17 2.37 ns
LVCMOS15, Slow, 16 mA 1.05 1.23 2.15 2.35 2.15 2.35 ns
LVCMOS15, Fast, 2 mA 1.05 1.23 3.43 3.63 3.43 3.63 ns
LVCMOS15, Fast, 4 mA 1.05 1.23 2.42 2.62 2.42 2.62 ns
LVCMOS15, Fast, 6 mA 1.05 1.23 1.92 2.12 1.92 2.12 ns
LVCMOS15, Fast, 8 mA 1.05 1.23 1.87 2.07 1.87 2.07 ns
LVCMOS15, Fast, 12 mA 1.05 1.23 1.87 2.07 1.87 2.07 ns
LVCMOS15, Fast, 16 mA 1.05 1.23 1.87 2.07 1.87 2.07 ns
LVCMOS15_JEDEC, QUIETIO, 2 mA 1.10 1.28 5.64 5.84 5.64 5.84 ns
LVCMOS15_JEDEC, QUIETIO, 4 mA 1.10 1.28 4.75 4.95 4.75 4.95 ns
LVCMOS15_JEDEC, QUIETIO, 6 mA 1.10 1.28 4.21 4.41 4.21 4.41 ns
LVCMOS15_JEDEC, QUIETIO, 8 mA 1.10 1.28 4.06 4.26 4.06 4.26 ns
LVCMOS15_JEDEC, QUIETIO, 12 mA 1.10 1.28 3.75 3.95 3.75 3.95 ns
LVCMOS15_JEDEC, QUIETIO, 16 mA 1.10 1.28 3.53 3.73 3.53 3.73 ns
LVCMOS15_JEDEC, Slow, 2 mA 1.10 1.28 4.32 4.52 4.32 4.52 ns
LVCMOS15_JEDEC, Slow, 4 mA 1.10 1.28 3.56 3.76 3.56 3.76 ns
LVCMOS15_JEDEC, Slow, 6 mA 1.10 1.28 2.44 2.64 2.44 2.64 ns
LVCMOS15_JEDEC, Slow, 8 mA 1.10 1.28 2.47 2.67 2.47 2.67 ns
LVCMOS15_JEDEC, Slow, 12 mA 1.10 1.28 2.15 2.35 2.15 2.35 ns
LVCMOS15_JEDEC, Slow, 16 mA 1.10 1.28 2.15 2.35 2.15 2.35 ns
LVCMOS15_JEDEC, Fast, 2 mA 1.10 1.28 3.43 3.63 3.43 3.63 ns
LVCMOS15_JEDEC, Fast, 4 mA 1.10 1.28 2.42 2.62 2.42 2.62 ns
LVCMOS15_JEDEC, Fast, 6 mA 1.10 1.28 1.92 2.12 1.92 2.12 ns
LVCMOS15_JEDEC, Fast, 8 mA 1.10 1.28 1.87 2.07 1.87 2.07 ns
LVCMOS15_JEDEC, Fast, 12 mA 1.10 1.28 1.87 2.07 1.87 2.07 ns
LVCMOS15_JEDEC, Fast, 16 mA 1.10 1.28 1.87 2.07 1.87 2.07 ns
LVCMOS12, QUIETIO, 2 mA 0.98 1.16 6.54 6.74 6.54 6.74 ns
LVCMOS12, QUIETIO, 4 mA 0.98 1.16 5.12 5.32 5.12 5.32 ns
Tabl e 2 9 : IOB Switching Characteristics for the Automotive XA Spartan-6 and the Spartan-6Q Devices(1) (Cont’d)
I/O Standard
TIOPI TIOOP TIOTP
UnitsSpeed Grade Speed Grade Speed Grade
-3 -2 -3 -2 -3 -2
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 33
Ta bl e 3 0 summarizes the value of TIOTPHZ. TIOTPHZ is described as the delay from the T pin to the IOB pad through the
output buffer of an IOB pad, when 3-state is enabled (i.e., a high impedance state). These delays are measured using
LVCMOS25, Fast, 12 mA.
LVCMOS12, QUIETIO, 6 mA 0.98 1.16 4.79 4.99 4.79 4.99 ns
LVCMOS12, QUIETIO, 8 mA 0.98 1.16 4.43 4.63 4.43 4.63 ns
LVCMOS12, QUIETIO, 12 mA 0.98 1.16 4.18 4.38 4.18 4.38 ns
LVCMOS12, Slow, 2 mA 0.98 1.16 5.12 5.32 5.12 5.32 ns
LVCMOS12, Slow, 4 mA 0.98 1.16 3.00 3.20 3.00 3.20 ns
LVCMOS12, Slow, 6 mA 0.98 1.16 2.91 3.11 2.91 3.11 ns
LVCMOS12, Slow, 8 mA 0.98 1.16 2.51 2.71 2.51 2.71 ns
LVCMOS12, Slow, 12 mA 0.98 1.16 2.25 2.45 2.25 2.45 ns
LVCMOS12, Fast, 2 mA 0.98 1.16 3.60 3.80 3.60 3.80 ns
LVCMOS12, Fast, 4 mA 0.98 1.16 2.49 2.69 2.49 2.69 ns
LVCMOS12, Fast, 6 mA 0.98 1.16 1.94 2.14 1.94 2.14 ns
LVCMOS12, Fast, 8 mA 0.98 1.16 1.82 2.02 1.82 2.02 ns
LVCMOS12, Fast, 12 mA 0.98 1.16 1.80 2.00 1.80 2.00 ns
LVCMOS12_JEDEC, QUIETIO, 2 mA 1.57 1.75 6.53 6.73 6.53 6.73 ns
LVCMOS12_JEDEC, QUIETIO, 4 mA 1.57 1.75 5.12 5.32 5.12 5.32 ns
LVCMOS12_JEDEC, QUIETIO, 6 mA 1.57 1.75 4.81 5.01 4.81 5.01 ns
LVCMOS12_JEDEC, QUIETIO, 8 mA 1.57 1.75 4.44 4.64 4.44 4.64 ns
LVCMOS12_JEDEC, QUIETIO, 12 mA 1.57 1.75 4.20 4.40 4.20 4.40 ns
LVCMOS12_JEDEC, Slow, 2 mA 1.57 1.75 5.14 5.34 5.14 5.34 ns
LVCMOS12_JEDEC, Slow, 4 mA 1.57 1.75 2.99 3.19 2.99 3.19 ns
LVCMOS12_JEDEC, Slow, 6 mA 1.57 1.75 2.90 3.10 2.90 3.10 ns
LVCMOS12_JEDEC, Slow, 8 mA 1.57 1.75 2.50 2.70 2.50 2.70 ns
LVCMOS12_JEDEC, Slow, 12 mA 1.57 1.75 2.26 2.46 2.26 2.46 ns
LVCMOS12_JEDEC, Fast, 2 mA 1.57 1.75 3.60 3.80 3.60 3.80 ns
LVCMOS12_JEDEC, Fast, 4 mA 1.57 1.75 2.49 2.69 2.49 2.69 ns
LVCMOS12_JEDEC, Fast, 6 mA 1.57 1.75 1.94 2.14 1.94 2.14 ns
LVCMOS12_JEDEC, Fast, 8 mA 1.57 1.75 1.83 2.03 1.83 2.03 ns
LVCMOS12_JEDEC, Fast, 12 mA 1.57 1.75 1.80 2.00 1.80 2.00 ns
Notes:
1. The Spartan-6Q FPGA -1L values are listed in Ta b le 2 8 .
Tabl e 3 0 : IOB 3-state ON Output Switching Characteristics (TIOTPHZ)
Symbol Description Speed Grade Units
-3 -3N -2 -1L
TIOTPHZ T input to Pad high-impedance 1.39 1.59 1.59 1.91 ns
Tabl e 2 9 : IOB Switching Characteristics for the Automotive XA Spartan-6 and the Spartan-6Q Devices(1) (Cont’d)
I/O Standard
TIOPI TIOOP TIOTP
UnitsSpeed Grade Speed Grade Speed Grade
-3 -2 -3 -2 -3 -2
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 34
I/O Standard Measurement Methodology
Input Delay Measurements
Ta bl e 3 1 shows the test setup parameters used for measuring input delay.
Tabl e 3 1 : Input Delay Measurement Methodology
Description I/O Standard Attribute VL(1) VH(1) VMEAS(3)(4) VREF(2)(4)
LVTTL (Low-Voltage Transistor-Transistor Logic) LVTTL 0 3.0 1.4
LVCMOS (Low-Voltage CMOS), 3.3V LVCMOS33 0 3.3 1.65
LVCMOS, 2.5V LVCMOS25 0 2.5 1.25
LVCMOS, 1.8V LVCMOS18 0 1.8 0.9
LVCMOS, 1.5V LVCMOS15 0 1.5 0.75
LVCMOS, 1.2V LVCMOS12 0 1.2 0.6
PCI (Peripheral Component Interface),
33 MHz and 66 MHz, 3.3V
PCI33_3, PCI66_3 Per PCI Specification
HSTL (High-Speed Transceiver Logic),
Class I & II
HSTL_I, HSTL_II VREF –0.5 V
REF +0.5 V
REF 0.75
HSTL, Class III HSTL_III VREF –0.5 V
REF +0.5 V
REF 0.90
HSTL, Class I & II, 1.8V HSTL_I_18, HSTL_II_18 VREF –0.5 V
REF +0.5 V
REF 0.90
HSTL, Class III 1.8V HSTL_III_18 VREF –0.5 V
REF +0.5 V
REF 1.1
SSTL (Stub Terminated Transceiver Logic),
Class I & II, 3.3V
SSTL3_I, SSTL3_II VREF –0.75 V
REF +0.75 V
REF 1.5
SSTL, Class I & II, 2.5V SSTL2_I, SSTL2_II VREF –0.75 V
REF +0.75 V
REF 1.25
SSTL, Class I & II, 1.8V SSTL18_I, SSTL18_II VREF –0.5 V
REF +0.5 V
REF 0.90
SSTL, Class II, 1.5V SSTL15_II VREF –0.2 V
REF +0.2 V
REF 0.75
LVDS (Low-Voltage Differential Signaling),
2.5V & 3.3V
LVDS_25, LVDS_33 1.25 – 0.125 1.25 + 0.125 0(5)
LVPECL (Low-Voltage Positive Emitter-Coupled
Logic), 2.5V & 3.3V
LVPECL_25, LVPECL_33 1.2 – 0.3 1.2 + 0.3 0(5)
BLVDS (Bus LVDS), 2.5V BLVDS_25 1.3 – 0.125 1.3 + 0.125 0(5)
Mini-LVDS, 2.5V & 3.3V MINI_LVDS_25,
MINI_LVDS_33
1.2 – 0.125 1.2 + 0.125 0(5)
RSDS (Reduced Swing Differential Signaling),
2.5V & 3.3V
RSDS_25, RSDS_33 1.2 – 0.1 1.2 + 0.1 0(5)
TMDS (Transition Minimized Differential Signaling),
3.3V
TMDS_33 3.0 – 0.1 3.0 + 0.1 0(5)
PPDS (Point-to-Point Differential Signaling,
2.5V & 3.3V
PPDS_25, PPDS_33 1.25 – 0.1 1.25 + 0.1 0(5)
Notes:
1. Input waveform switches between VL and VH.
2. Measurements are made at typical, minimum, and maximum VREF values. Reported delays reflect worst case of these measurements. VREF values
listed are typical.
3. Input voltage level from which measurement starts.
4. This is an input voltage reference that bears no relation to the VREF / VMEAS parameters found in IBIS models and/or noted in Figure 4.
5. The value given is the differential input voltage.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 35
Output Delay Measurements
Output delays are measured using a Tektronix P6245
TDS500/600 probe (< 1 pF) across approximately 4" of FR4
microstrip trace. Standard termination was used for all
testing. The propagation delay of the 4" trace is
characterized separately and subtracted from the final
measurement, and is therefore not included in the
generalized test setups shown in Figure 4 and Figure 5.
Measurements and test conditions are reflected in the IBIS
models except where the IBIS format precludes it.
Parameters VREF, RREF, CREF, and VMEAS fully describe
the test conditions for each I/O standard. The most accurate
prediction of propagation delay in any given application can
be obtained through IBIS simulation, using the following
method:
1. Simulate the output driver of choice into the generalized
test setup, using values from Ta b l e 3 2 .
2. Record the time to VMEAS.
3. Simulate the output driver of choice into the actual PCB
trace and load, using the appropriate IBIS model or
capacitance value to represent the load.
4. Record the time to VMEAS.
5. Compare the results of steps 2 and 4. The increase or
decrease in delay yields the actual propagation delay of
the PCB trace.
X-Ref Target - Figure 4
Figure 4: Single-Ended Test Setup
VREF
RREF
VMEAS
(voltage level when taking
delay measurement)
CREF
(probe capacitance)
FPGA Output
ds162_06_011309
X-Ref Target - Figure 5
Figure 5: Differential Test Setup
RREF VMEAS
+
CREF
FPGA Output
ds162_07_011309
Tabl e 3 2 : Output Delay Measurement Methodology
Description I/O Standard
Attribute
RREF
(Ω)
CREF(1)
(pF)
VMEAS
(V)
VREF
(V)
LVTTL (Low-Voltage Transistor-Transistor Logic) LVTTL (all) 1M 0 1.4 0
LVCMOS (Low-Voltage CMOS), 3.3V LVCMOS33 1M 0 1.65 0
LVCMOS, 2.5V LVCMOS25 1M 0 1.25 0
LVCMOS, 1.8V LVCMOS18 1M 0 0.9 0
LVCMOS, 1.5V LVCMOS15 1M 0 0.75 0
LVCMOS, 1.2V LVCMOS12 1M 0 0.6 0
PCI (Peripheral Component Interface)
33 MHz and 66 MHz, 3.3V
PCI33_3, PCI66_3 (rising edge) 25 10(2) 0.94 0
PCI33_3, PCI66_3 (falling edge) 25 10(2) 2.03 3.3
HSTL (High-Speed Transceiver Logic), Class I HSTL_I 50 0 VREF 0.75
HSTL, Class II HSTL_II 25 0 VREF 0.75
HSTL, Class III HSTL_III 50 0 0.9 1.5
HSTL, Class I, 1.8V HSTL_I_18 50 0 VREF 0.9
HSTL, Class II, 1.8V HSTL_II_18 25 0 VREF 0.9
HSTL, Class III, 1.8V HSTL_III_18 50 0 1.1 1.8
SSTL (Stub Series Terminated Logic), Class I, 1.8V SSTL18_I 50 0 VREF 0.9
SSTL, Class II, 1.8V SSTL18_II 25 0 VREF 0.9
SSTL, Class I, 2.5V SSTL2_I 50 0 VREF 1.25
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 36
Simultaneously Switching Outputs
Due to package electrical parasitics, a given package supports a limited number of simultaneous switching outputs (SSOs)
when using fast, high-drive outputs. Ta bl e 3 3 and Ta b l e 3 4 provide guidelines for the recommended maximum allowable
number of SSOs. These guidelines describe the maximum number of user I/O pins of an output signal standard that should
simultaneously switch in the same direction, while maintaining a safe level of switching noise for that particular signal
standard. Meeting these guidelines for the stated test conditions ensures that the FPGA operates free from the adverse
effects of GND and power bounce.
For each device/package combination, Ta bl e 3 3 provides the number of equivalent VCCO/GND pairs per bank. For each
output signal standard and drive strength, Ta bl e 3 4 recommends the maximum number of SSOs, switching in the same
direction, allowed per VCCO/GND pair within an I/O bank. The guidelines are categorized by package style, slew rate, and
output drive current. The number of SSOs are also specified by I/O bank. Multiply the appropriate numbers from each table
to calculate the maximum number of SSOs allowed within an I/O bank. The guidelines assume that all pins within a bank use
the same I/O standard. Although in general lower DRIVE settings improve SSO characteristics, in some instances higher
DRIVE settings improve SSO values because they also improve noise margin. Analysis using the PlanAhead tool supports
mixed standards within a bank. Exceeding these SSO guidelines can result in increased power or GND bounce, degraded
signal integrity, or increased system jitter. For a given I/O standard, if the SSO limit per pair in Ta bl e 3 4 is greater than the
maximum I/O per pair in Ta b l e 3 3 , then there is no SSO limit for the exclusive use of that I/O standard.
The recommended maximum SSO values assume that the FPGA is soldered on a printed circuit board and that the board
uses sound design practices. Due to the additional inductance introduced by the socket, the SSO values do not apply for
FPGAs mounted in sockets. The SSO values assume that the VCCAUX is powered at 3.3V. Setting VCCAUX to 2.5V provides
better SSO characteristics. For more detail, see UG381: Spartan-6 FPGA SelectIO Resources User Guide.
SSO analysis does not take relative pin locations into account. The PlanAhead tool supports simultaneous switching noise
(SSN) analysis, which is based on relative pin locations, allowing the optimal choice of package pins. For more information,
see UG792: Pin Planning Methodology Guide.
There are also restrictions on using SelectIO resources in proximity to GTP transceivers. For more information, see
UG386:Spartan-6 FPGA GTP Transceivers User Guide.
SSTL, Class II, 2.5V SSTL2_II 25 0 VREF 1.25
SSTL, Class II, 1.5V SSTL15_II 25 0 VREF 0.75
LVDS (Low-Voltage Differential Signaling), 2.5V & 3.3V LVDS_25, LVDS_33 100 0 0(3)
BLVDS (Bus LVDS), 2.5V BLVDS_25 Note 4 00
(3)
Mini-LVDS, 2.5V & 3.3V MINI_LVDS_25, MINI_LVDS_33 100 0 0(3)
RSDS (Reduced Swing Differential Signaling), 2.5V & 3.3V RSDS_25, RSDS_33 100 0 0(3)
TMDS (Transition Minimized Differential Signaling), 3.3V TMDS_33 Note 5 00
(3)
PPDS (Point-to-Point Differential Signaling, 2.5V & 3.3V PPDS_25, PPDS_33 100 0 0(3)
Notes:
1. CREF is the capacitance of the probe, nominally 0 pF.
2. Per PCI specifications.
3. The value given is the differential output voltage.
4. See the BLVDS Output Termination section in UG381, Spartan-6 FPGA SelectIO Resources User Guide.
5. See the TMDS_33 Termination section in UG381, Spartan-6 FPGA SelectIO Resources User Guide.
Tabl e 3 2 : Output Delay Measurement Methodology (Cont’d)
Description I/O Standard
Attribute
RREF
(Ω)
CREF(1)
(pF)
VMEAS
(V)
VREF
(V)
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 37
Tabl e 3 3 : Spartan-6 FPGA VCCO/GND Pairs per Bank
Package Devices Description Bank 0 Bank 1 Bank 2 Bank 3 Bank 4 Bank 5
TQG144 LX VCCO/GND Pairs 3 323N/AN/A
Maximum I/O per Pair 8 8138N/AN/A
CPG196 LX VCCO/GND Pairs 4 646N/AN/A
Maximum I/O per Pair 6 474N/AN/A
CSG225 LX VCCO/GND Pairs 4 444N/AN/A
Maximum I/O per Pair 10 10 9 10 N/A N/A
FT(G)256 LX VCCO/GND Pairs 5 645N/AN/A
Maximum I/O per Pair 8 9910 N/A N/A
CSG324
LX VCCO/GND Pairs 6 666N/AN/A
Maximum I/O per Pair 10 9109N/AN/A
LXT VCCO/GND Pairs 4 666N/AN/A
Maximum I/O per Pair 4 9109N/AN/A
CS(G)484
LX VCCO/GND Pairs 8 13 8 13 N/A N/A
Maximum I/O per Pair 7 878N/AN/A
LXT VCCO/GND Pairs 7 12 8 13 N/A N/A
Maximum I/O per Pair 5 868N/AN/A
FG(G)484
LX VCCO/GND Pairs 10 10 11 11 N/A N/A
Maximum I/O per Pair 6 898N/AN/A
LXT VCCO/GND Pairs 6 10 11 10 N/A N/A
Maximum I/O per Pair 7 878N/AN/A
FG(G)676
LX45 VCCO/GND Pairs 12 15 10 16 N/A N/A
Maximum I/O per Pair 3 787N/AN/A
LX75, LX100, LX150 VCCO/GND Pairs 12 91010 6 6
Maximum I/O per Pair 9 10 9 989
LXT VCCO/GND Pairs 10 810877
Maximum I/O per Pair 8 78877
FG(G)900
LX VCCO/GND Pairs 17 14 17 14 7 8
Maximum I/O per Pair 7 67876
LXT VCCO/GND Pairs 15 14 13 14 7 8
Maximum I/O per Pair 7 68876
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 38
Tabl e 3 4 : SSO Limit per VCCO/GND Pair
VCCO I/O Standard Drive Slew
SSO Limit per VCCO/GND Pair
All TQG144, CPG196,
CSG225, FT(G)256, and
LX devices in CSG324
All CS(G)484, FG(G)484,
FG(G)676, FG(G)900, and
LXT devices in CSG324
Bank 0/2 Bank 1/3 Bank 0/2 Bank 1/3/4/5
1.2V LVCMOS12, LVCMOS12_JEDEC
2
Fast 30 (1) 35 30 35
Slow 51 55 51 52
QuietIO 71 58 71 70
4
Fast 17 17 17 19
Slow 23 25 23 22
QuietIO 35 32 35 32
6
Fast 13 15 13 14
Slow 19 20 19 17
QuietIO 26 24 26 24
8
Fast N/A 12 N/A 12
Slow N/A 15 N/A 13
QuietIO N/A 20 N/A 19
12
Fast N/A 5 N/A 4
Slow N/A 8 N/A 5
QuietIO N/A 11 N/A 10
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 39
1.5V
LVCMOS15, LVCMOS15_JEDEC
2
Fast 33 40 33 41
Slow 57 62 57 56
QuietIO 70 67 70 66
4
Fast 19 21 19 21
Slow 30 30 30 24
QuietIO 38 33 38 30
6
Fast 14 16 14 16
Slow 18 19 18 17
QuietIO 27 24 27 21
8
Fast 11 13 11 12
Slow 16 16 16 14
QuietIO 23 20 23 17
12
Fast N/A 5 N/A 4
Slow N/A 8 N/A 5
QuietIO N/A 10 N/A 9
16
Fast N/A 5 N/A 4
Slow N/A 8 N/A 8
QuietIO N/A 10 N/A 9
HSTL_I 9 10 9 10
HSTL_II N/A 5 N/A 6
HSTL_III 7 9 7 9
DIFF_HSTL_I 27 30 27 30
DIFF_HSTL_II N/A 15 N/A 18
DIFF_HSTL_III 21 27 21 27
SSTL_15_II (3) N/A 5 N/A 4
DIFF_SSTL_15_II (3) N/A 15 N/A 12
Tabl e 3 4 : SSO Limit per VCCO/GND Pair (Cont’d)
VCCO I/O Standard Drive Slew
SSO Limit per VCCO/GND Pair
All TQG144, CPG196,
CSG225, FT(G)256, and
LX devices in CSG324
All CS(G)484, FG(G)484,
FG(G)676, FG(G)900, and
LXT devices in CSG324
Bank 0/2 Bank 1/3 Bank 0/2 Bank 1/3/4/5
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 40
1.8V
LVCMOS18, LVCMOS18_JEDEC
2
Fast 39 46 39 47
Slow 65 75 65 74
QuietIO 80 80 80 85
4
Fast 22 25 22 25
Slow 38 36 38 29
QuietIO 45 40 45 35
6
Fast 16 18 16 17
Slow 27 25 27 19
QuietIO 30 28 30 23
8
Fast 13 15 13 14
Slow 16 18 16 16
QuietIO 25 22 25 18
12
Fast 5 7 5 5
Slow 7 8 7 6
QuietIO 11 10 11 8
16
Fast 4 5 4 4
Slow 7 8 7 5
QuietIO 11 10 11 8
24
Fast N/A 5 N/A 3
Slow N/A 8 N/A 8
QuietIO N/A 10 N/A 8
HSTL_I_18 9 10 9 9
HSTL_II_18 N/A 5 N/A 6
HSTL_III_18 9 10 9 11
DIFF_HSTL_I_18 27 30 27 27
DIFF_HSTL_II_18 N/A 15 N/A 18
DIFF_HSTL_III_18 27 30 27 33
MOBILE_DDR (3) 12 14 12 14
DIFF_MOBILE_DDR (3) 36 42 36 42
SSTL_18_I (3) 9109 10
SSTL_18_II (3) N/A 5 N/A 4
DIFF_SSTL_18_I (3) 27 30 27 30
DIFF_SSTL_18_II (3) N/A 15 N/A 12
Tabl e 3 4 : SSO Limit per VCCO/GND Pair (Cont’d)
VCCO I/O Standard Drive Slew
SSO Limit per VCCO/GND Pair
All TQG144, CPG196,
CSG225, FT(G)256, and
LX devices in CSG324
All CS(G)484, FG(G)484,
FG(G)676, FG(G)900, and
LXT devices in CSG324
Bank 0/2 Bank 1/3 Bank 0/2 Bank 1/3/4/5
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 41
2.5V
LVCM OS2 5
2
Fast 38 43 38 43
Slow 46 52 46 48
QuietIO 57 64 57 59
4
Fast 21 24 21 23
Slow 26 31 26 27
QuietIO 33 32 33 30
6
Fast 15 17 15 16
Slow 19 22 19 19
QuietIO 25 23 25 19
8
Fast 12 15 12 14
Slow 15 18 15 16
QuietIO 21 19 21 16
12
Fast 1 3 1 1
Slow 2 7 2 4
QuietIO 3 8 3 8
16
Fast 1 3 1 1
Slow 3 7 3 3
QuietIO 4 9 4 8
24
Fast N/A 3 N/A 1
Slow N/A 5 N/A 2
QuietIO N/A 8 N/A 6
SSTL_2_I (3) 10 11 10 11
SSTL_2_II (3) N/A 7 N/A 7
DIFF_SSTL_2_I (3) 30 33 30 33
DIFF_SSTL_2_II (3) N/A 21 N/A 24
Tabl e 3 4 : SSO Limit per VCCO/GND Pair (Cont’d)
VCCO I/O Standard Drive Slew
SSO Limit per VCCO/GND Pair
All TQG144, CPG196,
CSG225, FT(G)256, and
LX devices in CSG324
All CS(G)484, FG(G)484,
FG(G)676, FG(G)900, and
LXT devices in CSG324
Bank 0/2 Bank 1/3 Bank 0/2 Bank 1/3/4/5
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 42
3.3V LVCMOS33
2
Fast 42 46 42 44
Slow 50 55 50 49
QuietIO 60 68 60 60
4
Fast 21 27 21 25
Slow 32 37 32 32
QuietIO 39 42 39 37
6
Fast 14 19 14 17
Slow 19 25 19 22
QuietIO 29 30 29 25
8
Fast 11 15 11 14
Slow 15 20 15 18
QuietIO 25 24 25 20
12
Fast 1 3 1 1
Slow 2 5 2 2
QuietIO 4 9 4 7
16
Fast 1 2 1 1
Slow 1 5 1 1
QuietIO 3 10 3 8
24
Fast 1 2 1 1
Slow 2 5 2 1
QuietIO 7 9 7 7
Tabl e 3 4 : SSO Limit per VCCO/GND Pair (Cont’d)
VCCO I/O Standard Drive Slew
SSO Limit per VCCO/GND Pair
All TQG144, CPG196,
CSG225, FT(G)256, and
LX devices in CSG324
All CS(G)484, FG(G)484,
FG(G)676, FG(G)900, and
LXT devices in CSG324
Bank 0/2 Bank 1/3 Bank 0/2 Bank 1/3/4/5
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 43
3.3V
LVTT L
2
Fast 53 65 53 62
Slow 70 80 70 73
QuietIO 79 89 79 91
4
Fast 23 30 23 27
Slow 34 41 34 37
QuietIO 44 49 44 46
6
Fast 16 21 16 20
Slow 21 28 21 25
QuietIO 34 39 34 34
8
Fast 12 16 12 15
Slow 16 22 16 19
QuietIO 27 28 27 24
12
Fast 1 3 1 1
Slow 2 5 2 4
QuietIO 2 10 2 8
16
Fast 1 3 1 1
Slow 1 7 1 2
QuietIO 3 11 3 8
24
Fast 1 2 1 1
Slow 2 5 2 2
QuietIO 8 9 8 8
PCI33_3 18 19 18 19
PCI66_3 18 19 18 19
SSTL_3_I 585 8
SSTL_3_II 3 5 3 3
DIFF_SSTL_3_I 15 24 15 24
DIFF_SSTL_3_II 9 15 9 9
SDIO 17 18 17 15
Tabl e 3 4 : SSO Limit per VCCO/GND Pair (Cont’d)
VCCO I/O Standard Drive Slew
SSO Limit per VCCO/GND Pair
All TQG144, CPG196,
CSG225, FT(G)256, and
LX devices in CSG324
All CS(G)484, FG(G)484,
FG(G)676, FG(G)900, and
LXT devices in CSG324
Bank 0/2 Bank 1/3 Bank 0/2 Bank 1/3/4/5
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 44
Various
LVDS_33 16 N/A 16 N/A
LVDS_25 20 N/A 20 N/A
BLVDS_25 20 48 20 20
MINI_LVDS_33 13 N/A 13 N/A
MINI_LVDS_25 18 N/A 18 N/A
RSDS_33 12 N/A 12 N/A
RSDS_25 15 N/A 15 N/A
TMDS_33 83 N/A 83 N/A
PPDS_33 12 N/A 12 N/A
PPDS_25 16 N/A 16 N/A
DISPLAY_PORT 42 40 42 30
I2C 47 55 47 42
SMBUS 44 52 44 40
Notes:
1. SSO limits greater than the number of I/O per VCCO/GND pair (Ta b le 3 3 ) indicate No Limit for the given I/O standard. They are provided in
this table to calculate limits when using multiple I/O standards in a bank.
2. Not available (N/A) indicates that the I/O standard is not available in the given bank.
3. When used with the MCB, these signals are exempt from SSO analysis due to the known activity of the MCB switching patterns. SSO
performance is validated for all MCB instances. MCB outputs can, in some cases, exceed the SSO limits.
Tabl e 3 4 : SSO Limit per VCCO/GND Pair (Cont’d)
VCCO I/O Standard Drive Slew
SSO Limit per VCCO/GND Pair
All TQG144, CPG196,
CSG225, FT(G)256, and
LX devices in CSG324
All CS(G)484, FG(G)484,
FG(G)676, FG(G)900, and
LXT devices in CSG324
Bank 0/2 Bank 1/3 Bank 0/2 Bank 1/3/4/5
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 45
Input/Output Logic Switching Characteristics
Tabl e 3 5 : ILOGIC2 Switching Characteristics
Symbol Description Speed Grade Units
-3 -3N -2 -1L
Setup/Hold
TICE0CK/TICKCE0 CE0 pin Setup/Hold with respect to CLK 0.56/
–0.30
0.56/
–0.25
0.79/
–0.22
1.21/
–0.52
ns
TISRCK/TICKSR SR pin Setup/Hold with respect to CLK 0.74/
–0.23
0.74/
–0.22
0.98/
–0.20
1.31/
–0.45
ns
TIDOCK/TIOCKD D pin Setup/Hold with respect to CLK without Delay 1.19/
–0.83
1.36/
–0.83
1.73/
–0.83
2.18/
–1.77
ns
TIDOCKD/TIOCKDD DDLY pin Setup/Hold with respect to CLK (using IODELAY2) 0.31/
0.00
0.47/
0.00
0.54/
0.00
0.63/
–0.39
ns
Combinatorial
TIDI D pin to O pin propagation delay, no Delay 0.95 1.28 1.53 2.25 ns
TIDID DDLY pin to O pin propagation delay (using IODELAY2) 0.23 0.39 0.44 0.74 ns
Sequential Delays
TIDLO D pin to Q pin using flip-flop as a latch without Delay 1.56 1.86 2.39 3.49 ns
TIDLOD DDLY pin to Q1 pin using flip-flop as a latch (using IODELAY2) 0.68 0.97 1.20 1.94 ns
TICKQ CLK to Q outputs for XC devices(1) 1.03 1.24 1.43 2.11 ns
CLK to Q outputs for XA and XQ devices 1.38 N/A 1.78 2.11 ns
TRQ_ILOGIC2 SR pin to Q outputs 1.81 1.81 2.50 3.05 ns
Notes:
1. For IDDR2 configuration; see TRACE reports for SDR timing.
Tabl e 3 6 : OLOGIC2 Switching Characteristics
Symbol Description Speed Grade Units
-3 -3N -2 -1L
Setup/Hold
TODCK/TOCKD D1/D2 pins Setup/Hold with respect to CLK 0.81/
–0.05
0.86/
–0.05
1.18/
0.00
1.73/
–0.27
ns
TOOCECK/TOCKOCE OCE pin Setup/Hold with respect to CLK 0.75/
–0.10
0.75/
–0.10
1.01/
–0.05
1.66/
–0.23
ns
TOSRCK/TOCKSR SR pin Setup/Hold with respect to CLK 0.70/
–0.28
0.79/
–0.28
1.03/
–0.23
1.39/
–0.47
ns
TOTCK/TOCKT T1/T2 pins Setup/Hold with respect to CLK 0.24/
–0.08
0.56/
–0.06
0.83/
–0.01
0.99/
–0.19
ns
TOTCECK/TOCKTCE TCE pin Setup/Hold with respect to CLK 0.58/
–0.06
0.72/
–0.06
1.18/
–0.01
1.51/
–0.13
ns
Sequential Delays
TOCKQ CLK to OQ/TQ out for XC devices(1) 0.48 0.51 0.74 0.74 ns
CLK to OQ/TQ out for XA and XQ devices 0.85 N/A 1.16 0.74 ns
TRQ_OLOGIC2 SR pin to OQ/TQ out 1.81 1.81 2.50 3.05 ns
Notes:
1. For ODDR2 configuration; see TRACE reports for SDR timing.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 46
Input Serializer/Deserializer Switching Characteristics
Output Serializer/Deserializer Switching Characteristics
Tabl e 3 7 : ISERDES2 Switching Characteristics
Symbol Description Speed Grade Units
-3 -3N -2 -1L
Setup/Hold for Control Lines
TISCCK_BITSLIP/ TISCKC_BITSLIP BITSLIP pin Setup/Hold with respect to CLKDIV 0.16/
–0.09
0.20/
–0.09
0.31/
–0.09
0.34/
–0.14
ns
TISCCK_CE / TISCKC_CE CE pin Setup/Hold with respect to CLK 0.71/
–0.47
0.71/
–0.42
0.97/
–0.42
1.39/
–0.71
ns
Setup/Hold for Data Lines
TISDCK_D /TISCKD_D D pin Setup/Hold with respect to CLK 0.24/
–0.15
0.25/
–0.05
0.29/
–0.05
0.09/
–0.05
ns
TISDCK_DDLY /TISCKD_DDLY DDLY pin Setup/Hold with respect to CLK (using
IODELAY2)
–0.25/
0.30
–0.25/
0.42
–0.25/
0.56
–0.54/
0.67
ns
TISDCK_D_DDR /TISCKD_D_DDR D pin Setup/Hold with respect to CLK at DDR mode –0.03/
0.04
–0.03/
0.16
–0.03/
0.18
–0.05/
0.12
ns
TISDCK_DDLY_DDR/
TISCKD_DDLY_DDR
D pin Setup/Hold with respect to CLK at DDR mode
(using IODELAY2)
–0.40/
0.48
–0.40/
0.53
–0.40/
0.71
–0.71/
0.86
ns
Sequential Delays
TISCKO_Q CLKDIV to out at Q pin 1.30 1.44 2.02 2.22 ns
FCLKDIV CLKDIV maximum frequency 270 262.5 250 125 MHz
Tabl e 3 8 : OSERDES2 Switching Characteristics
Symbol Description Speed Grade Units
-3 -3N -2 -1L
Setup/Hold
TOSDCK_D/TOSCKD_D D input Setup/Hold with respect to CLKDIV –0.03/
1.02
–0.03/
1.17
–0.03/
1.27
–0.02/
0.23
ns
TOSDCK_T/TOSCKD_T(1) T input Setup/Hold with respect to CLK –0.05/
1.03
–0.05/
1.13
–0.05/
1.23
–0.05/
0.24
ns
TOSCCK_OCE/TOSCKC_OCE OCE input Setup/Hold with respect to CLK 0.12/
–0.03
0.15/
–0.03
0.24/
–0.03
0.28/
–0.17
ns
TOSCCK_TCE/TOSCKC_TCE TCE input Setup/Hold with respect to CLK 0.14/
–0.08
0.17/
–0.08
0.27/
–0.08
0.31/
–0.16
ns
Sequential Delays
TOSCKO_OQ Clock to out from CLK to OQ 0.94 1.11 1.51 1.89 ns
TOSCKO_TQ Clock to out from CLK to TQ 0.94 1.11 1.51 1.91 ns
FCLKDIV CLKDIV maximum frequency 270 262.5 250 125 MHz
Notes:
1. TOSDCK_T2/TOSCKD_T2 (T input setup/hold with respect to CLKDIV) are reported as TOSDCK_T/TOSCKD_T in TRACE report.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 47
Input/Output Delay Switching Characteristics
Tabl e 3 9 : IODELAY2 Switching Characteristics
Symbol Description Speed Grade Units
-3 -3N -2 -1L(3)
TIODCCK_CAL / TIODCKC_CAL CAL pin Setup/Hold with respect to CK 0.28/
–0.13
0.33/
–0.13
0.48/
–0.13
N/A ns
TIODCCK_CE / TIODCKC_CE CE pin Setup/Hold with respect to CK 0.17/
–0.03
0.17/
–0.03
0.25/
–0.02
N/A ns
TIODCCK_INC/ TIODCKC_INC INC pin Setup/Hold with respect to CK 0.10/
0.02
0.12/
0.03
0.18/
0.06
N/A ns
TIODCCK_RST/ TIODCKC_RST RST pin Setup/Hold with respect to CK 0.12/
–0.02
0.15/
–0.02
0.22/
–0.01
N/A ns
TTAP1(2) Maximum tap 1 delay 8 14 16 N/A ps
TTAP2 Maximum tap 2 delay 40 66 77 N/A ps
TTAP3 Maximum tap 3 delay 95 120 140 N/A ps
TTAP4 Maximum tap 4 delay 108 141 166 N/A ps
TTAP5 Maximum tap 5 delay 171 194 231 N/A ps
TTAP6 Maximum tap 6 delay 207 249 292 N/A ps
TTAP7 Maximum tap 7 delay 212 276 343 N/A ps
TTAP8 Maximum tap 8 delay 322 341 424 N/A ps
FMINCAL Minimum allowed bit rate for calibration in variable
mode: VARIABLE_FROM_ZERO,
VARIABLE_FROM_HALF_MAX, and
DIFF_PHASE_DETECTOR.
188 188 188 N/A Mb/s
TIODDO_IDATAIN Propagation delay through IODELAY2 Note 1 Note 1 Note 1 Note 3
TIODDO_ODATAIN Propagation delay through IODELAY2 Note 1 Note 1 Note 1 Note 3
Notes:
1. Delay depends on IODELAY2 tap setting. See TRACE report for actual values.
2. Maximum tap delay = integer (number of taps/8) ×TTA P 8 +T
TA Pn (where n equals the remainder). For minimum delay consult the TRACE
setup and hold report. Minimum delay is typically greater than 30% of the maximum delay. Tap delays can vary by device and overall
conditions. See TRACE report for actual values.
3. Spartan-6 -1L devices only support tap 0. See TRACE report for actual values.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 48
CLB Switching Characteristics (SLICEM Only)
Tabl e 4 0 : CLB Switching Characteristics (SLICEM Only)
Symbol Description Speed Grade Units
-3 -3N -2 -1L
Combinatorial Delays
TILO An – Dn LUT inputs to A to D outputs 0.21 0.26 0.26 0.46 ns, Max
An – Dn LUT inputs through F7AMUX/F7BMUX to
AMUX/CMUX output
0.37 0.43 0.43 0.77 ns, Max
TOPAB An Dn LUT inputs through F7AMUX or F7BMUX and F8MUX
to BMUX output
0.37 0.46 0.46 0.84 ns, Max
TITO An Dn LUT inputs through latch to AQ – DQ outputs 0.82 0.95 0.95 1.64 ns, Max
TTITO_LOGIC An – Dn LUT inputs to AQ – DQ outputs (latch as logic) 0.82 0.95 0.95 1.64 ns, Max
TOPCYA An LUT inputs to COUT output 0.38 0.48 0.48 0.69 ns, Max
TOPCYB Bn LUT inputs to COUT output 0.38 0.49 0.49 0.71 ns, Max
TOPCYC Cn LUT inputs to COUT output 0.28 0.33 0.33 0.55 ns, Max
TOPCYD Dn LUT inputs to COUT output 0.28 0.35 0.35 0.52 ns, Max
TAXCY AX input to COUT output 0.21 0.26 0.26 0.36 ns, Max
TBXCY BX input to COUT output 0.13 0.16 0.16 0.18 ns, Max
TCXCY CX input to COUT output 0.10 0.12 0.12 0.09 ns, Max
TDXCY DX input to COUT output 0.09 0.11 0.11 0.09 ns, Max
TBYP CIN input to COUT output 0.08 0.10 0.10 0.06 ns, Max
TCINA CIN input to AMUX output 0.21 0.22 0.22 0.47 ns, Max
TCINB CIN input to BMUX output 0.30 0.31 0.31 0.57 ns, Max
TCINC CIN input to CMUX output 0.29 0.31 0.31 0.58 ns, Max
TCIND CIN input to DMUX output 0.31 0.32 0.32 0.68 ns, Max
Sequential Delays
TCKO Clock to AQ – DQ outputs 0.45 0.53 0.53 0.74 ns, Max
Setup and Hold Times of CLB Flip-Flops Before/After Clock CLK
TDICK/TCKDI AX – DX input to CLK on A – D flip-flops 0.42/
0.28
0.47/
0.39
0.47/
0.39
0.90/
0.56
ns, Min
TCECK/TCKCE CE input to CLK on A – D flip-flops 0.31/
–0.07
0.37/
–0.07
0.37/
–0.07
0.59/
–0.27
ns, Min
TSRCK/TCKSR SR input to CLK on A – D flip-flops for XC devices 0.41/
0.02
0.42/
0.02
0.42/
0.02
0.68/
–0.29
ns, Min
SR input to CLK on A – D flip-flops for XA and XQ devices 0.41/
0.02
N/A 0.44/
0.02
0.68/
–0.29
ns, Min
TCINCK/TCKCIN CIN input to CLK on A – D flip-flops 0.31/
–0.17
0.31/
–0.13
0.31/
–0.13
0.81/
–0.42
ns, Min
Set/Reset
TRPW SR input minimum pulse width 0.41 0.48 0.48 1.37 ns, Min
TRQ Delay from SR input to AQ – DQ flip-flops 0.60 0.70 0.70 0.88 ns, Max
TCEO Delay from CE input to AQ – DQ flip-flops 0.60 0.65 0.65 0.90 ns, Max
FTOG Toggle frequency (for export control) 862 806 667 500 MHz
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 49
CLB Distributed RAM Switching Characteristics (SLICEM Only)
CLB Shift Register Switching Characteristics (SLICEM Only)
Tabl e 4 1 : CLB Distributed RAM Switching Characteristics (SLICEM Only)
Symbol Description Speed Grade Units
-3 -3N -2 -1L
Sequential Delays
TSHCKO Clock to A – D outputs 1.26 1.55 1.55 2.35 ns, Max
Clock to A – D outputs (direct output path) 0.96 1.20 1.20 1.87 ns, Max
Setup and Hold Times Before/After Clock CLK
TDS/TDH AX – DX or AI – DI inputs to CLK 0.59/
0.17
0.73/
0.22
0.73/
0.22
1.17/
0.33
ns, Min
TAS/TAH Address An inputs to clock for XC devices 0.28/
0.35
0.32/
0.42
0.32/
0.42
0.26/
0.71
ns, Min
Address An inputs to clock for XA and XQ devices 0.28/
0.51
N/A 0.32/
0.51
0.26/
0.71
ns, Min
TWS/TWH WE input to clock 0.31/
–0.08
0.37/
–0.08
0.37/
–0.08
0.59/
–0.27
ns, Min
TCECK/TCKCE CE input to CLK 0.31/
–0.08
0.37/
–0.08
0.37/
–0.08
0.59/
–0.27
ns, Min
Tabl e 4 2 : CLB Shift Register Switching Characteristics
Symbol Description Speed Grade Units
-3 -3N -2 -1L
Sequential Delays
TREG Clock to A – D outputs 1.35 1.78 1.78 2.74 ns, Max
Clock to A – D outputs (direct output path) 1.24 1.65 1.65 2.48 ns, Max
Setup and Hold Times Before/After Clock CLK
TWS/TWH WE input to CLK 0.20/
–0.07
0.24/
–0.07
0.24/
–0.07
0.29/
–0.27
ns, Min
TCECK/TCKCE CE input to CLK for XC devices 0.30/
0.30
0.30/
0.38
0.30/
0.38
0.82/
–0.41
ns, Min
CE input to CLK for XA and XQ devices 0.32/
0.30
N/A 0.40/
0.38
0.82/
–0.41
ns, Min
TDS/TDH AX – DX or AI – DI inputs to CLK 0.07/
0.11
0.09/
0.14
0.09/
0.14
0.11/
0.23
ns, Min
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 50
Block RAM Switching Characteristics
Tabl e 4 3 : Block RAM Switching Characteristics
Symbol Description Speed Grade Units
-3 -3N -2 -1L
Block RAM Clock to Out Delays
TRCKO_DO Clock CLK to DOUT output (without output register)(1) 1.85 2.10 2.10 3.50 ns, Max
TRCKO_DO_REG Clock CLK to DOUT output (with output register)(2) 1.60 1.75 1.75 2.30 ns, Max
Setup and Hold Times Before/After Clock CLK
TRCCK_ADDR/TRCKC_ADDR ADDR inputs for XC devices(3) 0.35/
0.10
0.40/
0.12
0.40/
0.12
0.50/
0.15
ns, Min
ADDR inputs for XA and XQ devices(3) 0.35/
0.17
N/A 0.40/
0.17
0.50/
0.15
ns, Min
TRDCK_DI/TRCKD_DI DIN inputs(4) 0.30/
0.10
0.30/
0.10
0.30/
0.10
0.40/
0.15
ns, Min
TRCCK_EN/TRCKC_EN Block RAM Enable (EN) input 0.22/
0.05
0.25/
0.06
0.25/
0.06
0.44/
0.10
ns, Min
TRCCK_REGCE/TRCKC_REGCE CE input of output register 0.20/
0.10
0.20/
0.10
0.20/
0.10
0.28/
0.15
ns, Min
TRCCK_WE/TRCKC_WE Write Enable (WE) input 0.25/
0.10
0.33/
0.10
0.33/
0.10
0.28/
0.15
ns, Min
Maximum Frequency
FMAX Block RAM in all modes 320 280 280 150 MHz
Notes:
1. TRCKO_DO includes TRCKO_DOA and TRCKO_DOPA as well as the B port equivalent timing parameters.
2. TRCKO_DO_REG includes TRCKO_DOA_REG and TRCKO_DOPA_REG as well as the B port equivalent timing parameters.
3. The ADDR setup and hold must be met when EN is asserted (even when WE is deasserted). Otherwise, block RAM data corruption is possible.
4. TRDCK_DI includes both A and B inputs as well as the parity inputs of A and B.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 51
DSP48A1 Switching Characteristics
Tabl e 4 4 : DSP48A1 Switching Characteristics
Symbol Description Pre-
adder Multiplier Post-
adder
Speed Grade Units
-3 -3N -2 -1L
Setup and Hold Times of Data/Control Pins to the Input Register Clock
TDSPDCK_A_A1REG/
TDSPCKD_A_A1REG
A input to A1 register CLK N/A N/A N/A 0.15/
0.09
0.17/
0.09
0.17/
0.09
0.32/
0.09
ns
TDSPDCK_D_B1REG/
TDSPCKD_D_B1REG
D input to B1 register CLK Yes N/A N/A 1.90/
–0.07
1.95/
–0.07
1.95/
–0.07
2.82/
–0.07
ns
TDSPDCK_C_CREG/
TDSPCKD_C_CREG
C input to C register CLK
for XC devices N/A N/A N/A
0.11/
0.15
0.13/
0.15
0.13/
0.15
0.24/
0.09 ns
C input to C register CLK
for XA and XQ devices
0.11/
0.19 N/A 0.13/
0.23
0.24/
0.09
TDSPDCK_D_DREG/
TDSPCKD_D_DREG
D input to D register CLK
for XC devices N/A N/A N/A
0.09/
0.15
0.10/
0.15
0.10/
0.15
0.19/
0.12 ns
D input to D register CLK
for XA and XQ devices
0.09/
0.23 N/A 0.10/
0.27
0.19/
0.12
TDSPDCK_OPMODE_B1REG/
TDSPCKD_OPMODE_B1REG
OPMODE input to B1 register CLK Yes N/A N/A 1.97/
0.01
2.00/
0.01
2.00/
0.01
2.85/
0.01
ns
TDSPDCK_OPMODE_OPMODEREG/
TDSPCKD_OPMODE_OPMODEREG
OPMODE input to OPMODE
register CLK for XC devices
N/A N/A N/A
0.18/
0.12
0.21/
0.12
0.21/
0.12
0.40/
0.12
ns
OPMODE input to OPMODE
register CLK for XA and XQ
devices
0.18/
0.16 N/A 0.21/
0.22
0.40/
0.12
Setup and Hold Times of Data Pins to the Pipeline Register Clock
TDSPDCK_A_MREG/
TDSPCKD_A_MREG
A input to M register CLK N/A Yes N/A 3.06/
–0.40
3.51/
–0.40
3.51/
–0.40
3.97/
–0.40
ns
TDSPDCK_B_MREG/
TDSPCKD_B_MREG
B input to M register CLK Yes Yes N/A 3.96/
–0.68
4.58/
–0.68
4.58/
–0.68
7.00/
–0.68
ns
TDSPDCK_D_MREG/
TDSPCKD_D_MREG
D input to M register CLK Yes Yes N/A 4.23/
–0.56
4.80/
–0.56
4.80/
–0.56
6.84/
–0.56
ns
TDSPDCK_OPMODE_MREG/
TDSPCKD_OPMODE_MREG
OPMODE to M register CLK Yes Yes N/A 4.18/
–0.48
4.80/
–0.48
4.80/
–0.48
6.88/
–0.48
ns
No Yes N/A 2.37/
–0.48
2.70/
–0.48
2.70/
–0.48
4.28/
–0.48
ns
Setup and Hold Times of Data/Control Pins to the Output Register Clock
TDSPDCK_A_PREG/
TDSPCKD_A_PREG
A input to P register CLK N/A Yes Yes 4.32/
–0.76
5.06/
–0.76
5.06/
–0.76
7.52/
–0.76
ns
TDSPDCK_B_PREG/
TDSPCKD_B_PREG
B input to P register CLK Yes Yes Yes 5.87/
–0.59
6.87/
–0.59
6.87/
–0.59
10.55/
–0.59
ns
No Yes Yes 4.14/
–0.93
4.68/
–0.93
4.68/
–0.93
8.12/
–0.93
ns
TDSPDCK_C_PREG/
TDSPCKD_C_PREG
C input to P register CLK N/A N/A Yes 2.20/
–0.23
2.25/
–0.23
2.25/
–0.23
3.27/
–0.23
ns
TDSPDCK_D_PREG/
TDSPCKD_D_PREG
D input to P register CLK Yes Yes Yes 5.90/
–0.92
6.91/
–0.92
6.91/
–0.92
10.39/
–0.92
ns
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 52
TDSPDCK_OPMODE_PREG/
TDSPCKD_OPMODE_PREG
OPMODE input to P register CLK Yes Yes Yes 6.21/
–0.84
7.27/
–0.84
7.27/
–0.84
10.43/
–0.84
ns
No Yes Yes 1.69/
–0.87
1.98/
–0.87
1.98/
–0.87
3.62/
–0.87
ns
No No Yes 2.09/
–0.22
2.30/
–0.22
2.30/
–0.22
3.79/
–0.22
ns
Clock to Out from Output Register Clock to Output Pin
TDSPCKO_P_PREG CLK (PREG) to P output N/A N/A N/A 1.20 1.34 1.34 1.90 ns
Clock to Out from Pipeline Register Clock to Output Pins
TDSPCKO_P_MREG CLK (MREG) to P output N/A N/A Yes 3.38 3.95 3.95 5.83 ns
Clock to Out from Input Register Clock to Output Pins
TDSPCKO_P_A1REG CLK (A1REG) to P output N/A Yes Yes 5.02 5.87 5.87 9.65 ns
TDSPCKO_P_B1REG CLK (B1REG) to P output N/A Yes Yes 5.02 5.87 5.87 9.63 ns
TDSPCKO_P_CREG CLK (CREG) to P output N/A N/A Yes 3.12 3.64 3.64 5.24 ns
TDSPCKO_P_DREG CLK (DREG) to P output Yes Yes Yes 6.77 7.92 7.92 12.53 ns
Combinatorial Delays from Input Pins to Output Pins
TDSPDO_A_P A input to P output N/A No Yes 2.85 3.33 3.33 4.73 ns
N/A Yes No(2) 3.35 3.93 3.93 6.74 ns
N/A Yes Yes 4.56 5.22 5.22 8.94 ns
TDSPDO_B_P B input to P output Yes No No(2) 3.22 3.76 3.76 5.55 ns
Ye s Ye s N o (2) 6.01 6.54 6.54 9.76 ns
Yes Yes Yes 6.27 7.34 7.34 11.96 ns
TDSPDO_C_P C input to P output N/A N/A Yes 2.69 3.15 3.15 4.68 ns
TDSPDO_D_P D input to P output Yes Yes Yes 6.31 7.38 7.38 11.81 ns
TDSPDO_OPMODE_P OPMODE input to P output Yes Yes Yes 6.43 7.52 7.52 11.84 ns
No Yes Yes 4.84 5.66 5.66 9.25 ns
No No Yes 3.11 3.49 3.49 5.03 ns
Maximum Frequency
FMAX All registers used Yes Yes Yes 390 333 333 213 MHz
Notes:
1. A Yes signifies that the component is in the path. A No signifies that the component is being bypassed. N/A signifies not applicable because
no path exists.
2. Implemented in the post-adder by adding to zero.
Tabl e 4 4 : DSP48A1 Switching Characteristics (Cont’d)
Symbol Description Pre-
adder Multiplier Post-
adder
Speed Grade Units
-3 -3N -2 -1L
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 53
Tabl e 4 5 : Device DNA Interface Port Switching Characteristics
Symbol Description Speed Grade Units
-3 -3N -2 -1L
TDNASSU
(TDNADCK_SHIFT)
Setup time on SHIFT before the rising edge of CLK 7ns, Min
TDNASH
(TDNACKD_SHIFT)
Hold time on SHIFT after the rising edge of CLK 1ns, Min
TDNADSU
(TDNADCK_DIN)
Setup time on DIN before the rising edge of CLK 7ns, Min
TDNADH
(TDNACKD_DIN)
Hold time on DIN after the rising edge of CLK 1ns, Min
TDNARSU
(TDNADCK_READ)Setup time on READ before the rising edge of CLK 7ns, Min
1,000 ns, Max
TDNARH
(TDNACKD_READ)Hold time on READ after the rising edge of CLK 1 ns, Min
TDNADCKO
(TDNACKO_DOUT)Clock-to-output delay on DOUT after rising edge of CLK 0.5 ns, Min
6ns, Max
TDNACLKF(2) CLK frequency 2 MHz, Max
TDNACLKL CLK Low time 50 ns, Min
TDNACLKH CLK High time 50 ns, Min
Notes:
1. The minimum READ pulse width is 8 ns, the maximum READ pulse width is 1 µs.
2. Also applies to TCK when reading DNA through the boundary-scan port.
Tabl e 4 6 : Suspend Mode Switching Characteristics
Symbol Description Min Max Units
Entering Suspend Mode
TSUSPENDHIGH_AWAKE Rising edge of SUSPEND pin to falling edge of AWAKE pin without glitch filter 2.5 14 ns
TSUSPENDFILTER Adjustment to SUSPEND pin rising edge parameters when glitch filter enabled 31 430 ns
TSUSPEND_GWE Rising edge of SUSPEND pin until FPGA output pins drive their defined
SUSPEND constraint behavior (without glitch filter)
–15ns
TSUSPEND_GTS Rising edge of SUSPEND pin to write-protect lock on all writable clocked
elements (without glitch filter)
–15ns
TSUSPEND_DISABLE Rising edge of the SUSPEND pin to FPGA input pins and interconnect
disabled (without glitch filter)
1500 ns
Exiting Suspend Mode
TSUSPENDLOW_AWAKE Falling edge of the SUSPEND pin to rising edge of the AWAKE pin. Does not
include DCM or PLL lock time.
775µs
TSUSPEND_ENABLE Falling edge of the SUSPEND pin to FPGA input pins and interconnect re-
enabled
741µs
TAWAKE_GWE1 Rising edge of the AWAKE pin until write-protect lock released on all writable
clocked elements, using sw_clk:InternalClock and sw_gwe_cycle:1.
–80ns
TAWAKE_GWE512 Rising edge of the AWAKE pin until write-protect lock released on all writable
clocked elements, using sw_clk:InternalClock and sw_gwe_cycle:512.
–20.5µs
TAWAKE_GTS1 Rising edge of the AWAKE pin until outputs return to the behavior described in
the FPGA application, using sw_clk:InternalClock and sw_gts_cycle:1.
–80ns
TAWAKE_GTS512 Rising edge of the AWAKE pin until outputs return to the behavior described in
the FPGA application, using sw_clk:InternalClock and sw_gts_cycle:512.
–20.5µs
TSCP_AWAKE Rising edge of SCP pins to rising edge of AWAKE pin 7 75 µs
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 54
Configuration Switching Characteristics
Tabl e 4 7 : Configuration Switching Characteristics(1)
Symbol Description Speed Grade Units
-3 -3N -2 -1L
Power-up Timing Characteristics
TPL(2) PROGRAM_B Latency 4 4 4 5 ms, Max
TPOR(2) Power-on reset (50 ms ramp time)(3) 5/30 5/34 5/40 5/40 ms, Min/Max
Power-on reset (10 ms ramp time) 5/25 5/29 5/35 5/40 ms, Min/Max
TPROGRAM PROGRAM_B Pulse Width 500 500 500 500 ns, Min
Slave Serial Mode Programming Switching
TDCCK/TCCKD DIN Setup/Hold, slave mode 6.0/1.0 6.0/1.0 6.0/1.0 8.0/2.0 ns, Min
TCCO CCLK to DOUT 12 12 12 17 ns, Max
FSCCK Slave mode external CCLK 80 80 80 50 MHz, Max
Slave SelectMAP Mode Programming Switching
TSMDCCK/TSMCCKD SelectMAP Data Setup/Hold 6.0/1.0 6.0/1.0 6.0/1.0 8.0/2.0 ns, Min
TSMCSCCK/TSMCCKCS CSI_B Setup/Hold 7.0/0.0 7.0/0.0 7.0/0.0 9.0/2.0 ns, Min
TSMWCCK/TSMCCKW RDWR_B Setup/Hold 17.0/1.0 17.0/1.0 17.0/1.0 27.0/2.0 ns, Min
TSMCKCSO CSO_B clock to out 16 16 16 26 ns, Max
TSMCO CCLK to DATA out in readback 13 13 13 25 ns, Max
TSMCKBY CCLK to BUSY out in readback 12 12 12 17 ns, Max
FSMCCK
Maximum CCLK frequency (LX4, LX9, LX16, LX25,
LX25T, LX45, LX45T, LX75, and LX75T only)
50 50 50 25 MHz, Max
Maximum CCLK frequency (LX100 and LX100T in x8
mode, LX150, and LX150T only)
40 40 40 20 MHz, Max
Maximum CCLK frequency (LX100 and LX100T in x16
mode only)
35 35 35 20 MHz, Max
FRBCCK
Maximum Readback CCLK frequency, including block
RAM (LX4, LX9, LX16, LX25, LX25T, LX45, LX45T,
LX75, and LX75T only)
20 20 20 4 MHz, Max
Maximum Readback CCLK frequency, ignoring block
RAM (POST_CRC) (LX4, LX9, LX16, LX25, LX25T,
LX45, LX45T, LX75, and LX75T only)
50 50 50 30 MHz, Max
Maximum Readback CCLK frequency, including block
RAM (LX100, LX100T, LX150, and LX150T only)
12 12 12 4 MHz, Max
Maximum Readback CCLK frequency, ignoring block
RAM (POST_CRC) (LX100, LX100T, LX150, and
LX150T only)
35 35 35 20 MHz, Max
Boundary-Scan Port Timing Specifications
TTAPTCK TMS and TDI Setup time before TCK 10 10 10 17 ns, Min
TTCKTAP TMS and TDI Hold time after TCK 5.5 5.5 5.5 5.5 ns, Min
TTCKTDO TCK falling edge to TDO output valid 6.5 6.5 6.5 8 ns, Max
TTCKH TCK clock minimum High time 12 12 12 21 ns, Min
TTCKL TCK clock minimum Low time 12 12 12 21 ns, Min
FTCK Maximum configuration TCK clock frequency 33 33 33 18 MHz, Max
FTCKB Maximum boundary-scan TCK clock frequency 33 33 33 18 MHz, Max
FTCKAES Maximum AES key TCK clock frequency 2 2 2 2 MHz, Max
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 55
BPI Master Flash Mode Programming Switching(4)
TBPICCO(5) A[25:0], FCS_B, FOE_B, FWE_B, LDC outputs valid
after CCLK falling edge
15 15 15 20 ns, Max
TBPIICCK Master BPI CCLK (output) delay 10/100 10/100 10/100 10/130 µs, Min/Max
TBPIDCC/TBPICCD Setup/Hold on D[15:0] data input pins 5.0/1.0 5.0/1.0 5.0/1.0 6.0/2.0 ns, Min
SPI Master Flash Mode Programming Switching(6)
TSPIDCC/TSPIDCCD DIN, MISO0, MISO1, MISO2, MISO3, Setup/Hold
before/after the rising CCLK edge
5.0/1.0 5.0/1.0 5.0/1.0 7.0/1.0 ns, Min
TSPIICCK Master SPI CCLK (output) delay 0.4/7.0 0.4/7.0 0.4/7.0 0.4/10.0 µs, Min/Max
TSPICCM MOSI clock to out 13 13 13 19 ns, Max
TSPICCFC CSO_B clock to out 16 16 16 26 ns, Max
CCLK Output (Master Modes)
TMCCKL Master CCLK clock duty cycle Low 40/60 %, Min/Max
TMCCKH Master CCLK clock duty cycle High 40/60 %, Min/Max
FMCCK Maximum frequency, serial mode (Master Serial/SPI)
All devices
40 40 40 30 MHz, Max
Maximum frequency, parallel mode (Master
SelectMAP/BPI)
LX9, LX16, LX25, LX25T, LX45, LX45T, LX75, and
LX75T
40 40 40 25 MHz, Max
Maximum frequency, parallel mode (Master
SelectMAP/BPI)
LX100 and LX100T in x8 mode, LX150, and LX150T
40 40 40 20 MHz, Max
Maximum frequency, parallel mode (Master
SelectMAP/BPI)
LX100 and LX100T in x16 mode
35 35 35 20 MHz, Max
FMCCKTOL Frequency Tolerance, master mode ±50 ±50 ±50 ±50 %
CCLK Input (Slave Modes)
TSCCKL Slave CCLK clock minimum Low time 5 5 5 8 ns, Min
TSCCKH Slave CCLK clock minimum High time 5 5 5 8 ns, Min
USERCCLK Input
TUSERCCLKL USERCCLK clock minimum Low time 12 12 12 16 ns, Min
TUSERCCLKH USERCCLK clock minimum High time 12 12 12 16 ns, Min
FUSERCCLK Maximum USERCCLK frequency 40 40 40 30 MHz, Max
Notes:
1. Maximum frequency and setup/hold timing parameters are for 3.3V and 2.5V configuration voltages.
2. To support longer delays in configuration, use the design solutions described in UG380: Spartan-6 FPGA Configuration User Guide.
3. Ta b l e 6 specifies the power supply ramp time.
4. BPI mode is not supported in:
LX4, LX25, or LX25T devices
LX9 devices in the TQG144 package
LX9 or LX16 devices in the CPG196 package.
5. Only during configuration, the last edge is determined by a weak pull-up/pull-down resistor in the I/O.
6. Defense-grade Spartan-6Q -2Q devices configure in single default SPI Master (x1) mode at Tj= –55°C. During operation and when using all other
configuration functions, the minimum operating temperature is –40°C.
Tabl e 4 7 : Configuration Switching Characteristics(1) (Cont’d)
Symbol Description Speed Grade Units
-3 -3N -2 -1L
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 56
Clock Buffers and Networks
Tabl e 4 8 : Global Clock Switching Characteristics (BUFGMUX)
Symbol Description Devices Speed Grade Units
-3 -3N -2 -1L
TGSI (TGSI0, TGSI1) S pin Setup to I0/I1 inputs LX devices 0.25 0.31 0.48 0.48 ns
LXT devices 0.25 0.31 0.48 N/A ns
TGIO (TGI0O, TGI1O) BUFGMUX delay from I0/I1 to O LX devices 0.21 0.21 0.21 0.21 ns
LXT devices 0.21 0.21 0.21 N/A ns
Maximum Frequency
FMAX Global clock tree (BUFGMUX)(1) LX devices 400 400 375 250 MHz
LXT devices 400 400 375 N/A MHz
Notes:
1. The BUFGMUX FMAX values also apply to BUFH.
Tabl e 4 9 : Input/Output Clock Switching Characteristics (BUFIO2)
Symbol Description Devices Speed Grade Units
-3 -3N -2 -1L
TBUFCKO_O(1) Clock to out delay from I to O LX devices 0.67 0.82 1.09 1.50 ns
LXT devices 0.67 0.82 1.09 N/A ns
Maximum Frequency
FMAX I/O clock tree (BUFIO2) LX devices 540 525 500 300 MHz
LXT devices 540 525 500 N/A MHz
Notes:
1. TBUFCKO_O reflects the longest delay of TBUFCKO_IOCLK, TBUFCKO_DIVCLK, and TBUFCKO_SSTROBE. See TRACE reports for specific values.
Tabl e 5 0 : Input/Output Clock Switching Characteristics (BUFIO2FB)
Symbol Description Devices Speed Grade Units
-3 -3N -2 -1L
Maximum Frequency
FMAX I/O clock tree (BUFIO2FB) LX devices 1080 1050 950 500 MHz
LXT devices 1080 1050 950 N/A MHz
Tabl e 5 1 : Input/Output Clock Switching Characteristics (BUFPLL)
Symbol Description Devices Speed Grade Units
-3 -3N -2 -1L
Maximum Frequency
FMAX BUFPLL clock tree (BUFPLL) LX devices 1080 1050 950 500 MHz
LXT devices 1080 1050 950 N/A MHz
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 57
PLL Switching Characteristics
Tabl e 5 2 : PLL Specification
Symbol Description Device(1) Speed Grade Units
-3 -3N -2 -1L
FINMAX Maximum Input Clock Frequency from I/O Clock
(BUFIO2)
LX devices 540 525 450 300 MHz
LXT devices 540 525 450 N/A MHz
Maximum Input Clock Frequency from Global Clock
Buffer (BUFGMUX)
LX devices 400 400 375 250 MHz
LXT devices 400 400 375 N/A MHz
FINMIN Minimum Input Clock Frequency LX devices 19 19 19 19 MHz
LXT devices 19 19 19 N/A MHz
FINJITTER Maximum Input Clock Period Jitter: 19–200 MHz All 1 ns Maximum
Maximum Input Clock Period Jitter: > 200 MHz All <20% of clock input period Maximum
FINDUTY Allowable Input Duty Cycle: 19—199 MHz All 25/75 %
Allowable Input Duty Cycle: 200—299 MHz All 35/65 %
Allowable Input Duty Cycle: > 300 MHz All 45/55 %
FVCOMIN Minimum PLL VCO Frequency LX devices 400 400 400 400 MHz
LXT devices 400 400 400 N/A MHz
FVCOMAX Maximum PLL VCO Frequency LX devices 1080 1050 1000 1000 MHz
LXT devices 1080 1050 1000 N/A MHz
FBANDWIDTH Low PLL Bandwidth at Typical(3) All 1 1 1 1 MHz
High PLL Bandwidth at Typical(3) All 4 4 4 4 MHz
TSTAPHAOFFSET Static Phase Offset of the PLL Outputs All 0.12 0.12 0.12 0.15 ns
TOUTJITTER PLL Output Jitter(3) All Note 2
TOUTDUTY PLL Output Clock Duty Cycle Precision(4) All 0.15 0.15 0.20 0.25 ns
TLOCKMAX PLL Maximum Lock Time All 100 100 100 100 µs
FOUTMAX
PLL Maximum Output Frequency for BUFGMUX LX devices 400 400 375 250 MHz
LXT devices 400 400 375 N/A MHz
PLL Maximum Output Frequency for BUFPLL LX devices 1080 1050 950 500 MHz
LXT devices 1080 1050 950 N/A MHz
FOUTMIN PLL Minimum Output Frequency(5) All 3.125 3.125 3.125 3.125 MHz
TEXTFDVAR External Clock Feedback Variation: 19–200 MHz All 1 ns Maximum
External Clock Feedback Variation: > 200 MHz All < 20% of clock input period Maximum
RSTMINPULSE Minimum Reset Pulse Width All 5 5 5 5 ns
FPFDMAX(6) Maximum Frequency at the Phase Frequency Detector LX devices 500 500 400 300 MHz
LXT devices 500 500 400 N/A MHz
FPFDMIN Minimum Frequency at the Phase Frequency Detector LX devices 19 19 19 19 MHz
LXT devices 19 19 19 N/A MHz
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 58
TFBDELAY Maximum Delay in the Feedback Path All 3 ns Max or one CLKIN cycle
Notes:
1. LXT devices are not available with a -1L speed grade.
2. Values for this parameter are available in the Clocking Wizard.
3. The PLL does not filter typical spread spectrum input clocks because they are usually far below the bandwidth filter frequencies.
4. Includes global clock buffer.
5. Calculated as FVCO/128 assuming output duty cycle is 50%.
6. When using CLK_FEEDBACK = CLKOUT0 with BUFIO2 feedback, the feedback frequency will be higher than the phase frequency detector
frequency. FPFDMAX = FCLKFB / CLKFBOUT_MULT
Tabl e 5 2 : PLL Specification (Cont’d)
Symbol Description Device(1) Speed Grade Units
-3 -3N -2 -1L
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.1.1) January 30, 2015 www.xilinx.com
Product Specification 59
DCM Switching Characteristics
Tabl e 5 3 : Operating Frequency Ranges and Conditions for the Delay-Locked Loop (DLL)(1)
Symbol Description
Speed Grade
Units-3 -3N -2 -1L
MinMaxMinMaxMinMaxMinMax
Input Frequency Ranges
CLKIN_FREQ_DLL Frequency of the CLKIN clock
input when the CLKDV output is
not used.
5(2) 280(3) 5(2) 280(3) 5(2) 250(3) 5(2) 175(3) MHz
Frequency of the CLKIN clock
input when using the CLKDV
output.
5(2) 280(3) 5(2) 280(3) 5(2) 250(3) 5(2) 133(3) MHz
Input Pulse Requirements
CLKIN_PULSE CLKIN pulse width as a
percentage of the CLKIN period
for
CLKIN_FREQ_DLL < 150 MHz
40 60 40 60 40 60 40 60 %
CLKIN pulse width as a
percentage of the CLKIN period
for
CLKIN_FREQ_DLL > 150 MHz
45 55 45 55 45 55 45 55 %
Input Clock Jitter Tolerance and Delay Path Variation(4)
CLKIN_CYC_JITT_DLL_LF Cycle-to-cycle jitter at the CLKIN
input for
CLKIN_FREQ_DLL < 150 MHz
– ±300 – ±300 – ±300 – ±300 ps
CLKIN_CYC_JITT_DLL_HF Cycle-to-cycle jitter at the CLKIN
input for
CLKIN_FREQ_DLL > 150 MHz.
– ±150 – ±150 – ±150 – ±150 ps
CLKIN_PER_JITT_DLL Period jitter at the CLKIN input. ±1 ±1 ±1 ±1 ns
CLKFB_DELAY_VAR_EXT Allowable variation of the off-chip
feedback delay from the DCM
output to the CLKFB input.
–±1–±1–±1–±1ns
Notes:
1. DLL specifications apply when using any of the DLL outputs: CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, or CLKDV.
2. When operating independently of the DLL, the DFS supports lower CLKIN_FREQ_DLL frequencies. See Ta bl e 5 5 .
3. The CLKIN_DIVIDE_BY_2 attribute increases the effective input frequency range. When set to TRUE, the input clock frequency is divided by two as
it enters the DCM. Input clock frequencies for the clock buffer being used can be increased up to the FMAX (see Ta b l e 4 8 and Ta b l e 4 9 for BUFGMUX
and BUFIO2 limits). When used with CLK_FEEDBACK=2X, the input clock frequency matches the frequency for CLK2X, and is limited to
CLKOUT_FREQ_2X.
4. CLKIN_FREQ_DLL input jitter beyond these limits can cause the DCM to lose LOCK, indicated by the LOCKED output deasserting. The user must
then reset the DCM.
5. When using both DCMs in a CMT, both DCMs must be LOCKED.