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TLP185 Datasheet

Toshiba Semiconductor and Storage

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Datasheet

TLP185
1 2017-04-27
TOSHIBA Photocoupler GaAs Ired & Photo-Transistor
TLP185
Office Machine
Programmable Controllers
AC Adapter
I/O Interface Board
The TOSHIBA mini flat coupler TLP185 is a small outline coupler, suitable for
surface mount assembly.
TLP185 consists of a photo transistor optically coupled to a gallium arsenide
infrared emitting diode. Since TLP185 is smaller than DIP package, it’s
suitable for high-density surface mounting applications such as
programmable controllers.
Collector-emitter voltage: 80 V (min)
Current transfer ratio: 50 % (min)
Rank GB: 100% (min)
Isolation voltage: 3750 Vrms (min)
Operation Temperature:-55 to 110 ˚C
Safety Standards
UL approved: UL1577, File No. E67349
cUL approved: CSA Component Acceptance Service No. 5A
File No.E67349
CQC approved:GB4943.1,GB8898 Japan and Thailand Factory
适用干海拔 2000m 以下地安全使用
Option (V4) type
VDE approved: EN60747-5-5 ,EN60065,EN60950-1 (Note 1)
Under application EN62368-1
Note 1: When a EN60747-5-5 approved type is needed,
Please designate “Option(V4)
Construction mechanical rating
Creepage distance : 5.0 mm (min)
Clearance : 5.0 mm (min)
Insulation thickness : 0.4 mm (min)
Unit:
mm
TOSHIBA 11-4M1S
Weight: 0.08 g (typ.)
Pin Configuration (top view)
Start of commercial production
2011-12
TLP185
2 2017-04-27
Current Transfer Ratio
Type Classification
(Note1)
Current Transfer Ratio (%) (IC / IF)
Marking Of Classification
IF = 5 mA, VCE = 5 V, Ta = 25°C
Min Max
TLP185
Blank 50 400 Blank, YE, GR, GB, Y+, G, G+, B
Rank Y 50 150 YE , Y+
Rank GR 100 300 GR , G ,G+
Rank GB 100 400 GB, GR, G, G+, BL, B,
Rank YH 75 150 Y+
Rank GRL 100 200 G
Rank GRH 150 300 G+
Rank BLL 200 400 B
Note1: Ex Rank GB: TLP185 (GB,E
Note: Application, type name for certification test, please use standard product type name, i, e.
TLP185(GB,E: TLP185
TLP185
3 2017-04-27
Absolute Maximum Ratings (Ta = 25°C)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width 100 μs, f = 100 Hz
Note 2: Device considered a two terminal device: Pins 1 and 3 shorted together and 4 and 6 shorted together.
Recommended Operating Conditions
Characteristic Symbol Min Typ. Max Unit
Supply voltage VCC 5 48 V
Forward current IF 16 20 mA
Collector current IC 1 10 mA
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Characteristic Symbol Rating Unit
LED
Forward current IF 50 mA
Forward current derating (Ta 90°C) ΔIF/°C -1.5 mA/°C
Pulse forward current (Note 1) IFP 1 A
Reverse voltage VR 5 V
Diode power dissipation PD 100 mW
Diode power dissipation derating (Ta >90°C)
Δ
PD/°C -2.9 mW/°C
Junction temperature Tj 125 °C
Detector
Collector-emitter voltage VCEO 80 V
Emitter-collector voltage VECO 7 V
Collector current IC 50 mA
Collector power dissipation PC 150 mW
Collector power dissipation derating (Ta 25°C) ΔPC/°C -1.5 mW/°C
Junction temperature Tj 125 °C
Operating temperature range Topr -55 to 110 °C
Storage temperature range Tstg -55 to 125 °C
Lead soldering temperature (10 s) Tsol 260 °C
Total package power dissipation PT 200 mW
Total package power dissipation derating (Ta 25°C) ΔPT/°C -2.0 mW/°C
Isolation voltage (AC, 60 s, R.H. 60%) (Note 2) BVS 3750 Vrms
TLP185
4 2017-04-27
Electrical Characteristics (Ta = 25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
LED
Forward voltage VF IF = 10 mA 1.1 1.25 1.4 V
Reverse current IR VR = 5 V 5 μA
Capacitance CT V = 0 V, f = 1 MHz 30 pF
Detector
Collector-emitter breakdown voltage V(BR)CEO IC = 0.5 mA 80 V
Emitter-collector breakdown voltage V(BR)ECO IE = 0.1 mA 7 V
Collector dark current ICEO VCE = 48 V 0.01 0.08 μA
VCE = 48 V, Ta = 85°C 2 50 μA
Capacitance (collector to emitter) CCE V = 0 V, f = 1 MHz 10 pF
Coupled Electrical Characteristics (Ta = 25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
Current transfer ratio IC/IF IF = 5 mA, VCE = 5 V
Rank GB
50 400 %
100 400
Saturated CTR IC/IF(sat) IF = 1 mA, VCE = 0.4 V
Rank GB
60 %
30
Collector-emitter saturation voltage VCE(sat)
IC = 2.4 mA, IF = 8 mA 0.3
V
IC = 0.2 mA, IF = 1 mA
Rank GB
0.2
0.3
Off-state collector current IC(off) VF = 0.7 V, VCE = 48 V 1 10 μA
Isolation Characteristics (Ta = 25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
Capacitance (input to output) CS VS = 0 V, f = 1 MHz 0.8 pF
Isolation resistance RS VS = 500 V, R.H. 60% 1×10
10
14
Ω
Isolation voltage BVS
AC, 60 s 3750 Vrms
AC, 1 s, in oil 10000
DC, 60 s, in oil 10000 Vdc
TLP185
5 2017-04-27
Switching Characteristics (Ta = 25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
Rise time tr
VCC = 10 V, IC = 2 mA
RL = 100 Ω
5
μs
Fall time tf 9
Turn-on time ton 9
Turn-off time toff 9
Turn-on time ton RL = 1.9 kΩ (Fig.1)
VCC = 5 V, IF = 16 mA
2
μs
Storage time ts 30
Turn-off time toff 70
Fig. 1 Switching time test circuit
IF VCC
RL
VCE
t
OFF
t
ON
V
CE
I
F
t
S
4.5V
0.5V
VCC
ton
toff
TLP185
6 2017-04-27
I
F
-Ta
P
C
-Ta
Forward current IF (mA)
C
ollector power
dissipation PC (mW)
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
IFP- D R
IF- V F
Pulse forward current I
FP (mA)
Forward current I
F (mA)
Duty cycle ratio D
R
Forward voltage V
F
(V)
VF/Ta- I F
IF P V F P
Forward voltage temperature coefficient
Δ
VF /
Δ
Ta (mV/°C)
Pulse forward current I
FP (mA)
Forward current I
F
(mA)
Pulse forward voltage V
FP
(V)
*The above graphs show typical characteristic.
0
20
40
60
80
100
-20 020 40 60 80 100 120
0
20
40
60
80
100
120
140
160
-20 020 40 60 80 100 120
0.1
1
10
100
0.6 0.8 11.2 1.4 1.6 1.8 2
-3.2
-2.8
-2.4
-2
-1.6
-1.2
-0.8
-0.4
0.1 110 100
1
10
100
1000
0.6 11.4 1.8 2.2 2.6 33.4
11C
85˚C
50˚C
25˚C
0˚C
-25˚C
-55˚C
Pulse width100μs
Ta=25˚C
10
30
50
100
1000
300
500
3000
10-3
10-2
10-1
100
Pulse width10μs
Repetitive frequency=100Hz
Ta=25°C
This curve shows the maximum
limit to the forward current.
This curve shows the
maximum limit to the
collector power dissipation.
This curve shows the maximum
limit to the pulse forward current.
TLP185
7 2017-04-27
I
C
- V
CE
I
C
- V
CE
Collector current I
C (mA)
Collector current I
C (mA)
Collector-emitter voltage VCE (V)
Collector-emitter voltage V
CE
(V)
IC- I F
ICEO-Ta
Collector current I
C (mA)
Collector dark c
urrent ID (ICEO) (μA)
Forward current I
F
(mA)
Ambient temperature Ta (°C)
IC/IF - I F
Current transfer ratio I
C / IF (%)
Forward current I
F
(mA)
*The above graphs show typical characteristic.
0
10
20
30
40
50
0 2 4 6 8 10
0
10
20
30
00.2 0.4 0.6 0.8 1
0.1
1
10
100
0.1 1 10 100
0.0001
0.001
0.01
0.1
1
10
0 20 40 60 80 100 120
10
100
1000
0.1 110 100
5
10
50
30
20
15
Ta=25˚C
VCE=10V
VCE=5V
VCE=0.4V
VCE=10V
VCE=5V
VCE=0.4V
24V
10V
5V
V
CE
=48V
IF= 2 mA
IF=5mA
10
15
20
30
50
P
C
( max)
Ta=25˚C
Ta=25˚C
TLP185
8 2017-04-27
VCE(sat) - Ta
IC - Ta
Collector-Emitter saturation
Voltage VCE(sat) (V)
Collector current I
C (mA)
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
Switching time - RL
Switching time - Ta
Switching time (μs)
Switching time (μs)
Load resistance RL (kΩ)
Ambient temperature Ta (°C)
*The above graphs show typical characteristic.
0.00
0.04
0.08
0.12
0.16
0.20
0.24
0.28
-60 -40 -20 020 40 60 80 100 120
0.1
1
10
100
-60 -40 -20 020 40 60 80 100 120
1
10
100
1000
10000
110 100
0.1
1
10
100
1000
-60 -40 -20 0 20 40 60 80 100 120
IF=8mA, IC=2.4mA
IF=1mA, IC=0.2mA
VCE=5V
IF=0.5mA
5
1
10
25
t
off
Ta=25˚C
IF=16mA
VCC=5V
IF=16mA
VCC=5V
RL=1.9k
ts
ton
t
off
ts
toff
TLP185
9 2017-04-27
Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
Temperature profile example of lead (Pb) solder
Temperature profile example of using lead (Pb)-free solder
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2
weeks.
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
Please preheat it at 150°C between 60 and 120 seconds.
Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin
may be heated at most once.
Time
(s)
(°C)
240
210
160
60 to 120s
less than 30s
Package surface temperature
140
Time
(s)
C)
260
230
190
60 to 120s
30 to 50s
180
Package surface temperature
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum
temperature corresponding to the
solder paste type used by the
customer within the described profile.
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum
temperature corresponding to the
solder paste type used by the
customer within the described profile.
TLP185
10 2017-04-27
2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
TLP185
11 2017-04-27
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

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