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ARTIK™ 053 Datasheet

Samsung Semiconductor, Inc.

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Datasheet

The Samsung ARTIK™ 053 Module is a highly integrated
module for secure Internet of Things (IoT) devices that require
Wi-Fi® Connectivity. It is based on an ARM® Cortex® R4 core,
with on-module RAM and flash memory, a complete 2.4GHz
Wi-Fi subsystem with on-module antenna, an independent
security subsystem, PUF-based module authentication, and a
large complement of standard I/O interfaces.
ARTIK 053 Module provides excellent performance in a variety
of environments, with a feature set tailored specifically for IoT
end nodes.
Top View (Left) and Bottom View (Right) of ARTIK 053 Module
Module Overview ................................................................................................................................................................... 2
Table of Contents ................................................................................................................................................................... 3
List of Figures .......................................................................................................................................................................... 4
List of Tables ........................................................................................................................................................................... 4
Version History ....................................................................................................................................................................... 5
Block Diagram ......................................................................................................................................................................... 6
CPU ......................................................................................................................................................................................................... 6
Memory .................................................................................................................................................................................................. 6
Real Time Clock ..................................................................................................................................................................................... 6
PUF Unit ................................................................................................................................................................................................. 7
Security Subsystem ............................................................................................................................................................................... 7
Wi-Fi Subsystem .................................................................................................................................................................................... 7
UART Interface ....................................................................................................................................................................................... 7
GPIO Interface ....................................................................................................................................................................................... 7
I2C Interface ........................................................................................................................................................................................... 7
PWM Interface ....................................................................................................................................................................................... 8
SPI Interface .......................................................................................................................................................................................... 8
ADC Interface ......................................................................................................................................................................................... 8
Module Edge Pinout ............................................................................................................................................................... 9
Module Edge Pinout by Function ....................................................................................................................................... 12
ADC Interface ....................................................................................................................................................................................... 12
Debug Interface ................................................................................................................................................................................... 12
I2C Interface ......................................................................................................................................................................................... 12
INT Interface ........................................................................................................................................................................................ 12
Power Interface ................................................................................................................................................................................... 12
GPIO Interface ..................................................................................................................................................................................... 13
PWM Interface ..................................................................................................................................................................................... 13
Reset Interface ..................................................................................................................................................................................... 13
SPI Interface ........................................................................................................................................................................................ 14
UART Interface ..................................................................................................................................................................................... 14
Electrical Specifications ....................................................................................................................................................... 15
Absolute Maximum Rating ................................................................................................................................................................. 15
DC Electrical Characteristics .............................................................................................................................................................. 15
ESD Ratings .......................................................................................................................................................................................... 16
AC Electrical Characteristics .............................................................................................................................................................. 16
RF Electrical Characteristics ............................................................................................................................................................... 16
Mechanical Specifications ................................................................................................................................................... 17
Module Antenna Placement Requirements...................................................................................................................................... 18
Certification ........................................................................................................................................................................... 19
FCC Regulatory Disclosures................................................................................................................................................................ 19
Industry Canada Regulatory Disclosures ......................................................................................................................................... 20
EU Regulatory Disclosures ................................................................................................................................................................. 21
Ordering Information .......................................................................................................................................................... 22
Legal Information ................................................................................................................................................................. 23
Figure 1. ARTIK 053 Module Block Diagram ......................................................................................................................... 6
Figure 2. ADC LSB behavior .................................................................................................................................................... 8
Figure 3. ARTIK 053 Module Edge Pinout .............................................................................................................................. 9
Figure 4. ARTIK 053 Module Mechanical Dimensions ...................................................................................................... 17
Figure 5.Module Placement Restrictions ........................................................................................................................... 18
Table 1. ARTIK 053 Module Edge Pinout Signal Descriptions .......................................................................................... 10
Table 2. ADC Interface .......................................................................................................................................................... 12
Table 3. Debug Interface ...................................................................................................................................................... 12
Table 4. I2C Interface ............................................................................................................................................................. 12
Table 5. Interrupt Interface .................................................................................................................................................. 12
Table 6. GPIO Interface ......................................................................................................................................................... 13
Table 7. PWM Interface......................................................................................................................................................... 13
Table 8. Reset Interface ........................................................................................................................................................ 13
Table 9. SPI Interface ............................................................................................................................................................ 14
Table 10. UART Interface ...................................................................................................................................................... 14
Table 11. Absolute Maximum Ratings ................................................................................................................................ 15
Table 12. I/O DC Electrical Characteristics (PAD: [2-13, 18, 19], [21-26], [28-31], [33-45], [48-75], I/O) ..................... 15
Table 13. I/O DC Electrical Characteristics (PAD: [14-17], ADC) ....................................................................................... 15
Table 14. Recommended Operating Conditions ............................................................................................................... 16
Table 15. GPIO Signal Drive Strength ................................................................................................................................. 16
Table 16. ESD Ratings ........................................................................................................................................................... 16
Table 17.Level Shifter AC Electrical Characteristics .......................................................................................................... 16
Table 18.Tx Performance Characteristics .......................................................................................................................... 16
Table 19.Rx Performance Characteristics .......................................................................................................................... 16
Revision
Date
Maturity
V1.0
04/26/2017
Release
Figure 1 shows the functional Block Diagram of the ARTIK 053 Module.
The ARTIK 053 Module CPU has an ARM® Cortex® R4. It has the following features:
32KB of Instruction Cache (I-Cache)
32KB of Data Cache (D-Cache)
320 MHz execution clock
R4 core tuned for embedded and real-time applications
The ARTIK 053 Module on-module memory has the following features:
CPU and general purpose RAM
o 1280KB CPU RAM
o 128KB global Inter-Process Communication (IPC) RAM
8MB flash
The ARTIK 053 Module has a Real Time Clock (RTC) for tracking date/time. The RTC has the following features:
Binary-Coded Decimal (BCD) coded seconds, minutes, hour, day of the week, day, month, and year
Leap year detection and compensation
Millisecond tick time interrupt for Real-Time Operating System (RTOS) kernel time tick
The ARTIK 053 Module has a Physically Unclonable Function (PUF) unit. The PUF unit has the following features:
Generates unique key values, locked to an individual ARTIK 053 Module
The algorithm construction is unique to each module
Allows individual ARTIK 053 Modules to be “fingerprint-identified”
The ARTIK 053 Module has an independent security subsystem to ensure secure end-to-end operation in any IoT
environment. The security subsystem includes the following features:
Protected Execution Environment
o Secure IPC Mailbox for inter-subsystem communication
o Encapsulated key support
Backup encryption key - 256 bits
Security subsystem root private key - 521 bits
Storage key - 256 bits
Symmetric key engines
o Secure AES
o Secure DES/Triple-DES
Stream cipher engine
o ARC4 engine
Various Hash engines
o SHA-1, SHA2-256, SHA2-384, SHA2-512, MD5 HMAC
Asymmetric key engines
o PKA (Public Key Accelerator) engine
PRNG (Pseudo Random Number Generator)
DTRNG (Digital True Random Number Generator)
Secure key storage
The ARTIK 053 Module has an 802.11b/g/n Wi-Fi subsystem. The Wi-Fi subsystem has the following features:
802.11™ b/g/n support at 2.4GHz
20MHz single stream (802.11n)
WPA/WPA2/WAPI
Dedicated Wi-Fi Processor subsystem
The ARTIK 053 Module has four 2-pin UART interfaces, each with the following features:
Can be operated in DMA or interrupt-based mode
Support for 5, 6, 7 or 8 bit serial data transmit and receive
Programmable baud rate
One or two stop bit insertion
The ARTIK 053 Module has flexible General Purpose Input Output (GPIO) interfaces:
29 configurable GPIO ports
Independently configurable for either input or output
Configurable internal pull-up or pull-down resistors
The ARTIK 053 Module has two high speed multi-master I2C interfaces available, with speeds up to 3.4Mbps.
The ARTIK 053 Module has five PWM timers available, each with the following features:
32 bits of resolution for each PWM signal
Two 8 bit pre-scalers (first level of division) and 5 clock-dividers/multiplexers for second level division
Continuous run or one-shot pulse mode
Dead zone generator to avoid simultaneous change of multiple PWM signals
Interrupt generation
The ARTIK 053 Module has two SPI interfaces, each with the following features:
Full duplex communication
8, 16 or 32 bit shift registers and bus interface
Motorola SPI protocol and National Semiconductor Microwire protocol
Master and slave mode operation
Two independent 32 bit wide transmit/receive FIFOs
Transmit and receive speeds up to 50MHz
The ARTIK 053 Module has four channels of analog-to-digital converter. The A/D interface has the following features:
12 bit resolution
ADC conversion clock at 1.08 MSPS (Sampling per Second) using a main 6.5 MHz clock
Support sample averaging over 1, 2, 4, 8, 16, 32, 64 samples
Differential non-linearity error ±2 LSB
Integral non-linearity error ±6 LSB
Top offset error ±10 LSB
Bottom offset error ±10 LSB
Voltage range up to 1.8V
Figure 2 depicts the dynamic behavior between input voltage on the ADC and resulting LSB value in the ADC register.
The ARTIK 053 Module utilizes 79 signal, power, and ground pads. Figure 3 shows how the Edge Pinout is oriented and how signal
coordinates are assigned to the edge of the ARTIK 053 Module. Table 1 shows the edge pads and the signal names.
Pad Number
Pad Name
I/O Type*
PU/PD
Power
Default Function
1
GND
GND
2
XGPIO26
I
PD
VDDQ33_EXT0
GPIO
3
XGPIO25
I
PD
VDDQ33_EXT0
GPIO
4
XGPIO24
I
PD
VDDQ33_EXT0
GPIO
5
XGPIO21
I
PD
VDDQ33_EXT0
GPIO
6
XGPIO19
I
PD
VDDQ33_EXT0
GPIO
7
XGPIO18
I
PD
VDDQ33_EXT0
GPIO
8
XGPIO17
I
PD
VDDQ33_EXT0
GPIO
9
XGPIO14
I
PD
VDDQ33_EXT0
GPIO
10
XGPIO13
I
PD
VDDQ33_EXT0
GPIO
11
XGPIO16
I
PD
VDDQ33_EXT0
GPIO
12
XGPIO15
I
PD
VDDQ33_EXT0
GPIO
13
XGPIO20
I
PD
VDDQ33_EXT0
GPIO
14
XADC0AIN_1
AVDD18_ADC0
ADC
15
XADC0AIN_0
AVDD18_ADC0
ADC
16
XADC0AIN_2
AVDD18_ADC0
ADC
17
XADC0AIN_3
AVDD18_ADC0
ADC
18
XGPIO23
I
PD
VDDQ1833_SDIO_0
GPIO
19
XGPIO22
I
PD
VDDQ1833_SDIO_0
GPIO
20
GND
GND
21
XRESET_N
I
VDDQ33_EXT1
RESET
22
XJTAG_TMS
I
PU
VDDQ33_EXT1
DEBUG
23
XJTAG_TDI
I
PU
VDDQ33_EXT1
DEBUG
24
XJTAG_TCK
I
PD
VDDQ33_EXT1
DEBUG
25
XJTAG_TDO
I
PD
VDDQ33_EXT1
DEBUG
26
XJTAG_TRST_N
I
PD
VDDQ33_EXT1
DEBUG
27
3V3_EXT_LDO2
POWER
28
XEINT_0
I
PD
VDDQ33_EXT1
INT
29
XEINT_2
I
PD
VDDQ33_EXT1
INT
30
XEINT_1
I
PD
VDDQ33_EXT1
INT
31
PWR_RST
RESET
32
DC_5V_12V
POWER
33
XI2C0_SCL
I
PD
VDDQ33_EXT1
I2C
34
XI2C0_SDA
I
PD
VDDQ33_EXT1
I2C
35
XI2C1_SCL
I
PD
VDDQ33_EXT1
I2C
36
XI2C1_SDA
I
PD
VDDQ33_EXT1
I2C
37
XDEBUG_TXD
I
PD
VDDQ33_EXT1
DEBUG
38
XDEBUG_RXD
I
PD
VDDQ33_EXT1
DEBUG
39
XGPIO28
I
PD
VDDQ33_EXT0
GPIO
40
XPWMTOUT_4
I
PD
VDDQ33_EXT0
PWM
41
XPWMTOUT_1
I
PD
VDDQ33_EXT0
PWM
42
XPWMTOUT_0
I
PD
VDDQ33_EXT0
PWM
43
XPWMTOUT_5
I
PD
VDDQ33_EXT0
PWM
44
XPWMTOUT_2
I
PD
VDDQ33_EXT0
PWM
45
XPWMTOUT_3
I
PD
VDDQ33_EXT0
PWM
46
XUART0_TXD
LEVEL SHIFTED
47
XUART0_RXD
LEVEL SHIFTED
48
XSPI0_MISO
I
PD
VDDQ33_EXT0
SPI
49
XSPI0_CSN
I
PD
VDDQ33_EXT0
SPI
50
XSPI0_MOSI
I
PD
VDDQ33_EXT0
SPI
51
XSPI0_CLK
I
PD
VDDQ33_EXT0
SPI
Pad Number
Pad Name
I/O Type*
PU/PD
Power
Default Function
52
XUART1_TXD
I
PD
VDDQ33_EXT0
UART
53
XUART1_RXD
I
PD
VDDQ33_EXT0
UART
54
XUART2_RXD
I
PD
VDDQ33_EXT0
UART
55
XUART2_TXD
I
PD
VDDQ33_EXT0
UART
56
XUART3_RXD
I
PD
VDDQ33_EXT0
UART
57
XUART3_TXD
I
PD
VDDQ33_EXT0
UART
58
XGPIO12
I
PD
VDDQ33_EXT0
GPIO
59
XGPIO10
I
PD
VDDQ33_EXT0
GPIO
60
XGPIO9
I
PD
VDDQ33_EXT0
GPIO
61
XGPIO11
I
PD
VDDQ33_EXT0
GPIO
62
XGPIO6
I
PD
VDDQ33_EXT0
GPIO
63
XGPIO8
I
PD
VDDQ33_EXT0
GPIO
64
XGPIO7
I
PD
VDDQ33_EXT0
GPIO
65
XGPIO2
I
PD
VDDQ33_EXT0
GPIO
66
XGPIO4
I
PD
VDDQ33_EXT0
GPIO
67
XGPIO5
I
PD
VDDQ33_EXT0
GPIO
68
XGPIO1
I
PD
VDDQ33_EXT0
GPIO
69
XGPIO3
I
PD
VDDQ33_EXT0
GPIO
70
XGPIO0
I
PD
VDDQ33_EXT0
GPIO
71
XSPI1_MISO
I
PD
VDDQ33_EXT0
SPI
72
XSPI1_CLK
I
PD
VDDQ33_EXT0
SPI
73
XSPI1_MOSI
I
PD
VDDQ33_EXT0
SPI
74
XSPI1_CSN
I
PD
VDDQ33_EXT0
SPI
75
XGPIO27
I
PD
VDDQ33_EXT0
GPIO
76
GND
GND
Note:
1. * Default setting after reset
2. I/O pad type definition - I:input, O:output, I/O:input/output
3. Internal pull up/pull down definition - PU:pull-up, PD:pull-down, N:no pull
Pad Number
Pad Name
I/O Type
PU/PD
Power
Default Function
14
XADC0AIN_1
AVDD18_ADC0
XADC0AIN_1
15
XADC0AIN_0
AVDD18_ADC0
XADC0AIN_0
16
XADC0AIN_2
AVDD18_ADC0
XADC0AIN_2
17
XADC0AIN_3
AVDD18_ADC0
XADC0AIN_3
Pad Number
Pad Name
I/O Type
PU/PD
Power
Default Function
22
XJTAG_TMS
I
PU
VDDQ33_EXT1
XJTAG_TMS
23
XJTAG_TDI
I
PU
VDDQ33_EXT1
XJTAG_TDI
24
XJTAG_TCK
I
PD
VDDQ33_EXT1
XJTAG_TCK
25
XJTAG_TDO
I
PD
VDDQ33_EXT1
XJTAG_TDO
26
XJTAG_TRST_N
I
PD
VDDQ33_EXT1
XJTAG_TRST_N
37
XDEBUG_TXD
I
PD
VDDQ33_EXT1
XDEBUG_TXD
38
XDEBUG_RXD
I
PD
VDDQ33_EXT1
XDEBUG_RXD
Pad Number
Pad Name
I/O Type
PU/PD
Power
Default Function
33
XI2C0_SCL
I
PD
VDDQ33_EXT1
XI2C0_SCL
34
XI2C0_SDA
I
PD
VDDQ33_EXT1
XI2C0_SDA
35
XI2C1_SCL
I
PD
VDDQ33_EXT1
XI2C1_SCL
36
XI2C1_SDA
I
PD
VDDQ33_EXT1
XI2C1_SDA
Pad Number
Pad Name
I/O Type
PU/PD
Power
Default Function
28
XEINT_0
I
PD
VDDQ33_EXT1
XEINT_0
29
XEINT_2
I
PD
VDDQ33_EXT1
XEINT_2
30
XEINT_1
I
PD
VDDQ33_EXT1
XEINT_1
Pad Number
Pad Name
I/O Type
PU/PD
Power
Default Function
1
GND
20
GND
27
3V3_EXT_LDO2
32
DC_5V_12V
76
GND
Pad Number
Pad Name
I/O Type
PU/PD
Power
Default Function
2
XGPIO26
I
PD
VDDQ33_EXT0
XGPIO26
3
XGPIO25
I
PD
VDDQ33_EXT0
XGPIO25
4
XGPIO24
I
PD
VDDQ33_EXT0
XGPIO24
5
XGPIO21
I
PD
VDDQ33_EXT0
XGPIO21
6
XGPIO19
I
PD
VDDQ33_EXT0
XGPIO19
7
XGPIO18
I
PD
VDDQ33_EXT0
XGPIO18
8
XGPIO17
I
PD
VDDQ33_EXT0
XGPIO17
9
XGPIO14
I
PD
VDDQ33_EXT0
XGPIO14
10
XGPIO13
I
PD
VDDQ33_EXT0
XGPIO13
11
XGPIO16
I
PD
VDDQ33_EXT0
XGPIO16
12
XGPIO15
I
PD
VDDQ33_EXT0
XGPIO15
13
XGPIO20
I
PD
VDDQ33_EXT0
XGPIO20
18
XGPIO23
I
PD
VDDQ1833_SDIO_0
XGPIO23
19
XGPIO22
I
PD
VDDQ1833_SDIO_0
XGPIO22
39
XGPIO28
I
PD
VDDQ33_EXT0
XGPIO28
58
XGPIO12
I
PD
VDDQ33_EXT0
XGPIO12
59
XGPIO10
I
PD
VDDQ33_EXT0
XGPIO10
60
XGPIO9
I
PD
VDDQ33_EXT0
XGPIO9
61
XGPIO11
I
PD
VDDQ33_EXT0
XGPIO11
62
XGPIO6
I
PD
VDDQ33_EXT0
XGPIO6
63
XGPIO8
I
PD
VDDQ33_EXT0
XGPIO8
64
XGPIO7
I
PD
VDDQ33_EXT0
XGPIO7
65
XGPIO2
I
PD
VDDQ33_EXT0
XGPIO2
66
XGPIO4
I
PD
VDDQ33_EXT0
XGPIO4
67
XGPIO5
I
PD
VDDQ33_EXT0
XGPIO5
68
XGPIO1
I
PD
VDDQ33_EXT0
XGPIO1
69
XGPIO3
I
PD
VDDQ33_EXT0
XGPIO3
70
XGPIO0
I
PD
VDDQ33_EXT0
XGPIO0
75
XGPIO27
I
PD
VDDQ33_EXT0
XGPIO27
Pad Number
Pad Name
I/O Type
PU/PD
Power
Default Function
40
XPWMTOUT_4
I
PD
VDDQ33_EXT0
XPWMTOUT_4
41
XPWMTOUT_1
I
PD
VDDQ33_EXT0
XPWMTOUT_1
42
XPWMTOUT_0
I
PD
VDDQ33_EXT0
XPWMTOUT_0
43
XPWMTOUT_5
I
PD
VDDQ33_EXT0
XPWMTOUT_5
44
XPWMTOUT_2
I
PD
VDDQ33_EXT0
XPWMTOUT_2
45
XPWMTOUT_3
I
PD
VDDQ33_EXT0
XPWMTOUT_3
Pad Number
Pad Name
I/O Type
PU/PD
Power
Default Function
21
XRESET_N
I
VDDQ33_EXT1
XRESET_N
31
PWR_RST
Pad Number
Pad Name
I/O Type
PU/PD
Power
Default Function
48
XSPI0_MISO
I
PD
VDDQ33_EXT0
XSPI0_MISO
49
XSPI0_CSN
I
PD
VDDQ33_EXT0
XSPI0_CSN
50
XSPI0_MOSI
I
PD
VDDQ33_EXT0
XSPI0_MOSI
51
XSPI0_CLK
I
PD
VDDQ33_EXT0
XSPI0_CLK
71
XSPI1_MISO
I
PD
VDDQ33_EXT0
XSPI1_MISO
72
XSPI1_CLK
I
PD
VDDQ33_EXT0
XSPI1_CLK
73
XSPI1_MOSI
I
PD
VDDQ33_EXT0
XSPI1_MOSI
74
XSPI1_CSN
I
PD
VDDQ33_EXT0
XSPI1_CSN
Pad Number
Pad Name
I/O Type
PU/PD
Power
Default Function
Comment
46
XUART0_TXD
XUART0_TXD
Through Level Shifter
47
XUART0_RXD
XUART0_RXD
Through Level Shifter
52
XUART1_TXD
I
PD
VDDQ33_EXT0
XUART1_TXD
-
53
XUART1_RXD
I
PD
VDDQ33_EXT0
XUART1_RXD
-
54
XUART2_RXD
I
PD
VDDQ33_EXT0
XUART2_RXD
-
55
XUART2_TXD
I
PD
VDDQ33_EXT0
XUART2_TXD
-
56
XUART3_RXD
I
PD
VDDQ33_EXT0
XUART3_RXD
-
57
XUART3_TXD
I
PD
VDDQ33_EXT0
XUART3_TXD
-
PAD Number
Symbol
Condition
Min
Typ
Max
Units
PAD: [32]
VIN
Input voltage VIN on the high efficiency step down
converter
20
V
PAD: [2-19], [21-26], [28-31],
[33-45], [48-75]
Vundershoot
Undershoot voltage for I/O
-0.3
V
PAD: [31]
PWR_RST
-0.3
6
V
PAD: [46, 47]
VMAX
Based on 3V3 I/O signalling
63.3
V
IMAX
Continuous
305
mA
Pulsed
800
mA
Parameter
Condition
Min
Typ
Max
Units
Tolerant External Voltage
VTOL
3.3 Power Off and On
3.60
V
High-Level Input Voltage
CMOS Interface
VIH
2.31
3.60
V
Low-Level Input Voltage
CMOS Interface
VIL
VDD=3.30V
-0.30
0.70
V
Hysteresis Voltage
ΔV
0.15
V
High-Level Input Current
Input Buffer
IIH
VIN=3.30V
VDD=3.30V Power On
-3.00
3.00
µA
VDD=3.30V Power Off & SNS=0
-5.00
5.00
µA
Input Buffer with Pull-Down
VIN=3.30V
VDD=3.30V
13
40
90
µA
Low-Level Input Current
Input Buffer
IIL
VIN=0V
VDD=3.30V Power On and Off
-3.00
3.00
µA
Input Buffer with Pull-Down
VIN=0V
VDD=3.30V
-13.00
-90.00
µA
Output High Voltage
VOH
IOH = 2.0mA, 4.0mA, 8.0mA and 12.0mA
2.64
3.30
V
Output Low Voltage
VOL
IOL = -2.0mA, -4.0mA, -8.0mA and -12.0mA
0
0.66
V
Output Hi-Z Current
VOZ
-5
5
µA
Input Capacitance
CIN
Any input and bi-directional buffers
5
pF
Parameter
Acronym
Condition
Min
Typ
Max
Units
High Level Input Voltage
VIH
Guaranteed Logic High Level
1.26
1.80
V
Low Level Input Voltage
VIL
Guaranteed Logic Low Level
0
0.54
V
Output High Voltage
VOH
IOH=2mA, 4mA, 8mA and 12mA
1.44
1.80
V
Output Low Voltage
VOL
IOL=2mA, 4mA, 8mA and 12mA
0
0.36
V
Input Pull-Up Resistor Current
IRPU
VPAD=0
15
77
µA
Input Pull-Down Resistor Current
IRPD
VPAD=1.80
17
77
µA
Input Hysteresis
VH
0.18
V
Input Leakage Current for Non Tolerant Cells
IPAD
DVDD=1.80, VPAD=0 or 1.80V
-6
+6
µA
Off State Leakage Current
IOZ
DVDD=1.80, VPAD=0 or 1.80V
-6
+6
µA
Parameter
Symbol
Min
Typ
Max
Units
Main Power Supply: PAD: [32]
DC_5V_12V
4.50
18.00
V
Maximum Operating Temperature
Tc
-20
85
°C
State
Currents: Max conditions VDD=3.30V
Units
0
2
mA
1
4
mA
2
8 (Default)
mA
3
12
mA
Parameter
Min
Typ
Max
Units
ESD stress voltage Human Body Model (JEDEC)
-1.0
1.0
kV
ESD stress voltage Charged Device Model
250
V
PAD Number
Symbol
Condition
Min
Typ
Max
Units
PAD: [46, 47]
Dynamic Characteristics
CISS
Input Capacitance
VDS=25V, f=1.0MHz, VGS=0V
50
pF
COSS
Output Capacitance
25
pF
CRSS
Reverse Transfer Capacitance
5
pF
Parameter
Min
Typ
Max
Units
RF frequency range
2412
-
2472
GHz
11b (1-11Mbps)
16
dBm
11g (6-54Mbps)
14
dBm
11n, HT20 (MCS0-7)
12
dBm
Parameter
Min
Typ
Max
Units
RF frequency range
2412
2472
GHz
11b (1Mbps)
-97.2
dBm
11b (11Mbps)
-89.1
dBm
11g (6Mbps)
-94.1
dBm
11g (54Mbps)
-76.2
dBm
11n, HT20 (MCS0)
-93.9
dBm
11n, HT20 (MCS07)
-73.8
dBm
Figure 4 shows the mechanical dimensions of the ARTIK 053 Module. All dimensions are in mm.
Note: The top layer “NO PCB ROUTING” gray areas are to prevent any shorts
between exposed vias or traces and unused ARTIK 053 Module pads.
The ARTIK 053 Module has an integrated on-module antenna. Figure 5 describes the precise restrictions on location that must
be accounted for when placing the ARTIK 053 Module on your native PCB design. In addition please adhere to the following
guidelines:
Avoid severe WiFi radiation loss by allocating at least a 5x6.7mm “No PCB Routing” area (all layers) on either side of
the ARTIK 053 Module, next to the on-module antenna.
Locate the antenna area at the edge of your PCB board, and as far away from other electronics as possible.
See Figure 4 for additional routing restrictions.
This device complies with Part 15 of the FCC`s Rules. Operation is subject to the following two Conditions: (1) This device may
not cause harmful interference, and (2) This device must accept any interference received, including interference that may
cause undesirable operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the
FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee
that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct
the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/ TV technician for help.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment
should be installed and operated with a minimum distance of 20cm between the transmitter’s radiating structure(s) and the
body of the user or nearby persons.
This module is intended for OEM integration. The OEM integrator is responsible for FCC compliance and compliance with all
applicable regulations including those for modular transmitters 47 C.F.R. 15.212. The OEM product must comply with all
applicable labeling requirements including those contained in 15 C.F.R. 15.19. The OEM is solely responsible for certification
and testing and labeling of its own products. In addition to any independently required labels, the OEM shall also affix to the
outside of a device into which the module is installed a label referring to the enclosed module. This exterior label should be
prepared in a legible font and permanently affixed and using the wording “Contains Transmitter Module FCCID:
A3LCWAM210S.”
The OEM is required to ensure that the end product integrates this module so as to maintain a minimum distance of 20 cm
between the equipment’s radiating structure(s) and the body of the user or nearby persons. The OEM shall also advise its end
user of this requirement as required by applicable rules.
The OEM shall require that the end user of its product be informed that the FCC radio frequency exposure guidelines for an
uncontrolled environment can be satisfied. The OEM shall further inform its end user that any change or modifications to this
module not expressly approved by the manufacturer will void the warranty and the users’ authority to operate the
equipment.
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Cet appareil est conforme avec Industrie Canada exempts de licence standard RSS (s). Lopération est soumise aux deux conditions
suivantes:(1) cet appareil ne peut causer dinterférences, et
(2) cet appareil doit accepter toute interférence, y compris les
interférences qui peuvent causer un mauvais fonctionnement de l’appareil.
Industry Canada Radiation Exposures Statement and Limitations on Use
This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. This
equipment should be installed and must not be co-located or operating in conjunction with any other antenna or transmitter.
In the United States and Canada, only Channel 1~11 can be operated and these channel assignments deal only with the 2.4
GHz range.
The end product must be labeled to display the Industry Canada certification number of the module
Contains transmitter module IC: 649E-CWAM210S
Le dispositif d’accueil doivent être étiquetés pour afficher le numéro de certification d’Industrie Canada du module.
Contient module émetteur IC : 649E-CWAM210S
The following statement must be supplied with each product but can be printed in the user manual, the packaging, or provided as a
separated leaflet.
Hereby, Samsung declares that this IoT Module is in compliance with the essential requirements and other relevant
provisions of Article 3 of the R&TTE Directive 1999/5/EC, 2004/108/EC and RoHS directive 2011/65/EU.
“The declaration of conformity may be consulted at www.artik.io/certification”
The OEM is required to ensure that the end product integrates this module so as to maintain a minimum distance of 20 cm
between the equipment’s radiating structure(s) and the body of the user or nearby persons. The OEM shall also advise its end
user of this requirement as required by applicable rules.
Type
Order Number
Description
ARTIK 053 Module
SIP-0P5WRS301
One ARTIK 053 Module
For volume ordering of evaluation kits, please contact a sales representative in your area or visit
https://www.artik.io/contact-us/.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH THE SAMSUNG ARTIKDEVELOPMENT KIT AND ALL
RELATED PRODUCTS, UPDATES, AND DOCUMENTATION (HEREINAFTER “SAMSUNG PRODUCTS”). NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. THE
LICENSE AND OTHER TERMS AND CONDITIONS RELATED TO YOUR USE OF THE SAMSUNG PRODUCTS ARE GOVERNED
EXCLUSIVELY BY THE SAMSUNG ARTIK™ DEVELOPER LICENSE AGREEMENT THAT YOU AGREED TO WHEN YOU REGISTERED AS
A DEVELOPER TO RECEIVE THE SAMSUNG PRODUCTS. EXCEPT AS PROVIDED IN THE SAMSUNG ARTIKDEVELOPER LICENSE
AGREEMENT, SAMSUNG ELECTRONICS CO., LTD. AND ITS AFFILIATES (COLLECTIVELY, “SAMSUNG”) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION CONSEQUENTIAL OR INCIDENTAL DAMAGES, AND SAMSUNG DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, ARISING OUT OF OR RELATED TO YOUR SALE, APPLICATION AND/OR USE OF
SAMSUNG PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATED TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
SAMSUNG RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION, DOCUMENTATION AND SPECIFICATIONS WITHOUT
NOTICE. THIS INCLUDES MAKING CHANGES TO THIS DOCUMENTATION AT ANY TIME WITHOUT PRIOR NOTICE. THIS
DOCUMENTATION IS PROVIDED FOR REFERENCE PURPOSES ONLY, AND ALL INFORMATION DISCUSSED HEREIN IS PROVIDED
ON AN “AS IS” BASIS, WITHOUT WARRANTIES OF ANY KIND. SAMSUNG ASSUMES NO RESPONSIBILITY FOR POSSIBLE ERRORS
OR OMISSIONS, OR FOR ANY CONSEQUENCES FROM THE USE OF THE DOCUMENTATION CONTAINED HEREIN.
Samsung Products are not intended for use in medical, life support, critical care, safety equipment, or similar applications
where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any
governmental procurement to which special terms or provisions may apply.
This document and all information discussed herein remain the sole and exclusive property of Samsung. All brand names,
trademarks and registered trademarks belong to their respective owners. For updates or additional information about
Samsung ARTIK™, contact the Samsung ARTIK™ team via the Samsung ARTIK™ website at www.artik.io.
Copyright © 2017 Samsung Electronics Co., Ltd.
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or
by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior written consent of
Samsung Electronics.
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS"
basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of
Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one
party to the other party under this document, by implication, estoppel or other-wise. Samsung products are not intended for use in life
support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or
physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and
registered trademarks belong to their respective owners.

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