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ERA-W,V,S Series Datasheet

Panasonic Electronic Components

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Datasheet

Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Metal Film Thermosensitive Chip Resistors
E
1
R
2
A
3
S
4
1
5
5
6
J
7
1
8
0
9
3
10
V
11
Metal Film
Chip Resistors
Product Code Size, Power Rating
Type: inches
W:0402
V:0603
S:0805
0.031 W
0.063 W
0.1 W
Power Rating
Resistance Tolerance
Code
J
Tol.
±5%
Resistance Value
Temperature Coefficient of Resistance
Code Type
15
27
33
39
ERAV, ERAS
ERAW, ERAV, ERAS
ERAW, ERAV, ERAS
ERAV, ERAS
1500
2700
3300
3900
(
10–6/°C
)
Packaging Methods
Code
X
V
Packaging Type
Punched Carrier Taping
2mmpitch, 10,000 pcs. ERAW
ERAV
ERAS
Punched Carrier Taping
4mmpitch, 5,000 pcs.
The first two digits are significant figures of
resistance and the third one denotes number of
zeros following. Decimal point is expressed by “R ”.
(ex.) 103 : 10 k
6R8 : 6.8
a
b
t
W
L
(1)
Dimensions in mm (not to scale)
Type
(inches)
Dimensions (mm)
Mass (Weight)
[g/1000 pcs.]
LWa b t
ERAW
(0402) 1.00±0.07 0.50±0.05 0.15±0.10 0.25±0.07 0.35±0.05 0.6
ERAV
(0603) 1.60±0.20 0.80±0.20 0.30±0.20 0.30±0.20 0.45±0.10 2
ERAS
(0805) 2.00±0.20 1.25±0.10 0.40±0.25 0.40±0.25 0.50±0.10 4
Metal Film Thermosensitive Chip Resistors
0402, 0603, 0805
Type: ERAW, V, S
Features
Suitable for temperature correction circuits
Temperature coeffi cient value 1500 to 3900 10–6/°C
High performance
Quick response to tem per a ture change
Linearity
Excellent linear resistance val ue change in wide temperature range (–40 °C to +125 °C)
High reliability, High density placing
Small size and lightweight for PWB size reduction and lightweight products
Suitable for both refl ow and fl ow soldering
Reference Standards
IEC 60115-8, JIS C 5201-8, EIAJ RC-2145
RoHS compliant
Explanation of Part Numbers
Construction
Protective coating
Alumina substrate Electrode (Inner)
Electrode
(Between)
Thermosensitive
element Electrode (Outer) 1) Marking Temperture Coeffi cient value :
2 signifi cant fi gure
100
10–6/°C
ERAW type is no marking.
Oct. 201000
Discontinued
Metal Film Thermosensitive Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
0
40 20 0 20 40 60 80 100 120 140
20
40
60
80
100
120
Rated Load (%)
Ambient Temperature(°C)
70 °C
125 °C
30
40 25 0 25 50 75 100 125
20
10
0
10
20
30
40
50
60
Resistance Change (%)
Ambient Temperature (°C)
390010–6/°C (ppm/°C)
270010–6/°C (ppm/°C)
150010–6/°C (ppm/°C)
Type
(inched)
Power Rating
at 70 °C
(W)
Standard Specifi cation(1)
T.C.R.
Tolerance
Re sis tance
Tolerance
(%)
Standard
Resistance
Values
T.C.R.
(10–6C)(2) Resistance
Range ()
ERAW
(0402) 0.031 2700
3300
43 to 1 k
22 to 390 ±10 % ±5 E12
ERAV
(0603) 0.063
1500 10 to 10 k ±200 10 -6 C
±5 E12
2700
3300
3900
43 to 3.3 k
22 to 1.2 k
7.5 to 3 9 0
±10 %
ERAS
(0805) 0.1
1500 10 to 10 k ±200 10 -6 C
±5 E12
2700
3300
3900
43 to 5.1 k
22 to 1.8 k
6.2 to 470
±10 %
R75-R25
R25
1
7525
(2) T.C.R.=
{
106
}
10–6/°CR25: Re sis tance value at reference temperature 25 °C
R75: Re sis tance value at temperature 75 °C
Power Derating Curve
For resistors operated in ambient
tem per a tures above 70 °C, power rating
shall be derated in accordance with the
fi gure on the right.
Typical Linearity of Resistance Change
Category Temperature Range
40 °C to +125 °C
Ratings
(1) Please ask us when resistors other than standard spec i fi ca tion shown in the above table are needed.
Sep. 201000
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Metal Film Thermosensitive Chip Resistors
TA
P0
P2
P1
P1
φD0
B
F
W
E
(2 mm pitch)
φN
W2
W1
φA
φC
c
a
b
Chip Resistor
Punched Carrier
Attention
This product has high temperature coeffi cient. When mea sur ing resistance, the resistance value can change due
to Joule Heating. Therefore, the mea sur ing current shall be very small in order to prevent the resistance value from
changing. (For example, when the resistor is used at RCWV, temperature of the re sis tor rise about 15 °C and the
resistance value rise a few percents.) Resistance value may also change due to the ambient tem per a ture. Resistance
value is measured at 25 °C.
Recommended Land Pattern
Anexample of a land pattern to Metal Film Thermosensitive Chip Resistors is shown below.
Example
Packaging Methods (Taping)
Standard Quantity
Taping Reel
Carrier Tape
(Unit : mm)
(Unit : mm)
Type
(inch size)
Dimensions (mm)
abc
ERAW
(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
ERAV
(0603) 0.7 to 0.9 2.0 to 2.2 0.8 to 1.0
ERAS
(0805) 1.0 to 1.4 3.2 to 3.8 0.9 to 1.4
Type Kind of Taping Pitch (P1)Quantity
ERAW
Punched Carrier Taping
2 mm 10000 pcs./reel
ERAV 4 mm 5000 pcs./reel
ERAS
Type A B W F E P1P2P0φD0T
ERAW 0.67±0.05 1.17±0.05
8.00±0.20 3.50±0.05 1.75±0.10
2.00±0.10
2.00±0.05 4.00±0.10 1.50+0.10
0.52±0.05
ERAV 1.10±0.10 1.19±0.10
4.00±0.10 0.70±0.05
ERAS 1.65±0.15 2.50±0.20 0.84±0.05
–0
Type φAφNφCW1W2
ERAW
180.0+0 60+1.0 13.0±0.2 9.0+1.0 11.4±1.0
ERAV
ERAS
–1.5 –0 –0
Sep. 201000
Metal Film Thermosensitive Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Preheating
Peak
Heating
Temperature
Time
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 5 °C max. 10 s
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
For soldering For lead-free soldering
Temperature TimeTemperatureTime
Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s
Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s
Recommended Soldering Conditions
Recommendations and precautions are described below.
Recommended soldering conditions for refl ow
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
Recommended soldering conditions for fl ow
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER2 of this catalog.
1. Keep the rated power and ambient temperature within the specifi ed derating curve.
* When positioning and mounting Metal Film Thermosensitive Chip Resistors (hereafter called the resistors), make
allowance for the effect of heat generated through close contact between the resistors and neigh bor ing components
and for the temperature rise of adjacent heat-generating components.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
When applying pulses to the resistors, keep the pulse peak within the rated voltage.
3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. When the resistors' protective coatings are chipped, fl awed, or removed, the characteristics of the resistors may be
impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during
handling of the boards with the resistors mounted.
7. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'
protective coatings and bodies may be chipped, affecting their performance.
8. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
9. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of im mer sion.
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Sep. 201000
– 2 –
Safety Precautions (Common precautions for Fixed Resistors)
When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifi cations described in this catalog.
This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other signifi cant dam age, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
Systems equipped with a protection circuit and a protection device
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault
(1) Precautions for use
These products are designed and manufactured for general and standard use in general elec tron ic equipment
(e.g. AV equipment, home electric appliances, offi ce equipment, information and communication equipment)
These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or infl ammables, such as vinyl-coated wires, near these products.
Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al
at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Aug. 201201

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