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MAX809, MAX810, NCV809 Series Datasheet

ON Semiconductor

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Datasheet

© Semiconductor Components Industries, LLC, 2016
November, 2017 − Rev. 28 1Publication Order Number:
MAX809S/D
MAX809 Series,
MAX810 Series
Very Low Supply Current
3-Pin Microprocessor
Reset Monitors
The MAX809 and MAX810 are cost−effective system supervisor
circuits designed to monitor VCC in digital systems and provide a reset
signal to the host processor when necessary. No external components
are required.
The reset output is driven active within 10 msec of VCC falling
through the reset voltage threshold. Reset is maintained active for a
timeout period which is trimmed by the factory after VCC rises above
the reset threshold. The MAX810 has an active−high RESET output
while the MAX809 has an active−low RESET output. Both devices
are available in SOT−23 and SC−70 packages.
The MAX809/810 are optimized to reject fast transient glitches on
the VCC line. Low supply current of 0.5 mA (VCC = 3.2 V) makes these
devices suitable for battery powered applications.
Features
Precision VCC Monitor for 1.5 V, 2.5 V, 3.0 V, 3.3 V, and 5.0 V
Supplies
Precision Monitoring Voltages from 1.2 V to 4.9 V Available
in 100 mV Steps
Four Guaranteed Minimum Power−On Reset Pulse Width Available
(1 ms, 20 ms, 100 ms, and 140 ms)
RESET Output Guaranteed to VCC = 1.0 V.
Low Supply Current
Compatible with Hot Plug Applications
VCC Transient Immunity
No External Components
Wide Operating Temperature: −40°C to 105°C
These Devices are Pb−Free and are RoHS Compliant
Typical Applications
Computers
Embedded Systems
Battery Powered Equipment
Critical Microprocessor Power Supply Monitoring
VCC
VCC
VCC
PROCESSOR
RESET RESET
INPUT
MAX809/810
GND GND
Figure 1. Typical Application Diagram
RESET
NOTE: RESET is for MAX809
RESET is for MAX810
SOT−23
(TO−236)
CASE 318
PIN CONFIGURATION
3
1
2
VCC
GND
RESET
SOT−23/SC−70
(Top View)
xxx = Specific Device Code
M = Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
MARKING
DIAGRAM
3
121
2
3
RESET
See general marking information in the device marking
section on page 10 of this data sheet.
DEVICE MARKING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
ORDERING INFORMATION
xxx MG
G
xx MG
G
1
SC−70
(SOT−323)
CASE 419
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T
his document contains information on some products that
a
re still under development. ON Semiconductor reserves the
r
ight to change or discontinue these products without notice.
MAX809 Series, MAX810 Series
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2
Vref
1 GND
3
2
VCC
RESET
Figure 2. MAX809 Series Complementary Active−Low Output
Timeout
Counter Oscillator
VCC
Vref
1 GND
3
2
VCC
RESET
Oscillator
VCC
Timeout
Counter
Figure 3. MAX810 Series Complementary Active−High Output
MAX809 Series, MAX810 Series
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3
PIN DESCRIPTION
Pin No. Symbol Description
1 GND Ground
2 RESET (MAX809) RESET output remains low while VCC is below the reset voltage threshold, and for a reset timeout
period after VCC rises above reset threshold
2RESET (MAX810) RESET output remains high while VCC is below the reset voltage threshold, and for a reset timeout
period after VCC rises above reset threshold
3 VCC Supply Voltage (Typ)
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Power Supply Voltage (VCC to GND) VCC −0.3 to 6.0 V
RESET Output Voltage (CMOS) −0.3 to (VCC + 0.3) V
Input Current, VCC 20 mA
Output Current, RESET 20 mA
dV/dt (VCC) 100 V/msec
Thermal Resistance, Junction−to−Air (Note 1) SOT−23
SC−70 RqJA 301
314
°C/W
Operating Junction Temperature Range TJ−40 to +125 °C
Storage Temperature Range Tstg −65 to +150 °C
Lead Temperature (Soldering, 10 Seconds) Tsol +260 °C
ESD Protection
Human Body Model (HBM): Following Specification JESD22−A114
Machine Model (MM): Following Specification JESD22−A115
2000
200
V
Latchup Current Maximum Rating: Following Specification JESD78 Class II
Positive
Negative
ILatchup 200
200
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This based on a 35x35x1.6mm FR4 PCB with 10mm2 of 1 oz copper traces under natural convention conditions and a single component
characterization.
2. The maximum package power dissipation limit must not be exceeded.
PD+
T
J(max) *
T
A
RqJA
with TJ(max) = 150°C
MAX809 Series, MAX810 Series
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4
ELECTRICAL CHARACTERISTICS TA = −40°C to +105°C unless otherwise noted. Typical values are at TA = +25°C. (Note 3)
Characteristic Symbol Min Typ Max Unit
VCC Range
TA = 0°C to +70°C
TA = −40°C to +105°C (Note 4)
1.0
1.2
5.5
5.5
V
Supply Current
VCC = 3.3 V
TA = −40°C to +85°C
TA = 85°C to +105°C (Note 5)
VCC = 5.5 V
TA = −40°C to +85°C
TA = 85°C to +105°C (Note 5)
ICC
0.5
0.8
1.2
2.0
1.8
2.5
mA
Reset Threshold (Vin Decreasing) (Note 6) VTH V
MAX809SN490
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
4.83
4.78
4.66
4.9
4.97
5.02
5.14
MAX8xxLTR, MAX8xxSQ463
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
4.56
4.50
4.40
4.63
4.70
4.75
4.86
MAX809HTR
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
4.48
4.43
4.32
4.55 4.62
4.67
4.78
MAX8xxMTR, MAX8xxSQ438
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
4.31
4.27
4.16
4.38 4.45
4.49
4.60
MAX809JTR, MAX8xxSQ400
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
3.94
3.90
3.80
4.00
4.06
4.10
4.20
MAX8xxTTR, MAX809SQ308
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
3.04
3.00
2.92
3.08
3.11
3.16
3.24
MAX8xxSTR, MAX8xxSQ293
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
2.89
2.85
2.78
2.93
2.96
3.00
3.08
MAX8xxRTR, MAX8xxSQ263
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
2.59
2.56
2.49
2.63
2.66
2.70
2.77
MAX809SN232, MAX809SQ232
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
2.28
2.25
2.21
2.32
2.35
2.38
2.45
MAX809SN160
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
1.58
1.56
1.52
1.60
1.62
1.64
1.68
MAX809SN120, MAX8xxSQ120
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
1.18
1.17
1.14
1.20
1.22
1.23
1.26
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Production testing done at TA = 25°C, over temperature limits guaranteed by design.
4. For NCV automotive devices, this temperature range is TA = −40°C to +125°C.
5. For NCV automotive devices, this temperature range is TA = +85°C to +125°C.
6. Contact your ON Semiconductor sales representative for other threshold voltage options.
MAX809 Series, MAX810 Series
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5
ELECTRICAL CHARACTERISTICS (continued) TA = −40°C to +105°C unless otherwise noted. Typical values are at
TA = +25°C. (Note 7)
Characteristic Symbol Min Typ Max Unit
Detector Voltage Threshold Temperature Coefficient 30 − ppm/°C
VCC to Reset Delay VCC = VTH to (VTH − 100 mV) 10 msec
Reset Active TimeOut Period (Note 8)
MAX8xxSN(Q)293D1
MAX8xxSN(Q)293D2
MAX8xxSN(Q)293D3
MAX8xxSN(Q)293
tRP 1.0
20
100
140
3.3
66
330
460
msec
RESET Output Voltage Low (No Load) (MAX809)
VCC = VTH − 0.2 V
1.6 V v VTH v 2.0 V, ISINK = 0.5 mA
2.1 V v VTH v 4.0 V, ISINK = 1.2 mA
4.1 V v VTH v 4.9 V, ISINK = 3.2 mA
VOL 0.3 V
RESET Output Voltage High (No Load) (MAX809)
VCC = VTH + 0.2 V
1.6 V v VTH v 2.4 V, ISOURCE = 200 mA
2.5 V v VTH v 4.9 V, ISOURCE = 500 mA
VOH 0.8 VCC − V
RESET Output Voltage High (No Load) (MAX810)
VCC = VTH − 0.2 V
1.6 V v VTH v 2.4 V, ISOURCE = 200 mA
2.5 V v VTH v 4.9 V, ISOURCE = 500 mA
VOH 0.8 VCC − V
RESET Output Voltage Low (No Load) (MAX810)
VCC = VTH + 0.2 V
1.6 V v VTH v 2.0 V, ISINK = 0.5 mA
2.1 V v VTH v 4.0 V, ISINK = 1.2 mA
4.1 V v VTH v 4.9 V, ISINK = 3.2 mA
VOL 0.3 V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
7. Production testing done at TA = 25°C, over temperature limits guaranteed by design.
8. Contact your ON Semiconductor sales representative for timeout options availability for other threshold voltage options.
MAX809 Series, MAX810 Series
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6
85°C
−40°C
−40°C
TYPICAL OPERATING CHARACTERISTICS
0.5
0.4
0.3
0.2
0.1
0
0.5 1.5 2.5 3.5 4.5 6.5
−50 −25 0 25 50 75
SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
Figure 4. Supply Current vs. Supply Voltage
0.35
0.25
0.20
0.15
0.05
0
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
0.6
85°C
25°C
−40°C
0.5 1.5 2.5 3.5 4.5 6.5
25°C
VTH = 4.9 V
0.25
0.15
0.05
00.5 1.5 2.5 3.5 4.5 6.5
SUPPLY VOLTAGE (V)
0.35
85°C
25°C
SUPPLY CURRENT (mA)
VTH = 2.93 V
NORMALIZED THRESHOLD VOLTAGE
0.994
0.995
0.996
0.997
0.998
0.999
1.000
1.002
100
VTH = 1.2 V
−50 −25 0 25 50
0
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
0.08
0.16
0.24
0.32
0.40
75 100
MAX809L/M, VCC = 5.0 V
VTH = 4.9 V
VTH = 1.2 V
−50 −25 0 25 50
0
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
0.08
0.16
0.24
0.32
0.40
100
Figure 5. Supply Current vs. Supply Voltage
Figure 6. Supply Current vs. Supply Voltage Figure 7. Normalized Reset Threshold Voltage
vs. Temperature
Figure 8. Supply Current vs. Temperature
(No Load, MAX809) Figure 9. Supply Current vs. Temperature (No
Load, MAX810)
5.5 5.5
5.5
1.001
75
0.10
0.30
0.10
0.20
0.30
MAX809R/S/T, VCC = 3.3 V
MAX809L/M/R/S/T, VCC = 1.0 V
MAX810L/M, VCC = 5.0 V
MAX810R/S/T, VCC = 3.3 V
MAX810L/M/R/S/T, VCC = 1.0 V
MAX809 Series, MAX810 Series
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−40°C
TYPICAL OPERATING CHARACTERISTICS
25
20
15
10
5.0
0
0.5 1.5 2.5 3.5 4.5 5.0
−50 −25 0 25 50 75
SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
Figure 10. Output Voltage Low vs. Supply
Voltage
80
50
40
30
10
0
SUPPLY VOLTAGE (V)
OUTPUT VOLTAGE VCC (mV)
OUTPUT VOLTAGE VCC−VOH (mV)
30
85°C
25°C
−40°C
0.5 1.5 2.5 3.5 4.5
85°C
25°C
100
25
0−50 −25 0 25 75 125
TEMPERATURE (°C)
125
POWER−DOWN RESET DELAY (msec)
POWER−DOWN RESET DELAY (msec)
0
100
200
300
400
125
−50 −25 0 25 50
TEMPERATURE (°C)
NORMALIZED POWER−UP RESET TIMEOUT
0.7
0.8
0.9
1.2
1.3
75 100
Figure 11. Output Voltage High vs. Supply
Voltage
Figure 12. Power−Down Reset Delay vs.
Temperature and Overdrive (VTH = 1.2 V) Figure 13. Power−Down Reset Delay vs.
Temperature and Overdrive (VTH = 4.9 V)
Figure 14. Normalized Power−Up Reset vs.
Temperature
4.0 5.0
100
20
60
50
75
1.0
1.1
VTH = 4.63 V
ISOURCE = 100 mA
RESET ASSERTED
10050
VOD = 200 mV
VOD = 100 mV
VOD = 20 mV
VOD = 10 mV VOD = VCC−VTH
VTH = 4.90 V
ISINK = 500 mA
RESET ASSERTED
1.0 2.0 3.0 4.0
70
1.0 2.0 3.0
VOD = 20 mV
VOD = 10 mV VOD = VCC−VTH
VOD = 200 mV
VOD = 100 mV
MAX809 Series, MAX810 Series
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8
Detail Operation Description
The MAX809/810 series microprocessor reset
supervisory circuits are designed to monitor the power
supplies in digital systems and provide a reset signal to the
processor without any external components. Figure 2 shows
the timing diagram and a typical application below. Initially
consider that input voltage VCC is at a nominal level greater
than the voltage detector upper threshold (VTH). And the
RESE
T
(RESET) output voltage (Pin 2) will be in the high
state for MAX809, or in the low state for MAX 810 devices.
If there is an input power interruption and VCC becomes
significantly deficient, it will fall below the lower detector
threshold (VTH−). This event causes the RESET output to be
in the low state for the MAX809, or in the high state for the
NCP810 devices. After completion of the power
interruption, VCC will rise to its nominal level and become
greater than the VTH. This sequence activates the internal
oscillator circuitry and digital counter to count. After the
count of the timeout period, the reset output will revert back
to the original state.
tRP
VCC
VTH+
VTH–
VCC
VTH–
0V
VCC
VTH–
0V
Input Voltage
Reset Output
MAX809, NCP803
Reset Output
MAX810
Figure 15. Timing Waveforms
MAX809 Series, MAX810 Series
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9
APPLICATIONS INFORMATION
VCC Transient Rejection
The MAX809 provides accurate VCC monitoring and
reset timing during power−up, power−down, and
brownout/sag conditions, and rejects negative−going
transients (glitches) on the power supply line. Figure 16
shows the maximum transient duration vs. maximum
negative excursion (overdrive) for glitch rejection. Any
combination of duration and overdrive which lies under the
curve will not generate a reset signal. Combinations above
the curve are detected as a brownout or power−down.
Typically, transient that goes 100 mV below the reset
threshold and lasts 5.0 ms or less will not cause a reset pulse.
Transient immunity can be improved by adding a capacitor
in close proximity to the VCC pin of the MAX809.
Figure 16. Maximum Transient Duration vs.
Overdrive for Glitch Rejection at 25°C
Duration
VTH
Overdrive
V
CC
10
250
200
11060
MAXIMUM TRANSIENT DURATION (
m
sec)
50
300
RESET COMPARATOR OVERDRIVE (mV)
041
0
VTH = 4.9 V
150
100
VTH = 1.2 V
160 210 260 310 360
VTH = 2.93 V
RESET Signal Integrity During Power−Down
The MAX809 RESET output is valid to VCC = 1.0 V.
Below this voltage the output becomes an “open circuit” and
does not sink current. This means CMOS logic inputs to the
Microprocessor will be floating at an undetermined voltage.
Most digital systems are completely shutdown well above
this voltage. However, in situations where RESET must be
maintained valid to VCC = 0 V, a pull−down resistor must be
connected from RESET to ground to discharge stray
capacitances and hold the output low (Figure 17). This
resistor value, though not critical, should be chosen such that
it does not appreciably load RESET under normal operation
(100 kW will be suitable for most applications).
VCC
VCC
RESET
R1
100 k
MAX809/810
GND
Figure 17. Ensuring RESET Valid to VCC = 0 V
RESET
Processors With Bidirectional I/O Pins
Some Microprocessors have bidirectional reset pins.
Depending on the current drive capability of the processor
pin, an indeterminate logic level may result if there is a logic
conflict. This can be avoided by adding a 4.7 kW resistor in
series with the output of the MAX809 (Figure 18). If there
are other components in the system which require a reset
signal, they should be buffered so as not to load the reset line.
If the other components are required to follow the reset I/O
of the Microprocessor, the buffer should be connected as
shown with the solid line.
VCC
VCC
Microprocessor
RESET
MAX809/810
GND GND
4.7 k
Figure 18. Interfacing to Bidirectional Reset I/O
RESET
VCC
BUFFERED RESET
TO OTHER SYSTEM
COMPONENTS
BUFFER
RESET
MAX809 Series, MAX810 Series
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10
ORDERING, MARKING AND THRESHOLD INFORMATION
Part Number VTH* (V) Timeout* (ms) Description Marking Package Shipping
MAX809SN160T1G 1.60 140−460
Push−Pull RESET
SAA
SOT23−3
(Pb−Free) 3000 / Tape & Reel
MAX809SN232T1G 2.32 140−460 SQP
MAX809RTRG 2.63 140−460 SPS
NCV809RTRG 2.63 140−460 RPA
MAX809STRG 2.93 140−460 SPT
NCV809STRG 2.93 140−460 SUC
MAX809TTRG 3.08 140−460 SPU
MAX809JTRG 4.00 140−460 SPR
MAX809MTRG 4.38 140−460 SPV
NCV809MTRG 4.38 140−460 TAT
MAX809HTRG 4.55 140−460 SBD
MAX809LTRG 4.63 140−460 SPW
NCV809LTRG 4.63 140−460 STA
MAX809SN490T1G 4.90 140−460 SBH
MAX809SN120T1G 1.20 140−460 SSO
MAX809SN293D1T1G 2.93 1−3.3 SSP
NCV809SN293D1T1G* ACT
MAX809SN293D2T1G 2.93 20−66 SSQ
NCV809SN293D2T1G 2.93 20−66 ACE
MAX809SN293D3T1G 2.93 100−330 SSR
MAX809SQ120T1G 1.20 140−460 ZD
SC70−3
(Pb−Free) 3000 / Tape & Reel
MAX809SQ232T1G 2.32 140−460 ZE
MAX809SQ263T1G 2.63 140−460 ZF
MAX809SQ293T1G 2.93 140−460 ZG
NCV809SQ293T1G*
(In Development)
MAX809SQ308T1G 3.08 140−460 ZH
MAX809SQ400T1G 4.00 140−460 SZ
MAX809SQ438T1G 4.38 140−460 ZI
MAX809SQ463T1G 4.63 140−460 ZJ
MAX809SQ293D1T1G 2.93 1−3.3 ZK
MAX809SQ293D2T1G 2.93 20−66 ZL
MAX809SQ293D3T1G 2.93 100−330 ZM
MAX809 Series, MAX810 Series
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11
ORDERING, MARKING AND THRESHOLD INFORMATION
Part Number VTH** (V) Timeout** (ms) Description Marking Package Shipping
MAX810RTRG 2.63 140−460
Push−Pull RESET
SPX
SOT23−3
(Pb−Free) 3000 / Tape & Reel
MAX810STRG 2.93 140−460 SPY
MAX810TTRG 3.08 140−460 SPZ
MAX810MTRG 4.38 140−460 SQA
MAX810LTRG 4.63 140−460 SQB
MAX810SN120T1G 1.20 140−460 SSS
MAX810SN293D1T1G 2.93 1−3.3 SST
MAX810SN293D2T1G 2.93 20−66 SSU
MAX810SN293D3T1G 2.93 100−330 SSZ
MAX810SQ120T1G 1.20 140−460 ZN
SC70−3
(Pb−Free) 3000 / Tape & Reel
MAX810SQ263T1G 2.63 140−460 ZO
MAX810SQ270T1G 2.70 20−66 ZB
MAX810SQ293T1G 2.93 140−460 ZP
MAX810SQ400T1G 4.00 20−66 ZC
MAX810SQ438T1G 4.38 140−460 ZQ
MAX810SQ463T1G 4.63 140−460 ZR
MAX810SQ293D1T1G 2.93 1−3.3 ZS
MAX810SQ293D2T1G 2.93 20−66 ZT
MAX810SQ293D3T1G 2.93 100−330 ZU
For information on tape and reel specifications,including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
**Contact your ON Semiconductor sales representative for other threshold voltage options.
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12
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AR
D
A1
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
SOLDERING FOOTPRINT*
VIEW C
L
0.25
L1
e
EE
b
A
SEE VIEW C
DIM
AMIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1 0.01 0.06 0.10 0.000
b0.37 0.44 0.50 0.015
c0.08 0.14 0.20 0.003
D2.80 2.90 3.04 0.110
E1.20 1.30 1.40 0.047
e1.78 1.90 2.04 0.070
L0.30 0.43 0.55 0.012
0.039 0.044
0.002 0.004
0.017 0.020
0.006 0.008
0.114 0.120
0.051 0.055
0.075 0.080
0.017 0.022
NOM MAX
L1
H
2.10 2.40 2.64 0.083 0.094 0.104
HE
0.35 0.54 0.69 0.014 0.021 0.027
c0 −−− 10 0 −−− 10
T°°°°
T
3X
TOP VIEW
SIDE VIEW END VIEW
2.90
0.80
DIMENSIONS: MILLIMETERS
0.90
PITCH
3X
3X 0.95
RECOMMENDED
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MAX809 Series, MAX810 Series
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13
PACKAGE DIMENSIONS
SC−70 (SOT−323)
CASE 419−04
ISSUE N
AA2
De1
b
e
E
A1
c
L
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
0.05 (0.002)
1.9
0.075
0.65
0.025
0.65
0.025
0.9
0.035
0.7
0.028 ǒmm
inchesǓ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HE
DIM
AMIN NOM MAX MIN
MILLIMETERS
0.80 0.90 1.00 0.032
INCHES
A1 0.00 0.05 0.10 0.000
A2 0.70 REF
b0.30 0.35 0.40 0.012
c0.10 0.18 0.25 0.004
D1.80 2.10 2.20 0.071
E1.15 1.24 1.35 0.045
e1.20 1.30 1.40 0.047
0.035 0.040
0.002 0.004
0.014 0.016
0.007 0.010
0.083 0.087
0.049 0.053
0.051 0.055
NOM MAX
L2.00 2.10 2.40 0.079 0.083 0.095
HE
e1 0.65 BSC
0.38
0.028 REF
0.026 BSC
0.015
0.20 0.56 0.008 0.022
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