NZH Series Datasheet

Nexperia USA Inc.

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Datasheet

Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
application markets
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
the references to Nexperia, as shown below.
Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
use http://www.nexperia.com
Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use
salesaddresses@nexperia.com (email)
Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
the version, as shown below:
- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
- © Nexperia B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and
understanding,
Kind regards,
Team Nexperia
1. Product profile
1.1 General description
General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted
Device (SMD) plastic package.
1.2 Features
1.3 Applications
General regulation functions
1.4 Quick reference data
[1] Pulse test: tp300 μs; δ≤0.02.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
cathode 1 cm2.
[3] Device mounted on a ceramic PCB, Al2O3, standard footprint.
NZH series
Single Zener diodes
Rev. 01 — 27 January 2010 Product data sheet
Total power dissipation: 500 mW Small plastic package suitable for
surface-mounted design
Wide working voltage range Low differential resistance
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage IF=10mA [1] --0.9V
Ptot total power dissipation Tamb 25 °C[2] --500mW
[3] --1W
NZH_SER_1 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 January 2010 2 of 9
NXP Semiconductors NZH series
Single Zener diodes
2. Pinning information
[1] The marking bar indicates the cathode.
3. Ordering information
[1] The series consists of 25 types with nominal working voltages from 3.0 V to 30 V.
4. Marking
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 cathode [1]
2 anode 21
006aaa15
2
2
1
Table 3. Ordering information
Type number Package
Name Description Version
NZH3V0B to
NZH30C[1] - plastic surface-mounted package; 2 leads SOD123F
Table 4. Marking codes
Type number Marking code Type number Marking code
NZH3V0B CH NZH10C CW
NZH3V3A CJ NZH11C CX
NZH3V6B CK NZH12B CY
NZH3V9B CL NZH13B D9
NZH4V3B CM NZH15B D1
NZH4V7B CN NZH16C D2
NZH5V1B CP NZH18C D3
NZH5V6B CQ NZH20C D4
NZH6V2B CR NZH22C D5
NZH6V8B CS NZH24C D6
NZH7V5C CT NZH27C D7
NZH8V2B CU NZH30C DA
NZH9V1B CV - -
NZH_SER_1 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 January 2010 3 of 9
NXP Semiconductors NZH series
Single Zener diodes
5. Limiting values
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[2] Device mounted on a ceramic PCB, Al2O3, standard footprint.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[2] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[3] Soldering point of cathode tab.
7. Characteristics
[1] Pulse test: tp300 μs; δ≤0.02.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
IFforward current - 250 mA
Ptot total power dissipation Tamb 25 °C[1] -500mW
[2] -1W
Tjjunction temperature - 150 °C
Tamb ambient temperature 55 +150 °C
Tstg storage temperature 65 +150 °C
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1] - - 250 K/W
[2] - - 125 K/W
Rth(j-sp) thermal resistance from
junction to solder point
[3] --70K/W
Table 7. Characteristics
Tj=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage IF=10mA [1] --0.9V
Table 8. Characteristics per type; NZH3V0B to NZH10C
Tj=25
°
C unless otherwise specified.
NZHxxx Working voltage
VZ(V);
IZ=20mA
Maximum differential
resistance
rdif (Ω)
Reverse current
IR(μA) Diode
capacitance
Cd(pF)[1]
Min Max IZ=1mA IZ=20mA Max VR(V) Max
3V0B 2.85 3.15 1000 80 50 1 450
3V3A 3.16 3.38 1000 70 20 1 450
3V6B 3.42 3.78 1000 60 5 1 450
3V9B 3.71 4.10 1000 50 5 1 450
NZH_SER_1 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 January 2010 4 of 9
NXP Semiconductors NZH series
Single Zener diodes
[1] f = 1 MHz; VR=0V
[1] f = 1 MHz; VR=0V
[1] f = 1 MHz; VR=0V
4V3B 4.17 4.43 1000 40 5 1 450
4V7B 4.55 4.80 900 25 5 1 300
5V1B 4.94 5.20 800 20 5 1.5 300
5V6B 5.45 5.73 500 13 5 2.5 300
6V2B 5.96 6.27 300 10 5 3 200
6V8B 6.49 6.83 150 8 2 3.5 200
7V5C 7.29 7.67 120 8 0.5 4 150
8V2B 8.02 8.36 120 8 0.5 5 150
9V1B 8.85 9.23 120 8 0.5 6 150
10C 9.70 10.20 120 8 0.2 7 90
Table 9. Characteristics per type; NZH11C to NZH20C
Tj=25
°
C unless otherwise specified.
NZHxxx Working voltage
VZ(V);
IZ=10mA
Maximum differential
resistance
rdif (Ω)
Reverse current
IR(μA) Diode
capacitance
Cd(pF)[1]
Min Max IZ=1mA IZ=10mA Max VR(V) Max
11C 10.82 11.38 120 10 0.04 8 85
12B 11.44 12.03 110 12 0.04 9 85
13B 12.35 13.65 110 14 0.04 10 80
15B 14.25 15.75 110 16 0.04 11 75
16C 15.69 16.51 150 18 0.04 12 75
18C 17.42 18.33 150 23 0.04 13 70
20C 19.23 20.22 200 28 0.04 15 60
Table 10. Characteristics per type; NZH22C to NZH30C
Tj=25
°
C unless otherwise specified.
NZHxxx Working voltage
VZ(V);
IZ=5mA
Maximum differential
resistance
rdif (Ω)
Reverse current
IR(μA) Diode
capacitance
Cd(pF)[1]
Min Max IZ=1mA IZ=5mA Max VR(V) Max
22C 21.08 22.17 200 30 0.04 17 60
24C 23.12 24.31 200 35 0.04 19 55
27C 25.63 26.95 250 45 0.04 21 50
30C 28.50 31.50 250 55 0.04 23 50
Table 8. Characteristics per type; NZH3V0B to NZH10C …continued
Tj=25
°
C unless otherwise specified.
NZHxxx Working voltage
VZ(V);
IZ=20mA
Maximum differential
resistance
rdif (Ω)
Reverse current
IR(μA) Diode
capacitance
Cd(pF)[1]
Min Max IZ=1mA IZ=20mA Max VR(V) Max
NZH_SER_1 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 January 2010 5 of 9
NXP Semiconductors NZH series
Single Zener diodes
Tj=25°C
Fig 1. Forward current as a function of forward voltage; typical values
Tj=25°CT
j=25°C
Fig 2. Working current as a function of working
voltage; typical values Fig 3. Working current as a function of working
voltage; typical values
VF (V)
0.6 10.8
mbg781
100
200
300
IF
(mA)
0
VZ (V)
0108462
006aac010
20
30
10
40
50
IZ
(mA)
0
5.1
5.6 6.8 8.2
9.1
7.56.2
3.6
3.3
3.9
VZ(nom) (V) = 3.0
VZ (V)
7.5 17.515.010.0 12.5
006aac011
10
20
30
5
15
25
IZ
(mA)
0
1615
VZ(nom) (V) = 12 13
NZH_SER_1 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 January 2010 6 of 9
NXP Semiconductors NZH series
Single Zener diodes
8. Package outline
9. Packing information
[1] For further information and the availability of packing methods, see Section 13.
[2] The series consists of 25 types with nominal working voltages from 3.0 V to 30 V.
10. Soldering
Fig 4. Package outline SOD123F
04-11-29Dimensions in mm
1.2
1.0
0.25
0.10
3.6
3.4
2.7
2.5
0.55
0.35
0.70
0.55
1.7
1.5
1
2
Table 11. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
NZH3V0B to
NZH30C[2] SOD123F 4 mm pitch, 8 mm tape and reel -115 -135
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 5. Reflow soldering footprint SOD123F
1.6
1.6
2.9
4
4.4
1.1 1.22.1
1.1
(2×)
solder lands
solder resist
occupied area
solder paste
NZH_SER_1 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 January 2010 7 of 9
NXP Semiconductors NZH series
Single Zener diodes
11. Revision history
Table 12. Revision history
Document ID Release date Data sheet status Change notice Supersedes
NZH_SER_1 20100127 Product data sheet - -
NZH_SER_1 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 January 2010 8 of 9
NXP Semiconductors NZH series
Single Zener diodes
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors NZH series
Single Zener diodes
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 27 January 2010
Document identifier: NZH_SER_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Packing information . . . . . . . . . . . . . . . . . . . . . 6
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13 Contact information. . . . . . . . . . . . . . . . . . . . . . 8
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

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