MILLIGRID 2MM DUAL ROW
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
AT SEE 2013/07/18 SK Ang 2013/08/16 ML Ong 2013/08/16
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
7.0 Special Instructions for High-temperature Reflow Processing Only
The products covered in this specification are molded with a high-temperature thermoplastic
resin that can withstand the effects of elevated temperatures as seen in today’s reflow soldering
processes. This high temperature resin, like many used in the electronics industry, is
hygroscopic in nature, meaning it can absorb/desorb moisture readily.
Depending on the degree of elevated ambient temperature and relative humidity, the connectors
may absorb an increased percentage of moisture. This increase in percentage of absorption is
also dependent on the exposure time once connectors are removed from the sealed moisture
barrier bags. Higher levels of moisture absorption are typically non-detrimental in most
situations but when combined with the elevated peak temperatures and dwell times seen in
reflow solder processes trapped gasses and moisture can sometimes result in blistering of the
In view of the hygroscopic nature of the resin, proper handling and storage are required if
connectors will be processed or exposed to the higher temperatures of reflow soldering. Storage
exposure time begins once connectors have been removed from sealed moisture barrier bags.
Greater exposure time, storage and processing temperatures, ambient humidity and part
geometry are influencing factors. As such, if connectors are used in a reflow soldering
environment, it is recommended that upon removal from the moisture barrier bag, they should
be consumed within 48 hours with a temperature and humidity level of not more than 30°C and
60% RH respectively. For unused quantity, it is recommended to repack within 24 hours into the
moisture barrier bag and vacuum sealed prior to storage for future use.
Precautions and Remedy
To minimize moisture absorption, connectors are supplied in sealed moisture barrier bags with
desiccant pouches. It is recommended that the connectors remain sealed in moisture barrier
bags until they are ready to be consumed, following the above storage guideline. However, in
the event the connectors are removed from the moisture barrier bag and have been exposed to
conditions beyond the storage guideline, it is recommended that the connectors to be baked to
remove moisture. Exposed connectors may be baked at 125°C for 3 to 5 hours and thereafter,
they should be good for reflow soldering.