53261-0271 Datasheet

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LANGUAGE
JAPANESE
ENGLISH
REV.
R
T
SHEET
1-14
1-17
REVISE ON PC ONLY
TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
REVISED
116810
‘17/05/12 R.TANAKA
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DESIGN CONTROL
J
STATUS
WRITTEN
BY:
E.SUZUKI
CHECKED
BY:
K.TOJO
APPROVED
BY:
M.SASAO
DATE: YR/MO/DAY
2004/02/05
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
1 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
【1.適用範囲 SCOPE
本仕様書は 殿 に納入する
1.25mmッチ SMT電線対基板用 ネクタ について規定する。
This specification covers the 1.25mm PITCH WIRE TO BOARD SMT CONNECTOR series.
【2.製品名称及び型番 PRODUCT NAME AND PART NUMBER
Product Name
Part Number
ターミナル
Male TerminalAWG #26-28
50079-8*00
ターミナル
Male TerminalAWG #28-32
50058-8*00
ハウジング
Housing
51021-**00
ウェハー アッセンブリ
Wafer Assembly (R/A)
53261-**19
53261-**19テーピング梱包品
(乾燥剤入り、ハイバリア梱)
Embossed Tape Package for 53261-**19
(High barrier package including desiccant)
53261-**71
ウェハー アッセンブリ
Wafer Assembly (R/A) BLACK
53261-**17
53261-**17テーピング梱包品
(乾燥剤入り、ハイバリア梱)
Embossed Tape Package for 53261-**17
(High barrier package including desiccant)
53261-**27
ウェハー アッセンブリ
Wafer Assembly (ST.)
53398-**19
53398-**19テーピング梱包品
(乾燥剤入り、ハイバリア梱)
Embossed Tape Package for 53398-**19
(High barrier package including desiccant)
53398-**71
* : 図面参照 Refer to the drawing.
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
2 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
【3.定格及び適用電線 RATINGS AND APPLICABLE WIRES
Item
Standard
最大許容電圧
Rated Voltage (MAX.)
125 V(実効値 rms
AC(実効値 rms) / DC
被覆外径: 0.51.04mm MAX.
Insulation O.D
最大許容電流
及び適用電線
Rated Current (MAX.)
and Applicable wires
AWG. #26
1.0 A
AWG. #28
1.0 A
AWG. #30
1.0 A
AWG. #32
0.8 A
使用温度範囲*1*2*3
Ambient Temperature Range
-40 ~ +105
低温において氷結しないこと Not freeze in low temperature
防湿梱包開梱後の推奨保管条件*4
Storage condition after opening
the Humidity Prevention package
53261-**71/53261-**27
53398-**71に適用
温度
Temperature
-5℃~+35
湿度
Humidity
70%R.H.以下(但し結露なきこと)
70%R.H.MAX.(No condensation)
*1 : 基板実装後の無通電状態は、使用温度範囲が適用されます。
Non-operating connectors after reflow must follow the operating temperature range condition.
*2 : 通電による温度上昇分も含む。 Including terminal temperature rise.
*3 : 適合電線も本使用温度範囲を満足すること。
Applicable wires must also meet the specified temperature range.
*4: 開梱後の取り扱いについては、本書の取り扱いの注意事項を参照下さい。
Refer to Instruction upon usage.
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
3 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
参考許容電 CURRENT DERATING REFERENCE INFORMATION
AWG
2-circuits
8-circuits
15-circuits
Amps (A)
Amps (A)
Amps (A)
26
2.5
1.5
1.0
28
2.0
1.5
1.0
30
1.5
1.0
1.0
32
1.5
1.0
0.8
1) 各電流値は参考となります
Values are for REFERENCE ONLY.
2) 閾値は温度上昇30℃以下としています。
Current deratings are based on not exceeding 30°C Temperature Rise.
3) 温度上昇の測定は圧着端子のバレル部にて実施しています
Temperature Rise is measured in barrel area of crimp terminal.
4) 基板デザインにより温度上昇の結果が異なります
PCB trace design can greatly affect temperature rise results.
5) 全極に通電し測定しています
Data is for all circuits powered.
LANGUAGE
JAPANESE
ENGLISH
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TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
4 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
【4.性能 PERFORMANCE
4-1. 電気的性能 ELECTRICAL PERFORMANCE
Item
Test Condition
Requirement
4-1-1
Contact
Resistance
コネクタを嵌合させ、開放電圧 20mV以下、短絡
電流 10mA 以下にて測定する。(JIS C5402-2-1)
Mate connectors and measured by dry circuit,
20mV MAX., 10mA.MAX.
(JIS C5402-2-1)
20 milliohm MAX.
4-1-2
Insulation
Resistance
コネクタを嵌合させ、隣接するタ-ミナル間及び
タ-ミナル、ア-ス間に、DC 500V を印加し測定
する。
(
JIS C5402-3-1/MIL-STD-202
試験法
302
)
Apply 500V DC between adjacent terminals or
terminal and ground.
(JIS C5402-3-1/MIL-STD-202 Method 302)
100 Megohm MIN.
4-1-3
Dielectric
Strength
コネクタを嵌合させ、隣接するタ-ミナル間及び
タ-ミナル、ア-ス間にAC 250V 実効値)を 1
印加する。
(JIS C5402-4-1/MIL-STD-202 試験法 301)
Apply 250V AC(rms) between adjacent terminals
or terminal and ground for 1 minute.
(JIS C5402-4-1/MIL-STD-202 Method 301)
異常無きこと
No Damage
4-1-4
圧着部接触抵抗
Contact
Resistance
on Crimped
Portion
ターミナルに適合電線を圧着し、開放電圧20mV
下、短絡電流 10mA 以下にて測定する。
Crimp the applicable wire to the terminal,
measured by dry circuit, 20mV MAX., 10mA.MAX.
5 milliohm MAX.
LANGUAGE
JAPANESE
ENGLISH
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TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
5 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
4-2. 機械的性能 MECHANICAL PERFORMANCE
Item
Test Condition
Requirement
4-2-1
挿入力
及び抜去力
Insertion and
Withdrawal
Force
毎分 25±3mm の速さで挿入、抜去を行う。
Insert and withdraw connectors at the speed
rate of 25±3mm/minute.
9項参照
Refer to paragraph 9
4-2-2
圧着部引張強度
Crimping
Pull out Force
圧着されたターミナルを治具に
固定し、電線を軸方向に
毎分25±3mmの速さで引張る。
(JIS C5402-16-4)
Fix the crimped terminal to the jig, apply axial
pull out force on the wire at the speed rate of
25±3 mm/minute.
(JIS C5402-16-4)
AWG. #26
9.8 N1.0kgfMIN.
AWG. #28
9.8 N1.0kgfMIN.
AWG. #30
4.9 N0.5kgfMIN.
AWG. #32
3.0 N0.3kgfMIN.
4-2-3
圧着端子挿入力
Crimp Terminal
Insertion Force
圧着されたターミナルをハウジングに挿入する
Insert the crimped terminal into the housing.
4.9 N0.5kgfMAX.
4-2-4
圧着端子保持力
Crimp Terminal
Retention Force
ハウジングに装着した圧着されたターミナル
を毎分 25±3mm の速さで引張る。
Apply axial pull out force at the
speed rate of 25±3 mm/minute on the
crimped terminal assembled in the housing.
4.9 N0.5kgfMIN.
4-2-5
HDR端子保持力
Header Terminal
Retention Force
ハウジングに装着されたターミナル
毎分25±3mm 速さで軸方向に引張る。
Apply axial pull out force at the speed rate of
25±3mm/minute on the terminal assembled
in the housing.
4.9 N0.5kgfMIN.
LANGUAGE
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ENGLISH
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TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
6 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
4-3. の他 OTHERS
Item
Test Condition
Requirement
4-3-1
繰り返し挿抜
Repeated
Insertion /
Withdrawal
1分間10回以下の速さで、挿入、抜去を
30 繰返す。
Insert and withdraw connectors 30 cycles
repeatedly by rate of less than 10 cycles per
minute.
Contact
Resistance
40 milliohm
MAX.
4-3-2
温度上昇
Temperature
Rise
コネクタを嵌合させ、全ての圧着端子を直列に接
続し最大許容電流で熱平衡に達した時の温度上
昇を測定する。(UL498)
Mate connectors and all crimp terminals shall be
connected in a direct series.
The temperature rise shall be measured when
the terminal reaches terminal equilibrium
allowable current.
(UL498)
Temperature
Rise
30 MAX.
4-3-3
耐振動性
Vibration
コネクタを嵌合させ、DC 1mA 通電状態にて、
嵌合軸を含む互いに垂直な 3方向に 掃引割合
105510 Hz/分、全振幅 1.5mm の振動を各2
時間 加える。(ケーブルは固定すること)
(JIS C 60068-2-6/MIL-STD-202 試験法 201)
Mate connectors and subject to the following
vibration conditions, for a period of 2 hours in
each of 3 mutually perpendicular axes, passing
DC 1mA during the test.
(Fix the cable at test.)
Amplitude : 1.5mm P-P
Frequency : 10~55~10 Hz in 1 minute.
Duration : 2 hours in each X.Y.Z.axes.
(JIS C 60068-2-6/MIL-STD-202 Method 201)
Appearance
異常無きこと
No Damage
Contact
Resistance
40 milliohm
MAX.
Discontinuity
1.0 microsecond
MAX.
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TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
7 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-4
耐衝撃性
Mechanical
Shock
コネクタを嵌合させ、DC 1mA 通電状態にて、
テストパルス半周期、嵌合軸を含む互いに垂直な
6方向に490m/s { 50G }、作用時間11ms衝撃
を各3回、合計18回加える。
(JIS C60068-2-27/MIL-STD-202 験法 213)
Mate connectors and subject to the following
shock conditions. 3 shocks shall be applied
along 6 mutually perpendicular axes, passing
DC 1 mA current during the test.
(Total of 18 shocks)
Test pulse : Half Sine
Peak value : 490 m/s2 (50 G)
Duration : 11 ms
(JIS C60068-2-27/MIL-STD-202
Method 213)
Appearance
異常無きこと
No Damage
Contact
Resistance
40 milliohm
MAX.
Discontinuity
1.0 microsecond
MAX.
4-3-5
耐熱性
Heat
Resistance
コネクタを嵌合させ、85±2°C の雰囲気中に
96時間放置後取り出し、12時間室温に
放置する。
(JIS C60068-2-2/MIL-STD-202 試験法 108)
Mate connectors and expose to 85±2 for
96 hours. Upon completion of the exposure
period, the test specimens shall be
conditioned at ambient room conditions for
1 to 2 hours , after which the specified
measurements shall be performed.
(JIS C60068-2-2/MIL-STD-202 Method 108)
Appearance
異常無きこと
No Damage
Contact
Resistance
40 milliohm
MAX.
4-3-6
耐寒性
Cold
Resistance
コネクタを嵌合させ、40±3°C の雰囲気中に96
時間 放置後取り出し、12時間 室温
放置する。(JIS C60068-2-1)
Mate connectors and expose to -40±3°C for
96 hours. Upon completion of the exposure
period, the test specimens shall be conditioned
at ambient room conditions for
1 to 2 hours, after which the specified
measurements shall be performed.
(JIS C60068-2-1)
Appearance
異常無きこと
No Damage
接触抵抗
Contact
Resistance
40 milliohm
MAX.
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
8 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-7
耐湿性
Humidity
コネクタを嵌合させ、60±2°C相対湿度
90~95%の雰囲気中に96時間放置後
取り出し、12時間 室温に放置する。
(JIS C60068-2-78/MIL-STD-202 験法 103)
Mate connectors and expose to 60±2°C,
relative humidity 90 to 95% for 96 hours.
Upon completion of the exposure period,
the test specimens shall be conditioned
at ambient room conditions for 1 to 2 hours,
after which the specified measurements shall
be performed.
(JIS C60068-2-78/MIL-STD-202 Method 103)
Appearance
異常無きこと
No Damage
Contact
Resistance
40 milliohm MAX.
Dielectric
Strength
4-1-3項を
満たすこと
Must meet 4-1-3
Insulation
Resistance
10 Megohm MIN.
4-3-8
温度サイクル
Temperature
Cycling
コネクタを嵌合させ、 55±3°C 30分、
+105±2°C 30分。これを1サイクルとし、
5サイクル 繰返す
但し、温度移行時間は 5分以内 とする
試験後12時間 室温に放置する。
(JIS C60068-2-14)
Mate connectors and subject to the following
conditions for 5 cycles. Upon completion of the
exposure period, the test specimens shall be
conditioned at ambient room conditions for
1 to 2 hours, after which the specified
measurements shall be performed.
5 cycles of :
a) 55±3°C 30 minutes
b) + 105±2°C 30 minutes
Shift timeWithin 5 minutes
(JIS C60068-2-14)
Appearance
異常無きこと
No Damage
Contact
Resistance
40 milliohm MAX.
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
9 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-9
塩水噴霧
Salt Spray
コネクタを嵌合させ、35±2°C にて 1%
重量比の塩水を 48±4時間噴霧し、試験後
常温で水洗いした後、室温で乾燥させる。
(JIS C60068-2-11/MIL-STD-202 験法101)
Mate connectors and expose to the following
salt mist conditions. Upon completion of the
exposure period, salt deposits shall be
removed by a gentle wash or dip in running
water, after which the specified measurements
shall be performed.
NaCl solution
Concentration : 5±1 %
Spray time : 48±4 hours
Ambient temperature : 35±2 °C
(JIS 60068-2-11/MIL-STD-202 Method 101)
Appearance
異常無きこと
No Damage
Contact
Resistance
40 milliohm MAX.
4-3-10
耐亜硫酸ガス
SO2 Gas
コネクタを嵌合させ、40±2°Cにて50±5ppmの亜
硫酸ガス中に24時間放置する
Mated connectors and expose to the conditions
of 50±5ppm SO2 gas ambient temperature
40±2°C for 24 hours.
Appearance
異常無きこと
No Damage
Contact
Resistance
40 milliohm MAX.
4-3-11
耐アンモニア性
NH3 Gas
コネクタを嵌合させ、濃度28%アンモニア水
を入れた容器中40分間放置する。
1Lに対して25mLの割合)
Mated connectors and expose to the conditions
of NH3 gas evaporating from 28% NH3 solution
for 40 minutes.
(Rate is 25ml per 1L)
Appearance
異常無きこと
No Damage
Contact
Resistance
40 milliohm MAX.
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
10 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-12
はんだ付け性
Solderability
ターミナルまたはピンをフラックスに浸し、端
子先端より0.5mm迄、
245±3°Cのはんだに3±0.5秒浸す。
Dip terminal or pin into flux, and immerse the
area up to 0.5mm from the tip of terminal into
solder molten at 245±3°C for 3±0.5 sec.
濡れ性
Solder
Wetting
ピンホールや
隙間なく浸漬面
95%以上
95% of immersed
area must show
no voids, pin
holes.
4-3-13
はんだ耐熱性
Resistance
To Soldering
Heat
赤外線リフロー
(Reflow by IR Reflow Machine)
6項の推奨温度プロファイル条件にてリフロ
ーを行う。
Using the reflow profile condition below
paragraph 6, the product was reflowed.
Appearance
端子ガタ、割れ
異常なきこと
No Damage
手はんだ時
(Reflow by Manual Soldering iron)
端子先端、金具先端より0.5mmの位置
まで、350±10°Cはんだゴテにて
最大5秒加熱する。但し、異常な加圧のないこ
と。
Using a soldering iron (350 ±10°C for 5
seconds MAX.) heat up the area 0.5mm from
the tip of the solder tails and fitting nails.
However, do not apply excessive pressure to
either the terminals or fitting nails.
( ) 参考規格 Reference Standard
{ } 参考単位 Reference Unit
【5.外観形状、寸法及び材質 PRODUCT SHAPE, DIMENSIONS AND MATERIALS
5-1. 製品寸法及び材質 Dimensions and materials of product.
図面参照 Refer to the drawing.
LANGUAGE
JAPANESE
ENGLISH
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TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
11 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
【6.リフロー条件 REFLOW CONDITION
温度条件グラフ
(温度は基板パターン面)
TEMPERATURE CONDITION GRAPH
(TEMPERATURE ON THE SURFACE OF P.C.BOARD PATTERN)
注記;本リフロー条件に関しては、リフロー装置及び基板などにより条件が異なりますので、
事前にリフロー評価の確認をお願い致します。
また吸湿などの前処理は行わないで下さい。
NOTE ; Please check the reflow soldering condition by your own devices beforehand.
Because the condition changes by the soldering devices, P.C.Boards, and so on.
No moisture treatment before reflow process.
7.環境指令への適合 COMPLIANCE WITH ENVIRONMENTAL DIRECTIVE
1. ELV及びRoHS適合品
ELV and RoHS Compliant
8.取り扱いの注意事項 INSTRUCTION UPON USAGE
1. 防湿梱包開封後は防湿効果を失うため、すみやかにご使用下さい。効果維持を考慮し、開梱後の使用目安は48
時間以内です。
Please use it promptly after opening a packing. The recommendation is within at 48 hours.
245±5°C(ピーク温度
245±5°C(PEAK TEMP.)
90-120
90-120 sec.
150-180℃(予熱)
150-180(PRE-HEAT)
40-60 (220°C以上)
40-60 sec. (220°C MIN.)
リフロー回数2
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
12 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
9.挿入力及び抜去力 INSERTION / WITHDRAWAL FORCE
極数
No. of
CKT.
単位
Unit
挿入力(最大値)
Insertion force (MAX.)
抜去力(最小値)
Withdrawal force (MIN.)
初回
1st
6回目
6th
30回目
30th
初回
1st
6回目
6th
30回目
30th
2
N
{ kgf }
19.6
{ 2.0 }
17.6
{ 1.8 }
15.6
{ 1.6 }
2.8
{ 0.28 }
2.3
{ 0.23 }
1.8
{ 0.18 }
3
N
{ kgf }
24.5
{ 2.5 }
22.5
{ 2.3 }
20.5
{ 2.1 }
3.0
{ 0.30 }
2.5
{ 0.25 }
2.0
{ 0.20 }
4
N
{ kgf }
29.4
{ 3.0 }
27.4
{ 2.8 }
25.4
{ 2.6 }
3.3
{ 0.33 }
2.8
{ 0.28 }
2.3
{ 0.23 }
5
N
{ kgf }
34.3
{ 3.5 }
32.3
{ 3.3 }
30.3
{ 3.1 }
3.8
{ 0.38 }
3.3
{ 0.33 }
2.8
{ 0.28 }
6
N
{ kgf }
39.2
{ 4.0}
37.2
{ 3.8 }
35.2
{ 3.6 }
4.3
{ 0.43 }
3.8
{ 0.38 }
3.3
{ 0.33 }
7
N
{ kgf }
44.1
{ 4.5}
42.1
{ 4.3 }
40.1
{ 4.1 }
4.7
{ 0.48 }
4.3
{ 0.43 }
3.8
{ 0.38 }
8
N
{ kgf }
49.0
{ 5.0 }
47.0
{ 4.8 }
45.0
{ 4.6 }
5.2
{ 0.53 }
4.7
{ 0.48 }
4.3
{ 0.43 }
9
N
{ kgf }
53.9
{ 5.5 }
51.9
{ 5.3 }
49.9
{ 5.1 }
5.5
{ 0.56 }
5.0
{ 0.51 }
4.5
{ 0.46 }
10
N
{ kgf }
58.8
{ 6.0 }
56.8
{ 5.8 }
54.8
{ 5.6 }
5.8
{ 0.59 }
5.3
{ 0.54 }
4.8
{ 0.49 }
11
N
{ kgf }
63.7
{ 6.5 }
61.7
{ 6.3 }
59.7
{ 6.1}
6.1
{ 0.62 }
5.6
{ 0.57 }
5.1
{ 0.52 }
12
N
{ kgf }
68.6
{ 7.0 }
66.6
{ 6.8 }
64.6
{ 6.6}
6.4
{ 0.65 }
5.9
{ 0.60 }
5.4
{ 0.55 }
13
N
{ kgf }
73.5
{ 7.5 }
71.5
{ 7.3 }
69.5
{ 7.1 }
6.7
{ 0.68 }
6.2
{ 0.63 }
5.7
{ 0.58 }
14
N
{ kgf }
78.4
{ 8.0 }
76.4
{ 7.8 }
74.4
{ 7.6 }
7.0
{ 0.71 }
6.5
{ 0.66 }
6.0
{ 0.61 }
15
N
{ kgf }
83.3
{ 8.5 }
81.3
{ 8.3 }
79.3
{ 8.1 }
7.3
{ 0.74 }
6.8
{ 0.69 }
6.3
{ 0.64 }
17
N
{ kgf }
93.1
{ 9.5 }
91.2
{ 9.3 }
89.2
{ 9.1 }
7.9
{ 0.8 }
7.4
{ 0.75 }
6.9
{ 0.70 }
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
13 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
10.圧着端子取り扱い上の注意事 INSTRUCTION UPON USAGE OF CRIMP TERMINAL
1.保管する場合には、外装カートン表示に従って保管願ます。縦置き又は、天地逆にて保管すると
巻き緩みの原因になります。
When storing crimp terminal, please follow the view of outer carton. Do not store in an upright position
or upside down. It could loosen the terminal.
図1 端子梱包に関する各部名称
FIG.1. NOMENCLATURE FOR THE TERMINAL PACKAGING
2.保管環境に著しい高温・湿度がある場合、端子表面層に錆等の影響を及ぼす事がありますので
注意願います。
When storing the terminal in the significant temperature or, humidity, may be affected at the terminal surface.
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
14 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
3.輸送、運搬時、カートン内リール数が規定梱包数量に満たない場合には、リールに衝撃を与えぬ様に
衝材を入れガタつき防止を行って下さい
When number of reel in carton less than the prescribed quantity, prevent looseness with adding the cushion,
during transport, conveyance.
2 カートン内リール数が規定梱包数量に満たない場合の梱包方法
FIG.2 PACKAGING METHOD, IN CASE OF NUMBER OF REEL
IN CARTON LESS THAN THE PRESCRIBED QUANTITY
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
15 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
4.カートンからリールを取り出す際は、両側フランジを持ち取り出して下さい。片面だけを掴んだ場合
子自重によりコア部からフランジ面が剥がれる恐れがあります。
When removing the reel from the carton, please remove with holding the flange on both sides. Do not grab
only one side. It could detach the flange from the core.
3 リールの取り出し方法
FIG.3 METHOD OF REMOVING THE REEL FROM THE CARTON
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
16 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
5.カートンよりリールを取り出し保管される場合には、キャリア側を下側にし保管願ます。
キャリア側を上にし、保管されますと端子自重により巻き緩みが発生する恐れがあります
When storing the terminal with remove the reel from the carton, please keep carrier down side. Do not keep
carrier up side. It could loosen the terminal.
4リール保管時の向
FIG.4 DIRECTION OF THE REEL STORAGE
6.圧着機へリールを長時間掛けた状態でいますと、端子自重により巻き緩みが発生する恐れがあります。
使用にならない場合には、中間紙で端子全周を23周巻いた後、巻き緩みが生じない様、中間紙先端、
ランジ間のテープ止めをし、キャリア側を下にし保管願ます。
Do not put the reel in the crimping machine for long period. It could loosen the terminal. When it is not used,
after rolling interleaf twice, or three times into terminal all around, please keep carrier down side, with taping
tip of the interleaf and flange.
7.圧着仕様を満足する為に、当社推奨圧着機のご使用をお願い致します
In order to meet the crimp specification, please use our recommended crimping machine.
8 .外装カートン組立及び、中間紙繋ぎにステープル(ホチキス)は、使用しないで下さい。
Stapler prohibited in whole area with outer carton assembly, linking the interleaf .
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
PicoBlade 1.25 WIRE TO BOARD
SMT CONNECTOR
製品仕様書
U
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-51021-024
FILE NAME
PS51021024.doc
SHEET
17 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
REV.
REV. RECORD
DATE
ECN NO.
WRITTEN BY :
CHECKED
BY :
A
RELEASED
2004/02/05
J2004-2276
E.SUZUKI
K.TOJO
B
REVISED
2004/03/10
J2004-3002
E.SUZUKI
K.TOJO
C
REVISED
2004/03/29
J2004-3401
E.SUZUKI
K.TOJO
D
REVISED
2004/07/21
J2005-0243
N.AIDA
K.TOJO
E
REVISED
2004/12/06
J2005-1671
E.SUZUKI
K.TOJO
F
REVISED
2005/02/15
J2005-2371
E.SUZUKI
K.TOJO
G
REVISED
2005/04/19
J2005-3130
N.AIDA
K.TOYODA
H
REVISED
2006/01/18
J2006-2296
N.AIDA
K.TOYODA
J
REVISED
2007/07/02
J2008-0007
K.SAITO
T.HARUYAMA
K
REVISED
2007/05/27
J2008-0078
Y.AOYAGI
H.MATSUMOTO
L
REVISED
2009/01/06
J2009-1681
M.TAKAZONO
H.MATSUMOTO
M
REVISED
2011/10/14
J2012-0524
R.HORI
K.ASAKAWA
N
REVISED
2012/03/09
J2012-1209
R.HORI
K.ASAKAWA
P
REVISED
2016/08/17
107484
Q.HE
S.AKIYAMA
R
REVISED
2016/08/18
107594
Q.HE
S.AKIYAMA
T
REVISED
2016/12/27
110641
K.OMORI
S.AKIYAMA
U
REVISED
2017/05/12
116810
R.TANAKA
A.IDA

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