Chip Quik Inc.Download PDF Datasheet
Datasheet revision 1.3 www.chipquik.com
Solder Paste No-Clean Sn42/Bi57.6/Ag0.4 in 5cc Syringe 15g T3 Mesh
Printing speeds up to 100mm/sec
Long stencil life
Wide process window
Excellent wetting compatibility on most board finishes
Compatible with enclosed print heads
RoHS II and REACH compliant
Mesh Size: T3
Micron (µm) Range: 25-45
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Load: 87% Metal by Weight
Melting Point: 138°C (281°F)
Packaging: 5cc/15g Syringe
Shelf Life: Refrigerated >6 months, Unrefrigerated >2 months *See notes below:
*Shelf Life Notes: Chip Quik® solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually
inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product
thoroughly for 2-3 minutes before inspection and use.
Chip Quik® solder paste is manufactured using Made in USA high quality synthetic flux and precision atomized metal
powder. Chip Quik® solder paste is guaranteed for 12 months from date of manufacture, regardless of refrigeration. If you
have any issues with our solder paste, please contact Chip Quik® directly for no charge warranty replacement. Please retain
original bill of sale, and solder paste in original container as we may request its return for internal R&D testing purposes.
Print Speed: 25-100mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary
>8 hours @ 20-50% RH 22-28°C (72-82°F)
>4 hours @ 50-70% RH 22-28°C (72-82°F)
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25°C
(68-77°F) before use.
This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground
or air will not impact this product’s stated shelf life.
1 © 1994-2017 Chip Quik® Inc.
Reflow profile for Sn42/Bi57.6/Ag0.4 solder assembly, designed as a starting point for process optimization.
Test J-STD-004 or other
requirements as stated
L: No breakthrough
L: No corrosion
L: <1 decade drop (No-clean)
Surface Insulation Resistance 85°C,
85% RH @ 168 Hours
L: ≥100MΩ (No-clean)
Viscosity – Malcom @ 10 RPM/25°C
Print: 125-180, Dispense: 90-130
Clear and free from precipitation
Conflict Minerals Compliance
Electronic Industry Citizenship
Articles 33 and 67 of Regulation (EC)
Contains no substance >0.1% w/w that
is listed as a SVHC or restricted for
use in solder materials
Conforms to the following Industry Standards:
J-STD-004B, Amendment 1 (Solder Fluxes): Yes
J-STD-005A (Solder Pastes): Yes
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes
RoHS 2 Directive 2011/65/EU: Yes
2 © 1994-2017 Chip Quik® Inc.
SOLDER PASTE LOW TEMP 5CC W/TIP