GQFN SiP Soldering Recommendations
The information contained in this document defines the handling procedures and assembly processing conditions required for successful attachment to a PCB.
SM-ChiP™ Reflow Soldering Recommendations
The information contained in this document defines the handling procedures and assembly processing conditions for successful attachment to a printed circuit board.
Constant Current Control for DC-DC Converters
Vicor’s VI-200/VI-J00 and Maxi, Mini and Micro family DC-DC converters are voltage regulating devices, but their wide trim range makes it possible to use them as efficient high-power current sources.
Creating High Voltage Outputs
For applications that require high voltage outputs, multiple converters may be used in a series output configuration to produce a single output voltage that is the sum of all of the converter outputs in the array.
Hot Swap Capability Eliminates Down Time
The scope of this technical note includes design considerations as related to 48V distributed power architectures which employ hot swappable, modular power converters.
PCB Mount VIA Soldering Guidelines
This application note provides soldering process information for PCB mount VIA products including the MFM™, AIM™, PFM™, VIA BCM® VIA DCM™, etc.
RoHS-Compliant Through-Hole VI Chip® Soldering Recommendations
RoHS compliant, through-hole full size VI Chips are intended for wave soldering assembly. The information contained in this document defines the processing conditions required for mounting a full size VI Chip to the PCB using wave soldering or hand soldering.
Surviving Load Dumps on Military Vehicles
In this application note we will consider 24V systems only, primarily because they are more prevalent where high-end equipment is likely to be used, but also because the same circuits – with small modifications – can be used to meet the requirements of the 12V systems.