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Low profile capacitors are made thinner than typical devices of comparable length and width, in order to facilitate use in applications with strong height constraints.  Devices with thickness measurements as small as 0.006” (0.15mm) are available.  It should be noted that the reduced thickness of these devices renders them more vulnerable to cracking from board flexure, making careful design, assembly, and handling procedures doubly important , in light of the fact that applications calling for the extra millimeter or two of height reduction offered by these devices are likely to use thinner (and thus more flexible) circuit substrates also.