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Aries Electronics
EJECT-A-DIP™ Series
Aries Electronics
Lo-PRO® file, 513 Series
 
Aries Electronics
Lo-PRO® file, 526 Series

Lo-PRO® file, 513 Series

Socket, Closed Frame

Aries Electronics

Series 513 Lo-PRO® file socket with collet contacts and solder pin tails. 0.100" (2.54mm) pitch through hole mounting type.

Features
  • Gold plated contacts
  • Low profile
Specifications
  • Contact Finish - Mating:Gold
  • Contact Finish - Post:Tin
  • Contact Finish Thickness - Mating:10.0µin (0.25µm)
  • Contact Finish Thickness - Post:200.0µin (5.08µm)
  • Contact Material - Mating:Beryllium Copper
  • Contact Material - Post:Brass
  • Current Rating (Amps):3A
  • Features:Closed Frame
  • Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
  • Material Flammability Rating:UL94 V-0
  • Mounting Type:Through Hole
  • Operating Temperature:-55°C ~ 105°C
  • Pitch - Mating:0.100" (2.54mm)
  • Pitch - Post:0.100" (2.54mm)
  • Termination:Solder
  • Termination Post Length:0.125" (3.18mm)
Parts

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08-2513-1008-2513-10CONN IC DIP SOCKET 8POS GOLD DIP, 0.2" (5.08mm) Row Spacing8 (2 x 4)0.100" (2.54mm)GoldRoHS
10-2513-1010-2513-10CONN IC DIP SOCKET 10POS GOLD DIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)GoldRoHS
10-3513-1010-3513-10CONN IC DIP SOCKET 10POS GOLD DIP, 0.3" (7.62mm) Row Spacing10 (2 x 5)0.100" (2.54mm)GoldRoHS
16-3513-1016-3513-10CONN IC DIP SOCKET 16POS GOLD DIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)GoldRoHS
08-4513-1008-4513-10CONN IC DIP SOCKET 8POS GOLD DIP, 0.4" (10.16mm) Row Spacing8 (2 x 4)0.100" (2.54mm)GoldRoHS
18-6513-1018-6513-10CONN IC DIP SOCKET 18POS GOLD DIP, 0.6" (15.24mm) Row Spacing18 (2 x 9)0.100" (2.54mm)GoldRoHS
40-9513-1040-9513-10CONN IC DIP SOCKET 40POS GOLD DIP, 0.9" (22.86mm) Row Spacing40 (2 x 20)0.100" (2.54mm)GoldRoHS

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Associated Product
Aries Electronics LP300
Category: Interconnect, Wire-Connectors, Interconnects-Sockets-Accessories