Print Print this page
Omron Electronics Inc-EMC Div
XR2 Series
On Shore Technology Inc.
BU-178HT Series
On Shore Technology Inc.
ED Series

BU-178HT Series


On Shore Technology Inc.

The BU-178HT Series are surface mount, machined, DIP sockets.

  • Four finger clip with funnel design entry
  • Side and end stackable
  • Contact Finish - Mating:Gold
  • Contact Finish - Post:Copper
  • Contact Finish Thickness - Mating:78.7µin (2.00µm)
  • Contact Finish Thickness - Post:Flash
  • Contact Material - Mating:Beryllium Copper
  • Contact Material - Post:Brass
  • Contact Resistance:7 mOhm
  • Current Rating:1A
  • Features:Open Frame
  • Housing Material:Polybutylene Terephthalate (PBT), Glass Filled
  • Material Flammability Rating:UL94 V-0
  • Mounting Type:Surface Mount
  • Operating Temperature:-55°C ~ 125°C
  • Packaging:Tube
  • Pitch - Mating:0.100" (2.54mm)
  • Pitch - Post:0.100" (2.54mm)
  • Termination:Solder
  • Termination Post Length:0.059" (1.50mm)

View in Parametric Search

BU080Z-178-HTBU080Z-178-HTCONN IC DIP SOCKET 8POS GOLD DIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)GoldRoHS
BU060Z-178-HTBU060Z-178-HTCONN IC DIP SOCKET 6POS GOLD DIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)GoldRoHS
BU160Z-178-HTBU160Z-178-HTCONN IC DIP SOCKET 16POS GOLD DIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)GoldRoHS
BU200Z-178-HTBU200Z-178-HTCONN IC DIP SOCKET 20POS GOLD DIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)GoldRoHS
BU140Z-178-HTBU140Z-178-HTCONN IC DIP SOCKET 14POS GOLD DIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)GoldRoHS
BU180Z-178-HTBU180Z-178-HTCONN IC DIP SOCKET 18POS GOLD DIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)GoldRoHS
BU240Z-178-HTBU240Z-178-HTCONN IC DIP SOCKET 24POS GOLD DIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)GoldRoHS
BU400Z-178-HTBU400Z-178-HTCONN IC DIP SOCKET 40POS GOLD DIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)GoldRoHS

View in Parametric Search