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MEG-Array® Connector


FCI and Digi-Key offer the MEG-Array board-to-board connector


MEG-Array® Connector The MEG-Array connector is designed to meet the needs of 10Gb/s applications requiring up to 528 signal pins per connector. The combination of multiple stack heights (4mm to 14mm) and multiple sizes allows for optimal design flexibility while yielding less than 1% cross-talk performance when configured differentially. FCI has produced the MEG-Array® Connector System since 1996, shipping over 10 billion BGA contact interfaces illustrating FCI’s extended tradition as the premier BGA interconnect innovator and supplier. FCI’s patented BGA design is supported by fully automated quality control systems featuring 100% inspections of assembly coplanarity, solder sphere size and location, as well as critical-to-function terminal component attributes.

  • Features
  • Applications
  • Specifications
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Features
  • RoHS compliant (lead-free)
  • Ball Grid Array (BGA) termination for process friendly attachment
  • .050" x .050" BGA interface pitch optimizes routing and electrical performance
  • Demonstrated solder joint reliability of greater than 22 years life (per IPC-SM-785) is unmatched for a BGA mezzanine connector
  • Connector sizes of 81 signals to 528 signals providing 80 usable signals per linear cm (205 signals per linear inch) allow for optimization of board space and signal requirements
  • 10 Gb/s differential pair performance at less than 1% cross-talk meets the needs of high speed mezzanine applications
  • Meets Telcordia GR-1217-CORE and NPS-25298-2 specifications for utilization in telecom applications
  • Stack heights available from 4mm to 14mm (2mm increments)
  • Polarized design assures proper mating of the connector
  • Back to back testing connector (Interposer) available upon special request

Applications
  • Communications
    • Transmission
    • Access
    • Switching
    • Optics
    • Networking
  • Industrial & Instrumentation
    • Industrial controls & equipment
    • Analytical & diagnostic
    • Medical
  • Data
    • Servers
    • Storage

Specifications
Housing Liquid crystal polymer
Contact High strength copper alloy
Plating Au over Ni
Durability 50 cycles
Contact wipe 0.80mm nominal
Current rating 0.45 A/Contact ≤30°C ΔT (100% Energized)
2.0 A < 30°C ΔT (Single Contact Energized)
Dielectric withstanding voltage 200 VAC maximum
Insulation resistance 1000 mΩ minimum

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Series Connector Type Rows Mounting Type Pitch
MEG-Array® Array 10 Surface mount 0.050" (1.27mm)


Product Training Module (PTM) Product Training Module (PTM) for
MEG-Array® Mezzanine Connectors