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GIG-Array® Connector


FCI and Digi-Key introduce a new BGA mezzanine connector

GIG-Array® Connector
The GIG-Array connector is designed to meet the needs of up to 10Gb/s applications requiring up to 296 signal pins per connector. FCI’s long tradition as a BGA connector innovator assures expertise and reliability in the GIG-Array BGA design. The combination of multiple stack heights (15mm to 40mm) and multiple sizes (200 signals to 296 signals) utilizing a 100Ω differential matched impedance design allows for optimal design flexibility while yielding less than 1% cross-talk performance.

FCI's patented BGA design is supported by fully automated quality control systems featuring 100% inspections of assembly coplanarity, solder sphere size and location, as well as critical-to-function terminal component attributes. Multiple in-line vision systems, quality control product audits, and statistical process controls are all a part of our state-of-the-art manufacturing facility.

  • Features
  • Applications
  • Specifications
  • Buy Now

Features
  • RoHS compliant (lead-free) options are available
  • Ball Grid Array (BGA) termination for process friendly attachment
  • 1mm x 0.65mm BGA interface pitch optimizes routing and electrical performance
  • Stack heights available from 15mm to 40mm provide mezzanine design flexibility
  • Polarized design assures proper mating of the connector
  • Dual beam signal contacts provide two points of contact increasing product reliability
  • Connector sizes of 200 and 296 signals providing 62 signal contacts per linear cm (158 signal contacts per linear inch) allow for optimization of board space and signal requirements
  • 100Ω differential pair matched impedance assures consistent high speed performance
  • Up to 10 Gb/s differential pair performance
  • Very low cross-talk (VLC) design of less than 1% allows for required signal integrity performance

Applications
  • Communications
    • Transmission
    • Access
    • Switching
    • Optics
    • Networking
  • Data
    • Servers
    • Storage
  • Industrial & Instrumentation
    • Industrial controls & equipment

Specifications
Housing Liquid crystal polymer
Contact High strength copper alloy
Plating Au over Ni
Durability 25 cycles
Contact wipe 2.00mm nominal
Current rating 1A/contact <30°C
Low level contact resistance <20mΩ for 15mm mated height
<31mΩ for 28mm mated height
Dielectric withstanding voltage 500 VAC
Withstanding voltage 167 VAC max.
Propagation delay 55 pS for 15mm mated height
115 pS for 28mm mated height
Differential Impedance 100 ± 10%Ω
Near-end cross-talk @ 100pS <3%

Buy Now
Series Connector Type Rows Mounting Type Pitch
GIG-Array® Differential pair array 18 Surface mount 30µ in (0.76µm)


Product Training Module (PTM) Product Training Module (PTM) for
GIG-Array® Mezzanine Connectors