| Absolute Maximum Ratings(1) |
Operating Ratings(2) |
| Supply Voltage (VCC) ........................... –0.5V to +3.0V |
Supply Voltage (VCC) ............ 2.375V to 2.625V |
| Enable Voltage (VEN) ............................ –0.5V to +3.0V |
(VCCO) ............ 1.14V to 2.625V |
| VCC – VCCO ....................................................... < 1.8V |
Ambient Temp. (TA) .................. 1.14V to 2.625V |
| Input Voltage (VIN) .................................. –0.5V to VCC |
Package Thermal Resistance(3) |
| CML Output Voltage (VOUT) ...................... 0.6V to 3.0V |
MLF® |
| Current (VT) |
Still-air (ΘJA) ................................. 75°C/W |
| Source or sink on VT pin ................................. ±100mA |
Junction-to-board (ΨJB) ............... 33°C/W |
| Input Current |
|
| Source or sink Current on (IN, /IN) ..................... ±50mA |
|
| Maximum operating Junction Temp. ..................... 125°C |
|
| Lead Temp. (soldering, 20 sec.) ......................... 260°C |
|
| Storage Temp. (TS) ............................. –65°C to +150°C |
|
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Notes:
- Permanent device damage may occur if absolute maximum ratings are exceeded. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability.
- Limits are not guaranteed if the device is operated beyond the operating ratings.
- Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. ΨJB and ΘJA values are determined for a 4-layer board in still-air number, unless otherwise stated.
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