Does anyone out there have any useful suggestions regarding do-it-yourself reworking or first-time mounting of SOIC or QFP surface mount packages to PCBs for prototyping work? I have considerable experience working with 0603 through 1206 chip components and SOD and SMA/SMB parts. My experience has been that these two-terminal devices can be removed and attached with a small-tip soldering ironand a steady hand. However, when dealing with small plastic IC packages, the task becomes more difficult. Any suggestions regarding tools (low cost hopefully) and techniques, particularly on attachment of multi-pin SMD components would be appreciated. Thanks.
I use a tacky flux (from chipquick) and smear it all over the pads and some on the chip pins (just for good measure). Then you do something really evil and put a little bit of solder on the iron. Bring the iron towards the foot one of the chip's pins with the little ball facing the pin/pad and the watch the solder being sucked in. Don't worry about the flux boiling out whilst on the iron. There are more than enough flux on the board. Works like a charm!