- Vicor Corporation is a provider of high performance modular power components, enabling customers to efficiently convert and manage power from the wall plug to point-of-load. The entire power chain is addressed with a comprehensive portfolio of high-efficiency, high-density, power distribution architectures. This approach gives design engineers the flexibility to choose from modular, plug-and-play components ranging from bricks to semiconductor-centric solutions. More...

Vicor’s markets include enterprise and high performance computing, telecommunications and network infrastructure, industrial equipment and automation, vehicles and transportation and aerospace and defense electronics. Vicor’s headquarters and world-class manufacturing is in Andover, MA, USA. Less...

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Digi-Key’s library of more than 2000 exclusive PTM Online… On Demand® product training modules is a collection of training tools created with you – the busy design engineer – in mind. They are provided with the cooperation of participating supplier partners. From this one source, you can learn about the latest products and technologies, download datasheets, check inventory, contact our technical staff, and place an order for same-day shipment.

These modules are available in audio and non-audio formats and listed by supplier in easy-to-find alphabetical order. Simply locate the module that interests you and click on your format of choice. We hope you find these tools useful, and with new modules added continuously, we invite you to stop back often to see what’s new.

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Module NamePreviewAudioNon-AudioDurationParts List
  • Cool-ORing - active OR’ing
2.0MB422KB5 minParts List
  • Cool-Power ZVS Buck Regulator - point-of-load conversion
3.6MB1.3MB5 MinParts List
  • Cool-Power ZVS Buck Regulator - point-of-load regulation
3.1MB703KB5 minParts List
  • VI Brick AC Front End - complete AC-DC pcb mounted Brick
4.0MB1.2MB10 minParts List
  • VI Brick IBC - industry standard fixed ratio IBC’s (1/4 and 1/8 Bricks)
1.0MB108KB5 minParts List
  • VI Chip BCM - bus converter module
2.2MB418KB5 minParts List
  • VI Chip PRM
2.8MB1.0MB10 minParts List
  • VI Chip PRM and VTM - isolated DC-DC conversion with Factorized Power Architecture
1.5MB480KB5 minParts List
  • VI Chip® BCM® Converter housed in Package (ChiP)
2.8MB967KB5 minParts List

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BCM® Low-Voltage Bus Converter ModulesBCM® Low-Voltage Bus Converter Modules - Vicor's BCM low voltage bus converter modules are a series of isolated, fixed conversion ratio, DC-DC converters. These converters, which combine Vicor’s sine amplitude DC-DC conversion technology with Vicor’s unique thermally adept converter house in package (ChiP) packaging technology, feature more than five times the output power capability, 25% lower heat loss, and over four times the power density of best-in-class contemporary products.  More...


Power Design - Back to Basics

White Papers

350 V to 12 V DC "Yeaman Topology" Power System
Dual-Stage Feedback Technique for Single-Pole Feedback Compensation
Enabling Next Generation High Density Power Conversion
Factorized Power Architecture and VI BRICKs
FPA Overview: An introduction to Factorized Power Architecture
High Current, Low Voltage Solution For Microprocessor Applications from 48V Input
Innovative Power Device to Support Intermediate Bus Architecture Designs
The PI33XX: Zero-Voltage Switching Applied to Buck Regulation
Reduce Load Capacitance in Noise-Sensitive, High-Transient Applications, through Implementation of Active Filtering
The Sine Amplitude Converter™ Topology Provides Superior Efficiency and Power Density in Intermediate Bus Architecture Applications
Universal, Scalable Factorized Power Architecture for New Processors and Memory Loads

Design Guides

BCM Evaluation Board User Guide
DC-DC Converter Evaluation Board User Guide
Maxi, Mini, Micro Family DC-DC Converters and Accessory Modules
PRM / VTM Evaluation Board User Guide
VI-200 & VI-J00 Family DC-DC Converters and Configurable Power Supplies

Application Notes

AN:001 — Configuring Vicor IBC Converters with niPOLs
The niPOLs within IBA forego isolation and high–ratio voltage transformation in order to improve cost effectiveness, and they depend upon a nearby bus converter to supply isolated power at a low voltage. The BCM or IBC can be placed at the power entry point on the board. This will provide safety isolation from the higher backplane voltage as well as free up board space at the point–of–load.

AN:002 — PRM/VTM Parallel Operation
This applications note describes the steps needed to create a current sharing higher power array using two PRM-AL and VTM pairs in a parallel configuration. If the application requires more than two PRMs in parallel, please contact Applications Engineering for additional information.

AN:003 — Powering Multiple VTMs with a Single PRM
This Applications Note discusses the design practices for using Vicor's V•I Chip Pre-Regulator Module and Voltage Transformation Module to meet the challenge of power systems that require lower voltages, more current, and multiple voltages within one system. Vicor's V•I Chips can address these challenges.

AN:005 — FPA Printed Circuit Board Layout Guidelines
Factorized Power with V•I Chips enable system density to keep pace with technology by providing layout flexibility and high power density. More importantly, V•I Chips allow a power conversion system to be factorized or separated into its constituent functions.

AN:006 — A Filter Solution for the BCM
The Bus Converter Module (BCM) is a member of Vicor's Factorized Power Architecture family of V•I Chips. It provides an isolated intermediate bus voltage to power non-isolated point-of-load (POL) converters from a narrow input range DC source.

AN:007 — Using VTMs as 26 – 55 V Input Bus Converters
The Voltage Transformation Module (VTM) is a fundamental building block of Factorized Power Architecture (FPA). This new power conversion architecture separates the functions of the DC-DC converter — regulation, isolation, and transformation — into two building blocks.

AN:008 — V•I Chip BCM Bus Converter Thermal Management
The purpose of this Applications Note is to determine the power capability of the BCMs given certain ambient temperature and air flow conditions plus heat sink options.

AN:009 — V•I Chip Soldering Recommendations
V•I Chips are intended for reflow soldering assembly. The information contained in this document defines the processing conditions required for successful attachment to a PCB. Failure to follow the recommendations provided can result in aesthetic and functional failure of the module.

AN:016 — Using BCM™ Bus Converters in High Power Arrays
This application note provides methods and guidelines for designing BCMs into high power arrays.

AN:017 — RoHS-Compliant Through-Hole V•I Chip Soldering Recommendations
RoHS compliant, through-hole full size V•I Chips are intended for wave soldering assembly. The information contained in this document defines the processing conditions required for mounting a full size V•I Chip to the PCB using wave soldering or hand soldering.

AN:018 — Providing a Constant Current for Powering LEDs using the PRM and VTM
Light Emitting Diodes (LEDs) require a constant current for proper operation. In order to use the PRM and VTM to power an LED, it is necessary to modify the operation of the PRM to provide a regulated current. This application note provides guidelines for implementing that constant current source using the chipset.

AN:022 — MIL EMI and Transient Solutions
28 Volt defense applications must meet a number of noise and power related standards such as MIL-STD-461, MIL-STD-704, and MIL-STD-1275.

AN:024 — Accurate Point-of-Load Voltage Regulation Using Simple Adaptive Loop Feedback
This application note explains the adaptive loop regulation concept and the design procedure to achieve good voltage regulation for a simple PRM/VTM combination.

Dual, High and Low Side ORing Application Using PICOR’s PI2003 and PI2007

Recommended PCB Design & Surface Mount Guidelines for Picor Corporation’s LGA Packages
More about Vicor

Since 1981, Vicor has engaged in the development, manufacture and sale of power conversion components and systems.

Vicor also manufactures and sells complete configurable power systems, accessory products and custom power solutions. It also licenses certain rights to its technology in return for ongoing royalties. The principal markets for Vicor's power converters and systems are large original equipment manufacturers (OEMs) and smaller, lower volume users, which are broadly distributed across several major market areas.

Power components are manufactured using highly automated processes in our ISO 9001 registered facilities in Andover, MA. As a result, the products are quickly available, economically priced and of consistent high quality.

Headquartered in Andover, MA, our customers include those of original equipment manufacturers (OEMs) in the communications, data processing, industrial control, test equipment, medical, and military electronics markets.

Vicor offers three distinct types of power components. All of these high-performance products work well with different power architectures including Distributed, Intermediate Bus, and Factorized Power.

Vicor’s Brick Business Unit (BBU) offers tens of thousands of standard and custom high-performance power conversion components delivered worldwide with very short development and delivery cycles. Vicor's PowerBench™ on-line tool suite enables the design of customized brick or configurable power supplies by customers to their exact specifications in minutes. Our new line of modular power converters known as VI Bricks™ incorporate V•I Chips into innovative, thermally-enhanced packaging. They can be used in a wide variety of applications that require high efficiency, high power density, improved thermal management, low noise, fast transient response, and overall design flexibility. When customers have application-specific requirements, Vicor Custom Power, with design centers throughout the USA, provides them with exactly the power supplies they want with the highest quality and the best value. Vicor's Brick Business Unit is a top supplier to 8,000 civilian and military manufacturers across the globe.

Vicor’s V•I Chip Business Unit offers families of high-performance, high-density V•I Chip™ BCM™ bus converters, PRM™ regulators, and VTM™ current multipliers enabling Factorized Power Architecture™ (FPA™) systems. Targeted to next generation system designs in server / datacenters, ATE, telecom, solid state lighting/displays, and defense electronics, V•I Chip modules support high efficiency, high power density and fast, scalable power system development at a low total cost. Leveraging factorized regulation and isolation / transformation functions, FPA power systems provide the flexibility to meet advanced application requirements. Customers use V•I Chips to enable the highest computing performance and efficiency: already, three of the top 10 supercomputers in the TOP500 (TFLOPS) and five of the top 10 supercomputers in the Green500 (MFLOPS / Watt) are powered by V•I Chips.

Our Picor Corporation business unit is a fabless designer, developer, and marketer of high performance integrated circuits and related products for use in a broad variety of power system applications. Power components such as Active Filters, Power Management and High-Density Power Conversion products from Picor are developed with a detailed knowledge of end-use power system requirements resulting in superior performance, reliability, and cost-effectiveness. Picor also develops application-specific power components that are incorporated into Vicor’s own products. In fact, much of the differentiation and power conversion innovations of our V•I Chip and BBU products is attributable to Picor’s proprietary semiconductor circuitry.
Power Architecture

Click on the links below to learn how Vicor addresses various power architectures.

Centralized Power Architecture (CPA)
Intermediate Bus Architecture (IBA)
Distributed Power Architecture (DPA)
Factorized Power Architecture (FPA)
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