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Manufacturer Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
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Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
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05-0513-10T - Aries Electronics A768AR-ND CONN SOCKET SIP 5POS GOLD 9,630 - Immediate
1.10000 1 Bulk? 0513 Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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8428-21B1-RK-TR Datasheet 8428-21B1-RK-TR - 3M 3M2821B1TR-ND CONN SOCKET PLCC 28POS TIN 1,800 - Immediate
1.12100 450 Tape & Reel (TR)?
Alternate Packaging
8400 Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8428-21B1-RK-TR Datasheet 8428-21B1-RK-TR - 3M 3M2821B1CT-ND CONN SOCKET PLCC 28POS TIN 2,265 - Immediate
1.75000 1 Cut Tape (CT)?
Alternate Packaging
8400 Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8428-21B1-RK-TR Datasheet 8428-21B1-RK-TR - 3M 3M2821B1DKR-ND CONN SOCKET PLCC 28POS TIN 2,265 - Immediate
Digi-Reel® 1 Digi-Reel®?
Alternate Packaging
8400 Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8432-21B1-RK-TR Datasheet 8432-21B1-RK-TR - 3M 3M3221B1TR-ND CONN SOCKET PLCC 32POS TIN 1,800 - Immediate
1.15900 450 Tape & Reel (TR)?
Alternate Packaging
8400 Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8432-21B1-RK-TR Datasheet 8432-21B1-RK-TR - 3M 3M3221B1CT-ND CONN SOCKET PLCC 32POS TIN 2,046 - Immediate
1.81000 1 Cut Tape (CT)?
Alternate Packaging
8400 Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8432-21B1-RK-TR Datasheet 8432-21B1-RK-TR - 3M 3M3221B1DKR-ND CONN SOCKET PLCC 32POS TIN 2,046 - Immediate
Digi-Reel® 1 Digi-Reel®?
Alternate Packaging
8400 Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
69802-132LF Datasheet 69802-132LF - Amphenol FCI 609-3479-ND CONN SOCKET PLCC 32POS TIN 9,227 - Immediate
1.24000 1 Tube?
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Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
115-93-308-41-001000 Datasheet 115-93-308-41-001000 - Mill-Max Manufacturing Corp. ED58083-ND CONN IC DIP SOCKET 8POS GOLD 1,034 - Immediate
1.26000 1 Tube? 115 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-318-41-001000 Datasheet 110-44-318-41-001000 - Mill-Max Manufacturing Corp. ED90051-ND CONN IC DIP SOCKET 18POS TIN 4,636 - Immediate
1.27000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-308-41-003000 Datasheet 115-93-308-41-003000 - Mill-Max Manufacturing Corp. ED5308-ND CONN IC DIP SOCKET 8POS GOLD 1,422 - Immediate
1.28000 1 Tube? 115 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8420-11B1-RK-TP Datasheet 8420-11B1-RK-TP - 3M 3M2011B1-ND CONN SOCKET PLCC 20POS TIN 2,128 - Immediate
1.31000 1 Tube? 8400 Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8420-21B1-RK-TP Datasheet 8420-21B1-RK-TP - 3M 3M2021B1-ND CONN SOCKET PLCC 20POS TIN 2,785 - Immediate
1.33000 1 Tube? 8400 Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
111-93-308-41-001000 Datasheet 111-93-308-41-001000 - Mill-Max Manufacturing Corp. ED60008-ND CONN IC DIP SOCKET 8POS GOLD 1,609 - Immediate
1.36000 1 Tube? 111 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
54020-32030LF Datasheet 54020-32030LF - Amphenol FCI 609-4704-ND CONN SOCKET PLCC 32POS TIN 1,958 - Immediate
1.39000 1 Tube?
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Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 100µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 100µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS) -40°C ~ 105°C
8428-11B1-RK-TP Datasheet 8428-11B1-RK-TP - 3M 3M2811B1-ND CONN SOCKET PLCC 28POS TIN 1,531 - Immediate
1.42000 1 Tube? 8400 Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
115-43-308-41-003000 Datasheet 115-43-308-41-003000 - Mill-Max Manufacturing Corp. ED90208-ND CONN IC DIP SOCKET 8POS GOLD 2,441 - Immediate
1.44000 1 Tube? 115 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
940-44-028-17-400000 Datasheet 940-44-028-17-400000 - Mill-Max Manufacturing Corp. ED90013-ND CONN SOCKET PLCC 28POS TIN 2,040 - Immediate
1.45000 1 Tube? 940 Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 150µin (3.81µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-314-41-001000 Datasheet 110-41-314-41-001000 - Mill-Max Manufacturing Corp. ED90516-ND CONN IC DIP SOCKET 14POS GOLD 1,421 - Immediate
1.45000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
14-3518-10 Datasheet 14-3518-10 - Aries Electronics A401-ND CONN IC DIP SOCKET 14POS GOLD 4,290 - Immediate
1.56000 1 Bulk? 518 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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808-AG11D-ES-LF Datasheet 808-AG11D-ES-LF - TE Connectivity AMP Connectors A105046-ND CONN IC DIP SOCKET 8POS GOLD 3,148 - Immediate
1.56000 1 Tube? 800 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 20µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
940-44-032-24-000000 Datasheet 940-44-032-24-000000 - Mill-Max Manufacturing Corp. ED90007-ND CONN SOCKET PLCC 32POS TIN 1,480 - Immediate
1.57000 1 Tube? 940 Active PLCC 32 (2 x 7, 2 x 9) 0.100" (2.54mm) Tin 150µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-87-632-41-001101 Datasheet 110-87-632-41-001101 - Preci-Dip 1212-1022-ND CONN IC DIP SOCKET 32POS GOLD 1,018 - Immediate
1.60000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin
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Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
940-44-028-24-000000 Datasheet 940-44-028-24-000000 - Mill-Max Manufacturing Corp. ED90006-ND CONN SOCKET PLCC 28POS TIN 2,105 - Immediate
1.62000 1 Tube? 940 Active PLCC 28 (4 x 7) 0.100" (2.54mm) Tin 150µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-43-314-41-001000 Datasheet 210-43-314-41-001000 - Mill-Max Manufacturing Corp. ED90106-ND CONN IC DIP SOCKET 14POS GOLD 1,073 - Immediate
1.68000 1 Tube? 210 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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02:18:36 1/19/2017