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Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
8444-11B1-RK-TP Datasheet 8444-11B1-RK-TP - 3M 3M4411B1-ND CONN SOCKET PLCC 44POS TIN 1,809 - Immediate
1.62000 1 Tube? 8400 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
917-93-103-41-005000 Datasheet 917-93-103-41-005000 - Mill-Max Manufacturing Corp. ED2150-ND CONN TRANSIST TO-5 3POS GOLD 1,077 - Immediate
1.65000 1 Tube? 917 Active Transistor, TO-5 3 (Round)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-316-41-001000 Datasheet 110-93-316-41-001000 - Mill-Max Manufacturing Corp. ED3316-ND CONN IC DIP SOCKET 16POS GOLD 8,277 - Immediate
1.66000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-316-41-001000 Datasheet 110-43-316-41-001000 - Mill-Max Manufacturing Corp. ED90034-ND CONN IC DIP SOCKET 16POS GOLD 5,211 - Immediate
1.66000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-328-41-001000 Datasheet 110-99-328-41-001000 - Mill-Max Manufacturing Corp. ED3128-ND CONN IC DIP SOCKET 28POS TINLEAD 2,618 - Immediate
1.68000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-328-41-001000 Datasheet 110-44-328-41-001000 - Mill-Max Manufacturing Corp. ED90054-ND CONN IC DIP SOCKET 28POS TIN 2,523 - Immediate
1.68000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-628-41-001000 Datasheet 110-44-628-41-001000 - Mill-Max Manufacturing Corp. ED90057-ND CONN IC DIP SOCKET 28POS TIN 2,462 - Immediate
1.68000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-424-41-001000 Datasheet 110-44-424-41-001000 - Mill-Max Manufacturing Corp. ED90055-ND CONN IC DIP SOCKET 24POS TIN 2,777 - Immediate
1.69000 1 Tube? 110 Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-314-41-001000 Datasheet 110-93-314-41-001000 - Mill-Max Manufacturing Corp. ED3314-ND CONN IC DIP SOCKET 14POS GOLD 2,318 - Immediate
1.70000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-314-41-001000 Datasheet 110-43-314-41-001000 - Mill-Max Manufacturing Corp. ED90033-ND CONN IC DIP SOCKET 14POS GOLD 2,264 - Immediate
1.70000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
940-44-044-17-400000 Datasheet 940-44-044-17-400000 - Mill-Max Manufacturing Corp. ED90015-ND CONN SOCKET PLCC 44POS TIN 3,533 - Immediate
1.75000 1 Tube? 940 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150µin (3.81µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
16-3518-10 Datasheet 16-3518-10 - Aries Electronics A402AE-ND CONN IC DIP SOCKET 16POS GOLD 2,061 - Immediate
1.76000 1 Bulk? 518 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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917-93-104-41-005000 Datasheet 917-93-104-41-005000 - Mill-Max Manufacturing Corp. ED2151-ND CONN TRANSIST TO-5 4POS GOLD 1,049 - Immediate
1.79000 1 Tube? 917 Active Transistor, TO-5 4 (Round)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
940-44-044-24-000000 Datasheet 940-44-044-24-000000 - Mill-Max Manufacturing Corp. ED90008-ND CONN SOCKET PLCC 44POS TIN 4,044 - Immediate
1.80000 1 Tube? 940 Active PLCC 44 (4 x 11) 0.100" (2.54mm) Tin 150µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8452-11B1-RK-TP Datasheet 8452-11B1-RK-TP - 3M 3M5211B1-ND CONN SOCKET PLCC 52POS TIN 1,125 - Immediate
1.86000 1 Tube? 8400 Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
940-44-052-24-000000 Datasheet 940-44-052-24-000000 - Mill-Max Manufacturing Corp. ED90009-ND CONN SOCKET PLCC 52POS TIN 6,641 - Immediate
1.89000 1 Tube? 940 Active PLCC 52 (4 x 13) 0.100" (2.54mm) Tin 150µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-632-41-001000 Datasheet 110-44-632-41-001000 - Mill-Max Manufacturing Corp. ED90058-ND CONN IC DIP SOCKET 32POS TIN 5,979 - Immediate
1.92000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
940-44-068-24-000000 Datasheet 940-44-068-24-000000 - Mill-Max Manufacturing Corp. ED90010-ND CONN SOCKET PLCC 68POS TIN 5,930 - Immediate
1.94000 1 Tube? 940 Active PLCC 68 (4 x 17) 0.100" (2.54mm) Tin 150µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
20-3518-10 Datasheet 20-3518-10 - Aries Electronics A404AE-ND CONN IC DIP SOCKET 20POS GOLD 1,680 - Immediate
1.95000 1 Bulk? 518 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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917-43-104-41-005000 Datasheet 917-43-104-41-005000 - Mill-Max Manufacturing Corp. ED90274-ND CONN TRANSIST TO-5 4POS GOLD 2,644 - Immediate
2.01000 1 Tube? 917 Active Transistor, TO-5 4 (Round)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
54020-44030LF Datasheet 54020-44030LF - Amphenol FCI 609-4705-ND CONN SOCKET PLCC 44POS TIN 4,348 - Immediate
2.03000 1 Tube?
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Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 100µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 100µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS) -40°C ~ 105°C
110-43-320-41-001000 Datasheet 110-43-320-41-001000 - Mill-Max Manufacturing Corp. ED90036-ND CONN IC DIP SOCKET 20POS GOLD 7,961 - Immediate
2.08000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-320-41-001000 Datasheet 110-93-320-41-001000 - Mill-Max Manufacturing Corp. ED3320-ND CONN IC DIP SOCKET 20POS GOLD 2,567 - Immediate
2.08000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AR 40 HZL-TT Datasheet AR 40 HZL-TT - Assmann WSW Components AE10018-ND CONN IC DIP SOCKET 40POS TIN 2,057 - Immediate
2.10000 1 Tube?
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Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
8468-11B1-RK-TP Datasheet 8468-11B1-RK-TP - 3M 3M6811B1-ND CONN SOCKET PLCC 68POS TIN 1,626 - Immediate
2.19000 1 Tube? 8400 Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
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07:12:18 1/19/2017