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Manufacturer Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
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Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
214-3339-00-0602J Datasheet 214-3339-00-0602J - 3M 3M1402-ND CONN IC DIP SOCKET ZIF 14POS GLD 1,216 - Immediate
17.81000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
220-3342-00-0602J Datasheet 220-3342-00-0602J - 3M 3M2002-ND CONN IC DIP SOCKET ZIF 20POS GLD 508 - Immediate
18.94000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-1275-00-0602J Datasheet 224-1275-00-0602J - 3M 3M2402-ND CONN IC DIP SOCKET ZIF 24POS GLD 539 - Immediate
19.13000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
216-3340-00-0602J Datasheet 216-3340-00-0602J - 3M 3M1602-ND CONN IC DIP SOCKET ZIF 16POS GLD 670 - Immediate
19.19000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
48-6554-11 Datasheet 48-6554-11 - Aries Electronics A309-ND CONN IC DIP SOCKET ZIF 48POS GLD 159 - Immediate
20.94000 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
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Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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240-1280-00-0602J Datasheet 240-1280-00-0602J - 3M 3M4002-ND CONN IC DIP SOCKET ZIF 40POS GLD 318 - Immediate
21.72000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-1286-00-0602J Datasheet 224-1286-00-0602J - 3M 3M2406-ND CONN IC DIP SOCKET ZIF 24POS GLD 321 - Immediate
22.42000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
0804MC Datasheet 0804MC - Texas Instruments 296-32607-ND CONN TRANSIST TO-3 8POS GOLD 269 - Immediate
950 - Factory Stock
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23.78000 1 Bulk?
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Active Transistor, TO-3 8 (Oval)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200µin (5.08µm) Brass Polyester, Glass Filled -55°C ~ 150°C
208-7391-55-1902 Datasheet 208-7391-55-1902 - 3M 3M5054-ND CONN SOCKET SOIC 8POS GOLD 733 - Immediate
25.20000 1 Bulk? Textool™ Active SOIC 8 (2 x 4)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
214-7390-55-1902 Datasheet 214-7390-55-1902 - 3M 3M5055-ND CONN SOCKET SOIC 14POS GOLD 190 - Immediate
25.68000 1 Bulk? Textool™ Active SOIC 14 (2 x 7)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
248-1282-00-0602J Datasheet 248-1282-00-0602J - 3M 3M5004-ND CONN IC DIP SOCKET ZIF 48POS GLD 429 - Immediate
27.32000 1 Tube? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
216-7383-55-1902 Datasheet 216-7383-55-1902 - 3M 3M5078-ND CONN SOCKET SOIC 16POS GOLD 197 - Immediate
28.06000 1 Bulk? Textool™ Active SOIC 16 (2 x 8)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
MS03 Datasheet MS03 - Apex Microtechnology 598-1384-ND CONN TRANSIST TO-3 8POS GOLD 846 - Immediate
29.10000 1 Bulk? Apex Precision Power® Active Transistor, TO-3 8 (Oval)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200µin (5.08µm) Brass Polyester, Glass Filled
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203-2737-55-1102 Datasheet 203-2737-55-1102 - 3M 3M10849-ND CONN TRANSIST TO-3/TO-66 3POS 342 - Immediate
36.08000 1 Bulk? Textool™ Active Transistor, TO-3 and TO-66 3 (Rectangular)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.234" (5.94mm) Gold 30µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 150°C
228-7396-55-1902 Datasheet 228-7396-55-1902 - 3M 3M5059-ND CONN SOCKET SOIC 28POS GOLD 403 - Immediate
38.09000 1 Bulk? Textool™ Active SOIC 28 (2 x 14)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
220-2600-00-0602 Datasheet 220-2600-00-0602 - 3M 3M5062-ND CONN SOCKET SIP ZIF 20POS GOLD 108 - Immediate
38.74000 1 Bulk? Textool™ Active SIP, ZIF (ZIP) 20 (1 x 20) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
2-821949-5 Datasheet 2-821949-5 - TE Connectivity AMP Connectors A32368-ND CONN SOCKET PQFP 132POS TIN-LEAD 195 - Immediate
39.87000 1 Tube?
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Active QFP 132 (4 x 33) 0.050" (1.27mm) Tin-Lead 200µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP)
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200-6313-9UN-1900 Datasheet 200-6313-9UN-1900 - 3M 3M5068-ND CONN SOCKET PGA ZIF 169POS GOLD 207 - Immediate
44.25000 1 Bulk? Textool™ Active PGA, ZIF (ZIP) 169 (13 x 13) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
200-6311-9UN-1900 Datasheet 200-6311-9UN-1900 - 3M 3M5067-ND CONN SOCKET PGA ZIF 121POS GOLD 301 - Immediate
44.33000 1 Bulk? Textool™ Active PGA, ZIF (ZIP) 121 (11 x 11) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
MS05 Datasheet MS05 - Apex Microtechnology 598-1386-ND CONN IC DIP SOCKET 12POS GOLD 154 - Immediate
53.24000 1 Bulk? Apex Precision Power® Active DIP, 1.2" (30.48mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyester, Glass Filled
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169-PRS13001-12 Datasheet 169-PRS13001-12 - Aries Electronics A314-ND CONN SOCKET PGA ZIF GOLD 143 - Immediate
61.64000 1 Bulk? PRS Active PGA, ZIF (ZIP)
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0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
225-PRS15001-12 Datasheet 225-PRS15001-12 - Aries Electronics A315-ND CONN SOCKET PGA ZIF GOLD 178 - Immediate
68.46000 1 Bulk? PRS Active PGA, ZIF (ZIP)
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0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
289-PRS17001-12 Datasheet 289-PRS17001-12 - Aries Electronics A316-ND CONN SOCKET PGA ZIF GOLD 45 - Immediate
79.98000 1 Bulk? PRS Active PGA, ZIF (ZIP)
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0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
248-5205-01 Datasheet 248-5205-01 - 3M 3M10840-ND CONN SOCKET QFN 48POS GOLD 40 - Immediate
90.78000 1 Bulk? Textool™ Active QFN 48 (4 x 12) 0.020" (0.50mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold
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Beryllium Copper Polyethersulfone (PES)
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361-PRS19001-12 Datasheet 361-PRS19001-12 - Aries Electronics A317-ND CONN SOCKET PGA ZIF GOLD 30 - Immediate
93.04000 1 Bulk? PRS Active PGA, ZIF (ZIP)
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0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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00:17:39 2/26/2017