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Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
110-43-632-41-001000 Datasheet 110-43-632-41-001000 - Mill-Max Manufacturing Corp. ED90043-ND CONN IC DIP SOCKET 32POS GOLD 1,683 - Immediate
2.97000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-93-628-41-001000 Datasheet 210-93-628-41-001000 - Mill-Max Manufacturing Corp. ED60005-ND CONN IC DIP SOCKET 28POS GOLD 419 - Immediate
3.00000 1 Tube? 210 Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-320-41-001000 Datasheet 110-13-320-41-001000 - Mill-Max Manufacturing Corp. ED56203-ND CONN IC DIP SOCKET 20POS GOLD 1,389 - Immediate
3.02000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
32-6518-10 Datasheet 32-6518-10 - Aries Electronics A410AE-ND CONN IC DIP SOCKET 32POS GOLD 2,366 - Immediate
3.07000 1 Bulk? 518 Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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828-AG11D-ESL-LF Datasheet 828-AG11D-ESL-LF - TE Connectivity AMP Connectors A121608-ND CONN IC DIP SOCKET 28POS GOLD 3,366 - Immediate
3.43000 1 Tube? 800 Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
210-43-632-41-001000 Datasheet 210-43-632-41-001000 - Mill-Max Manufacturing Corp. ED90111-ND CONN IC DIP SOCKET 32POS GOLD 2,031 - Immediate
3.43000 1 Tube? 210 Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-6518-10 Datasheet 40-6518-10 - Aries Electronics A411-ND CONN IC DIP SOCKET 40POS GOLD 971 - Immediate
3.57000 1 Bulk? 518 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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110-43-640-41-001000 Datasheet 110-43-640-41-001000 - Mill-Max Manufacturing Corp. ED90044-ND CONN IC DIP SOCKET 40POS GOLD 2,592 - Immediate
3.71000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
25-0513-10 Datasheet 25-0513-10 - Aries Electronics A208-ND CONN SOCKET SIP 25POS GOLD 2,514 - Immediate
4.15000 1 Bulk? 0513 Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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40-0518-10 Datasheet 40-0518-10 - Aries Electronics A460-ND CONN SOCKET SIP 40POS GOLD 2,372 - Immediate
4.23000 1 Bulk? 518 Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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210-43-640-41-001000 Datasheet 210-43-640-41-001000 - Mill-Max Manufacturing Corp. ED90112-ND CONN IC DIP SOCKET 40POS GOLD 2,082 - Immediate
4.29000 1 Tube? 210 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1-1571994-0 Datasheet 1-1571994-0 - TE Connectivity AMP Connectors 1-1571994-0-ND CONN SOCKET SIP 10POS GOLD 1,641 - Immediate
4.79000 1 Bulk? 510 Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 20µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 20µin (0.51µm) Copper Thermoplastic, Polyester
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110-43-320-41-801000 Datasheet 110-43-320-41-801000 - Mill-Max Manufacturing Corp. ED90185-ND CONN IC DIP SOCKET 20POS GOLD 1,139 - Immediate
5.02000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-312-11-001000 Datasheet 299-93-312-11-001000 - Mill-Max Manufacturing Corp. ED58434-ND CONN IC DIP SOCKET 12POS GOLD 1,056 - Immediate
5.19000 1 Tube? 299 Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-312-11-001000 Datasheet 299-43-312-11-001000 - Mill-Max Manufacturing Corp. ED90160-ND CONN IC DIP SOCKET 12POS GOLD 593 - Immediate
5.52000 1 Tube? 299 Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
20-0511-10 Datasheet 20-0511-10 - Aries Electronics A201-ND CONN SOCKET SIP 20POS TIN 2,305 - Immediate
6.21000 1 Bulk? 511 Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Through Hole
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Solder 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
299-43-314-10-001000 Datasheet 299-43-314-10-001000 - Mill-Max Manufacturing Corp. ED90137-ND CONN IC DIP SOCKET 14POS GOLD 3,225 - Immediate
6.70000 1 Tube? 299 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-C182-10 Datasheet 40-C182-10 - Aries Electronics A540-ND CONN IC DIP SOCKET 40POS GOLD 268 - Immediate
8.19000 1 Bulk? EJECT-A-DIP™ Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-810-90R Datasheet 14-810-90R - Aries Electronics A116-ND CONN IC DIP SOCKET 14POS TIN 656 - Immediate
8.28000 1 Bulk? Vertisockets™ 800 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
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TDU03DTON Datasheet TDU03DTON - Sullins Connector Solutions S9634-ND CONN SOCKET TRANSIST 3POS GOLD 235 - Immediate
10.56000 1 Bulk?
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Active Transistor 3 (Rectangular)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Board Guide Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -55°C ~ 175°C
32-6554-10 Datasheet 32-6554-10 - Aries Electronics A304-ND CONN IC DIP SOCKET ZIF 32POS TIN 799 - Immediate
12.22000 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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24-6554-11 Datasheet 24-6554-11 - Aries Electronics A301AE-ND CONN IC DIP SOCKET ZIF 24POS GLD 418 - Immediate
14.14000 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
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Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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48-6554-10 Datasheet 48-6554-10 - Aries Electronics A308-ND CONN IC DIP SOCKET ZIF 48POS TIN 447 - Immediate
14.55000 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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40-6554-10 Datasheet 40-6554-10 - Aries Electronics A306-ND CONN IC DIP SOCKET ZIF 40POS TIN 342 - Immediate
14.58000 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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28-6554-11 Datasheet 28-6554-11 - Aries Electronics A303-ND CONN IC DIP SOCKET ZIF 28POS GLD 412 - Immediate
15.33000 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
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Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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16:02:21 1/23/2017