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Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
506-AG11D-ESL-LF Datasheet 506-AG11D-ESL-LF - TE Connectivity AMP Connectors A105216-ND CONN IC DIP SOCKET 6POS GOLD 1,525 - Immediate
1.83000 1 Tube? 500 Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-318-41-001000 Datasheet 110-93-318-41-001000 - Mill-Max Manufacturing Corp. ED3318-ND CONN IC DIP SOCKET 18POS GOLD 1,339 - Immediate
1.87000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-43-103-41-005000 Datasheet 917-43-103-41-005000 - Mill-Max Manufacturing Corp. ED90273-ND CONN TRANSIST TO-5 3POS GOLD 5,972 - Immediate
1.89000 1 Tube? 917 Active Transistor, TO-5 3 (Round)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
214-44-314-01-670800 Datasheet 214-44-314-01-670800 - Mill-Max Manufacturing Corp. ED90237-ND CONN IC DIP SOCKET 14POS TIN 1,533 - Immediate
1.89000 1 Tube? 214 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
69802-144LF Datasheet 69802-144LF - Amphenol FCI 609-3481-ND CONN SOCKET PLCC 44POS TIN 3,254 - Immediate
1.94000 1 Tube?
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Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
8468-21A1-RK-TP Datasheet 8468-21A1-RK-TP - 3M 3M6821A1-ND CONN SOCKET PLCC 68POS TIN 1,694 - Immediate
2.16000 1 Tube? 8400 Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8468-21B1-RK-TP Datasheet 8468-21B1-RK-TP - 3M 3M6821B1-ND CONN SOCKET PLCC 68POS TIN 1,405 - Immediate
2.16000 1 Tube? 8400 Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8468-11B1-RK-TP Datasheet 8468-11B1-RK-TP - 3M 3M6811B1-ND CONN SOCKET PLCC 68POS TIN 1,668 - Immediate
2.19000 1 Tube? 8400 Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
115-43-316-41-003000 Datasheet 115-43-316-41-003000 - Mill-Max Manufacturing Corp. ED90210-ND CONN IC DIP SOCKET 16POS GOLD 1,350 - Immediate
2.22000 1 Tube? 115 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-422-41-001000 Datasheet 110-43-422-41-001000 - Mill-Max Manufacturing Corp. ED90039-ND CONN IC DIP SOCKET 22POS GOLD 1,217 - Immediate
2.29000 1 Tube? 110 Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
214-99-320-01-670800 Datasheet 214-99-320-01-670800 - Mill-Max Manufacturing Corp. ED2132-ND CONN IC DIP SOCKET 20POS TINLEAD 1,038 - Immediate
2.36000 1 Tube? 214 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin-Lead 100µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
214-44-320-01-670800 Datasheet 214-44-320-01-670800 - Mill-Max Manufacturing Corp. ED90240-ND CONN IC DIP SOCKET 20POS TIN 4,275 - Immediate
2.45000 1 Tube? 214 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-318-41-003000 Datasheet 115-43-318-41-003000 - Mill-Max Manufacturing Corp. ED90211-ND CONN IC DIP SOCKET 18POS GOLD 1,436 - Immediate
2.49000 1 Tube? 115 Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-624-41-001000 Datasheet 110-43-624-41-001000 - Mill-Max Manufacturing Corp. ED90041-ND CONN IC DIP SOCKET 24POS GOLD 1,010 - Immediate
2.50000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AR-28-HZL/01/7-TT Datasheet AR-28-HZL/01/7-TT - Assmann WSW Components AE10029-ND CONN IC DIP SOCKET 28POS GOLD 1,341 - Immediate
2.54000 1 Tube?
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Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR 14 HZW/TN Datasheet AR 14 HZW/TN - Assmann WSW Components AE10047-ND CONN IC DIP SOCKET 14POS GOLD 1,029 - Immediate
2.55000 1 Tube?
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Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
917-43-108-41-005000 Datasheet 917-43-108-41-005000 - Mill-Max Manufacturing Corp. ED90275-ND CONN TRANSIST TO-5 8POS GOLD 2,613 - Immediate
2.58000 1 Tube? 917 Active Transistor, TO-5 8 (Round)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AR 16 HZW/TN Datasheet AR 16 HZW/TN - Assmann WSW Components AE10048-ND CONN IC DIP SOCKET 16POS GOLD 753 - Immediate
2.69000 1 Tube?
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Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR 32 HZL/01-TT Datasheet AR 32 HZL/01-TT - Assmann WSW Components AE10030-ND CONN IC DIP SOCKET 32POS GOLD 654 - Immediate
2.87000 1 Tube?
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Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
111-93-324-41-001000 Datasheet 111-93-324-41-001000 - Mill-Max Manufacturing Corp. ED60012-ND CONN IC DIP SOCKET 24POS GOLD 460 - Immediate
2.92000 1 Tube? 111 Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-632-41-001000 Datasheet 110-93-632-41-001000 - Mill-Max Manufacturing Corp. ED3632-ND CONN IC DIP SOCKET 32POS GOLD 508 - Immediate
2.97000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-93-628-41-001000 Datasheet 210-93-628-41-001000 - Mill-Max Manufacturing Corp. ED60005-ND CONN IC DIP SOCKET 28POS GOLD 925 - Immediate
3.00000 1 Tube? 210 Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-43-628-41-001000 Datasheet 210-43-628-41-001000 - Mill-Max Manufacturing Corp. ED90110-ND CONN IC DIP SOCKET 28POS GOLD 305 - Immediate
3.00000 1 Tube? 210 Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-320-41-001000 Datasheet 110-13-320-41-001000 - Mill-Max Manufacturing Corp. ED56203-ND CONN IC DIP SOCKET 20POS GOLD 1,812 - Immediate
3.02000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
28-6518-10 Datasheet 28-6518-10 - Aries Electronics A409AE-ND CONN IC DIP SOCKET 28POS GOLD 1,215 - Immediate
3.02000 1 Bulk? 518 Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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16:00:57 2/19/2017